CN103811434A - LTCC leadless encapsulation - Google Patents
LTCC leadless encapsulation Download PDFInfo
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- CN103811434A CN103811434A CN201410064703.0A CN201410064703A CN103811434A CN 103811434 A CN103811434 A CN 103811434A CN 201410064703 A CN201410064703 A CN 201410064703A CN 103811434 A CN103811434 A CN 103811434A
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- substrate
- ltcc
- cover plate
- cavity
- frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The invention discloses an LTCC leadless encapsulation. The LTCC leadless encapsulation comprises a substate, a cover board, an enclosure frame and a cover plate; the enclosure frame is welded on one lateral surface of the substrate, and the substrate which is surrounded by the enclosure frame is used for holding an electronic apparatus; the cover plate covers the mouth of the enclosure frame to close the enclosure frame; a cavity is formed in the other lateral surface of the substrate and is used for holding the electronic apparatus, and the cover board covers the mouth of the cavity to close the cavity; the substrate at four sides of the cover board is provided with pins through silk screen printing, and the pins are connected with signal wires in the substrate through metal through holes. The LTCC leadless encapsulation enables the gap between the pins to narrow (the minimum gap is 0.5 millimeters), the encapsulation volume of the product with a lot of I/O is reduced greatly, and accordingly the product is miniaturized; leadless circuits can be welded through reflow soldering process, the soldering quality and efficiency are improved; the product is easier to assemble and mount, and the soldering disadvantages caused by easy floating and bending of leaded mounting are avoided.
Description
Technical field
The present invention relates to a kind of LTCC non-leaded package, belong to integrated antenna package technical field.
Background technology
Normally packed by metal casing of packing forms based on the micro-assembling integrated circuit of ltcc substrate at present.But along with integrated object electrical functions complexity and further microminaturization requirement, traditional leaded encapsulating structure can not meet the demands.Its weak point is:
A) between pin and between pin and housing, need to separate with insulating material, the volume of housing is larger, can not meet the requirement of miniaturization;
B) pin is in use flexible.
Summary of the invention
Technical problem to be solved by this invention is to overcome defect of the prior art, the LTCC non-leaded package that provides a kind of non-leaded package can realize pin thin space.
For solving the problems of the technologies described above, the invention provides a kind of LTCC non-leaded package, it is characterized in that, comprise the substrate, the cover plate that are packaged together, enclose frame and cover plate;
Enclose frame and be welded on a side of substrate, enclose frame surround substrate on for assembling electronic device; The oral area that encloses frame is covered and is formed sealing by cover plate;
On the another side of substrate, have a cavity, on the substrate in this cavity, for assembling electronic device, cavity oral area is covered and is formed sealing by cover plate;
On cover plate substrate around, screen printing is brushed with pin, and pin is by the holding wire interconnection of laying in metal throuth hole and substrate.
Cavity, by two stacking forming of the cavity varying in size, forms a step cavity.
Described substrate is multilayer interconnection ltcc substrate.
Utilize laser cutting-up that laminated ceramic chips is cut into shaped as frame chamber wall, then burn altogether after one is folded, is pressed into the ceramic chips of multilayer shaped as frame chamber wall and the ceramic chips of not windowing, form substrate and the integrated ceramic substrate of the cavity on it.
Described cover plate materials is pottery.
The described frame that encloses adopts eutectic Welding to be welded on the side of substrate, makes to enclose frame and substrate and forms air-tight packaging.
Described cover plate employing parallel seam welding technique is welded in encloses on frame, makes cover plate and encloses frame formation air-tight packaging.
The beneficial effect that the present invention reaches:
A) non-leaded package can be realized pin thin space (minimum spacing is 0.5mm), concerning I/O quantity product how, can reduce widely encapsulation volume, realizes product miniaturization;
B) reflow soldering process welding be can adopt without lead wire circuit, welding quality and efficiency improved;
C) assembling product, mount easilier, while avoiding leaded mounting, easily float and bending causes weld defect.
Accompanying drawing explanation
Fig. 1 is LTCC non-leaded package encapsulating structure front view;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the upward view of Fig. 1;
Fig. 4 is the concise and to the point process flow diagram of LTCC non-leaded package;
Fig. 5 is board structure front view;
Fig. 6 is the vertical view of Fig. 5;
Fig. 7 is for enclosing frame front view;
Fig. 8 is the vertical view of Fig. 7;
Fig. 9 is cover plate front view;
Figure 10 is the vertical view of Fig. 9.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.Following examples are only for technical scheme of the present invention is more clearly described, and can not limit the scope of the invention with this.
1. encapsulation technology scheme
As Figure 1-Figure 4, LTCC non-leaded package of the present invention comprises the substrate 1, the cover plate 2 that are packaged together, encloses frame 3 and cover plate 4.Enclose frame 3 and adopt eutectic Welding to be welded on a side of substrate 1, enclose on the substrate that frame 3 surrounds and can assemble electronic device 100.The oral area that encloses frame 3 is covered and is formed sealing by cover plate 4.On the another side of substrate 1, have a step-like cavity 11, on the substrate in this cavity 11, can assemble electronic device 200, step-like cavity 11 oral areas are covered and are formed sealing by cover plate 2.
A) board structure: substrate 1 is multilayer interconnection LTCC (LTCC) substrate.Utilize laser scribing incision technology, use with the ceramic chips of the identical material of ltcc substrate and make shaped as frame chamber wall multilayer ceramics, after again these being folded, be pressed into one with the ceramics of shaped as frame chamber wall and other ceramics of not windowing, burn altogether, obtain substrate and cavity integrated ceramic substrate 1.Cavity is positioned at the bottom of integrated substrate, by stacking the forming of cavity of two different sizes of size, forms a step cavity.
B) encapsulating structure: be packaged with top layer encapsulation and bottom encapsulation two parts.Enclosing on the substrate in frame of top layer is assembled with the devices such as bare chip, plate resistor, sheet capacitor, adopts eutectic weldering and parallel seam welding technology to realize air-tight packaging.In the cavity of the bottom of substrate 1, be assembled with the device such as plate resistor, sheet capacitor, adopt ceramic cover plate 2 encapsulation to realize half air-tight packaging.Encapsulating structure figure is shown in Fig. 1-Fig. 4.
C) pin design: adopt screen printing technique pin 5 to be printed on to the bottom of substrate, and on the cover plate 2 that is positioned at bottom package substrate 1 around.Utilize the holding wire interconnection of plated-through hole and substrate internal layer, connect printing technology pin is connected to the sidewall of substrate by metallization side, complete pin and make.
D) processing technology: substrate 1 adopts LTCC technique to make; Components and parts are integrated on ltcc substrate by bonding die, bonding techniques; Adopt metal to enclose the weldering of frame eutectic, parallel seam welding and ceramic cap packaging technology and realize air-tight packaging.
1.1 ltcc substrate
A) substrate 1 material: Dupont951 series green or similar characteristic material.
B) design parameter
Board structure dimensional drawing is shown in Fig. 5 and Fig. 6.
1) substrate 1 size: A × B, designs ltcc substrate size according to the actual requirements.
2) substrate 1 number of plies: formed by wiring layer and cavity layer, according to the complexity of circuit and be combined with and require the design substrate number of plies.
3) cavity 11: by stacking the forming of cavity of two different sizes.Look from the bottom of substrate, be used for bonding device near the areola 11a of substrate, the large cavity 11b that is positioned at bottom encapsulates for (bonded ceramics cover plate).
1. large cavity 11b size: C≤A-4 mm, D≤B-4mm, or design as required large cavity 11b size, but size should be than substrate 1 to 4mm when young;
2. cavity 11 step dimension: E >=0.8mm, or design as required step dimension, but step dimension can not be less than 0.8mm;
3. the large cavity 11b degree of depth: H1=ceramic cap thickness+0.2mm (surplus).
4. the areola 11a degree of depth: H2=device maximum height+0.3mm (surplus);
4) pin 5 spacing: design (minimum spacing is 0.5mm) as required;
5) pin 5 sizes: design as required.
1.2 ceramic cover plate encapsulation
Encapsulation effect: 1. make the components and parts of hybrid circuit be hedged off from the outer world, avoid mechanical damage; 2. prevent extraneous moist gas, the infringement of corrosive environment to circuit.
A) material
1) cover plate 2 materials: 96% Al
2o
3potsherd;
2) ceramic cover plate encapsulation bonded adhesives: other model insulation bonded adhesives of DG-4 insulating cement or quite performance;
B) parameter
1) cover plate 2 sizes: than the little about 0.2mm of large cavity size;
2) cover plate 2 thickness: than the little about 0.1mm of large cavity depth;
3) DG-4 insulating cement first, component B proportioning ratio: 3: 1;
4) DG-4 insulating cement condition of cure: temperature: normal temperature, time: 24h.
1.3 enclose frame and cover plate thereof
Adopt eutectic weldering and parallel seam welding technique:
Eutectic weldering definition: adopt and make scolder than the low-melting metal material of mother metal, weldment and scolder are heated to above to scolder fusing point, lower than mother metal fusion temperature, utilize the wetting mother metal of liquid solder fill play movement and realize and being connected with the counterdiffusion of mother metal phase.As 450 ℃ of welding temperature <, when metal alloy that scolder is two or more (having eutectic melting point), be called eutectic weldering, also claim solder (soldering).
Parallel seam welding definition: under high pure nitrogen environment, the local heat energy producing by the high-frequency current pulse of computer program control makes metal enclose frame and cover plate fusion, to form air-tight packaging.
A) material
1) the thick AuSn scolder of welding material: 0.03mm/0.05mm or the quite welding material of performance;
2) welding bead material: DuPont-4597/AuSn or the quite conductor material of performance;
3) enclose frame and patch material thereof: the kovar alloy of surface gold-plating or the quite alloy material of performance.Enclose frame gold plating thickness: 1.5 μ m～2.5 μ m, cover plate gold plating thickness: 0.5 μ m～0.75 μ m.
B) parameter
1) enclose frame 3 sizes: enclose frame and see Fig. 7, Fig. 8;
A=A-0.2, b=B-0.2, length and width is than the little 0.2mm of substrate;
w=0.8mm～1.0mm；
H=device maximum height+1.5mm (surplus).
2) enclose frame cover plate 4 sizes, unit is mm, and cover plate is shown in Fig. 9, Figure 10;
h1=0.25mm，h2=0.1mm；
a1=a-0.1,b1=b-0.1；
a2=a-(2w+0.4)，b2=b-(2w+0.4)。
3) enclose frame weld zone width: enclose frame thickness 2 times.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the technology of the present invention principle; can also make some improvement and distortion, these improvement and distortion also should be considered as protection scope of the present invention.
Claims (7)
1. a LTCC non-leaded package, is characterized in that, comprises the substrate, the cover plate that are packaged together, encloses frame and cover plate;
Enclose frame and be welded on a side of substrate, enclose frame surround substrate on for assembling electronic device; The oral area that encloses frame is covered and is formed sealing by cover plate;
On the another side of substrate, have a cavity, on the substrate in this cavity, for assembling electronic device, cavity oral area is covered and is formed sealing by cover plate;
On cover plate substrate around, screen printing is brushed with pin, and pin is by the holding wire interconnection of laying in metal throuth hole and substrate.
2. LTCC non-leaded package according to claim 1, is characterized in that, cavity, by two stacking forming of the cavity varying in size, forms a step cavity.
3. LTCC non-leaded package according to claim 1, is characterized in that, described substrate is multilayer interconnection ltcc substrate.
4. LTCC non-leaded package according to claim 3, it is characterized in that, utilize laser cutting-up that laminated ceramic chips is cut into shaped as frame chamber wall, then burn altogether after one is folded, is pressed into the ceramic chips of multilayer shaped as frame chamber wall and the ceramic chips of not windowing, form substrate and the integrated ceramic substrate of the cavity on it.
5. LTCC non-leaded package according to claim 1, is characterized in that, described cover plate materials is pottery.
6. LTCC non-leaded package according to claim 1, is characterized in that, described in enclose frame and adopt eutectic Welding to be welded on the side of substrate, make to enclose frame and substrate formation air-tight packaging.
7. LTCC non-leaded package according to claim 1, is characterized in that, described cover plate employing parallel seam welding technique is welded in encloses on frame, makes cover plate and encloses frame formation air-tight packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410064703.0A CN103811434A (en) | 2014-02-26 | 2014-02-26 | LTCC leadless encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410064703.0A CN103811434A (en) | 2014-02-26 | 2014-02-26 | LTCC leadless encapsulation |
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| CN103811434A true CN103811434A (en) | 2014-05-21 |
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| CN201410064703.0A Pending CN103811434A (en) | 2014-02-26 | 2014-02-26 | LTCC leadless encapsulation |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104330080A (en) * | 2014-11-07 | 2015-02-04 | 中国兵器工业集团第二一四研究所苏州研发中心 | Integrated packaging method of novel MEMS gyroscope |
| CN104766833A (en) * | 2015-04-10 | 2015-07-08 | 中国工程物理研究院电子工程研究所 | Microwave circuit three-dimensional encapsulation structure with circuits arranged on front-back surface of LTCC base plate |
| CN106229301A (en) * | 2016-08-01 | 2016-12-14 | 中国电子科技集团公司第五十八研究所 | A kind of air-tightness surface attaching type digital isolator encapsulating structure |
| CN107301982A (en) * | 2017-05-11 | 2017-10-27 | 西安空间无线电技术研究所 | CGA integrative packagings structure and its implementation based on LTCC |
| CN107949226A (en) * | 2017-12-29 | 2018-04-20 | 广州致远电子有限公司 | A kind of surface-adhered type isolation module and preparation method thereof |
| CN108428672A (en) * | 2018-04-17 | 2018-08-21 | 中国电子科技集团公司第二十九研究所 | The two-sided three-dimensionally integrated framework of ceramics and packaging method of ultra-wide band radio-frequency micro-system |
| CN109813931A (en) * | 2019-01-25 | 2019-05-28 | 中北大学 | High-range acceleration transducer ceramic silicon ceramic three-layer leadless packaging structure |
| CN109950211A (en) * | 2017-11-22 | 2019-06-28 | 中国电子科技集团公司第五十五研究所 | The two-sided multi-cavity structure ceramic shell of X-band and multi-layer ceramics co-firing technology method |
| CN110544632A (en) * | 2019-08-01 | 2019-12-06 | 中国电子科技集团公司第二十九研究所 | Method for manufacturing BGA (ball grid array) bonding pad on packaging cover plate of LTCC (Low temperature Co-fired ceramic) substrate with double-sided cavity |
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| EP0100727A2 (en) * | 1982-07-30 | 1984-02-15 | Fujitsu Limited | Semiconductor device comprising a ceramic base |
| JPS6074659A (en) * | 1983-09-30 | 1985-04-26 | Fujitsu Ltd | Semiconductor device |
| CN1252682A (en) * | 1998-10-26 | 2000-05-10 | 太阳诱电株式会社 | Mixed type module |
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Patent Citations (3)
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|---|---|---|---|---|
| EP0100727A2 (en) * | 1982-07-30 | 1984-02-15 | Fujitsu Limited | Semiconductor device comprising a ceramic base |
| JPS6074659A (en) * | 1983-09-30 | 1985-04-26 | Fujitsu Ltd | Semiconductor device |
| CN1252682A (en) * | 1998-10-26 | 2000-05-10 | 太阳诱电株式会社 | Mixed type module |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104330080A (en) * | 2014-11-07 | 2015-02-04 | 中国兵器工业集团第二一四研究所苏州研发中心 | Integrated packaging method of novel MEMS gyroscope |
| CN104766833A (en) * | 2015-04-10 | 2015-07-08 | 中国工程物理研究院电子工程研究所 | Microwave circuit three-dimensional encapsulation structure with circuits arranged on front-back surface of LTCC base plate |
| CN104766833B (en) * | 2015-04-10 | 2017-11-14 | 中国工程物理研究院电子工程研究所 | A kind of microwave circuit three-dimension packaging structure of ltcc substrate positive and negative cloth circuits |
| CN106229301B (en) * | 2016-08-01 | 2018-10-30 | 中国电子科技集团公司第五十八研究所 | A kind of air-tightness surface attaching type digital isolator encapsulating structure |
| CN106229301A (en) * | 2016-08-01 | 2016-12-14 | 中国电子科技集团公司第五十八研究所 | A kind of air-tightness surface attaching type digital isolator encapsulating structure |
| CN107301982A (en) * | 2017-05-11 | 2017-10-27 | 西安空间无线电技术研究所 | CGA integrative packagings structure and its implementation based on LTCC |
| CN109950211A (en) * | 2017-11-22 | 2019-06-28 | 中国电子科技集团公司第五十五研究所 | The two-sided multi-cavity structure ceramic shell of X-band and multi-layer ceramics co-firing technology method |
| CN109950211B (en) * | 2017-11-22 | 2020-12-18 | 中国电子科技集团公司第五十五研究所 | X-waveband double-sided multi-cavity structure ceramic shell and multilayer ceramic co-firing process method |
| CN107949226A (en) * | 2017-12-29 | 2018-04-20 | 广州致远电子有限公司 | A kind of surface-adhered type isolation module and preparation method thereof |
| CN108428672A (en) * | 2018-04-17 | 2018-08-21 | 中国电子科技集团公司第二十九研究所 | The two-sided three-dimensionally integrated framework of ceramics and packaging method of ultra-wide band radio-frequency micro-system |
| CN109813931A (en) * | 2019-01-25 | 2019-05-28 | 中北大学 | High-range acceleration transducer ceramic silicon ceramic three-layer leadless packaging structure |
| CN109813931B (en) * | 2019-01-25 | 2021-04-02 | 中北大学 | Ceramic silicon ceramic three-layer leadless packaging structure of high-range acceleration sensor |
| CN110544632A (en) * | 2019-08-01 | 2019-12-06 | 中国电子科技集团公司第二十九研究所 | Method for manufacturing BGA (ball grid array) bonding pad on packaging cover plate of LTCC (Low temperature Co-fired ceramic) substrate with double-sided cavity |
| CN110544632B (en) * | 2019-08-01 | 2021-01-29 | 中国电子科技集团公司第二十九研究所 | Method for manufacturing BGA (ball grid array) bonding pad on packaging cover plate of LTCC (Low temperature Co-fired ceramic) substrate with double-sided cavity |
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Application publication date: 20140521 |
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