CN110296629B - Staggered hemispherical groove heat exchange plate for printed circuit board heat exchanger - Google Patents
Staggered hemispherical groove heat exchange plate for printed circuit board heat exchanger Download PDFInfo
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- CN110296629B CN110296629B CN201910613173.3A CN201910613173A CN110296629B CN 110296629 B CN110296629 B CN 110296629B CN 201910613173 A CN201910613173 A CN 201910613173A CN 110296629 B CN110296629 B CN 110296629B
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- hemispherical
- plate
- grooves
- top surface
- hemispherical grooves
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
- F28F9/262—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators
- F28F9/268—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators by permanent joints, e.g. by welding
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention discloses a staggered hemispherical groove heat exchange plate for a printed circuit board heat exchanger, which is mainly applied to the fields of petroleum, chemical industry, metallurgy, electric power, ships and the like.
Description
Technical Field
The invention relates to a heat exchange plate of a printed circuit board heat exchanger used in the fields of petroleum, chemical industry, metallurgy, electric power, ships and the like, in particular to a staggered hemispherical groove heat exchange plate for the printed circuit board heat exchanger.
Background
The printed circuit board type heat exchanger has great application prospect in the fields of petroleum, chemical industry, metallurgy, electric power, ships and the like by taking the characteristics of high temperature resistance, high pressure resistance and high efficiency as a novel compact heat exchanger. The manufacturing process comprises the steps of firstly processing micro channels on a heat exchange plate in a photochemical etching, laser etching or machining mode, then welding the processed plates in a diffusion welding mode to form a heat exchanger core, and finally assembling a seal head and the like to finish the whole heat exchanger. The structural form of the heat exchange plate channels is the one that determines the performance of the heat exchanger, and the most commonly used channel structure at present is a straight channel shape or a zigzag channel. The straight channel is the simplest, the pressure loss is the smallest, but the heat transfer performance is the worst; the zigzag channel can further strengthen heat dissipation by adding fluid disturbance. However, the heat exchange capacity of the direct-channel heat exchange plate or the zigzag heat exchange plate is still limited, and the direct-channel heat exchange plate cannot be suitable under the conditions of certain requirements of compact structure and large heat exchange capacity; the heat exchange plate is sensitive to the structure of the heat exchange plate and strict requirements are set for the machining precision whether the heat exchange plate is in a straight channel or in a zigzag shape.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides the staggered hemispherical groove heat exchange plate for the printed circuit board heat exchanger, wherein the continuous staggered hemispherical groove channels replace straight channels or 'zigzag' -shaped channels, so that the heat exchange area and disturbance are increased, and the heat exchange efficiency of the heat exchange plate of the printed circuit board heat exchanger is enhanced; meanwhile, the staggered hemispherical groove heat exchange plates are insensitive to the structure of the heat exchange plates due to the relatively straight channels or the zigzag channels, so that the requirements on the machining precision are low, and the yield is improved.
In order to achieve the above object, the technical scheme of the present invention is realized by:
the heat exchange plate comprises a hot plate 1, a partition plate 2 and a cold plate 3, wherein the hot plate 1 and the cold plate 3 are symmetrically arranged on two sides of the partition plate 2 and welded with the partition plate 2 by diffusion welding, and the hot plate 1, the partition plate 2 and the cold plate 3 form the heat exchange plate with the staggered hemispherical grooves;
the hot plate 1 and the cold plate 3 have the same structure, and each comprises a top surface 4, a plurality of top surface hemispherical grooves 6 formed in the top surface 4, a bottom surface 5 and a plurality of bottom surface hemispherical grooves 7 formed in the bottom surface 5, wherein the maximum opening surfaces of the plurality of top surface hemispherical grooves 6 are parallel to the top surface 4, and the maximum opening surfaces of the plurality of bottom surface hemispherical grooves 7 are parallel to the bottom surface 5.
When the thickness of the partition plate 2 is d and d ranges from 0.5 to 2mm, the thickness of the hot plate 1 is 2d and the thickness of the cold plate 3 is 2d.
When the thickness of the partition plate 2 is d, the range of d is 0.5-2mm, the hemispherical groove diameters of the plurality of top hemispherical grooves 6 are 2-3d, the spherical centers of the plurality of top hemispherical grooves 6 are positioned on the same straight line of the top surface 4, the spherical center distances of the plurality of top hemispherical grooves 6 are 1.8-2.8d, the plurality of top hemispherical grooves 6 are partially intersected, and the spherical center distances of the plurality of top hemispherical grooves 6 are smaller than the hemispherical groove diameters of the plurality of top hemispherical grooves 6.
When the thickness of the partition plate 2 is d, the range of d is 0.5-2mm, the hemispherical groove diameters of the plurality of bottom hemispherical grooves 7 are 2-3d, the spherical centers of the plurality of bottom hemispherical grooves 7 are positioned on the same straight line of the bottom 5, the spherical center distances of the plurality of bottom hemispherical grooves 7 are 1.8-2.8d, the plurality of bottom hemispherical grooves 7 are partially intersected, and the spherical center distances of the plurality of bottom hemispherical grooves 7 are smaller than the hemispherical groove diameters of the plurality of bottom hemispherical grooves 7.
When the thickness of the partition plate 2 is d, the d range is 0.5-2mm, the plurality of top surface hemispherical grooves 6 and the plurality of bottom surface hemispherical grooves 7 are staggered, the center-to-center distance between the plurality of top surface hemispherical grooves 6 and the plurality of bottom surface hemispherical grooves 7 parallel to the top surface 4 is 0.9-1.4d, the center-to-center distance perpendicular to the top surface 4 is 2-3d, and the plurality of top surface hemispherical grooves 6 and the plurality of bottom surface hemispherical grooves 7 are partially intersected.
The invention has the following advantages and beneficial effects:
1. the invention provides a staggered hemispherical groove heat exchange plate for a printed circuit board heat exchanger, which replaces a straight channel or a zigzag channel by a continuous staggered hemispherical groove channel, increases heat exchange area and disturbance, and enhances heat exchange efficiency of the heat exchange plate of the printed circuit board heat exchanger.
2. The invention provides a staggered hemispherical groove heat exchange plate for a printed circuit board heat exchanger, which is insensitive to the structure of the heat exchange plate and has lower requirements on processing precision due to a relatively straight channel or a zigzag channel, thereby improving the yield.
3. The invention provides a staggered hemispherical groove heat exchange plate for a printed circuit board heat exchanger, which not only can use photochemical etching to realize strong adaptability to laser corrosion or machining, but also only needs to determine two machining parameters of the spherical center position and the hemispherical groove diameter, and is simple to machine.
Drawings
Fig. 1 is a schematic view of a staggered hemispherical trough heat exchanger plate structure and arrangement.
FIG. 2 is a schematic view of a hot plate or cold plate structure.
In the figure: 1-hot plate, 2-baffle, 3-cold plate, 4-top surface, 5-bottom surface, 6-top surface hemisphere groove, 7-bottom surface hemisphere groove.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings.
As shown in fig. 1, an interlaced hemispherical groove heat exchange plate for a printed circuit board heat exchanger comprises a heat plate 1, a partition plate 2 and a cold plate 3, wherein the heat plate 1 and the cold plate 3 have the same structure, the heat plate 1 and the cold plate 3 are symmetrically arranged on two sides of the partition plate 2 and welded with the partition plate 2 by diffusion welding, the partition plate 2 isolates fluid in the heat plate 1 and the cold plate 3 to play a sealing role, and the heat plate 1, the partition plate 2 and the cold plate 3 form the interlaced hemispherical groove heat exchange plate.
As shown in fig. 2, the heat plate 1 includes a top surface 4, a bottom surface 5, a plurality of top surface hemispherical grooves 6, a plurality of bottom surface hemispherical grooves 7, the largest opening surfaces of the plurality of top surface hemispherical grooves 6 are parallel to the top surface 4, the largest opening surfaces of the plurality of bottom surface hemispherical grooves 7 are parallel to the bottom surface 5, the heat fluid is moved in the plurality of top surface hemispherical grooves 6 and the plurality of bottom surface hemispherical grooves 7 in the heat plate 1, the heat exchange area between the heat fluid and the solid is increased due to the existence of the hemispherical grooves, and the hemispherical grooves are complex, so that disturbance is greatly enhanced, and the heat exchange efficiency of the heat exchange plate is improved.
As shown in fig. 2, the cold plate 3 includes a top surface 4, a bottom surface 5, a plurality of top surface hemisphere grooves 6, a plurality of bottom surface hemisphere grooves 7, the maximum opening surface of the plurality of top surface hemisphere grooves 6 is parallel to the top surface 4, the maximum opening surface of the plurality of bottom surface hemisphere grooves 7 is parallel to the bottom surface 5, cold fluid is moved in the plurality of top surface hemisphere grooves 6 and the plurality of bottom surface hemisphere grooves 7 in the cold plate 3, the heat exchange area between cold fluid and solid is increased due to the existence of hemisphere grooves, and the shape of the hemisphere grooves is complex, so that disturbance is greatly enhanced, and the heat exchange efficiency of the heat exchange plate is improved.
As shown in fig. 2, when the separator 2 has a thickness d, d ranges from 0.5 to 2mm. If the thickness of the partition plate 2 is too small, the strength is insufficient, cold and hot fluid is easy to directly contact, the heat exchange plate is invalid, and if the thickness of the partition plate 2 is too large, the heat exchange efficiency is too low. Based on the separator thickness d, the hot plate 1 has a thickness of 2d and the cold plate 3 has a thickness of 2d.
As shown in fig. 2, when the thickness of the partition plate 2 is d, and d ranges from 0.5 to 2mm, the hemispherical groove diameter of the plurality of top hemispherical grooves 6 is 2 to 3d, and the centers of the plurality of top hemispherical grooves 6 are located on a straight line of the top surface 4, the center-of-sphere distances of the plurality of top hemispherical grooves 6 are 1.8 to 2.8d, the plurality of top hemispherical grooves 6 are partially intersected, and therefore, the center-of-sphere distances of the plurality of top hemispherical grooves 6 are smaller than the hemispherical groove diameter of the plurality of top hemispherical grooves 6, and the intersecting portions of the plurality of top hemispherical grooves 6 provide channels for fluid flow.
As shown in fig. 2, when the thickness of the partition plate 2 is d, and d ranges from 0.5 to 2mm, the hemispherical groove diameter of the plurality of bottom hemispherical grooves 7 ranges from 2 to 3d, and the centers of the plurality of bottom hemispherical grooves 7 are located on a straight line of the bottom 5, the center-to-center distances of the plurality of bottom hemispherical grooves 7 ranges from 1.8 to 2.8d, the plurality of bottom hemispherical grooves 7 are partially intersected, and therefore, the center-to-center distances of the plurality of bottom hemispherical grooves 7 are smaller than the hemispherical groove diameter of the plurality of bottom hemispherical grooves 7, and the intersecting portions of the plurality of bottom hemispherical grooves 7 provide channels for fluid flow.
As shown in fig. 2, when the thickness of the partition plate 2 is d, and the d range is 0.5-2mm, the plurality of top surface hemispherical grooves 6 and the plurality of bottom surface hemispherical grooves 7 are staggered, the center-to-center distance between the plurality of top surface hemispherical grooves 6 and the plurality of bottom surface hemispherical grooves 7 parallel to the top surface 4 is 0.9-1.4d, the center-to-center distance between the plurality of bottom surface hemispherical grooves 7 perpendicular to the top surface 4 is 2-3d, the heat exchange area between the fluid and the solid is increased due to the existence of the hemispherical grooves, the hemispherical grooves are complex in shape, disturbance is greatly enhanced, the heat exchange efficiency of the heat exchange plate is improved, the plurality of top surface hemispherical grooves 6 and the plurality of bottom surface hemispherical grooves 7 are partially intersected, and the intersecting part between the plurality of top surface hemispherical grooves 6 and the plurality of bottom surface hemispherical grooves 7 provides a channel for fluid flow.
Claims (5)
1. A crisscross hemisphere groove heat exchange plate for printed circuit board heat exchanger, its characterized in that: the heat exchange plate comprises a heat plate (1), a partition plate (2) and a cold plate (3), wherein the heat plate (1) and the cold plate (3) are symmetrically arranged on two sides of the partition plate (2) and welded with the partition plate (2) by utilizing diffusion welding, and the heat plate (1), the partition plate (2) and the cold plate (3) form a staggered hemispherical groove heat exchange plate;
the hot plate (1) and the cold plate (3) have the same structure, and each hot plate comprises a top surface (4), a plurality of top surface hemispherical grooves (6) formed in the top surface (4), a bottom surface (5) and a plurality of bottom surface hemispherical grooves (7) formed in the bottom surface (5), wherein the maximum opening surfaces of the plurality of top surface hemispherical grooves (6) are parallel to the top surface (4), and the maximum opening surfaces of the plurality of bottom surface hemispherical grooves (7) are parallel to the bottom surface (5);
the plurality of top surface hemispherical grooves (6) are partially intersected, so that the spherical center distance of the plurality of top surface hemispherical grooves (6) is smaller than the hemispherical groove diameter of the plurality of top surface hemispherical grooves (6), and the intersection part of the plurality of top surface hemispherical grooves (6) provides a channel for fluid flow;
the plurality of bottom surface hemispherical grooves (7) are partially intersected, so that the spherical center distance of the plurality of bottom surface hemispherical grooves (7) is smaller than the hemispherical groove diameter of the plurality of bottom surface hemispherical grooves (7), and the intersection part of the plurality of bottom surface hemispherical grooves (7) provides a channel for fluid flow;
the top surface hemisphere grooves (6) and the bottom surface hemisphere grooves (7) are arranged in a staggered mode, and the intersecting parts of the top surface hemisphere grooves (6) and the bottom surface hemisphere grooves (7) provide channels for fluid flow.
2. An interleaved hemispherical slot heat exchanger plate for a printed circuit board heat exchanger according to claim 1 wherein: when the thickness of the partition plate (2) is d and the range of d is 0.5-2mm, the thickness of the hot plate (1) is 2d, and the thickness of the cold plate (3) is 2d.
3. An interleaved hemispherical slot heat exchanger plate for a printed circuit board heat exchanger according to claim 1 wherein: when the thickness of the partition plate (2) is d, the d range is 0.5-2mm, the hemispherical groove diameters of the plurality of top hemispherical grooves (6) are 2-3d, the spherical centers of the plurality of top hemispherical grooves (6) are positioned on the same straight line of the top surface (4), and the spherical center distance of the plurality of top hemispherical grooves (6) is 1.8-2.8d.
4. An interleaved hemispherical slot heat exchanger plate for a printed circuit board heat exchanger according to claim 1 wherein: when the thickness of the partition plate (2) is d, the d range is 0.5-2mm, the hemispherical groove diameters of the plurality of bottom hemispherical grooves (7) are 2-3d, the spherical centers of the plurality of bottom hemispherical grooves (7) are positioned on the same straight line of the bottom surface (5), and the spherical center distance of the plurality of bottom hemispherical grooves (7) is 1.8-2.8d.
5. An interleaved hemispherical slot heat exchanger plate for a printed circuit board heat exchanger according to claim 1 wherein: when the thickness of the partition plate (2) is d, the d range is 0.5-2mm, the plurality of top surface hemispherical grooves (6) and the plurality of bottom surface hemispherical grooves (7) are arranged in a staggered mode, the center-to-center distance between the plurality of top surface hemispherical grooves (6) and the plurality of bottom surface hemispherical grooves (7) parallel to the top surface (4) is 0.9-1.4d, the center-to-center distance perpendicular to the top surface (4) is 2-3d, and the plurality of top surface hemispherical grooves (6) and the plurality of bottom surface hemispherical grooves (7) are partially intersected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910613173.3A CN110296629B (en) | 2019-07-09 | 2019-07-09 | Staggered hemispherical groove heat exchange plate for printed circuit board heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910613173.3A CN110296629B (en) | 2019-07-09 | 2019-07-09 | Staggered hemispherical groove heat exchange plate for printed circuit board heat exchanger |
Publications (2)
| Publication Number | Publication Date |
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| CN110296629A CN110296629A (en) | 2019-10-01 |
| CN110296629B true CN110296629B (en) | 2023-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910613173.3A Active CN110296629B (en) | 2019-07-09 | 2019-07-09 | Staggered hemispherical groove heat exchange plate for printed circuit board heat exchanger |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2200926C2 (en) * | 2001-02-12 | 2003-03-20 | Казанский государственный технический университет им. А.Н.Туполева | Heat-exchange surface |
| RU2620886C1 (en) * | 2016-03-22 | 2017-05-30 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Брянский государственный технический университет" | Matrix of plate-type heat exchanger |
| CN107024134A (en) * | 2017-04-20 | 2017-08-08 | 中国科学院工程热物理研究所 | Heat exchanger plates for printed circuit sheet heat exchanger |
| CN210625442U (en) * | 2019-07-09 | 2020-05-26 | 西安交通大学 | Staggered semispherical groove heat exchange plate structure for printed circuit board heat exchanger |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104807361A (en) * | 2014-01-29 | 2015-07-29 | 丹佛斯微通道换热器（嘉兴）有限公司 | Heat exchanging plate and plate heat exchanger comprising heat exchanging plate |
| US10352626B2 (en) * | 2016-12-14 | 2019-07-16 | Shinko Electric Industries Co., Ltd. | Heat pipe |
-
2019
- 2019-07-09 CN CN201910613173.3A patent/CN110296629B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2200926C2 (en) * | 2001-02-12 | 2003-03-20 | Казанский государственный технический университет им. А.Н.Туполева | Heat-exchange surface |
| RU2620886C1 (en) * | 2016-03-22 | 2017-05-30 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Брянский государственный технический университет" | Matrix of plate-type heat exchanger |
| CN107024134A (en) * | 2017-04-20 | 2017-08-08 | 中国科学院工程热物理研究所 | Heat exchanger plates for printed circuit sheet heat exchanger |
| CN210625442U (en) * | 2019-07-09 | 2020-05-26 | 西安交通大学 | Staggered semispherical groove heat exchange plate structure for printed circuit board heat exchanger |
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| CN110296629A (en) | 2019-10-01 |
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