KR20140066450A - Window cleaning kit for wire bonding apparatus, wire bonding apparatus including the same and cleaning method of capillary using the same - Google Patents

Abstract

Disclosed are a cleaning kit for a wire bonding apparatus capable of effectively removing foreign substances adhered to an end of a capillary while using the wire bonding for a long period of time, a wire bonding apparatus comprising the same, and a capillary cleaning method using the same. The cleaning kit for the wire bonding apparatus, according to an embodiment of the present invention, is a cleaning kit which fixes a wire bonding object and is used by being fixedly mounted to a window clamp having holes or as a removable type. The cleaning kit for the wire bonding apparatus comprises: a vibration generating plate mounted on the window clamp; and a polishing sheet attached to the vibration generating plate to be linked with the vibration generating plate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning kit for a wire bonding apparatus, a wire bonding apparatus including the cleaning kit, and a capillary cleaning method using the same. BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a window cleaning kit for a wire bonding apparatus, a wire bonding apparatus including the same, and a capillary cleaning method using the same. More particularly, A wire bonding apparatus including the cleaning kit, and a capillary cleaning method using the same.

BACKGROUND ART [0002] Techniques for connecting a light emitting chip and a substrate with a wire using a wire bonding apparatus in a semiconductor manufacturing process are widely used. In this wire bonding process, gold is often used as a wire. However, in recent years, there are cases where metal wires other than gold, such as copper, which are capable of signal processing at a higher speed and are inexpensive, are often used in response to demands for higher speed and lower cost of semiconductors.

In this wire bonding apparatus, a tube-shaped capillary is mounted to handle fine wires. One end of the wire is ball-bonded to the light emitting chip by the capillary, and the other end of the wire is stitch bonded to the substrate. That is, the wire bonding apparatus first provides a discharge flame to a wire extending a predetermined length to the lower end of the capillary so that a ball is formed. Then, the wire bonding apparatus moves the capillary toward the light emitting chip, and then supplies ultrasonic waves to the capillary so that the ball is ball-bonded to the light emitting chip. Finally, the wire bonding apparatus moves the capillary toward the substrate, and then provides ultrasonic waves to the capillary so that the other end of the wire is stitch bonded to the substrate. At this time, after the stitch bonding of the wire, the wire is disconnected from the substrate, and the above-described series of steps is repeated.

However, such a capillary, especially at the capillary end, is provided with various harsh environments. That is, a discharge flame is applied to the end portion of the capillary, and the molten portion of the wire is also contacted.

Further, when the capillary is brought into contact with the light emitting chip or the substrate, since the ultrasound energy is concentrated on the end portion of the capillary, the severity becomes more serious. For this reason, as the wire bonding is performed for a long time, various foreign substances accumulate on the end of the capillary. At the end of the capillary, the particles, the wire, the light emitting chip of the capillary itself decomposed by the discharge flame, and various metallic foreign substances by the substrate are continuously attached and accumulated.

As described above, when various metal foreign substances are accumulated on the end of the capillary, the shape of the end of the capillary is not constant, which causes a high rate of occurrence of bonding at the time of wire bonding.

Conventionally, various kinds of metal foreign substances are removed from the capillary by treating the capillary with a predetermined chemical agent. However, since such chemical agents can damage the capillary, after the chemical agent treatment is performed, Essential visual inspection is required. However, the treatment of the chemical agent of such a capillary takes a very long time, and in some cases, the capillary itself is damaged.

Because of this problem, after using the capillary for a certain period of time, the capillary itself is being replaced instead of being treated with the chemical agent, but in this case, it takes a long time to replace the capillary, There is a problem that the process yield is lowered due to reasons such as the operation setting being required to be executed again.

A related prior art is Korean Patent Publication No. 10-2010-0043410 (published on Apr. 29, 2010), which discloses a capillary and a wire bonding apparatus including the capillary.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a wire bonding apparatus and a wire bonding method for generating vibrations that can inevitably remove various metallic foreign substances adhering to the ends of a capillary during long- A wire bonding apparatus including the same, and a capillary cleaning method using the same.

According to an aspect of the present invention, there is provided a cleaning kit for a wire bonding apparatus, which fixes a wire bonding object, is fixedly mounted on a window clamp having a hole, or used in a detachable form. A vibration generating plate that is seated on the window clamp; And a polishing sheet attached to the vibration generating plate and interlocking with the vibration generating plate.

According to an aspect of the present invention, there is provided a wire bonding apparatus comprising: a capillary through which a wire passes; A bonding arm that fixes the capillary and controls up and down and left and right reciprocating movements of the capillary; A heater block mounted on a lower portion of the capillary and the bonding arm; A window clamp disposed on the heater block to fix a wire bonding object and having a plurality of holes; And a cleaning kit having a vibration generating plate mounted on the window clamp and a polishing sheet attached on the vibration generating plate and interlocking with the vibration generating plate.

According to another aspect of the present invention, there is provided a method of cleaning a capillary using a wire bonding apparatus, the method comprising the steps of: (a) attaching an end of a capillary to a bonding object, step; (b) driving a vibration generating plate interlocked with a polishing sheet of the cleaning kit to polish the end of the capillary; And (c) aligning the polished capillary to an upper portion of the wire bonding object.

The cleaning kit for a wire bonding apparatus according to the present invention is physically cleaned in a state where the capillary is fixed to the upper portion of the polishing sheet interlocked with the vibration plate for generating vibration, It is possible to effectively remove the metal foreign matter adhering to the end portion. As a result, the cleaning kit for a wire bonding apparatus according to the present invention can prolong the replacement cycle of the capillary by 2.5 times or more to drastically reduce the process loss, thereby reducing the capillary replacement cost. Currently, the replacement period of the capillary is about 800,000 rpm, but when the capillary is cleaned using the cleaning kit for a wire bonding device according to the present invention, it can be extended to 2,000,000 rats or more.

Further, the wire bonding apparatus according to the present invention includes a cleaning kit including a vibration generating plate and a polishing sheet, thereby performing wire bonding for a predetermined period of time. Thereafter, the wire bonding failure due to a metal foreign substance adhering to the capillary end It can be prevented in advance.

In addition, the capillary cleaning method using the wire bonding apparatus according to the present invention does not require a chemical agent treatment but also physical cleaning using a cleaning kit that generates vibration without replacing the capillary itself, There is no loss in cost due to the replacement of the capillary itself and there is an advantage in that the process yield can be improved since it is not necessary to perform the operation setting again.

1 is a view for explaining a cleaning kit for a wire bonding apparatus according to an embodiment of the present invention.
Fig. 2 is a perspective view showing the window clamp of Fig. 1;
3 is an exploded perspective view showing the vibration generating plate of FIG. 1 in an enlarged manner.
4 is a view for explaining a cleaning method using a cleaning kit.
5 is a view for explaining a cleaning kit for a wire bonding apparatus according to another embodiment of the present invention.
6 is a cross-sectional view taken along the line VI-VI 'of FIG.
7 is a view for explaining a cleaning kit for a wire bonding apparatus according to another embodiment of the present invention.
8 is a perspective view illustrating a wire bonding apparatus according to an embodiment of the present invention.
FIG. 9 is a flowchart showing a capillary cleaning method using a wire bonding apparatus according to an embodiment of the present invention.
10 is a photograph showing a state before the end of the capillary of the wire bonding apparatus is cleaned.
11 is a photograph showing the state after the end of the capillary of the wire bonding apparatus is cleaned.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Hereinafter, a cleaning kit for a wire bonding apparatus, a wire bonding apparatus including the same, and a capillary cleaning method using the same will be described in detail with reference to the accompanying drawings.

FIG. 1 is a view for explaining a cleaning kit for a wire bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the window clamp of FIG. 1 shows a state in which the cleaning kit is mounted at a position corresponding to a plurality of holes of the window clamp.

Referring to FIGS. 1 and 2, a window cleaning kit 100 for a wire bonding apparatus according to an embodiment of the present invention includes a plurality of holes H for fixing a wire bonding object (not shown) And is mounted and used in the window clamp 10.

At this time, although not shown in the drawings, the wire bonding object may be a substrate having a light emitting chip attached thereto. The substrate and the light emitting chips are transferred to the wire bonding device in order to make mutual electrical connection by wire bonding using a metal wire.

At this time, the window clamp 10 has a plurality of holes (H) exposing the light emitting chip attached on the substrate to perform wire bonding, and the plurality of holes (H) are arranged at the center portion. The window clamp 10 is disposed at a relatively higher position than the central portion of the window clamp 10 by bending the opposite side edges upward.

The window cleaning kit 100 for a wire bonding apparatus according to an embodiment of the present invention includes the vibration generating plate 120 and the polishing sheet 140.

The vibration generating plate 120 is seated on the window clamp 10. The vibration generating plate 120 may be designed to have a rectangular shape when viewed in a plan view, but it is not necessarily limited thereto, and it may be modified in various shapes such as a circle, a triangle, and a pentagon.

3 is an exploded perspective view of the vibration generating plate of FIG. 1 in an enlarged manner, and will be described in more detail with reference to FIG.

3, the vibration generating plate 120 includes a case 122, an electromagnetic force generator 124, a vibrator 126, and a vibration transmitting plate 128.

The case 122 has a box shape opened on the upper side. The case 122 serves to protect the electromagnetic force generator 124 and the vibrator 126, which will be described later, from external physical shocks. At this time, the case 122 is desirably designed to have a thickness of 8 to 12 mm. When the thickness of the case 122 is less than 8 mm, the thickness of the case 122 is too thin, so that it may be difficult to protect the electromagnetic force generator and the vibrator from external impacts. Conversely, when the thickness of the case 122 exceeds 12 mm, not only the workability is not easy but also the vibration efficiency may be lowered due to the increase in weight due to the increase in thickness.

The electromagnetic force generator 124 is inserted into the case 122 and receives electromagnetic power from a drive control unit (not shown) to generate an electromagnetic force. Although not shown in the figure, the electromagnetic force generator 124 may include a coil (not shown) through which a current flows and a magnetic body (not shown) that interacts with the current to generate an attractive force or a repulsive force .

The vibrator 126 vibrates under the action of an electromagnetic force. At this time, the electromagnetic force generator 124 and the vibrator 126 are preferably designed to have a thickness of 4 to 7 mm, respectively. When the thickness of the electromagnetic force generator 124 and the vibrator 126 is less than 4 mm, it may be difficult to generate vibration amount necessary for efficiently cleaning the end of the capillary. On the contrary, when the thickness of the electromagnetic force generator 124 and the vibrator 126 exceeds 7 mm, it acts as a factor to increase the total volume of the vibration generating plate and it may be difficult to secure the mounting area.

The vibration transmitting plate 128 covers the upper side of the case 122 and transmits the vibration from the vibrator 126 to the outside. The vibration transmitting plate 128 may be formed of a rigid material or an elastic material. SUS (stainless steel), titanium (Ti), or the like may be used as the material of the vibration transmitting plate 128. At this time, the vibration transmitting plate 128 is preferably formed to a thickness of 1 to 3 mm. If the thickness of the vibration transmitting plate 128 is less than 1 mm, it may be difficult to secure sufficient rigidity. Conversely, when the thickness of the vibration transmitting plate 128 exceeds 3 mm, it is advantageous in securing rigidity, but there is a problem that the vibration transmission efficiency is rapidly lowered.

When the driving power is applied to the coil of the electromagnetic force generator 124, more specifically, the coil of the electromagnetic force generator 124 from the drive control unit, the above-described vibration generating plate 120 generates a magnetic flux according to the direction of the current flowing along the coil. The magnetic flux thus generated generates an electromagnetic force through interaction with the magnetic body 126. As a result, when the electromagnetic force generated by the electromagnetic force generator 124 is applied to the vibrator 126 to vibrate, the vibration plate 126 receives the vibration and vibrates.

Although not shown in the drawings, the vibration generating plate 120 according to the present invention includes a case 122 which is open at the upper side, an ultrasonic vibrator 120 inserted in the case 122, And a vibration transmitting plate 128 covering the upper side of the case and transmitting the vibration of the ultrasonic vibration element to the outside.

FIG. 4 is a view for explaining a cleaning method using a cleaning kit. More specifically, FIG. 4 shows a process of cleaning a capillary end using a polishing sheet.

Referring to FIG. 4, a polishing sheet 140 is attached on the vibration generating plate 120 and interlocked with the vibration generating plate 120. The abrasive sheet 140 includes a base film 142 and abrasive grains 144 inserted into the base film 142. The abrasive grains 144 may be at least one selected from the group consisting of SiC, Al ₂ O ₃ , Cr ₂ O ₃ , Fe ₂ O ₃ , ZrO ₂ , CeO ₂ , SiO ₂ and BaCO ₃ .

The abrasive grains 144 may have a diameter of 5 to 10 mu m, more preferably a diameter of 2 to 4 mu m, and most preferably 2.5 to 3.5 mu m. This is to easily remove the bonded foreign matter 30 accumulated at the end of the capillary 50 and to prevent the end of the capillary 50 from being damaged. That is, when the diameter of the abrasive grains 144 is less than 5 탆, it may be difficult to effectively remove the bonded foreign matter 30 adhering to the end of the capillary 50. Conversely, if the diameter of the abrasive grains 144 exceeds 10 mu m, there is a fear that the ends of the capillary 50 are damaged.

At this time, the window cleaning kit 100 for the wire bonding apparatus is detachably attached at a position corresponding to the plurality of holes H of the window clamp 10. That is, when the wire bonding is performed using the capillary 50 for a predetermined time, the cleaning kit 100 may be used for removing the bonding foreign material 30 inevitably attached to the end of the capillary 50 The capillary 50 is mounted in a position corresponding to the plurality of holes H in a state in which the capillary 50 is moved in the upward direction away from the plurality of holes H. [ Thereafter, the capillary 50 is lowered and attached to the upper surface of the polishing sheet 140 of the cleaning kit 100, and the capillary 50 is removed by using the vibration generating plate 120 of the cleaning kit 100, ) Is cleaned by a physical friction method. The cleaning kit 100 is detached from the window clamp 10 after cleaning is completed.

FIG. 5 is a view for explaining a cleaning kit for a wire bonding apparatus according to another embodiment of the present invention, and FIG. 6 is a cross-sectional view taken along the line VI-VI 'of FIG. Here, in the other embodiments of the present invention, the same reference numerals are given to the same names as in the embodiment.

5 and 6, a cleaning kit 100 for a wire bonding apparatus according to another embodiment of the present invention includes a cleaning kit (not shown) for a wire bonding apparatus according to one embodiment shown in FIGS. 1 and 2 1 in Fig. 1).

However, the cleaning kit for a wire bonding apparatus according to an embodiment of the present invention is mounted on a window clamp 10 in a detachable form, And is mounted on the clamp 10 in a fixed manner. That is, although not shown in the drawing, the cleaning kit 100 is mounted on the window clamp 10 in such a manner that the cleaning clamp 100 is coupled and fixed by a bonding method using an adhesive (not shown) or a screw fastening method .

Further, the cleaning kit 100 for a wire bonding apparatus according to another embodiment of the present invention may be attached to one side edge of the window clamp 10, or may be attached to both side edges of the window clamp 10, respectively. Therefore, the cleaning kit 100 is mounted around the plurality of holes H of the window clamp 10.

In addition, the cleaning kit 100 for a wire bonding apparatus according to another embodiment of the present invention may further include an impact absorbing layer 160. The shock absorbing layer 160 is attached to the lower portion of the vibration generating plate 120 to prevent a physical impact with the window clamp 10. The impact absorbing layer 160 may be formed of one material selected from polyurethane, elastic rubber, silicone, sponge, styrofoam, and the like.

The impact absorbing layer 160 is preferably formed to a thickness of 10 to 50 mm. If the thickness of the impact absorbing layer 160 is less than 10 mm, it may be difficult to properly exhibit the shock absorbing function. Conversely, when the thickness of the impact absorbing layer 160 exceeds 50 mm, there is a risk of raising the manufacturing cost without further increase in the effect, which is not economical.

7 is a view for explaining a cleaning kit for a wire bonding apparatus according to another embodiment of the present invention. The cleaning kit for a wire bonding apparatus according to another embodiment of the present invention is substantially the same as the cleaning kit for a wire bonding apparatus according to an embodiment of the present invention, and a description thereof will be omitted.

7, a cleaning kit 100 for a wire bonding apparatus according to another embodiment of the present invention includes a vibration transmission plate 128, a case 122, an electromagnetic force generator 124, a vibrator 126, And a vibrating connection wiring 129.

The vibration transmitting plate 128 is seated on the window clamp 10 and receives vibration from the vibrator 126 from the vibration connecting wiring 129. At this time, the vibration transmission plate 128 may be formed of a rigid material or an elastic material. SUS (stainless steel), titanium (Ti), or the like may be used as the material of the vibration transmitting plate 128.

The case 122 is mounted on one side remote from the window clamp 122, and may have a box shape.

The electromagnetic force generator 124 is inserted into the case 122 and receives electromagnetic power from a drive control unit (not shown) to generate an electromagnetic force. Then, the vibrator 126 vibrates under the action of an electromagnetic force.

The vibration connection wiring 129 serves to transmit the vibration from the vibrator 126 to the vibration transmission plate 128.

The vibration generating plate according to another embodiment of the present invention seats only the vibration transmitting plate on the window clamp and the components other than the vibration transmitting plate are mounted on the side separated from the window clamp, There is a better aspect.

8 is a perspective view illustrating a wire bonding apparatus according to an embodiment of the present invention.

8, a wire bonding apparatus 200 according to an embodiment of the present invention includes a capillary 50, a bonding arm 60, a heater block 80, a window clamp 10, and a cleaning kit 100).

The capillary 50 passes through the wire 52. At this time, although not shown in the drawing, the wire 52 may be wound around a spool (not shown).

The bonding arm 60 fixes the capillary 50 and serves to control the upward and downward and leftward and rightward reciprocating movements of the capillary 50.

The heater block 80 is mounted to the bottom of the capillary 50 and the bonding arm 60.

The window clamp 10 is disposed on the heater block 80 to fix a wire bonding object and has a plurality of holes H. [

The cleaning kit 100 includes a vibration generating plate 120 mounted on the window clamp 10 and a polishing sheet 140 attached on the vibration generating plate 120 to interlock with the vibration generating plate 120 .

The cleaning sheet 100 may be attached to the window clamp 10 when the end of the capillary 50 is to be cleaned in a state where the cleaning sheet 100 is disposed on a side away from the window clamp 10, After the cleaning of the end of the window clamp 10 is completed. Alternatively, the cleaning sheet 100 may be attached in a fixed form to one side of the window clamp 10, or may be attached in a fixed form on each side. In this case, the wire bonding apparatus 200 performs wire bonding for a set time. When the end of the capillary 50 is cleaned, the capillary 50 is fixed to the window clamp 10 and then washed and wire-bonded repeatedly in such a manner as to return to the wire bonding position after the cleaning is completed.

In addition, the wire bonding apparatus 200 according to the embodiment of the present invention may further include a window clamp clamp 70.

The window clamps 70 are mounted on both side edges of the window clamp 10 to prevent the window clamp 10 from flowing.

The wire bonding apparatus including the cleaning kit according to the above-described embodiment of the present invention can effectively clean the end portion of the capillary by mounting the self-oscillating cleaning sheet on the window clamp, There is an advantage in that it is possible to reduce time and cost for replacement.

Hereinafter, a capillary cleaning method using a wire bonding apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 9 is a flowchart showing a capillary cleaning method using a wire bonding apparatus according to an embodiment of the present invention.

Referring to FIG. 9, a method of cleaning a capillary using a wire bonding apparatus according to an embodiment of the present invention includes a capillary attaching step (S210), a capillary polishing step (S220), and a wire bonding And a capillary alignment step S230 on the object.

washing Kit  On Capillary  Attach

In the capillary attaching step (S210) on the cleaning kit, the end of the capillary, to which the wire bonding is performed, is attached to the upper portion of the cleaning kit with respect to the object to be bonded. At this time, the set time can be defined as the time when the wire bonding is performed. For example, the set time may be 12 to 20 hours, but is not limited thereto.

Capillary polishing

In the capillary polishing step (S220), the end of the capillary is polished by driving the vibration generating plate interlocked with the polishing sheet of the cleaning kit. In this step, it is preferable that the capillary is fixed and the polishing sheet interlocked with the vibration generating plate is vibrated.

In the case of the present invention, since the vibration generating plate is driven in a state in which the capillary is fixed, vibration can be transmitted to the polishing sheet interlocked with the capillary so that the end portion of the capillary can be directly polished. The attached metal foreign matter can be removed more effectively. At this time, friction between the capillary and the polishing sheet can be controlled by adjusting the vibration intensity of the vibration generating plate.

Capillary alignment above wire bond object

In the capillary aligning step S230 above the wire bonding object, the capillary having been polished is aligned with the upper portion of the wire bonding object. At this time, since the end of the capillary is in the state of performing the above-described capillary polishing step (S220), wire bonding can be performed immediately.

10 is a photograph showing a state before cleaning the capillary end of the wire bonding apparatus, and Fig. 11 is a photograph showing a state after cleaning the capillary end of the wire bonding apparatus.

First, as shown in FIG. 10, it can be confirmed that a bonding foreign matter adheres to the periphery of the end portion of the capillary.

As shown in FIG. 11, after the end of the capillary is cleaned using the capillary cleaning method using the wire bonding apparatus according to the embodiment of the present invention, it can be seen that almost all the bonded foreign substances are removed.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. These changes and modifications may be made without departing from the scope of the present invention. Accordingly, the scope of the present invention should be determined by the following claims.

100: cleaning kit 120: vibration generating plate
122: Case 124: Electromagnetic force generator
126: oscillator 128: oscillation transmitting plate
129: Vibration connection wiring 140: Polishing sheet
142: base film 144: abrasive grains
160: shock absorbing layer
200: wire bonding device 10: window clamp
30: metal foreign substance 50: capillary
52: wire 60: bonding arm
70: window clamp clamp 80: heater block
S210: Step of attaching the capillary on the cleaning kit
S220: Capillary polishing step
S230: capillary alignment step to the top of the wire bonding object

Claims (16)

A cleaning kit for fixing a wire bonding object, fixedly mounted on a window clamp having a hole, or used in a detachable form,
A vibration generating plate mounted on the window clamp; And
And a polishing sheet attached on the vibration generating plate and interlocking with the vibration generating plate.
The method according to claim 1,
The cleaning kit
Wherein the fixing member is attached to one side edge of the window clamp or is attached to both side edges of the window clamp.
The method according to claim 1,
The vibration generating plate
A case in which an upper side is opened,
An electromagnetic force generator inserted in the case and generating an electromagnetic force by receiving power,
A vibrator that vibrates under the action of the electromagnetic force,
And a vibration transmitting plate covering the upper side of the case and transmitting the vibration from the vibrator to the outside.
The method of claim 3,
The electromagnetic force generator
A coil through which a current flows,
And a magnetic body that interacts with the current to generate an attractive force or a repulsive force.
The method according to claim 1,
The vibration generating plate
A vibration transmission plate seated on the window clamp,
A case having a box shape and mounted on a side away from the window clamp,
An electromagnetic force generator inserted in the case and generating an electromagnetic force by being supplied with power;
A vibrator that vibrates under the action of the electromagnetic force,
And a vibration connecting wiring for transmitting vibration from the vibrator to the vibration transmitting plate.
The method according to claim 1,
The vibration generating plate
A case in which an upper side is opened,
An ultrasonic vibration element inserted in the case and generating ultrasonic vibration by receiving power,
And a vibration transmitting plate covering the upper side of the case and transmitting the vibration of the ultrasonic vibration element to the outside.
The method according to claim 1,
The polishing sheet
A base film,
And abrasive grains inserted in the base film.
8. The method of claim 7,
The abrasive particles
Wherein at least one of SiC, Al ₂ O ₃ , Cr ₂ O ₃ , Fe ₂ O ₃ , ZrO ₂ , CeO ₂ , SiO ₂ and BaCO ₃ is contained.
8. The method of claim 7,
The diameter of the abrasive grains
5 to 10 mu m. ≪ / RTI >
The method according to claim 1,
The cleaning kit
And a shock absorbing layer attached to a lower portion of the vibration generating plate to prevent a physical impact with the window clamp.
11. The method of claim 10,
The impact-
Wherein the elastic member is formed of one material selected from polyurethane, elastic rubber, silicone and sponge, and has a thickness of 10 to 50 mm.
A capillary through which the wire passes;
A bonding arm that fixes the capillary and controls up and down and left and right reciprocating movements of the capillary;
A heater block mounted on a lower portion of the capillary and the bonding arm;
A window clamp disposed on the heater block to fix a wire bonding object and having a plurality of holes; And
And a cleaning kit having a vibration generating plate mounted on the window clamp and a polishing sheet attached on the vibration generating plate and interlocking with the vibration generating plate.
13. The method of claim 12,
The cleaning kit
And a shock absorbing layer attached between the window clamp and the vibration generating plate.
14. The method of claim 13,
The impact-
A thickness of 10 to 50 mm, and is formed of one material selected from polyurethane, elastic rubber, silicone, and sponge.
A capillary cleaning method using the wire bonding apparatus according to any one of claims 12 to 14,
(a) attaching an end portion of the capillary to which the wire bonding is performed to the bonding object over the cleaning kit for a set time;
(b) driving a vibration generating plate interlocked with a polishing sheet of the cleaning kit to polish the end of the capillary; And
(c) aligning the polished capillary to an upper portion of the wire bonding object. < Desc / Clms Page number 20 >
16. The method of claim 15,
In the step (b)
The polishing
Wherein the capillary is fixed and the polishing sheet interlocked with the vibration generating plate is vibrated.

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