CN103831676A - Window cleaning kit for wire bonding apparatus, wire bonding apparatus including the same and cleaning method of capillary using the same - Google Patents
Window cleaning kit for wire bonding apparatus, wire bonding apparatus including the same and cleaning method of capillary using the same Download PDFInfo
- Publication number
- CN103831676A CN103831676A CN201310596850.8A CN201310596850A CN103831676A CN 103831676 A CN103831676 A CN 103831676A CN 201310596850 A CN201310596850 A CN 201310596850A CN 103831676 A CN103831676 A CN 103831676A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- external member
- bonding
- bonding device
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7801—Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
Abstract
The invention relates to a window cleaning kit for a wire bonding apparatus, a wire bonding apparatus including the same and a cleaning method of capillary using the same; the apparatus can effectively clean foreign matters attached on end portions of the capillaries in a long term process using the wire bonding; the cleaning kit for wire bonding apparatus can fix a wire bonding object, can be arranged on a window clamp plate having a hole in a fixed manner for usage, and can be used as the cleaning kit in a dismounting state; the cleaning kit comprises a vibration generation plate and a grinding sheet; the vibration generation plate is placed on the window clamp plate; the grinding sheet is attached on the vibration generation plate and linked with the vibration generation plate.
Description
Technical field
The present invention relates to a kind of Bonding (WireBonding) device with cleaning external member, comprising that this Bonding device is with cleaning the Bonding device of external member and utilizing the capillary cleaning method of this Bonding device, in more detail, relate to by the cleaning external member for generating vibration being installed to window clamping plate (window clamp), can effectively clean the Bonding device of end capillaceous with cleaning external member, comprising that this Bonding device is with cleaning the Bonding device of external member and utilizing the capillary cleaning method of this Bonding device.
Background technology
In semi-conductive preparation section, generally use and utilize Bonding device, connect the technology of luminescence chip and substrate with metal wire.In this Bonding operation, generally use gold as metal wire.But, from the demand of nearest semi-conductive high speed, low price, except gold, also there is once in a while the situation that can carry out more the metal wires such as signal is at a high speed processed and expense is cheap copper that uses.
The capillary of tubular state is installed at this Bonding device, and for handling fine metal wire, and by this capillary, one end of metal wire and luminescence chip carry out ball bonding, and the other end of metal wire and substrate carry out stitch bond., first Bonding device supplies with discharge spark to the metal wire that the length with regulation is extended along lower end capillaceous, makes to form ball.Then, Bonding device moves after capillary to luminescence chip direction, supplies with ultrasonic wave, thereby make ball and luminescence chip carry out ball bonding to this capillary.Finally, Bonding device moves after capillary to orientation substrate, again supplies with ultrasonic wave to capillary, thereby makes the other end of this metal wire carry out stitch bond with substrate.Now, after metal wire carries out stitch bond, from substrate cutting metal wire, and again repeatedly carry out a series of process as above.
But this capillary, especially can provide various rugged environments in end capillaceous.That is, end capillaceous both can be applied in discharge spark, also can contact with the part of the melting of metal wire.
And when capillary is in the time contacting with luminescence chip or substrate, because ultrasonic energy concentrates on end capillaceous, thereby this severe degree will increase the weight of more.Due to this reason, carry out for a long time Bonding, more can accumulate various foreign matters at capillary end.The various metallic foreign bodies that caused by particle, metal wire, luminescence chip and the substrate of the capillary decomposing by discharge spark self will be accumulated in the mode that continues to adhere at this capillary end.
Like this, the in the situation that of accumulating various metallic foreign body in end capillaceous, due to the out-of-shape of capillary end, thereby the main cause that bonding generation rate improves when becoming Bonding.
In the past, with the chemical industry medicament of being scheduled to, capillary was processed, thereby removed various metallic foreign bodies from capillary, but because this chemical industry medicament likely damages capillary, thereby after implementing chemical industry chemicals treatment, must implement visual inspection to capillary.But, this chemical industry chemicals treatment capillaceous is not only needed for a long time, and according to circumstances, also exists capillary self to be subject to damaged problem.
Due to this problem, after using capillary at the appointed time, change capillary itself and replace chemical industry chemicals treatment, but in this case, not only need for a long time changing when capillary, and the reason set of the work that need re-execute when new capillary is installed etc. has the problem that operation benefit factor declines.
As relevant existing document, have Republic of Korea's publication communique No. 10-2010-0043410 (on 04 29th, 2010 bulletins), and above-mentioned document capillary is disclosed and has comprised this Bonding device capillaceous.
Summary of the invention
The object of the invention is to, a kind of Bonding device cleaning external member of utilizing cleaning sheet can effectively remove the generated vibration that is inevitably attached to the various metallic foreign bodies of capillary end in the long-time process of carrying out Bonding in the situation that there is no capillary damage is provided, comprises that this Bonding device is with cleaning the Bonding device of external member and utilizing the capillary cleaning method of this Bonding device.
Be used for the Bonding device of the embodiment of the present invention of reaching above-mentioned purpose with cleaning external member, for anchor leg bonding object, being installed in a fixed manner the window clamping plate with hole uses, or use with the form of mounting or dismounting, it is characterized in that, comprise: vibration generation board, is positioned on window clamping plate; And abrasive sheet, be attached on above-mentioned vibration generation board, and link with above-mentioned vibration generation board.
The Bonding device that is used for the embodiments of the invention of reaching above-mentioned purpose, is characterized in that, comprising: capillary, passes through metal wire; Bonding arm, for fixing above-mentioned capillary, and controls above-mentioned upper and lower and left and right reciprocating motion capillaceous; Heat block, is installed on the bottom of above-mentioned capillary and bonding arm; Window clamping plate, are disposed on above-mentioned heat block, for Bonding object is fixed, and have multiple holes; And cleaning external member, thering is vibration generation board and abrasive sheet, above-mentioned vibration generation board is positioned on above-mentioned window clamping plate, and above-mentioned abrasive sheet is attached on above-mentioned vibration generation board, and links with above-mentioned vibration generation board.
Be used for the cleaning method capillaceous that utilizes Bonding device of the embodiments of the invention of reaching above-mentioned purpose, it is characterized in that, comprise: step (a), for bonding object, is attached to by the end capillaceous of the Bonding of having carried out setting-up time the top of cleaning external member; Step (b), drives the vibration generation board being connected with the abrasive sheet of above-mentioned cleaning external member to grind above-mentioned end capillaceous; And step (c), arrange on the top of Bonding object the capillary that has finished above-mentioned grinding.
Bonding device of the present invention with cleaning external member so that capillary be fixed on and the top of the abrasive sheet that is connected of oscillating plate that generates vibration, and under the state adhering to, form physical cleaning, thereby can in the situation that there is no damage capillaceous, effectively remove the metallic foreign body that is attached to capillary end.As a result, Bonding device of the present invention extends the replacement cycle capillaceous more than 2.5 times with cleaning external member, thereby obviously reduces operation loss, can expect to reduce thus the effect of capillary renewal cost.Current, each replacement cycle capillaceous is 800,000 dozens of front and back, but is utilizing Bonding device cleaning external member of the present invention to clean in situation capillaceous, has advantages of and can be extended for to 2,000,000 dozens each replacement cycle capillaceous above.
And Bonding device of the present invention has the cleaning external member of involving vibrations generation board and abrasive sheet, thereby carrying out after the Bonding of setting-up time, can prevent in advance the bad of the Bonding that caused by the metallic foreign body that is attached to capillary end.
And, utilize the capillary cleaning method of Bonding device of the present invention not only need not carry out chemical industry chemicals treatment, but also in the case of without change capillary itself, the physical cleaning that generates the cleaning external member of vibration by utilization removes the metallic foreign body that is attached to capillary end, therefore there is not the expenses of changing capillary itself, and, because the work that need not re-execute is set, thereby have advantages of and can improve operation benefit factor.
Accompanying drawing explanation
Fig. 1 is the figure that cleans external member for Bonding device for one embodiment of the invention are described.
Fig. 2 is the stereogram of the window clamping plate of presentation graphs 1.
Fig. 3 is the exploded perspective view of the vibration generation board of presentation graphs 1 enlargedly.
Fig. 4 is the figure that utilizes the cleaning method that cleans external member for illustrating.
Fig. 5 is the figure that cleans external member for Bonding device for an embodiment more of the present invention is described.
Fig. 6 is the VI-VI along Fig. 5 ' line is with the cutaway view that represents of mode of cutting.
Fig. 7 is the figure that cleans external member for Bonding device for another embodiment of the present invention is described.
Fig. 8 is the stereogram that represents the Bonding device of embodiments of the invention.
Fig. 9 is the process flow chart that represents the capillary cleaning method that utilizes Bonding device of embodiments of the invention.
Figure 10 is the photo that represents to clean the state before the end capillaceous of Bonding device.
Figure 11 is the photo that represents to clean the state after the end capillaceous of Bonding device.
The specific embodiment
Below, with reference to accompanying drawing to cleaning external member for the Bonding device of the preferred embodiment of the present invention, comprising the Bonding device of this Bonding device cleaning external member and utilize the capillary cleaning method of this Bonding device to be elaborated as follows.
Fig. 1 is the figure that cleans external member for Bonding device for one embodiment of the invention are described, Fig. 2 is the stereogram of the window clamping plate of presentation graphs 1.Now, Fig. 1 is illustrated in the position corresponding with multiple holes of window clamping plate the state that cleans external member is installed.
With reference to Fig. 1 and Fig. 2, the Bonding device of shown one embodiment of the invention is with cleaning external member 100 for anchor leg bonding object (not shown), and is installed on the window clamping plate 10 with multiple hole H and uses.
Now, although not shown in accompanying drawing, Bonding object can be the substrate that is attached with luminescence chip.In order to make between aforesaid substrate and luminescence chip by utilizing the Bonding of metallized metal line to form mutual electrical connection, to Bonding device handover aforesaid substrate and luminescence chip.
Now, window clamping plate 10 have multiple hole H, for exposing the luminescence chip being attached on substrate, carry out Bonding, and this multiple hole H are disposed at middle body.And, the upwards lateral bend of both sides of the edge part of window clamping plate 10, thus than middle body, be disposed at relatively high position.
The Bonding device of above-mentioned one embodiment of the invention is with cleaning external member 100 involving vibrations generation boards 120 and abrasive sheet 140.
Above-mentioned vibration generation board 120 is positioned on window clamping plate 10.This vibration generation board 120 can be designed to foursquare shape from plane, but is not limited to this, changes design also harmless with variforms such as circle, triangle, pentagons.
Now, Fig. 3 is the exploded perspective view of the vibration generation board of Watch with magnifier diagram 1, more specifically describes with reference to this figure.
With reference to Fig. 3, vibration generation board 120 comprises shell 122, electromagnetic force maker 124, oscillator 126 and vibration transmission plate 128.
Above-mentioned shell 122 is the box-like of upside opening.This shell 122 plays from outside physical impact protection will electromagnetic force maker 124 described later and the effect of oscillator 126.Now, preferably, shell 122 is designed to have to the thickness of 8mm～12mm.Be less than 8mm at the thickness of shell 122, because this thickness is crossed thin and is likely difficult to protect electromagnetic force maker and oscillator from external impact.On the contrary, be greater than 12mm at the thickness of shell 122, be not only not easy processing, and the increase of the weight causing due to the increase of thickness, the worry that exists vibration efficiency to decline.
Above-mentioned electromagnetic force maker 124 inserts to the inside of shell 122, and never illustrated drive control part reception power supply generates electromagnetic force.Now, although illustrate, electromagnetic force maker 124 can comprise: coil (not shown), receives power supply and make current flowing; And magnetic (not shown), occurring to interact with above-mentioned electric current generates gravitation or repulsion.
Above-mentioned oscillator 126 receives the vibration that is used for of electromagnetic force.Now, preferably, electromagnetic force maker 124 and oscillator 126 are designed to have respectively to the thickness of 4～7mm.Thickness at electromagnetic force maker 124 and oscillator 126 is less than 4mm, likely has difficulties generating effectively to clean aspect the required vibratory output in end capillaceous.On the contrary, be greater than 7mm at the thickness of electromagnetic force maker 124 and oscillator 126, can become the principal element that increases vibration generation board overall volume, thereby aspect erection space, have difficulties guaranteeing.
Above-mentioned vibration transmission plate 128 plays the upside that covers shell 122, transmits the effect of the vibration generating from above-mentioned oscillator 126 to outside.This vibration transmission plate 128 can form by having the material of rigidity or having flexible material etc.As the material of vibration transmission plate 128, can use stainless steel (SUS, stainless steel), titanium (Ti) etc.Now, preferably, vibration transmission plate 128 forms with the thickness of 1mm～3mm.Thickness in vibration transmission plate 128 is less than 1mm, likely aspect sufficient rigidity, has difficulties guaranteeing.On the contrary, be greater than 3mm at the thickness of vibration transmission plate 128, although favourable to guaranteeing rigidity aspect, there is the problem that vibration transmission efficiency sharply declines.
If above-mentioned vibration generation board 120, to electromagnetic force maker 124, applies driving power from drive control part to the coil of electromagnetic force maker 124 particularly, can generate magnetic flux along sense of current, above-mentioned electric current flows along above-mentioned coil.The magnetic flux so generating is by generating electromagnetic force with the interaction of magnetic 126.As a result, if receive the electromagnetic force that generates from electromagnetic force maker 124 be used for oscillator 126 is vibrated, vibrate transmission plate 128 and receive these vibrations and vibrate.
On the other hand, although not shown, vibration generation board 120 of the present invention can comprise: shell 122, and the upside of above-mentioned shell is open; Ultrasonic vibration element (not shown), inserts to the inside of above-mentioned shell 122, receives power supply and generates ultrasonic vibration; Vibrate transmission plate 128, cover the upside of above-mentioned shell, the vibration of transmitting above-mentioned ultrasonic vibration element to outside.
Fig. 4 is the figure that utilizes the cleaning method that cleans external member for illustrating, more specifically, is to represent to utilize abrasive sheet to clean the figure of the process of capillary end.
With reference to Fig. 4, abrasive sheet 140 is attached on vibration generation board 120, links with above-mentioned vibration generation board 120.This abrasive sheet 140 comprises: base material film 142 and polishing particles 144, above-mentioned polishing particles 144 is to the interior insertion of above-mentioned base material film 142.Now, polishing particles 144 can be to be selected from SiC, Al
2o
3, Cr
2o
3, Fe
2o
3, ZrO
2, CeO
2, SiO
2and BaCO
3in more than one.
Above-mentioned polishing particles 144 can have the diameter of 5 μ m～10 μ m, more preferably, has the diameter of 2 μ m～4 μ m, the most preferably, can have the diameter of 2.5 μ m～3.5 μ m.This prevents that the end of capillary 50 is impaired for easily removing the bonding foreign matter 30 of the end that accumulates on capillary 50 when.That is, be less than 5 μ m at the diameter of polishing particles 144, likely have difficulties effectively removing aspect the bonding foreign matter 30 of end that is attached to capillary 50.On the contrary, be greater than 10 μ m at the diameter of polishing particles 144, there is the impaired worry in end of capillary 50.
Now, above-mentioned Bonding device is with cleaning external member 100 form installation with dismounting in the position corresponding with multiple hole H of window clamping plate 10.; if above-mentioned Bonding device utilizes capillary 50 to carry out Bonding with cleaning external member 100 within the time of setting; in order to remove the bonding foreign matter 30 of the end that is inevitably attached to capillary 50; by capillary 50 under the state of the upper side direction displacement separating with multiple hole H, adhere to above-mentioned Bonding device with cleaning external member 100 to be equipped on the form of the position corresponding with multiple hole H.Afterwards, capillary 50 is declined, thereby being attached to Bonding device with cleaning under the state of uper side surface of abrasive sheet 140 of external member 100, utilize the vibration generation board 120 that cleans external member 100 for Bonding device, come the end of capillary 50 to implement to clean in physical friction mode.After finishing cleaning, will dismantle this Bonding device with cleaning external member 100 from window clamping plate 10.
Fig. 5 is the figure that cleans external member for Bonding device for an embodiment more of the present invention is described.Fig. 6 is the VI-VI along Fig. 5 ' line is with the cutaway view that represents of mode of cutting.Now, in an embodiment more of the present invention, give identical Reference numeral for the title identical with an embodiment.
With reference to Fig. 5 and Fig. 6, the Bonding device of an illustrated embodiment more of the present invention in fact can be identical with the Bonding device of an embodiment who illustrate and describe in Fig. 1 and Fig. 2 cleaning external member (Fig. 1 100) with cleaning external member 100.
Just, the Bonding device of one embodiment of the invention is installed on window clamping plate 10 with cleaning external member with the form of dismounting, and on the contrary, the Bonding device of an embodiment more of the present invention is installed with the form that is fixed on window clamping plate 10 with cleaning external member 100, shows in this difference.That is, although not shown, Bonding device with clean external member 100 can by utilize adhesive (not shown) juncture, utilize the fastened by screw mode (not shown) of screw etc., be installed on window clamping plate 10 with the form being fixed in combination.
And the Bonding device of an embodiment more of the present invention can or be attached to a lateral edges of window clamping plate 10 with cleaning external member 100, or is attached to respectively 10 both sides of the edge of above-mentioned window clamping plate.Therefore, above-mentioned Bonding device is installed on the periphery of multiple groove H of window clamping plate 10 by cleaning external member 100.
And the Bonding device of yet another embodiment of the invention also can comprise impact absorbing layer 160 with cleaning external member 100.This impact absorbing layer 160 is attached to the bottom of vibration generation board 120, plays the effect preventing with the physical impact of window clamping plate 10.Preferably, this impact absorbing layer 160 is formed by a kind of material that is selected from polyurethanes, elastic caoutchouc, silicon, sponge, plastic foam etc.
Preferably, this impact absorbing layer 160 forms with the thickness of 10mm～50mm.If the thickness of impact absorbing layer 160 is less than in the situation of 10mm, likely aspect the effect of normal performance impact-absorbing, having difficulties.On the contrary, if the thickness of impact absorbing layer 160 is greater than in the situation of 50mm, does not more only improve the worry of manufacturing cost when multiple-effect fruit, thereby do not there is economy.
On the other hand, Fig. 7 is the figure that cleans external member for Bonding device for another embodiment of the present invention is described.Now, the Bonding device of another embodiment of the present invention uses cleaning external member identical with the Bonding device of an embodiment in fact with cleaning external member, thereby omits repeat specification, and mainly describes as main take discrepancy.
With reference to Fig. 7, the Bonding device of shown another embodiment of the present invention is with cleaning external member 100 involving vibrations transmission plate 128, shell 122, electromagnetic force maker 124, oscillator 126 and vibration connecting line 129.
Above-mentioned vibration transmission plate 128 is positioned on window clamping plate 10, and receives from vibration connecting line 129 vibration generating from oscillator 126.Now, vibration transmission plate 128 can form by having the material of rigidity or having flexible material etc.As the material of vibration transmission plate 128, can use stainless steel (SUS, stainless steel), titanium (Ti) etc.
Above-mentioned shell 122 is installed on the side separating with window clamping plate 122, and can be box-like.
Above-mentioned electromagnetic force maker 124 inserts to the inside of shell 122, and never illustrated drive control part receives power supply, generates electromagnetic force.And oscillator 126 receives the vibration that is used for of electromagnetic force.
Above-mentioned vibration connecting line 129 plays to vibration transmission plate 128 and transmits the vibration generating from above-mentioned oscillator 126.
Because the vibration generation board of above-mentioned another embodiment of the present invention is only positioned over vibration transmission plate on window clamping plate, and multiple structural elements are in addition installed on to the side separating with window clamping plate, thereby compared with an embodiment, more outstanding in space use.
Fig. 8 is the stereogram that represents the Bonding device of embodiments of the invention.
With reference to Fig. 8, the Bonding device 200 of shown embodiments of the invention comprises capillary 50, bonding arm 60, heat block 80, window clamping plate 10 and cleans external member 100.
Clean external member 100 involving vibrations generation boards 120 and abrasive sheet 140, above-mentioned vibration generation board 120 is positioned on window clamping plate 10, and above-mentioned abrasive sheet 140 is attached on above-mentioned vibration generation board 120, links with vibration generation board 120.
Now, if clean the end of capillary 50 under the state that cleaning sheet 100 is disposed to the side separating with window clamping plate 10, cleaning sheet 100 is attached to window clamping plate 10, and after finishing the cleaning of the end to capillary 50, can use in the mode of dismantling above-mentioned cleaning sheet 100 from window clamping plate 10.Different, cleaning sheet 100 can adhere to the form of the side that is fixed on window clamping plate 10, or also can adhere to the form that is individually fixed in both sides.Now, Bonding device 200 is being carried out after the Bonding of setting-up time, in the time cleaning the end of capillary 50, utilize bonding arm 60 to transfer capillary 50 to the top of cleaning sheet 100 of a lateral edges that is attached to window clamping plate 10 and complete the mode of returning to Bonding position after cleaning and repeatedly implement cleaning and Bonding.
And the Bonding device 200 of the embodiment of the present invention can also comprise window clamping plate clip 70.
Above-mentioned window clamping plate clip 70 is installed on respectively the both sides of the edge of window clamping plate 10, plays the effect of the movement that prevents above-mentioned window clamping plate 10.
Above-mentioned embodiments of the invention comprise that the cleaning sheet of self vibration is installed on window clamping plate by the Bonding device that cleans external member, thereby not only can effectively clean end capillaceous, also have advantages of and can reduce time capillaceous, the expense etc. changed.
Below, with reference to accompanying drawing, the capillary cleaning method that utilizes Bonding device of embodiments of the invention is described.
Fig. 9 is the process flow chart that represents the capillary cleaning method that utilizes Bonding device of embodiments of the invention.
With reference to Fig. 9, the capillary cleaning method that utilizes Bonding device of illustrated embodiments of the invention comprises: in cleaning external member, adhere to step S210 capillaceous; Grinding steps S220 capillaceous; And arrange step S230 capillaceous on the top of Bonding object.
in cleaning external member, adhere to capillary
In cleaning external member, adhere in step S210 capillaceous, adhere to the end capillaceous of the Bonding of para-linkage object execution setting-up time on the top of cleaning external member.Now, setting-up time can be defined as to the time of carrying out Bonding, as an example, can be 12 hours～20 hours, but be not limited to this.
grinding capillaceous
In grinding steps S220 capillaceous, drive the vibration generation board being connected with the abrasive sheet that cleans external member to grind end capillaceous.In the time carrying out this step, preferably, with fixed capillary, and make to implement with the mode of vibrating the abrasive sheet vibration that generation board is connected.
In situation of the present invention, owing to driving vibration generation board under the state of fixed capillary, make it possible to the abrasive sheet transmitting vibrations being connected with this vibration generation board, and with the direct way of contact, end capillaceous is carried out and ground, thereby can more effectively remove the metallic foreign body that is attached to capillary end.Now, the oscillation intensity that can vibrate generation board by adjusting is controlled the friction between capillary and abrasive sheet.
capillary is arranged on top at Bonding object
Arrange in step S230 capillaceous on the top of Bonding object, arrange on the top of Bonding object the capillary that has finished grinding.Now, due to the state of end capillaceous in the above-mentioned grinding steps S220 capillaceous of executed, thereby can directly carry out Bonding.
Now, Figure 10 is the photo that is illustrated in the state before the end capillaceous of cleaning Bonding device, and Figure 11 is the photo that is illustrated in the state behind the end capillaceous of cleaning Bonding device.
First, as shown in figure 10, can confirm to be attached with bonding foreign matter in end periphery capillaceous.
As shown in figure 11, can confirm, after cleaning end capillaceous with the capillary cleaning method that utilizes Bonding device of the embodiment of the present invention, to have removed nearly all bonding foreign matter.
Above, centered by embodiments of the invention, be illustrated, but by the level of the those of ordinary skill of the technical field under the present invention, can apply numerous variations or distortion.This change and distortion only otherwise depart from technological thought provided by the present invention, just can be considered as belonging to the present invention.Therefore, interest field of the present invention should be judged by the claimed scope of invention.
Claims (16)
1. Bonding device, with cleaning an external member, for anchor leg bonding object, is installed in a fixed manner the window clamping plate with hole and uses, or use with the form of mounting or dismounting, it is characterized in that, comprising:
Vibration generation board, is positioned on window clamping plate; And
Abrasive sheet, is attached on above-mentioned vibration generation board, and links with above-mentioned vibration generation board.
2. Bonding device according to claim 1, with cleaning external member, is characterized in that, above-mentioned Bonding device is by cleaning external member or be attached to a lateral edges of above-mentioned window clamping plate, or is attached to respectively the both sides of the edge of above-mentioned window clamping plate.
3. Bonding device according to claim 1, with cleaning external member, is characterized in that, above-mentioned vibration generation board comprises:
Shell, upside is open;
Electromagnetic force maker, inserts to the inside of above-mentioned shell, receives power supply and generates electromagnetic force;
Oscillator vibrates under the effect of above-mentioned electromagnetic force; And
Vibrate transmission plate, cover the upside of above-mentioned shell, transmit the vibration from above-mentioned oscillator to outside.
4. Bonding device according to claim 3, with cleaning external member, is characterized in that, above-mentioned electromagnetic force maker comprises:
Coil, receives above-mentioned power supply and makes current flowing; And
Magnetic, occurring to interact with above-mentioned electric current generates gravitation or repulsion.
5. Bonding device according to claim 1, with cleaning external member, is characterized in that, above-mentioned vibration generation board comprises:
Vibration transmission plate, is positioned on above-mentioned window clamping plate;
Shell, is installed on the side separating with above-mentioned window clamping plate, and has box-like;
Electromagnetic force maker, inserts to the inside of above-mentioned shell, receives power supply and generates electromagnetic force;
Oscillator vibrates under the effect of above-mentioned electromagnetic force; And
Vibration connecting line, transmits the vibration from above-mentioned oscillator to above-mentioned vibration transmission plate.
6. Bonding device according to claim 1, with cleaning external member, is characterized in that, above-mentioned vibration generation board comprises:
Shell, upside is open;
Ultrasonic vibration element, inserts to the inside of above-mentioned shell, receives power supply and generates ultrasonic vibration; And
Vibrate transmission plate, cover the upside of above-mentioned shell, the vibration of transmitting above-mentioned ultrasonic vibration element to outside.
7. Bonding device according to claim 1, with cleaning external member, is characterized in that, above-mentioned abrasive sheet comprises base material film and polishing particles, and above-mentioned polishing particles inserts in above-mentioned base material film.
8. Bonding device according to claim 7, with cleaning external member, is characterized in that, above-mentioned polishing particles comprises and is selected from SiC, Al
2o
3, Cr
2o
3, Fe
2o
3, ZrO
2, CeO
2, SiO
2and BaCO
3in more than one.
9. Bonding device according to claim 7, with cleaning external member, is characterized in that, the diameter of above-mentioned polishing particles is 5～10 μ m.
10. Bonding device according to claim 1 is with cleaning external member, it is characterized in that, above-mentioned Bonding device also comprises impact absorbing layer with cleaning external member, above-mentioned impact absorbing layer is attached to the bottom of above-mentioned vibration generation board, for preventing the physical impact between above-mentioned vibration generation board and above-mentioned window clamping plate.
Cleaning external member for 11. Bonding devices according to claim 10, is characterized in that, above-mentioned impact absorbing layer is formed by a kind of material being selected from polyurethanes, elastic caoutchouc, silicone and sponge, and has the thickness of 10～50mm.
12. 1 kinds of Bonding devices, is characterized in that, comprising:
Capillary, passes through metal wire;
Bonding arm, for fixing above-mentioned capillary, and controls above-mentioned upper and lower and left and right reciprocating motion capillaceous;
Heat block, is installed on the bottom of above-mentioned capillary and bonding arm;
Window clamping plate, are disposed on above-mentioned heat block, for Bonding object is fixed, and have multiple holes; And
Clean external member, have vibration generation board and abrasive sheet, above-mentioned vibration generation board is positioned on above-mentioned window clamping plate, and above-mentioned abrasive sheet is attached on above-mentioned vibration generation board, and links with above-mentioned vibration generation board.
13. Bonding devices according to claim 12, is characterized in that, above-mentioned cleaning external member also comprises impact absorbing layer, and above-mentioned impact absorbing layer is attached between above-mentioned window clamping plate and above-mentioned vibration generation board.
14. Bonding devices according to claim 13, is characterized in that, above-mentioned impact absorbing layer has the thickness of 10～50mm, and are formed by a kind of material being selected from polyurethanes, elastic caoutchouc, silicone and sponge.
15. 1 kinds are utilized the cleaning method capillaceous of Bonding device, utilize the Bonding device described in any one in claim 12 to 14, it is characterized in that, comprising:
Step (a), for bonding object, is attached to by the end capillaceous of the Bonding of having carried out setting-up time the top of cleaning external member;
Step (b), drives the vibration generation board being connected with the abrasive sheet of above-mentioned cleaning external member to grind above-mentioned end capillaceous; And
Step (c), arranges on the top of Bonding object the capillary that has finished above-mentioned grinding.
The 16. capillary cleaning methods that utilize Bonding device according to claim 15, is characterized in that, in above-mentioned steps (b), and above-mentioned being ground to, fixing above-mentioned capillary, and make to vibrate with the abrasive sheet of above-mentioned vibration generation board interlock.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120133699A KR101473811B1 (en) | 2012-11-23 | 2012-11-23 | Window cleaning kit for wire bonding apparatus, wire bonding apparatus including the same and cleaning method of capillary using the same |
| KR10-2012-0133699 | 2012-11-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103831676A true CN103831676A (en) | 2014-06-04 |
Family
ID=50795739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310596850.8A Pending CN103831676A (en) | 2012-11-23 | 2013-11-22 | Window cleaning kit for wire bonding apparatus, wire bonding apparatus including the same and cleaning method of capillary using the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2014107561A (en) |
| KR (1) | KR101473811B1 (en) |
| CN (1) | CN103831676A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107124904A (en) * | 2015-12-25 | 2017-09-01 | 华祥股份有限公司 | Wire bonding device |
| US11035898B1 (en) | 2020-05-11 | 2021-06-15 | International Test Solutions, Inc. | Device and method for thermal stabilization of probe elements using a heat conducting wafer |
| US11155428B2 (en) | 2018-02-23 | 2021-10-26 | International Test Solutions, Llc | Material and hardware to automatically clean flexible electronic web rolls |
| US11211242B2 (en) | 2019-11-14 | 2021-12-28 | International Test Solutions, Llc | System and method for cleaning contact elements and support hardware using functionalized surface microfeatures |
| US11318550B2 (en) | 2019-11-14 | 2022-05-03 | International Test Solutions, Llc | System and method for cleaning wire bonding machines using functionalized surface microfeatures |
| US11756811B2 (en) | 2019-07-02 | 2023-09-12 | International Test Solutions, Llc | Pick and place machine cleaning system and method |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9833818B2 (en) | 2004-09-28 | 2017-12-05 | International Test Solutions, Inc. | Working surface cleaning system and method |
| US8371316B2 (en) | 2009-12-03 | 2013-02-12 | International Test Solutions, Inc. | Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware |
| JP6224551B2 (en) | 2014-05-23 | 2017-11-01 | アルプス電気株式会社 | Pressure contact connector and manufacturing method thereof |
| US9825000B1 (en) * | 2017-04-24 | 2017-11-21 | International Test Solutions, Inc. | Semiconductor wire bonding machine cleaning device and method |
| US10792713B1 (en) | 2019-07-02 | 2020-10-06 | International Test Solutions, Inc. | Pick and place machine cleaning system and method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100889297B1 (en) * | 2008-09-12 | 2009-03-18 | 주식회사 코스마 | Cleaning jig of capillary for wire bonding, cleaning device of capillary for wire bonding, method for fabricating thereof and method for cleaning using the same |
-
2012
- 2012-11-23 KR KR1020120133699A patent/KR101473811B1/en not_active IP Right Cessation
-
2013
- 2013-11-22 CN CN201310596850.8A patent/CN103831676A/en active Pending
- 2013-11-22 JP JP2013241516A patent/JP2014107561A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107124904A (en) * | 2015-12-25 | 2017-09-01 | 华祥股份有限公司 | Wire bonding device |
| US11155428B2 (en) | 2018-02-23 | 2021-10-26 | International Test Solutions, Llc | Material and hardware to automatically clean flexible electronic web rolls |
| US11434095B2 (en) | 2018-02-23 | 2022-09-06 | International Test Solutions, Llc | Material and hardware to automatically clean flexible electronic web rolls |
| US11756811B2 (en) | 2019-07-02 | 2023-09-12 | International Test Solutions, Llc | Pick and place machine cleaning system and method |
| US11211242B2 (en) | 2019-11-14 | 2021-12-28 | International Test Solutions, Llc | System and method for cleaning contact elements and support hardware using functionalized surface microfeatures |
| US11318550B2 (en) | 2019-11-14 | 2022-05-03 | International Test Solutions, Llc | System and method for cleaning wire bonding machines using functionalized surface microfeatures |
| US11035898B1 (en) | 2020-05-11 | 2021-06-15 | International Test Solutions, Inc. | Device and method for thermal stabilization of probe elements using a heat conducting wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140066450A (en) | 2014-06-02 |
| JP2014107561A (en) | 2014-06-09 |
| KR101473811B1 (en) | 2014-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103831676A (en) | Window cleaning kit for wire bonding apparatus, wire bonding apparatus including the same and cleaning method of capillary using the same | |
| CN109802548A (en) | Vibratory driver and portable equipment | |
| KR100889297B1 (en) | Cleaning jig of capillary for wire bonding, cleaning device of capillary for wire bonding, method for fabricating thereof and method for cleaning using the same | |
| US6085764A (en) | Cleaning apparatus and method | |
| CN109802545A (en) | Vibration actuator and portable equipment | |
| JP2009033864A (en) | Vibration generator | |
| JP2008147551A (en) | Wire bonding method and wire bonding device | |
| CN109802544A (en) | Vibration actuator and portable equipment | |
| KR20120101071A (en) | Megasonic multifrequency apparatus with matched transducers and mounting plate | |
| CN102547541A (en) | Piezoelectric sound component | |
| JP2006032506A (en) | Method and device for peeling semiconductor wafer | |
| US9979269B2 (en) | Micromechanical component and method for producing a micromechanical component | |
| JP2007245325A (en) | Ultrasonic grinding device and grindstone for use therein | |
| GB2449759A (en) | Methods for cleaning generator coils | |
| JP2005001096A (en) | Ultrasonic vibrating table | |
| JP2001062700A (en) | Wire saw | |
| JP2004351605A (en) | Ultrasonic vibrating table | |
| JP2008147550A (en) | Wire bonding method | |
| KR101068247B1 (en) | Apparatus For Removing The Burr On the Edge of Rod Ending Part | |
| US20090133712A1 (en) | Methods for cleaning generator coils | |
| KR101085461B1 (en) | Apparatus for small sized actuator using different elastic spring | |
| JP2009146916A (en) | Piezoelectric fan device | |
| JP4288363B2 (en) | Ultrasonic mounting tool and electronic component mounting apparatus | |
| JP5085228B2 (en) | Piezoelectric fan device | |
| KR101374269B1 (en) | Ultrasonic cleaner with demagnetization function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140604 |