CN103796492A - Heat collecting end - Google Patents
Heat collecting end Download PDFInfo
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- CN103796492A CN103796492A CN201410034754.9A CN201410034754A CN103796492A CN 103796492 A CN103796492 A CN 103796492A CN 201410034754 A CN201410034754 A CN 201410034754A CN 103796492 A CN103796492 A CN 103796492A
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- collecting terminal
- hot collecting
- microchannel module
- hot
- entrance
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Abstract
The invention relates to a heat collecting end which comprises a box body and a micro-channel module. The box body is provided with a containing cavity. The two opposite sides of the box body are provided with holes respectively, wherein the holes serve as outlets of the heat collecting end. The bottom of the box body is provided with holes which serve as inlets of the heat collecting end. The micro-channel module is provided with a plurality of cylindrical holes for working media to pass through. The middle of the micro-channel module is provided with a wedge-shaped groove which serves as an inlet of the micro-channel module, and the micro-channel module is fixedly arranged in the containing cavity of the box body. The inlet of the micro-channel module is arranged by being right opposite to the inlet of the heat collecting end. The cylindrical holes of the micro-channel module extend towards the outlets in the other side of the heat collecting end from the outlets in one side of the heat collecting end.
Description
Technical field
The present invention relates to a kind of hot collecting terminal, relate in particular to a kind of hot collecting terminal that uses lotus root shape porous material.
Background technology
In recent years, the thermal boundary problem that high integrationization causes has become one of the major issue of the development such as restriction computer chip, photoelectric device and technical bottleneck, how highly effective and safe chip dispel the heat and becomes one of important topic that electronic device studies.
The general principle of heat dissipation design is to treat between radiating element and environment, and an alap thermal resistance is provided, and object is control core temperature, makes it to work in the temperature range allowing.Through years development, Fluid for Single-phase Fluid Loop System heat dissipation technology has benefited from its heat dissipation capacity greatly and assembles the features such as convenient, has a wide range of applications at field of radiating.
The current common runner form of existing hot collecting terminal has solid matter copper post, individual layer micro-channel and multilayer micro-channel etc.But the microchannel pressure drop of existing heat abstractor is large, fluid the quantity of heat convection in the time passing through until radiating element is very little, thereby heat radiation level there is no essence lifting.
Summary of the invention
In view of this, necessaryly provide a kind of hot collecting terminal that uses lotus root shape porous material, to realize efficient heat-sinking capability.
A kind of hot collecting terminal, it comprises casing and microchannel module.Described casing has a host cavity, and the porose outlet as hot collecting terminal is offered respectively in the relative both sides of this casing, and the porose entrance as hot collecting terminal is offered in the bottom of this casing.Described microchannel module has multiple cylindrical holes, the plurality of cylindrical hole is used for passing through working media, the pars intermedia of this microchannel module is provided with the entrance of wedge-shaped slot as this microchannel module, described microchannel module is fixedly installed in the host cavity of described casing, the entrance of this microchannel module and the entrance of described hot collecting terminal are just to arranging, and multiple cylindrical holes of described microchannel module extend to the Way out of opposite side from the outlet of described hot collecting terminal one side.
Compared with prior art, hot collecting terminal provided by the invention is owing to using lotus root shape porous material as heat exchange core, and adopt in the middle of enter both sides go out structure, have benefited from the huge specific area in its inner microchannel, and larger inlet area and discharge area, therefore heat convection effect is brought into play to maximum; Described lotus root shape porous material microchannel inner wall smooth, comparing groove-type structure has lower flow resistance, therefore there is larger flow under same pump pressure head.Therefore, hot collecting terminal of the present invention has higher heat-sinking capability.
Accompanying drawing explanation
Fig. 1 is the perspective view of the heat abstractor that provides of the embodiment of the present invention.
Fig. 2 is the part-structure schematic diagram of the heat abstractor that provides of the embodiment of the present invention.
Fig. 3 is the exploded view of hot collecting terminal in the heat abstractor that provides of the embodiment of the present invention.
Fig. 4 is the profile of hot collecting terminal in the heat abstractor that provides of the embodiment of the present invention.
Fig. 5 is the perspective view of microchannel module in the heat abstractor that provides of another embodiment of the present invention.
Fig. 6 is the perspective view of base in the heat abstractor that provides of another embodiment of the present invention.
Main element symbol description
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10 |
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11 |
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12 |
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13 |
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14 |
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111 |
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112 |
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113 |
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114 |
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115 |
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116 |
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117 |
| Hot |
118、119 |
| Host cavity | 110 |
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120 |
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121 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with the accompanying drawings and the specific embodiments, hot collecting terminal provided by the invention is described in further detail.
Refer to Fig. 1 and Fig. 2, the embodiment of the present invention provides a kind of heat abstractor 10, and this heat abstractor 10 can be for the heat radiation such as computer chip, photoelectric device.
Described heat abstractor 10 comprises hot collecting terminal 11, circulation line 12, pump 13, fin 14 and is at least arranged at the working media (not shown) of described hot collecting terminal 11, circulation line 12 or electromagnetic pump 13.This working media is low-melting-point metal or low-melting alloy.Described hot collecting terminal 11 and electromagnetic pump 13 are communicated with and are formed a close access by described circulation line 12, and described fin 14 is arranged at the outer wall of described circulation line 12, for dispelling the heat to described circulation line 12.
Refer to Fig. 3 and Fig. 4, described hot collecting terminal 11 comprises casing and microchannel module 112.This casing is made up of cover plate 111 and base 113, and described cover plate 111 and base 113 are by being welded and fixed sealing.
The material of described cover plate 111 can be copper or silicon etc.In the present embodiment, described cover plate 111 is a copper flat board, and the thickness of this cover plate 111 is preferably 1 millimeter.The inner surface 115 that this cover plate 111 has an outer surface 114 and is oppositely arranged with this outer surface 114.This outer surface 114 is fitted with treating radiating element, and inner surface 115 welds with described microchannel module 112.
The material of described microchannel module 112 can be copper or silicon etc., and in the present embodiment, the material of this microchannel module 112 is copper.This microchannel module 112 has multiple cylindrical holes 116, and the plurality of cylindrical hole 116 forms microchannel and is used for passing through working media.The surface size of described microchannel module 112 with treat radiating element sizableness.This microchannel module 112 is connected to the inner surface 115 of described cover plate 111 by diffusion welding (DW), the effect of diffusion welding (DW) is to guarantee not add any foreign material under weld strength condition, can be down to minimum in connection with locating thermal resistance.
Described microchannel module 112 is to utilize the prepared lotus root shape of metal-gas eutectic directional solidification processes porous material, this lotus root shape porous material inside has that massive parallel is arranged and the cylindrical hole of inner wall smooth 116, average pore size can be controlled between 0 to 1 millimeter by changing preparation technology parameter, from cross section visual angle, be covered with tiny circular hole, face porosity be whole circular hole areas account for cross-sectional area ratio in 40% left and right, specific area is huge.Therefore, in the time passing to working media, can give play to efficient heat exchange property, and relatively cheap its market using value that promoted of cost.
The heat exchange property of described microchannel module 112 is subject to the impact in aperture larger, according to analog computation and experimental results, water is during as working media, can adopt the microchannel module 112 of small-bore, the average pore size that is to say the cylindrical hole 116 in this microchannel module 112 is less than 600 microns, preferably average pore size scope is 300 microns to 500 microns, and optimum average pore size is 400 microns of left and right.Low-melting-point metal or low-melting alloy are that working media is while being, the wide-aperture microchannel module 112 of general employing, the average pore size that is to say the cylindrical hole 116 in this microchannel module is greater than 600 microns, preferably average pore size scope is 700 microns to 900 microns, and optimum average pore size is 800 microns of left and right.
The thickness of described microchannel module 112 is larger, and total heat exchange amount is just larger, but thickness exceedes after 4mm, and heat exchange property promotes no longer obvious, considers from heat exchange property and assembly performance, is preferably 6mm.
It is the strongest that heat convection in cylindrical fluid channel acts on arrival end, reduce gradually along hole length direction afterwards, and reduce amplitude from large to small, conventionally at the convection heat transfer intensity in arrival end 5mm to 10mm far above whole section of mean value.Therefore, take to have wedge-shaped slot at the middle part of described microchannel module 112, the inclined-plane of this wedge-shaped slot and horizontal plane angle, between 40 ° to 50 °, are preferably 45 °.This wedge-shaped slot is the entrance 117 of microchannel module 112, microchannel module 112 left and right entrance and exit type structures are compared in this design, have the cylindrical hole entrance quantity of twice, in the middle of the position that strong convection heat exchange effect occurs is positioned at just, corresponding in the centre for the treatment of radiating element density of heat flow rate maximum, meanwhile, cylindrical hole entrance is positioned at wedge-shaped slot inclined-plane and is equivalent to increase inlet area, has reduced the pressure loss in porch.
In the present embodiment, described microchannel module 112 is made up of two bevelled microchannel modules of tool, and these two bevelled microchannel modules of tool to described cover plate 111, form wedge-shaped slot as entrance 117 at the central portion of described microchannel module 112 by diffusion welding (DW).Certainly, also can cut out a wedge-shaped slot at the middle part of described microchannel module 112 as entrance 117.
In addition, refer to Fig. 5, because metal current-gas eutectic directional solidification processes level is not enough to guarantee that all cylindrical holes 116 are penetrating on the length direction more than 25 millimeters, mean the cylindrical hole that can have in actual applications obstruction, the microchannel number of actual participation convection action so will reduce, and heat exchange property is just had a greatly reduced quality.So, according to the size of required microchannel module 112, can on the length direction perpendicular to cylindrical hole 116, can adopt line cutting mode to offer some grooves 121, object is the penetrating ratio that increases cylindrical hole 116 in each segmentation, make more microchannel participate in convection action, reduce the flow resistance of working media simultaneously, thereby enhancing heat transfer effect, the width of groove 121 is 0.5 millimeter, groove 121 does not cut completely, object is the globality that guarantees microchannel module 112, fixing and being installed while facilitating diffusion welding (DW), the side of slotting is solder side, object is to guarantee that the top one deck cylindrical hole 116 is penetrating good.In the present embodiment, described microchannel module 112 sizes are less, so without offering some grooves 121.
The material of described base 113 is metal or polymethyl methacrylate.In the present embodiment, the material of this base 113 is copper, and this base 113 is a hatch frame, has a host cavity 110, for placing described microchannel module 112.On two relative sidewalls of described base 113, offer respectively multiple holes, respectively as hot collecting terminal outlet 118 and outlet 119.Offer the entrance 120 of multiple holes as hot collecting terminal in the bottom of described base 113, the entrance 117 of this entrance 120 and described microchannel module 112 is adjacent and be oppositely arranged, and is beneficial to working media liquid and flows into the rear microchannel that enters smoothly microchannel module 112 of described hot collecting terminal 11.
In the present embodiment, comprehensive radiating effect with consider along stroke pressure loss factor, hot collecting terminal outlet 118 and outlet 119 are respectively six, hot collecting terminal entrance 120 is six.
The structure of described base 113 is not limited to this, refers to Fig. 6, and the outlet of described hot collecting terminal 11 118 and outlet 119 also can be opened in described base 113 bottoms and close on the two ends of sidewall.Certainly, the structure of described hot collecting terminal entrance 120 and quantity are also not limited to the present embodiment, as long as working media liquid can enter this hot collecting terminal 11.
The surface that described microchannel module 112 has wedge-shaped slot is arranged at the bottom of described base 113, and the entrance 117 of described microchannel module 112 and the entrance of described base 113 are just to arranging, the diffusion into the surface of described microchannel module 112 opposite sides is welded to the inner surface 115 of described cover plate 111, described cover plate 111 is soldered to described base 113 and forms casing, and described microchannel module 112 is fixed in described casing.The cylindrical hole 116 of described microchannel module 112 exports 118 thermotropism collecting terminals from hot collecting terminal and exports 119 directions extensions.And, between described microchannel module 112 and described hot collecting terminal outlet 118 and outlet 119, there is respectively certain intervals.
Described working media liquid directly enters the entrance 117 of microchannel module 112 from hot collecting terminal entrance 120, and via this entrance 117 to two side inflow microchannel modules 112, in the cylindrical hole of this microchannel module 112, carry out after heat convection effect, flow out microchannel module 112 from both sides, then flow out from hot collecting terminal outlet 118 and outlet 119 respectively, being designed to two outlets, to be equivalent to discharge area double, reduced like this pressure loss.Because the outlet of described microchannel module 112 both sides is distinguished just to described hot collecting terminal outlet 118 and outlet 119, so can reduce the bend flow channel pressure loss.
Described working media is not limited to low-melting-point metal or low-melting alloy, can be also water.Described low-melting-point metal is as gallium etc., and described low-melting alloy is as gallium indium alloy, gallium-indium-tin alloy, Na-K alloy etc.In the time that described working media is water, can adopt this working media of driven by mechanical pump.In the time that described working media is low-melting-point metal or low-melting alloy, can adopt mechanical pump or electromagnetic pump to drive this working media.In the present embodiment, described working media is low-melting-point metal gallium.
The material of described circulation line 12 is copper, is preferably dimensioned to be external diameter 6mm left and right, thickness of pipe wall 0.5mm left and right, and inside and outside wall can plate inoxidzable coating.
Described electromagnetic pump 13 is arranged at the middle part of heat abstractor 10, and the pump housing of described electromagnetic pump 13 has import and outlet (not indicating), and this import and outlet be the pipeline of parallel arrangement, and quantity and size are all mated with described circulation line 12.Described electromagnetic pump 13 is as actuating force, to drive working media to circulate heat radiation take electric current suffered Lorentz force in magnetic field, and it is little that described electromagnetic pump 13 has noise, the advantage that the life-span is long.
One end of described a part of circulation line 12 is connected with described hot collecting terminal outlet 118, the other end is connected with described hot collecting terminal outlet 119, one end of another part circulation line 12 is connected with hot collecting terminal entrance 120, and the other end is connected with the outlet of described electromagnetic pump 13.One end of a part of circulation line 12 is connected with the entrance of described electromagnetic pump 13 again, and the other end is connected with being connected described hot collecting terminal outlet 118 and exporting 119 circulation line 12, and forms the structure of threeway.Described circulation line 12 is intervally arranged in ventilating surface, and all has round-corner transition at turning.
Described fin 14 is copper or aluminum, in the present embodiment, the material of this fin 14 is copper, thickness is preferably 0.5mm, spacing is preferably 2mm to 3mm, and each fin 14 all processes circular hole (not shown) at circulation line 12 correspondence positions, processes square hole (not shown) at electromagnetic pump 13 correspondence positions simultaneously, described fin 14 welds together with the outer wall of circulation line 12, and described circulation line 12 and described electromagnetic pump 13 are arranged in described fin 14.And, be provided with fan (not shown) in two sides vertical with fin 14.Described electromagnetic pump 13 is positioned at ventilation scope, is wrapped up by densely arranged fin 14, can dispel the heat to reach the effect that reduces temperature by Forced Air Convection.
When use, the outer surface 114 of the hot collecting terminal cover plate 111 of described heat abstractor 10 scribbles heat-conducting silicone grease, under external jig pressure with treat that the heating face of radiating element fits tightly.The described heat for the treatment of that radiating element sends conducts to described cover plate 111 by heat exchange pattern.Working media liquid enters hot collecting terminal 11 through circulation line 12 under the driving of electromagnetic pump 13, flow in the cylindrical hole 116 of microchannel module 112, carry out after heat convection with wall in cylindrical hole inside, cross thermodynamic medium liquid and enter into respectively two groups of symmetrical circulation lines 12 from hot collecting terminal two side outlets 118 and 119, and enter in electromagnetic pump 13, thereby enter next circulation after heat abstractor bottom is converged by threeway.
In this process, working media liquid absorption is from the heat for the treatment of that radiating element sends, and temperature raises, and finally flows out from described hot collecting terminal outlet 118 and 119, dispels the heat through circulation line.Because described fin 14 and the outer wall of described circulation line 12 weld together, so the thermodynamic medium liquid of crossing in described circulation line 12 dispels the heat by this fin 14, the side of this fin 14 is provided with fan again, therefore the heat of this fin 14 distributes by described fan.Therefore, in cyclic process, the heat of crossing thermodynamic medium liquid is distributed, and can enter into circulation next time with lower temperature, so that treat radiating element heat radiation.
In addition, those skilled in the art can also do other and change in spirit of the present invention, and the variation that these do according to spirit of the present invention, all should be included in the present invention's scope required for protection.
Claims (10)
1. a hot collecting terminal, it comprises:
One casing, this casing has a host cavity, and the porose outlet as hot collecting terminal is offered respectively in the relative both sides of this casing, and the porose entrance as hot collecting terminal is offered in the bottom of this casing;
One microchannel module, this microchannel module has multiple cylindrical holes, the plurality of cylindrical hole is used for passing through working media, the pars intermedia of this microchannel module is provided with the entrance of wedge-shaped slot as this microchannel module, described microchannel module is fixedly installed in the host cavity of described casing, the entrance of this microchannel module and the entrance of described hot collecting terminal are just to arranging, and multiple cylindrical holes of described microchannel module extend to the Way out of opposite side from the outlet of described hot collecting terminal one side.
2. hot collecting terminal as claimed in claim 1, is characterized in that, the inclined-plane of described microchannel module wedge-shaped slot and the angle of horizontal plane at 40 degree between 50 degree.
3. hot collecting terminal as claimed in claim 1, is characterized in that, the inclined-plane of described microchannel module wedge-shaped slot and the angle of horizontal plane are 45 degree.
4. hot collecting terminal as claimed in claim 1, it is characterized in that, described microchannel module is spaced apart is provided with multiple grooves, the bearing of trend of the plurality of groove is perpendicular to the bearing of trend of described multiple cylindrical holes, and the diffusion into the surface with multiple grooves of described microchannel module is welded to the inner surface of described casing.
5. hot collecting terminal as claimed in claim 1, is characterized in that, described casing is made up of cover plate and base, and this cover plate and base are by being welded and fixed.
6. hot collecting terminal as claimed in claim 1, is characterized in that, the opposing sidewalls of described base is offered respectively the porose outlet as hot collecting terminal, and the porose entrance as hot collecting terminal is offered in the bottom of this base.
7. hot collecting terminal as claimed in claim 1, is characterized in that, the bottom of described base is closed on the two ends of sidewall and offered the porose outlet as hot collecting terminal.
8. hot collecting terminal as claimed in claim 1, is characterized in that, between described microchannel module and described hot collecting terminal two side outlets, has respectively certain intervals.
9. hot collecting terminal as claimed in claim 1, is characterized in that, in the time that described working media is low-melting-point metal or low-melting alloy, the aperture of multiple cylindrical holes of described microchannel module is greater than 600 microns.
10. hot collecting terminal as claimed in claim 1, is characterized in that, in the time that described working media is water, the aperture of multiple cylindrical holes of described microchannel module is less than 600 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410034754.9A CN103796492B (en) | 2014-01-25 | 2014-01-25 | Heat collecting end using lotus root-shaped cellular material microchannel module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410034754.9A CN103796492B (en) | 2014-01-25 | 2014-01-25 | Heat collecting end using lotus root-shaped cellular material microchannel module |
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| Publication Number | Publication Date |
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| CN103796492A true CN103796492A (en) | 2014-05-14 |
| CN103796492B CN103796492B (en) | 2017-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410034754.9A Expired - Fee Related CN103796492B (en) | 2014-01-25 | 2014-01-25 | Heat collecting end using lotus root-shaped cellular material microchannel module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109768020A (en) * | 2018-11-26 | 2019-05-17 | 清华大学 | A kind of novel microchannel cold plates |
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| US5132780A (en) * | 1988-01-07 | 1992-07-21 | Prime Computer, Inc. | Heat sink apparatus with an air deflection member |
| US20070026301A1 (en) * | 2005-07-29 | 2007-02-01 | Gun-Goo Lee | Battery module having improved cooling efficiency |
| US20070272392A1 (en) * | 2006-05-23 | 2007-11-29 | Debashis Ghosh | Impingement cooled heat sink with low pressure drop |
| CN101167184A (en) * | 2005-04-21 | 2008-04-23 | 日本轻金属株式会社 | Liquid-cooled jacket |
| WO2010034312A1 (en) * | 2008-09-29 | 2010-04-01 | Danamics Aps | A pump housing for an electromagnetic pump and a method of assembling a cooling circuit comprising the pump housing |
| US20100139904A1 (en) * | 2005-08-11 | 2010-06-10 | Osaka University | Heat sink and method of producing the same |
| CN102456644A (en) * | 2010-11-03 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Liquid-cooled heat dissipation system |
| CN103188912A (en) * | 2011-12-27 | 2013-07-03 | 刘源 | Lotus-type regular porous metal microchannel heat sink using liquid metal working medium |
-
2014
- 2014-01-25 CN CN201410034754.9A patent/CN103796492B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5132780A (en) * | 1988-01-07 | 1992-07-21 | Prime Computer, Inc. | Heat sink apparatus with an air deflection member |
| CN101167184A (en) * | 2005-04-21 | 2008-04-23 | 日本轻金属株式会社 | Liquid-cooled jacket |
| US20070026301A1 (en) * | 2005-07-29 | 2007-02-01 | Gun-Goo Lee | Battery module having improved cooling efficiency |
| US20100139904A1 (en) * | 2005-08-11 | 2010-06-10 | Osaka University | Heat sink and method of producing the same |
| US20070272392A1 (en) * | 2006-05-23 | 2007-11-29 | Debashis Ghosh | Impingement cooled heat sink with low pressure drop |
| WO2010034312A1 (en) * | 2008-09-29 | 2010-04-01 | Danamics Aps | A pump housing for an electromagnetic pump and a method of assembling a cooling circuit comprising the pump housing |
| CN102456644A (en) * | 2010-11-03 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Liquid-cooled heat dissipation system |
| CN103188912A (en) * | 2011-12-27 | 2013-07-03 | 刘源 | Lotus-type regular porous metal microchannel heat sink using liquid metal working medium |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109768020A (en) * | 2018-11-26 | 2019-05-17 | 清华大学 | A kind of novel microchannel cold plates |
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