CN103814627A - 用于将嵌入的芯片连接到印刷电路板中的方法和设备 - Google Patents

用于将嵌入的芯片连接到印刷电路板中的方法和设备 Download PDF

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CN103814627A
CN103814627A CN201280045830.5A CN201280045830A CN103814627A CN 103814627 A CN103814627 A CN 103814627A CN 201280045830 A CN201280045830 A CN 201280045830A CN 103814627 A CN103814627 A CN 103814627A
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pcb
microchip
circuit board
printed circuit
attached
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潘弘柏
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Mosaid Technologies Inc
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Mosaid Technologies Inc
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Abstract

本发明描述了用于将微芯片（3）安装到印刷电路板（PCB）1内的方法和设备。PCB1具有腔（2），其中在该腔（2）内安装微芯片（3）。建立到PCB1中的信号线的连接（28），并且用模塑混合物（30）填充腔（2）。在一些实施例中，将一个（4）或两个（5）嵌入金属层热连接到微芯片（3），以提高热导率。根据实施例将热面板（8）和（9）或者热沉（18）和（19）附接到嵌入金属层（4）和（5），以进一步增加热导率。

Description

用于将嵌入的芯片连接到印刷电路板中的方法和设备
相关申请的交叉引用
本申请要求在2011年9月21日提交的、名称为“METHOD ANDAPPARATUS FOR CONNECTING INLAID CHIP INTO PRINTEDCIRCUIT BOARD”、申请号为61/537206的美国临时专利申请的优先权，该美国临时专利申请通过引用被全部包含于此。
技术领域
本发明涉及将半导体集成电路安装到印刷电路板，本发明更具体涉及将存储装置安装到印刷电路板，并且本发明尤其涉及用于将存储装置安装到PCB并同时提供充分散热的方法和设备。
背景技术
移动消费电子产品（仅举几例，例如蜂窝电话、便携式计算机、个人数字助理（PDA）和MP3播放器）的出现，已经增加了对紧凑的高性能存储装置的需求。在很多方面，半导体存储装置的现代发展可被看作是使用尽可能小的装置以规定的运行速度提供最大数量的数据位的过程。在此背景下，术语“最小”通常表示在“横向”X/Y平面中由存储装置占用的最小面积，该“横向”X/Y平面例如是图1所示的由印刷电路板（PCB）或者模块板传统结构的主表面所限定的平面。
毫不意外地，对由半导体装置占用的可容忍的横向面积的限制已激发微芯片设计者垂直集成他们的装置的数据存储容量。因此，多年来，本来可能在横向平面中彼此相邻排列的多个存储装置已经变成在相对于横向X/Y平面的Z平面中，由一个存储装置垂直堆叠在另一个之上。
所谓的“硅通孔（TSV）”制造的最新发展已经促使趋势朝向垂直堆叠的半导体存储装置。迄今为止，大部分3D堆叠技术仅关注垂直方向的芯片级集成。在PCB（印刷电路板）上，每个单独的芯片需要空间来将信号引脚电连接以及物理连接到PCB节点。此外，由于高容量微芯片的增加的功耗，由微芯片产生的热量问题已变得更加糟糕。因此，除了一些逻辑微芯片之外，包括CPU（中央处理单元）、GPU（图形处理单元）和高性能存储器（DDR3、DDR4、GDDR5等）的大部分主要的半导体芯片，需要高效的热沉（heat sink）结构。热沉被物理地设计为增加与围绕它的冷却流体（例如空气）接触的表面面积。逼近气流速度(approach air velocity)、材料选择、散热片（或其他突出物）设计以及表面处理是影响热沉的热阻（即热性能）的一些设计因素。由于热沉的这种表面面积需求，因此CPU或GPU具有体积较大的热沉，并且需要足够的空间在PCB上安装微芯片和关联的热沉这两者。近来，移动革新已经骤增为半导体工业的主趋势，这使得电气元件的紧凑设计是强制性的。
移动产品尤其需要PCB的紧凑设计以及每个单独元件的小形状因子，以便缩小移动产品的总的大小。消费者市场仍然要求移动产品至少有主流便携式电脑级别的性能。因此，简单地采用具有大的热沉的便携式CPU和GPU不是一种可行的解决方案。系统设计者努力寻找在系统速度确定元件（例如CPU、GPU和诸如DRAM的主存储器）的功耗和性能之间的最佳权衡。热沉效率由热沉的总面积以及热沉本身和芯片封装材料的热特征来确定。主芯片元件（CPU、GPU和主存储器）应该具有热沉散热片或者面板，以从它们扩散热量，这使得PCB的总面积不能被缩小到如系统设计者所期望的那样。此外，封装本身需要一些空间，以具有如图1中所示的焊球连接。真实芯片的大小通常小于封装本身。当然在实际应用中，如图2所示，存在安装到PCB的数个芯片。
用于提供更好的芯片安装和热沉布置的一种建议的解决方案是如图3所示的Ruwel技术的铜嵌入技术。铜嵌入技术对于从电路板直接迁移热量的现有概念提供了一种可选方式。在热关键元件下将热通孔排成阵列，其目标是通过内层上的铜区域或者通过板将热量从该元件传递到热沉。与普通的镀通孔不同，热通孔不需要彼此电绝缘，并且因此允许较高的孔密度。由于孔中的铜是高传导性的，因此最大数量的小孔将产生最低的热阻。
热通孔的典型阵列具有约30W/mK的平均热导率（thermalconductivity）。热通孔是用于散热的一种有效方法，这是因为孔是在标准钻孔过程中钻好的。该技术的逻辑后续发展是由铜嵌入技术取代热通孔阵列，其中将一块固体铜按压并锚定到电路板的整个厚度内。铜嵌体首先充当功率半导体的焊料表面，并且其次充当通过电路板的高效热导路径（从热量的来源到热沉）。从那一侧，可使用导热胶粘剂将热量直接迁移到合适的热沉。铜嵌体的热导率的典型值为370W/mK，这意味着效率比热通孔多10倍。除了绝佳的热导率，元件插入工艺也存在优点，这是因为如果使用热通孔，焊膏不能流入孔，并且在其整个接触表面上焊接该元件。此外，该技术非常有效并且能够完全自动化。
然而，甚至这种具有高热导率的紧凑PCB设计的新方法也不能解决封装本身的形状因子的根本问题。并且如图3所示，仅允许一侧的热扩散。
通常由如最终元件产品的封装元件来覆盖微芯片。该附加处理步骤要求芯片制作者更多的测试时间和成本。此外，每个芯片的封装大小严重影响最终电子产品的总形状因子。尽管采用新类型的通风方法，以及为每个发热微芯片使用小风扇提高了热导率，但损失是付出复杂度大小和功率使用。最近，晶片自身作为最终元件被出售给系统制造者，该晶片不由芯片制造者封装。在这种情况下，系统使用者可以基于他们的系统需求和PCB大小很容易地确定他们自己的形状因子。需要一种用于保持有效热传递的微芯片安装的改进方法和设备。
发明内容
本发明提供一种用于保持有效热传递的微芯片安装的改进方法和设备。本发明允许在PCB板的内部安装微芯片，其具有将热量从微芯片传递到该板和外部环境的能力。
本发明不需要在芯片制造阶段的封装过程。与其中所有需要的微芯片被安装到具有大体为平面的顶部和底部表面的PCB上的现有封装技术相比，占据较大的PCB区域并且产生运转热量的所有或者一些微芯片被嵌入到PCB内。比起当前在PCB上安装芯片，其结果是消耗了较少的区域。此外，可在PCB的两侧提供热面板或者热沉，以增加空气流动。与用于当前PCB的单个热面板或热沉相比。从系统的观点，本发明提供了紧凑和多用途的系统设计，以实现在移动产品中作为关键因素的小形状因子。本发明还使用在PCB上的两侧的热面板布置，来提供具有竞争力的热扩散。PCB上不是所有的芯片都必须使用该方法。该方法可以仅应用于关键的以及产生热量的一个或多个芯片，该一个或多个芯片需要较大的PCB区域用于进行安装。无需进行芯片封装，包含在PCB内的微芯片和信号线要好于半导体工业中可用的封装方法。
另一个实施例允许将热沉附接到微芯片，以进一步增加热量传递。本实施例的进一步改进允许将热沉附接到微芯片的两侧。
然而，其他实施例用具有高热导率的热面板代替一个或数个热沉。
本发明的进一步的实施例允许信号线在嵌入到PCB板中的微芯片之下和周围穿过。
然而，另一个实施例允许将突起焊接点添加到本发明，以提供增强的布线灵活性。
附图说明
为清楚起见结合所附附图，根据下文的具体实施方式，本发明的特征和优点将变得明显。图中仅示出单个芯片，但应该理解，PCB板上的芯片的实际数量远远超过一个。
图1是PCB上的传统微芯片布置的横截面图；
图2是PCB上的多个微芯片布置的俯视图；
图3是可选的安装到PCB的微芯片的横截面图；
图4是本发明的第一实施例的横截面图；
图5是本发明的第二实施例的横截面图；
图6是图3的实施例的细节横截面图；
图7是图4的实施例的细节横截面图；
图8是本发明的第三实施例的细节横截面图；
图9是本发明的第四实施例的细节横截面图；
图10是本发明的第五实施例的细节横截面图；
图11是本发明的第六实施例的细节横截面图；
图12是本发明的第七实施例的细节横截面图；
图13是本发明的第八实施例的细节横截面图；
图14是本发明的第九实施例的细节横截面图。
具体实施方式
图4是本发明的第一实施例的剖面图。具有大体为平面的顶部和底部表面的PCB1包括腔2，其包含微芯片3。可以通过在PCB1中切割出一个凹槽来创建腔2，或者腔2可存在于PCB1的原始冲压件中。嵌入金属层4处于顶部表面6上，且类似的嵌入金属层5与微芯片3的底部表面7相接触。嵌入金属层4和5是小块的导热金属，例如铜、铝和银。尽管示出了两个热面板，但某些应用可能只有一个热面板或者甚至没有热面板。顶部热面板8与嵌入金属层4相接触。底部热面板9可被提供来与嵌入金属层5相接触。在运转时，来自微芯片3的热量通过嵌入金属层5和6传递到热面板8和9，在此热量可被散发。
图5是本发明的第二实施例的剖面图。该实施例类似于图4，除了其使用热沉而不是热面板。尽管示出了两个热沉，但某些应用可能具有一个热沉或者甚至没有热沉。具有大体为平面的顶部和底部表面的PCB11包括腔12，其包含微芯片13。嵌入金属层14处于顶部表面16上，并且类似的嵌入金属层15与微芯片13的底部表面17相接触。顶部热沉18与嵌入金属层14相接触。底部热沉19可被提供来与嵌入金属层15相接触。在运转中，来自微芯片13的热量通过嵌入金属层15和16传递到热沉18和19，在此热量可被散发。
图6是图3的实施例的细节横截面图，具有单个热沉。微芯片23被安装在腔22中。嵌入金属层24与微芯片23的底部表面27热接触。通过使用导热胶粘剂26将单个热沉25连接到嵌入金属层24。用焊线29执行从微芯片23的顶部表面29上的焊接点（pad）到PCB信号接触点的信号连接。用模塑混合物30填充腔22的剩余部分。如果如图6所示的那样嵌入微芯片23，则在微芯片和PCB信号接触点之间的任何其他类型的连接包括在所提供的实施例中。与目前可用的热沉方法相比，嵌入金属层24保证了更好的热导率。
图7是图4的实施例的细节横截面图，具有单个热面板35而不是热沉。热面板35具有比热沉更高的热导率。通过使用这样的结构，系统设计者可得到非常薄的PCB，其在诸如电话的移动产品中很有用。与用于传统系统板设计的、在PCB上安装的芯片不同，形状因子仅由芯片大小以及芯片焊接点和PCB信号接触点之间的焊线38的距离来确定。微芯片33安装于腔32中。嵌入金属层34与微芯片33的底部表面37热接触。通过使用导热胶粘剂36将单个热面板35连接到嵌入金属层34。采用焊线39执行从微芯片33的顶部表面39上的焊接点到PCB信号接触点的信号连接。用模塑混合物40填充腔32的剩余部分。
图8是图5所示的本发明实施例的细节横截面图，具有两个热沉25和45。该实施例类似于图6，但具有附加的元件44-46。该配置在当微芯片33产生较高热量的情况下特别有用，使得通过使用每一侧上的热沉25和45可实现快速的热扩散。与图4和图7相比，PCB的厚度和热沉的高度确定系统板设计的形状因子。然而，包括热沉高度的PCB的总大小仍然小于当前可用的PCB上的芯片安装方法。通过使用导热胶粘剂46，将附加的金属嵌入层44结合到微芯片33的顶部表面和第二热沉45。
图9是图4所示的发明实施例的细节横截面图，具有两个热面板35和55。该实施例类似于图7，但具有附加的元件54-56。该配置在当微芯片33产生较高热量的情况下特别有用，使得通过使用两侧上的热面板35和55可实现快速的热扩散。与图4和图7相比，高度较小且热扩散的效率甚至更高。通过使用导热胶粘剂56，将附加的金属嵌入层54结合到微芯片33的顶部表面和热面板55。
图10是本发明的第五实施例的细节横截面图。图10示出了该结构如何允许使信号线77在微芯片下穿过的方式。为实现这种结构，应将热沉65置于微芯片33的模塑混合物一侧上。通过使用导热胶粘剂56，将金属嵌入层54结合到微芯片33的顶部表面和热沉65。
图11是本发明的第六实施例的细节横截面图。图11示出了该结构如何允许使信号线77在微芯片下穿过的方式。为实现这种结构，应将热面板75置于微芯片33的模塑混合物一侧上。通过使用导热胶粘剂76，将金属嵌入层74结合到微芯片33的顶部表面和热面板75。
图12是第七实施例的细节横截面图。该结构在其中PCB设计中不需要热沉或者热面板的情况下很有用。在图12中，PCB61的信号线77可在微芯片63下穿过。该方法适用于以下这种微芯片：例如，产生较少的热量并且不影响系统的可靠性和性能的逻辑芯片。使用该方法，可获得改进的PCB上的布线布置以及改进的嵌入式芯片布置。
图13是使用焊球连接84的第八实施例的细节横截面图。图13示出了微芯片83的突起焊接点81的实例。在微芯片的边缘突起焊接点布置的情况下，允许任何方向的（两个或单个）热沉或热面板布置。在图13中，嵌入金属层88在微芯片83的下方并且通过导热胶粘剂87连接到热沉。如上所示，可用热面板来代替热沉86。
图14是使用焊球连接94的第九实施例的细节横截面图。该实施例改进了图13，这是因为其允许使用微芯片93，该微芯片93具有在所有位置上的突起焊接点。其被限制为使用例如要求具有单侧热沉95或热面板。图14在PCB设计上具有更好的布线灵活性。
所示的实施例仅示例由所附权利要求限定的发明。

Claims (18)

1.一种印刷电路板（PCB），包括：
大体为平面的顶部表面；以及
大体为平面的底部表面；以及
在所述顶部和所述底部表面之间延伸的电绝缘材料；
被配置为容纳微芯片的、在所述电绝缘材料中的腔。
2.如权利要求1所述的印刷电路板（PCB），还包括：在所述腔内的第一嵌入金属层，其被配置为与所述腔内的任一微芯片热连接。
3.如权利要求2所述的印刷电路板（PCB），其中所述第一嵌入金属层被配置为附接到热面板。
4.如权利要求2所述的印刷电路板（PCB），其中所述第一嵌入金属层被配置为附接到热沉。
5.如权利要求2所述的印刷电路板（PCB），还包括：在所述腔内的第二嵌入金属层，其被配置为与所述腔内的任一微芯片的所述第一嵌入金属层一侧的相对侧热连接。
6.如权利要求5所述的印刷电路板（PCB），其中所述第二嵌入金属层被配置为附接到热面板。
7.如权利要求5所述的印刷电路板（PCB），其中所述第二嵌入金属层被配置为附接到热沉。
8.如权利要求1所述的印刷电路板（PCB），还包括：填充所述腔的至少部分的模塑混合物。
9.如权利要求1所述的印刷电路板（PCB），还包括：在所述腔下穿过的至少一个信号线。
10.如权利要求1所述的印刷电路板（PCB），还包括：被配置为连接到所述腔内的任一微芯片的电连接。
11.如权利要求11所述的印刷电路板（PCB），其中所述电连接包括被配置为附接到焊线的焊接点。
12.如权利要求11所述的印刷电路板（PCB），其中所述电连接还包括被配置为附接到焊球的突起焊接点。
13.一种用于将微芯片附接到印刷电路板的方法，包括以下步骤：
在所述印刷电路板中提供腔，以及
在所提供的腔中布置微芯片，以及
还提供到所述微芯片的电连接。
14.如权利要求13所述的用于将微芯片附接到印刷电路板的方法，还包括以下步骤：
通过使用金属嵌体提供用于将热量从所述微芯片排出的路径。
15.如权利要求15所述的用于将微芯片附接到印刷电路板的方法，还包括以下步骤：
提供连接到所述金属嵌体的散热器。
16.如权利要求15所述的用于将微芯片附接到印刷电路板的方法，其中所述散热器是热沉。
17.如权利要求15所述的用于将微芯片附接到印刷电路板的方法，其中所述散热器是热面板。
18.如权利要求14所述的用于将微芯片附接到印刷电路板的方法，还包括以下步骤：
还提供位于与第一热量排出路径相对的微芯片一侧的第二路径，用于将热量从所述微芯片排出。
CN201280045830.5A 2011-09-21 2012-09-18 用于将嵌入的芯片连接到印刷电路板中的方法和设备 Pending CN103814627A (zh)

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