CN103823329A - Mask plate and a defect detection method for same - Google Patents

Mask plate and a defect detection method for same Download PDF

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Publication number
CN103823329A
CN103823329A CN201210465858.6A CN201210465858A CN103823329A CN 103823329 A CN103823329 A CN 103823329A CN 201210465858 A CN201210465858 A CN 201210465858A CN 103823329 A CN103823329 A CN 103823329A
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pattern
mask plate
determining defects
defect
square
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CN103823329B (en
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凌文君
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Semiconductor Manufacturing International Shanghai Corp
Semiconductor Manufacturing International Corp
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Semiconductor Manufacturing International Shanghai Corp
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  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

The invention discloses a mask plate and a defect detection method for the same. A plurality of defect determination patterns are arranged between a pattern area and a sealed frame of the mask plate, so that required points can be automatically selected and judged according to the defect determination patterns through a detection unit in a detection process, the manual operation of a technician is avoided, and influence probably caused by the manual operation is further avoided. In addition, due to the adoption of the mask plate, time and labor can be saved, and the working efficiency and the production efficiency are greatly improved.

Description

Mask plate and it is carried out to the method for defects detection
Technical field
The present invention relates to integrated circuit and manufacture field, particularly a kind of mask plate and it is carried out to the method for defects detection.
Background technology
The manufacturing of integrated circuit is a very complicated process, and wherein, photoetching technique is one of the most complicated technology, is also the important motivity that promotes integrated circuit technology development, the whether powerful performance that is directly determining chip of photoetching technique.
Mask plate is a part indispensable in photoetching process, and the quality of mask plate quality is determining that can subsequent technique realize preferably.Therefore must detect it after mask plate completes, to judge whether it satisfies the demand.
The detection method often having in the industry is at present mainly and adopts the STARLight light shield check system of KLA-tencor to detect, and this mainly selects from the angle of accuracy and precision.But STARLight light shield check system also has the defect of itself, such as for a brand-new mask plate, must need related personnel to carry out manual operation finish the work foundation (setup), a series of processes such as calibration (calibration) etc., this is one wastes time and energy very much, the work that can not ensure the quality of products again.Operating personnel are difficult to guarantee the correctness of the selection of each point in this process, once there is mistake, will make some false defect numbers (false count) increase, thereby think that the performance of mask plate is not up to standard, especially for the mask plate that is greater than F level, this phenomenon will be more remarkable.
Therefore, how to overcome this present situation, the impact that as much as possible human factor caused reduces, and will be conducive to the raising of detection level of mask plate.
Summary of the invention
The object of the present invention is to provide a kind of mask plate and it is carried out to the method for defects detection, to solve in prior art manual operation length consuming time, inefficient problem.
For solving the problems of the technologies described above, the invention provides a kind of mask plate, comprising:
Pattern area and seal frame, described seal frame surrounds pattern area, has multiple determining defects patterns between described seal frame and pattern area.
Optionally, for described mask plate, described determining defects pattern comprises linear pattern and square pattern.
Optionally, for described mask plate, described linear pattern comprises one or more in OPC pattern, horizontal and vertical short-term bar.
Optionally, for described mask plate, described square pattern comprises one or more in intensive square, sparse square, cross-wise lines, longitudinal lines and oblique lines.
Optionally, for described mask plate, described determining defects pattern is 4.
Optionally, for described mask plate, described determining defects pattern is evenly distributed between described seal frame and pattern area.
Optionally, for described mask plate, the described determining defects pattern being positioned on same diagonal line has identical structure.
Optionally, for described mask plate, be positioned at the structure difference of the described determining defects pattern on different diagonal line.
The present invention improves a kind of method of utilizing mask plate as above to carry out defects detection, comprising:
Detecting unit is provided;
Described mask plate is placed in described detecting unit, if the defect detecting is identical with described determining defects pattern, judges it is not defect; If the defect detecting is not identical with described determining defects pattern, judge it is defect.
Compared with prior art, carry out in the method for defects detection at mask plate provided by the invention and to it, between the pattern area of mask plate and seal frame, be provided with multiple determining defects patterns, thereby in testing process, needed point be selected and be weighed to detecting unit can automatically according to determining defects pattern, so just do not need technician's manual operation, and then the impact of having avoided manual operation to bring, adopt mask plate provided by the invention can save time and manpower simultaneously, thereby increase work efficiency greatly and production efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of the mask plate of the embodiment of the present invention;
Fig. 2 is the schematic diagram of the linear pattern of the embodiment of the present invention;
Fig. 3 is the schematic diagram of the square pattern of the embodiment of the present invention.
Embodiment
The method of carrying out defects detection to mask plate provided by the invention and to it below in conjunction with the drawings and specific embodiments is described in further detail.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying, only in order to convenient, the object of the aid illustration embodiment of the present invention lucidly.
Please refer to Fig. 1; the mask plate 100 of the embodiment of the present invention has following structure: substrate 101; be preferably quartz base plate; on substrate 101, be formed with seal frame 102 and be positioned at the pattern area 103 of seal frame 102 interior zones; on described seal frame 102, be formed with diaphragm (pellicle), these all can adopt existing technique to form.Main points of the present invention are, described mask plate also has determining defects pattern 104, the region of described determining defects pattern 104 between seal frame 102 and pattern area 103; Also determining defects pattern 104 can be arranged in described pattern area 103, consider the impact possible on pattern area, and the edge of pattern area is generally blank, be preferably the edge that is arranged at pattern area 103.Be understandable that, position the present embodiment of described determining defects pattern 104 is only for example at this, should be not affect the manufacture of pattern area, and can be protected film protection and be advisable.
As described in the background art, in the testing process of mask plate, be easy to make false defect number (false count) to increase, inventor analyzed the testing process of different mask plates through the long period, found that most false defects is to have general character.For the mask plate that can form the layer (line/space layer) with linear structure, conventionally OPC pattern, some are short and small, uneven, and horizontal and vertical (horizontal and vertical at this is in the industry conventional X/Y direction, specifically can show the direction on the adjacent both sides of mask plate, lower with) lines be easy to be determined into defect; For the mask plate that can form the layer (contact/via layer) with pore space structure, conventionally at intensive square (dense contact, be hole close quarters), sparse square (sparse contact, i.e. hole sparse region), cross-wise lines, longitudinally lines can be determined into defect with oblique (with the described horizontal and vertical acute angle that is) lines place.And being most mask plates, these above-mentioned shapes all have, and being these shape places, actual conditions do not there is defect, therefore inventor determines on the basis of original mask plate, to set relevant pattern, contrasts, thereby avoid erroneous judgement in testing process.
Preferably, can there are multiple determining defects patterns 104, and multiple determining defects pattern 104 to comprise above-mentioned two situations (linear pattern and square pattern).The present embodiment adopts 4 determining defects patterns 104, comprises two linear patterns 1041 and two square patterns 1042.4 determining defects patterns 104 are evenly distributed between described seal frame 102 and pattern area 103.In order to be conducive to practical application, described determining defects pattern 104 alternative arrangements, the described determining defects pattern 104 being positioned on same diagonal line has identical structure, be positioned at the structure difference of the described determining defects pattern 104 on different diagonal line, namely the linear pattern 1041 of the present embodiment and the spread pattern of square pattern 1042.It is up and down, identical but linear pattern 1041 and square pattern 1042 are preferably that certain described linear pattern 1041 and square pattern 1042 also can be arranged between seal frame 102 and pattern area 103 region, and be greater than 1.
Please refer to Fig. 2, it is the structural representation of linear pattern 1041, as seen from the figure, it can be divided into 4 regions, first area 201, second area 202, the 3rd region 203 and the 4th region 204, described first area 201, second area 202 and the 3rd region 203 have mainly concentrated some short and small, uneven horizontal and vertical lines, the 4th region 204 is mainly the pattern after OPC, here be noted that, conventionally reticle pattern is all to process through OPC, therefore the difference in described four regions is mainly the pattern of lines, it is described first area 201, short and small in second area 202 and the 3rd region 203, uneven lines are factors of erroneous judgement, in the 4th region 204, be that OPC processes impact judgement.In addition, described first area 201, second area 202, the three regions 203 and the 4th region 204 be not limited to Fig. 2 to pattern, be also not limited to the arrangement of Fig. 2, as long as it can be concluded described influence factor into this determining defects pattern.
Then, please refer to Fig. 3, it is the structural representation of square pattern 1042, as seen from the figure, it also can be divided into 4 regions, the 5th 301, the six regions 302, region, SECTOR-SEVEN territory 303 and Section Eight territory 304, described the 5th region 301 is intensive squares, described the 6th region 302 is to comprise cross-wise lines, longitudinal lines and intensive square, and described SECTOR-SEVEN territory 303 is to comprise oblique lines and intensive square, and described Section Eight territory 304 is sparse squares.It should be noted that, 301, the six regions 302, described the 5th region, SECTOR-SEVEN territory 303 and Section Eight territory 304 be not limited to Fig. 3 to pattern, be also not limited to the arrangement of Fig. 3, as long as it can be concluded described influence factor into this determining defects pattern.
On the basis of above-described embodiment, the mask plate obtaining just will become simple in actual testing process.The method of utilizing described mask plate to carry out defects detection comprises: detecting unit is provided, can be STARlight(simultaneous transmission and reflection of light for model at this) light shield check system, only need technician that described mask plate is placed in described light shield check system, it will set up voluntarily according to described determining defects pattern the process of (setup), calibration (calibration) and scanning, thereby avoid manually carrying out the human factor occurring in the process of setup, reduced erroneous judgement.After Setup, if the defect detecting is identical with described determining defects pattern, judge it is not defect; If the defect detecting is not identical with described determining defects pattern, judge it is defect.
Through the new mask plate of one species is carried out to actual detection, obtain following result:
Table one
Figure BDA00002420282000052
Table two
Wherein, table one detects for existing method, and table two is for to detect according to method of the present invention.From above table, adopt mask plate of the present invention and detection method can greatly reduce the occurrence rate of false defect, saved detection time simultaneously, but, although the saving of detection time is only at 3 ~ 5 minutes, its actual conditions are that now methodical whole process all needs have technician on the scene, and method and technology personnel of the present invention mainly place and take off mask plate, and automation mechanized operation ability improves greatly.The experiment proved that, mask plate of the present invention and detection method can each mask plate detection shorten the time of 3 ~ 5 minutes, the labour of every day can save approximately 7.5 hours (work in 8 hours), therefore can economize out the task that a large amount of time gone other, enhance productivity greatly, detect performance (performance) simultaneously and will improve 5% ~ 10%, and then make the production capacity of equipment every day improve approximately 10%.
In the mask plate that above-described embodiment provides and the preparation method of mask plate, between the pattern area of mask plate and seal frame, be provided with multiple determining defects patterns, thereby in testing process, needed point be selected and be weighed to detecting unit can automatically according to determining defects pattern, so just do not need technician's manual operation, and then the impact of having avoided manual operation to bring, adopt mask plate provided by the invention can save time and manpower simultaneously, thereby increase work efficiency greatly and production efficiency.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention invention.Like this, if within of the present invention these are revised and modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to including these changes and modification.

Claims (9)

1. a mask plate, is characterized in that, comprising:
Pattern area and seal frame, described seal frame surrounds pattern area, has multiple determining defects patterns between described seal frame and pattern area.
2. mask plate as claimed in claim 1, is characterized in that, described determining defects pattern comprises linear pattern and square pattern.
3. mask plate as claimed in claim 2, is characterized in that, described linear pattern comprises one or more in OPC pattern, horizontal and vertical short-term bar.
4. mask plate as claimed in claim 2, is characterized in that, described square pattern comprises one or more in intensive square, sparse square, cross-wise lines, longitudinal lines and oblique lines.
5. mask plate as claimed in claim 1, is characterized in that, described determining defects pattern is 4.
6. mask plate as claimed in claim 5, is characterized in that, described determining defects pattern is evenly distributed between described seal frame and pattern area.
7. mask plate as claimed in claim 6, is characterized in that, the described determining defects pattern being positioned on same diagonal line has identical structure.
8. mask plate as claimed in claim 6, is characterized in that, is positioned at the structure difference of the described determining defects pattern on different diagonal line.
9. utilize mask plate described in claim 1 ~ 8 any one to carry out the method for defects detection, it is characterized in that, comprising:
Detecting unit is provided;
Described mask plate is placed in described detecting unit, if the defect detecting is identical with described determining defects pattern, judges it is not defect; If the defect detecting is not identical with described determining defects pattern, judge it is defect.
CN201210465858.6A 2012-11-16 2012-11-16 Mask plate and the method that it is carried out defects detection Active CN103823329B (en)

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Application Number Priority Date Filing Date Title
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CN103823329B CN103823329B (en) 2016-09-07

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070066805A (en) * 2005-12-22 2007-06-27 주식회사 하이닉스반도체 Photomask for detecting a defect
CN101093520A (en) * 2006-06-23 2007-12-26 株式会社日立高新技术 System and method for detecting a defect
CN101275920A (en) * 2007-03-30 2008-10-01 Hoya株式会社 Pattern flaw detection method, photo mask manufacturing method and pattern transfer printing method
WO2011062279A1 (en) * 2009-11-20 2011-05-26 独立行政法人産業技術総合研究所 Method of examining defects, wafer subjected to defect examination or semiconductor element manufactured using the wafer, quality control method for wafer or semiconductor element, and defect examining device
CN102486604A (en) * 2010-12-03 2012-06-06 中芯国际集成电路制造(北京)有限公司 Phase shift mask, manufacturing method thereof and haze defect detection method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070066805A (en) * 2005-12-22 2007-06-27 주식회사 하이닉스반도체 Photomask for detecting a defect
CN101093520A (en) * 2006-06-23 2007-12-26 株式会社日立高新技术 System and method for detecting a defect
CN101275920A (en) * 2007-03-30 2008-10-01 Hoya株式会社 Pattern flaw detection method, photo mask manufacturing method and pattern transfer printing method
WO2011062279A1 (en) * 2009-11-20 2011-05-26 独立行政法人産業技術総合研究所 Method of examining defects, wafer subjected to defect examination or semiconductor element manufactured using the wafer, quality control method for wafer or semiconductor element, and defect examining device
CN102486604A (en) * 2010-12-03 2012-06-06 中芯国际集成电路制造(北京)有限公司 Phase shift mask, manufacturing method thereof and haze defect detection method thereof

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