CN210625442U - Staggered semispherical groove heat exchange plate structure for printed circuit board heat exchanger - Google Patents
Staggered semispherical groove heat exchange plate structure for printed circuit board heat exchanger Download PDFInfo
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- CN210625442U CN210625442U CN201921060291.8U CN201921060291U CN210625442U CN 210625442 U CN210625442 U CN 210625442U CN 201921060291 U CN201921060291 U CN 201921060291U CN 210625442 U CN210625442 U CN 210625442U
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Abstract
The utility model discloses a crisscross hemisphere groove heat transfer plate structure for printed circuit board heat exchanger, mainly be applied to fields such as petroleum, chemical industry, metallurgy, electric power, boats and ships, including hot plate, baffle and cold plate, hot plate and cold plate symmetry arrange in the baffle both sides to utilize diffusion welding to weld with the baffle, hot plate, baffle and cold plate constitute crisscross hemisphere groove heat transfer plate; the hot plate and the cold plate have the same structure and respectively comprise a top surface, a plurality of top surface hemispherical grooves formed in the top surface, a bottom surface and a plurality of bottom surface hemispherical grooves formed in the bottom surface, the largest opening surface of each top surface hemispherical groove is parallel to the top surface, and the largest opening surface of each bottom surface hemispherical groove is parallel to the bottom surface; the utility model provides a brand-new structure replaces straight channel or "it" font passageway through continuous crisscross hemisphere groove passageway on hot plate and the cold drawing, has increased heat transfer area and disturbance, and does not have high expectations to the machining precision, and technology adaptability is better.
Description
Technical Field
The utility model relates to a heat transfer board of printed circuit board heat exchanger who uses in fields such as oil, chemical industry, metallurgy, electric power, boats and ships, in particular to crisscross hemisphere groove heat transfer plate structure for printed circuit board heat exchanger.
Background
As a novel compact heat exchanger, the printed circuit board type heat exchanger has great application prospect in the fields of petroleum, chemical industry, metallurgy, electric power, ships and the like due to the characteristics of high temperature resistance, high pressure resistance and high efficiency. The manufacturing process comprises the steps of firstly processing micro channels on a heat exchange plate in a photochemical etching mode, a laser etching mode or a machining mode and the like, welding processed plates in a diffusion welding mode to form a heat exchanger core body, and finally assembling a seal head and the like to finish the processing of the whole heat exchanger. The performance of the heat exchanger is determined by the structural form of the heat exchange plate channels, and the most common channel structure at present is a straight channel-shaped or zigzag channel. The straight channel is simplest, the pressure loss is minimum, but the heat transfer performance is worst; the zigzag channel can further enhance heat dissipation by increasing fluid turbulence. However, the heat exchange capacity of the straight channel heat exchange plate or the zigzag heat exchange plate is still limited, and the heat exchange plate cannot be applied to certain conditions requiring compact structure and large heat exchange amount; no matter the straight channel heat exchange plate or the zigzag heat exchange plate is sensitive to the structure of the heat exchange plate, and strict requirements are provided for the processing precision.
Disclosure of Invention
The purpose of the utility model is to overcome the deficiencies of the prior art, and to provide a staggered semispherical groove heat exchange plate structure for a printed circuit board heat exchanger, which replaces a straight channel or a zigzag channel by a continuous staggered semispherical groove channel, increases the heat exchange area and the disturbance, and enhances the heat exchange efficiency of the heat exchange plate of the printed circuit board heat exchanger; meanwhile, the staggered hemispherical groove heat exchange plates are insensitive to the structure of the heat exchange plates due to the relative straight channels or zigzag channels, the requirement on processing precision is low, and the rate of finished products is improved.
In order to achieve the above object, the technical solution of the present invention is realized by:
a staggered hemispherical groove heat exchange plate structure for a printed circuit board heat exchanger comprises a hot plate 1, a partition plate 2 and a cold plate 3, wherein the hot plate 1 and the cold plate 3 are symmetrically arranged at two sides of the partition plate 2 and are welded with the partition plate 2 by diffusion welding, and the hot plate 1, the partition plate 2 and the cold plate 3 form a staggered hemispherical groove heat exchange plate;
the hot plate 1 and the cold plate 3 have the same structure and respectively comprise a top surface 4, a plurality of top surface hemispherical grooves 6 and a bottom surface 5 which are arranged on the top surface 4, and a plurality of bottom surface hemispherical grooves 7 which are arranged on the bottom surface 5, wherein the maximum opening surface of the plurality of top surface hemispherical grooves 6 is parallel to the top surface 4, and the maximum opening surface of the plurality of bottom surface hemispherical grooves 7 is parallel to the bottom surface 5.
When the thickness of the partition plate 2 is d and the range of d is 0.5-2mm, the thickness of the hot plate 1 is 2d, and the thickness of the cold plate 3 is 2 d.
When the thickness of the partition board 2 is d, the range of d is 0.5-2mm, the diameter of the hemispherical groove of the top hemispherical grooves 6 is 2-3d, the sphere centers of the top hemispherical grooves 6 are positioned on a straight line of the top surface 4, the distance between the sphere centers of the top hemispherical grooves 6 is 1.8-2.8d, the top hemispherical grooves 6 are partially intersected, and the distance between the sphere centers of the top hemispherical grooves 6 is smaller than the diameter of the hemispherical grooves of the top hemispherical grooves 6.
When the thickness of the partition board 2 is d, the range of d is 0.5-2mm, the diameter of the hemispherical groove of the bottom hemispherical grooves 7 is 2-3d, the sphere centers of the bottom hemispherical grooves 7 are positioned on a straight line of the bottom 5, the distance between the sphere centers of the bottom hemispherical grooves 7 is 1.8-2.8d, the bottom hemispherical grooves 7 are partially intersected, and the distance between the sphere centers of the bottom hemispherical grooves 7 is smaller than the diameter of the hemispherical grooves of the bottom hemispherical grooves 7.
When the thickness of the partition board 2 is d, and the range of d is 0.5-2mm, the plurality of top hemispherical grooves 6 and the plurality of bottom hemispherical grooves 7 are arranged in a staggered mode, the distance between the centers of the plurality of top hemispherical grooves 6 and the plurality of bottom hemispherical grooves 7, which are parallel to the top surface 4, is 0.9-1.4d, the distance between the centers of the plurality of bottom hemispherical grooves 7 and the top surface 4, which are perpendicular to the top surface 4, is 2-3d, and the plurality of top hemispherical grooves 6 and the plurality of bottom hemispherical grooves 7 are partially intersected.
The utility model has the advantages of it is following and beneficial effect:
1. the utility model provides a crisscross hemisphere groove heat transfer plate structure for printed circuit board heat exchanger replaces straight passageway or "it" font passageway through continuous crisscross hemisphere groove passageway, has increased heat transfer area and disturbance, has strengthened the heat exchange efficiency of printed circuit board heat exchanger heat transfer plate.
2. The utility model provides a crisscross hemisphere groove heat transfer plate structure for printed circuit board heat exchanger, because relative straight passageway or "it" font passageway, crisscross hemisphere groove heat transfer plate is insensitive to the heat transfer plate structure, and is lower to the machining precision requirement, has improved the yield.
3. The utility model provides a crisscross hemisphere groove heat transfer plate structure for printed circuit board heat exchanger, its processing technology not only can use the photochemistry etching, still has stronger adaptability to laser corrosion or machining, and only needs to confirm two processing parameters of hemisphere groove centre of sphere position and hemisphere groove diameter, and processing is comparatively simple.
Drawings
FIG. 1 is a schematic diagram of a staggered hemispherical-groove heat exchange plate structure and arrangement.
FIG. 2 is a schematic view of a hot or cold plate configuration.
In the figure: 1-hot plate, 2-partition plate, 3-cold plate, 4-top surface, 5-bottom surface, 6-top surface semispherical groove and 7-bottom surface semispherical groove.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in figure 1, a crisscross hemisphere groove heat transfer plate structure for printed circuit board heat exchanger, including hot plate 1, baffle 2 and cold drawing 3, hot plate 1 and cold drawing 3 have the same structure, and hot plate 1 and cold drawing 3 symmetrical arrangement are in 2 both sides of baffle to utilize the diffusion welding to weld with baffle 2, and baffle 2 has isolated the fluid in hot plate 1 and the cold drawing 3, play the sealing effect, and hot plate 1, baffle 2 and cold drawing 3 have constituteed crisscross hemisphere groove heat transfer plate.
As shown in fig. 2, the hot plate 1 comprises a top surface 4, a bottom surface 5, a plurality of top surface hemispherical grooves 6, a plurality of bottom surface hemispherical grooves 7, the maximum opening surface of the top surface hemispherical grooves 6 is parallel to the top surface 4, the maximum opening surface of the bottom surface hemispherical grooves 7 is parallel to the bottom surface 5, hot fluid flows through the top surface hemispherical grooves 6 and the bottom surface hemispherical grooves 7 in the hot plate 1, the existence of the hemispherical grooves increases the heat exchange area between the hot fluid and the solid, the shape of the hemispherical grooves is complex, the disturbance is greatly enhanced, and the heat exchange efficiency of the heat exchange plate is improved.
As shown in fig. 2, the cold plate 3 comprises a top surface 4, a bottom surface 5, a plurality of top surface hemispherical grooves 6, a plurality of bottom surface hemispherical grooves 7, the maximum opening surface of the top surface hemispherical grooves 6 is parallel to the top surface 4, the maximum opening surface of the bottom surface hemispherical grooves 7 is parallel to the bottom surface 5, cold fluid flows in the top surface hemispherical grooves 6 and the bottom surface hemispherical grooves 7 in the cold plate 3, the heat exchange area between the cold fluid and the solid is increased due to the existence of the hemispherical grooves, the shape of the hemispherical grooves is complex, disturbance is greatly enhanced, and the heat exchange efficiency of the heat exchange plate is improved.
As shown in FIG. 2, when the thickness of the partition board 2 is d, and d ranges from 0.5 to 2 mm. If the thickness of the partition board 2 is too small, the strength is not enough, cold and hot fluids are easily in direct contact, the heat exchange plate fails, and if the thickness of the partition board 2 is too large, the heat exchange efficiency is too low. Based on the thickness d of the partition, the hot plate 1 has a thickness of 2d and the cold plate 3 has a thickness of 2 d.
As shown in fig. 2, when the thickness of the partition board 2 is d, and d ranges from 0.5 mm to 2mm, the hemispherical groove diameter of the plurality of apical hemispherical grooves 6 ranges from 2d to 3d, and the centers of the plurality of apical hemispherical grooves 6 are located on a straight line of the apical surface 4, the center-to-center distance of the plurality of apical hemispherical grooves 6 ranges from 1.8 d to 2.8d, and the plurality of apical hemispherical grooves 6 partially intersect each other, so that the center-to-center distance of the plurality of apical hemispherical grooves 6 is smaller than the hemispherical groove diameter of the plurality of apical hemispherical grooves 6, and the intersecting portion of the plurality of apical hemispherical grooves 6 provides a passage for fluid flow.
As shown in fig. 2, when the thickness of the partition board 2 is d, and d ranges from 0.5 mm to 2mm, the hemispherical groove diameter of the bottom surface hemispherical grooves 7 ranges from 2d to 3d, and the centers of the bottom surface hemispherical grooves 7 are located on a straight line of the bottom surface 5, the center-to-center distance of the bottom surface hemispherical grooves 7 ranges from 1.8 d to 2.8d, and the bottom surface hemispherical grooves 7 partially intersect each other, so that the center-to-center distance of the bottom surface hemispherical grooves 7 is smaller than the hemispherical groove diameter of the bottom surface hemispherical grooves 7, and the intersecting portions of the bottom surface hemispherical grooves 7 provide a passage for fluid flow.
As shown in fig. 2, when the thickness of the partition board 2 is d, and the range of d is 0.5-2mm, the top hemispherical grooves 6 and the bottom hemispherical grooves 7 are arranged in a staggered manner, the distance between the centers of the top hemispherical grooves 6 and the bottom hemispherical grooves 7 parallel to the top surface 4 is 0.9-1.4d, the distance between the centers of the spheres perpendicular to the top surface 4 is 2-3d, the existence of the hemispherical grooves increases the heat exchange area between the fluid and the solid, and the shape of the hemispherical grooves is complex, so that the disturbance is greatly enhanced, the heat exchange efficiency of the heat exchange board is improved, the top hemispherical grooves 6 and the bottom hemispherical grooves 7 are partially intersected, and the intersected parts of the top hemispherical grooves 6 and the bottom hemispherical grooves 7 provide a passage for the fluid to flow.
Claims (5)
1. The utility model provides a crisscross hemisphere groove heat transfer plate structure for printed circuit board heat exchanger which characterized in that: the heat exchange plate comprises a hot plate (1), a partition plate (2) and a cold plate (3), wherein the hot plate (1) and the cold plate (3) are symmetrically arranged on two sides of the partition plate (2) and are welded with the partition plate (2) by diffusion welding, and the hot plate (1), the partition plate (2) and the cold plate (3) form a staggered hemispherical groove heat exchange plate;
the hot plate (1) and the cold plate (3) have the same structure and respectively comprise a top surface (4), a plurality of top surface hemispherical grooves (6) and a bottom surface (5) which are formed in the top surface (4), and a plurality of bottom surface hemispherical grooves (7) which are formed in the bottom surface (5), wherein the maximum opening surface of the top surface hemispherical grooves (6) is parallel to the top surface (4), and the maximum opening surface of the bottom surface hemispherical grooves (7) is parallel to the bottom surface (5).
2. The staggered hemispherical groove heat exchange plate structure for a printed circuit board heat exchanger of claim 1, wherein: when the thickness of the partition plate (2) is d and the range of d is 0.5-2mm, the thickness of the hot plate (1) is 2d, and the thickness of the cold plate (3) is 2 d.
3. The staggered hemispherical groove heat exchange plate structure for a printed circuit board heat exchanger of claim 1, wherein: when the thickness of the partition board (2) is d, the range of d is 0.5-2mm, the diameter of the hemispherical groove of the top hemispherical grooves (6) is 2-3d, the sphere centers of the top hemispherical grooves (6) are positioned on one straight line of the top surface (4), the sphere center distance of the top hemispherical grooves (6) is 1.8-2.8d, the top hemispherical grooves (6) are partially intersected, and the sphere center distance of the top hemispherical grooves (6) is smaller than the diameter of the hemispherical groove of the top hemispherical grooves (6).
4. The staggered hemispherical groove heat exchange plate structure for a printed circuit board heat exchanger of claim 1, wherein: when the thickness of the partition board (2) is d, the range of d is 0.5-2mm, the diameter of the hemispherical groove of the bottom hemispherical grooves (7) is 2-3d, the sphere centers of the bottom hemispherical grooves (7) are positioned on one straight line of the bottom surface (5), the sphere center distance of the bottom hemispherical grooves (7) is 1.8-2.8d, the bottom hemispherical grooves (7) are partially intersected, and the sphere center distance of the bottom hemispherical grooves (7) is smaller than the diameter of the hemispherical grooves of the bottom hemispherical grooves (7).
5. The staggered hemispherical groove heat exchange plate structure for a printed circuit board heat exchanger of claim 1, wherein: when the thickness of the partition board (2) is d, the range of d is 0.5-2mm, the top hemispherical grooves (6) and the bottom hemispherical grooves (7) are arranged in a staggered mode, the distance between the centers of the top hemispherical grooves (6) and the bottom hemispherical grooves (7) which are parallel to the top surface (4) is 0.9-1.4d, the distance between the centers of the spheres perpendicular to the top surface (4) is 2-3d, and the top hemispherical grooves (6) and the bottom hemispherical grooves (7) are partially intersected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921060291.8U CN210625442U (en) | 2019-07-09 | 2019-07-09 | Staggered semispherical groove heat exchange plate structure for printed circuit board heat exchanger |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921060291.8U CN210625442U (en) | 2019-07-09 | 2019-07-09 | Staggered semispherical groove heat exchange plate structure for printed circuit board heat exchanger |
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| CN210625442U true CN210625442U (en) | 2020-05-26 |
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| CN201921060291.8U Active CN210625442U (en) | 2019-07-09 | 2019-07-09 | Staggered semispherical groove heat exchange plate structure for printed circuit board heat exchanger |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110296629A (en) * | 2019-07-09 | 2019-10-01 | 西安交通大学 | A kind of staggeredly half ball groove heat exchanger plates for printed circuit sheet heat exchanger |
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2019
- 2019-07-09 CN CN201921060291.8U patent/CN210625442U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110296629A (en) * | 2019-07-09 | 2019-10-01 | 西安交通大学 | A kind of staggeredly half ball groove heat exchanger plates for printed circuit sheet heat exchanger |
| CN110296629B (en) * | 2019-07-09 | 2023-10-24 | 西安交通大学 | Staggered hemispherical groove heat exchange plate for printed circuit board heat exchanger |
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