CN103785667A - Plasma cracking recovery production line of waste circuit board - Google Patents
Plasma cracking recovery production line of waste circuit board Download PDFInfo
- Publication number
- CN103785667A CN103785667A CN201210433850.1A CN201210433850A CN103785667A CN 103785667 A CN103785667 A CN 103785667A CN 201210433850 A CN201210433850 A CN 201210433850A CN 103785667 A CN103785667 A CN 103785667A
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- China
- Prior art keywords
- plasma
- circuit board
- production line
- plasma cracking
- furnace
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Processing Of Solid Wastes (AREA)
Abstract
The invention relates to a plasma cracking recovery production line of a waste circuit board. According to a flow path, the production line sequentially comprises a filling device, a plasma cracking furnace, a heat exchange device, a purification device, an acid-base neutralization and drying device, a fly ash dust collecting device and a washing device. Through the production line composed of the devices, metals and inorganic substances in a waste circuit board can be effectively separated, so that the metals can be recycled; toxic heavy metals can be solidified in the inorganic substances so as to be used as building materials; and plasma torch in the plasma cracking furnace can move vertically, thus solving the problem that cooling can not be started due to covering of an insulated glass body on the furnace bottom and the problem that the furnace bottom rises.
Description
Technical field
The present invention relates to a kind of useless circuit board plasma pyrolysis remanufacture line.
Background technology
Along with modernized society's develop rapidly, various artificial synthetic chemical substances are there are, much wherein harmful or poisonous, particularly under high-tech condition, produce a large amount of high-risk electronic wastes, in prior art, usually adopt and simply burn or bury processing, in this process, can produce the materials such as the multiple virose lead of a large amount of dioxin (Dioxin) classes material, hypertoxic garbage flying ash and absorbent formation, cadmium, silver, severe contamination environment, cause environmental pollution increasingly to aggravate.Particularly in discarded electric PC board, not only contain nonmetal organic matter, inorganic matter, also contain multiple precious metal element, after burning or burying, not only can also can cause the wasting of resources by serious environment pollution.
Summary of the invention
The object of the invention is to overcome the defect that prior art exists, provide a kind of operation continuity strong, the useless circuit board plasma pyrolysis remanufacture line of one of energy-conserving and environment-protective.
The technical scheme that realizes the object of the invention is: a kind of useless circuit board plasma pyrolysis remanufacture line, described production line comprises adding material device, ionospheric plasma cracking furnace, heat-exchange device, purifier, acid-base neutralization and drying device, flying dust dust collect plant and wash mill successively by flow process.
Technique scheme, described ionospheric plasma cracking furnace comprises body of heater and plasma torch, described plasma torch is arranged on furnace roof.
Technique scheme, described plasma torch can move up and down.
Technique scheme, described furnace body outer wall one side is provided with feeding port.
Technique scheme, described plasma cracking furnace body is built by laying bricks or stones and is formed by high-temperature refractory.
Adopt after technique scheme, the present invention has following positive effect:
The present invention, by the production line of the composition of each device, can separate the metal in useless circuit board effectively with inorganic matter, make metal be recycled utilization, and toxic heavy metal is solidificated in inorganic matter, can be used as construction material and uses; Plasma torch in ionospheric plasma cracking furnace can move up and down, can solve because of on furnace bottom, cover insulating glass body cause cooling cannot starting problem and furnace bottom rising problem; The present invention can reach higher environmental requirement, realizes zero-emission.
Accompanying drawing explanation
For content of the present invention is more easily expressly understood, according to specific embodiment also by reference to the accompanying drawings, the present invention is further detailed explanation, wherein below
Fig. 1 is structural representation of the present invention;
Fig. 2 is ionospheric plasma cracking furnace structural representation.
In figure, each label represents:
1, adding material device; 2, ionospheric plasma cracking furnace; 21, body of heater; 22, plasma torch; 23, feeding port; 3, heat-exchange device; 4, purifier; 5, acid-base neutralization and drying device; 6, flying dust dust collect plant; 7 and wash mill.
The specific embodiment
(embodiment 1)
See Fig. 1, the present invention has adding material device 1, ionospheric plasma cracking furnace 2, heat-exchange device 3, purifier 4, acid-base neutralization and drying device 5, flying dust dust collect plant 6 and wash mill 7.Ionospheric plasma cracking furnace 2 comprises body of heater 21 and plasma torch 22, and plasma torch 22 is arranged on furnace roof,
As preferred version of the present invention, plasma torch 22 can move up and down, can effectively solve because of on furnace bottom, cover insulating glass body cause cooling cannot starting problem and furnace bottom rising problem.
Body of heater 21 outer wall one sides are provided with feeding port 23, adopt special sealing means when charging, can guarantee that burner hearth is negative-pressure reduction atmosphere, thoroughly melting cracking organic-inorganic poisonous waste.
Ionospheric plasma cracking furnace 2 bodies of heater 21 of the present invention are built by laying bricks or stones and are formed by high-temperature refractory, can realize metal debirs and be not less than reaction at 1200 ℃.。
Operation principle of the present invention is: useless circuit board the like waste enters ionospheric plasma cracking furnace 2 by adding material device 1, at the interior organic waste of ionospheric plasma cracking furnace 2 by the plasma decomposes of high-temperature high-density, refractory metal oxide is melted as metal through reduction reaction, lower boiling material is vaporized, cracking, debirs are in the high temperature that is not less than 1200 ℃ ~ 1400 ℃, be broken down into atomic structure, 99.9% dioxin is decomposed completely, smoke treatment adopts chilling technique that it was quenched to below 100 ℃ in 0.2 second after discharging in heat-exchange device 3, thereby the dioxin of jumping over easily generates humidity province, then tail gas pass through purifier 4, acid-base neutralization and drying device 5, after flying dust dust collect plant 6 and wash mill 7, become pure air and enter atmosphere, the dust that flying dust dust collect plant 6 gathers also can thoroughly reclaim through the process of melting down again, metal and inorganic matter are discharged by ionospheric plasma cracking furnace, recoverable,
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (5)
1. a useless circuit board plasma pyrolysis remanufacture line, is characterized in that: described production line comprises adding material device (1), ionospheric plasma cracking furnace (2), heat-exchange device (3), purifier (4), acid-base neutralization and drying device (5), flying dust dust collect plant (6) and wash mill (7) successively by flow process.
2. useless circuit board plasma pyrolysis remanufacture line according to claim 1, is characterized in that: described ionospheric plasma cracking furnace (2) comprises body of heater (21) and plasma torch (22), and described plasma torch (22) is arranged on furnace roof.
3. useless circuit board plasma pyrolysis remanufacture line according to claim 2, is characterized in that: described plasma torch (22) can move up and down.
4. useless circuit board plasma pyrolysis remanufacture line according to claim 2, is characterized in that: described body of heater (21) outer wall one side is provided with feeding port (23).
5. according to the useless circuit board plasma pyrolysis remanufacture line described in claim 2 or 4, it is characterized in that: ionospheric plasma cracking furnace (2) body of heater (21) is built by laying bricks or stones and formed by high-temperature refractory.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210433850.1A CN103785667A (en) | 2012-11-01 | 2012-11-01 | Plasma cracking recovery production line of waste circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210433850.1A CN103785667A (en) | 2012-11-01 | 2012-11-01 | Plasma cracking recovery production line of waste circuit board |
Publications (1)
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CN103785667A true CN103785667A (en) | 2014-05-14 |
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Family Applications (1)
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CN201210433850.1A Withdrawn CN103785667A (en) | 2012-11-01 | 2012-11-01 | Plasma cracking recovery production line of waste circuit board |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110496357A (en) * | 2019-09-24 | 2019-11-26 | 江苏帕斯玛环境科技有限公司 | The plasma cracking device of high saliferous, high concentration organic raffinat |
Citations (8)
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---|---|---|---|---|
US4644877A (en) * | 1984-01-23 | 1987-02-24 | Pyroplasma International N.V. | Plasma pyrolysis waste destruction |
US5280757A (en) * | 1992-04-13 | 1994-01-25 | Carter George W | Municipal solid waste disposal process |
CN1597155A (en) * | 2003-09-18 | 2005-03-23 | 中国科学院力学研究所 | Method of treating waste matter using plasma electric arc technology and its device |
CN101088581A (en) * | 2007-08-20 | 2007-12-19 | 丁家亮 | Poisonous waste treating method and special apparatus |
CN101737786A (en) * | 2009-12-24 | 2010-06-16 | 童加增 | Plasma melting cracking treating equipment |
CN101745517A (en) * | 2009-12-17 | 2010-06-23 | 航天环境工程有限公司 | Device and method for processing active carbon containing heavy metals and fine dust |
CN202207705U (en) * | 2011-09-13 | 2012-05-02 | 杭州电子科技大学 | Device of pyrolysis combined plasma discharging harmless recovery processing circuit board |
CN202877220U (en) * | 2012-11-01 | 2013-04-17 | 常州翔宇资源再生科技有限公司 | Plasma cracking recovery production line for waste circuit boards |
-
2012
- 2012-11-01 CN CN201210433850.1A patent/CN103785667A/en not_active Withdrawn
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4644877A (en) * | 1984-01-23 | 1987-02-24 | Pyroplasma International N.V. | Plasma pyrolysis waste destruction |
US5280757A (en) * | 1992-04-13 | 1994-01-25 | Carter George W | Municipal solid waste disposal process |
CN1597155A (en) * | 2003-09-18 | 2005-03-23 | 中国科学院力学研究所 | Method of treating waste matter using plasma electric arc technology and its device |
CN101088581A (en) * | 2007-08-20 | 2007-12-19 | 丁家亮 | Poisonous waste treating method and special apparatus |
CN101745517A (en) * | 2009-12-17 | 2010-06-23 | 航天环境工程有限公司 | Device and method for processing active carbon containing heavy metals and fine dust |
CN101737786A (en) * | 2009-12-24 | 2010-06-16 | 童加增 | Plasma melting cracking treating equipment |
CN202207705U (en) * | 2011-09-13 | 2012-05-02 | 杭州电子科技大学 | Device of pyrolysis combined plasma discharging harmless recovery processing circuit board |
CN202877220U (en) * | 2012-11-01 | 2013-04-17 | 常州翔宇资源再生科技有限公司 | Plasma cracking recovery production line for waste circuit boards |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110496357A (en) * | 2019-09-24 | 2019-11-26 | 江苏帕斯玛环境科技有限公司 | The plasma cracking device of high saliferous, high concentration organic raffinat |
CN110496357B (en) * | 2019-09-24 | 2024-06-04 | 江苏帕斯玛环境科技有限公司 | Plasma cracking device for high-salt-content and high-concentration organic raffinate |
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Application publication date: 20140514 |