CN103782445A - 用于rfid电路的阻隔层电介质 - Google Patents
用于rfid电路的阻隔层电介质 Download PDFInfo
- Publication number
- CN103782445A CN103782445A CN201280043141.0A CN201280043141A CN103782445A CN 103782445 A CN103782445 A CN 103782445A CN 201280043141 A CN201280043141 A CN 201280043141A CN 103782445 A CN103782445 A CN 103782445A
- Authority
- CN
- China
- Prior art keywords
- barrier layer
- layer dielectric
- weight
- thick film
- dielectric composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004888 barrier function Effects 0.000 title claims abstract description 43
- 239000000203 mixture Substances 0.000 claims abstract description 46
- 229920000642 polymer Polymers 0.000 claims abstract description 25
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical group CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 239000003960 organic solvent Substances 0.000 claims description 15
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 13
- 229920000728 polyester Polymers 0.000 claims description 5
- 238000003856 thermoforming Methods 0.000 claims description 5
- -1 urethane ester Chemical class 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 3
- 229910021485 fumed silica Inorganic materials 0.000 claims description 2
- 229920001519 homopolymer Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 9
- 239000004417 polycarbonate Substances 0.000 abstract description 9
- 229910052709 silver Inorganic materials 0.000 abstract description 9
- 239000004332 silver Substances 0.000 abstract description 9
- 229920000515 polycarbonate Polymers 0.000 abstract description 6
- 239000003989 dielectric material Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 description 13
- 239000000843 powder Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 150000002168 ethanoic acid esters Chemical class 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- RUJPNZNXGCHGID-UHFFFAOYSA-N (Z)-beta-Terpineol Natural products CC(=C)C1CCC(C)(O)CC1 RUJPNZNXGCHGID-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000320 mechanical mixture Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- QJVXKWHHAMZTBY-GCPOEHJPSA-N syringin Chemical compound COC1=CC(\C=C\CO)=CC(OC)=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 QJVXKWHHAMZTBY-GCPOEHJPSA-N 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Computer Hardware Design (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明涉及聚合物厚膜阻隔层电介质组合物。由所述组合物制成的电介质可用于多种电子应用中以保护电元件，并且尤其可用于RFID应用中以隔离和保护其上方的导电性银天线和其下方的聚碳酸酯基板两者。
Description
技术领域
本发明涉及聚合物厚膜阻隔层电介质组合物。由所述组合物制成的电介质可用于多种电子应用中以保护电元件，并且尤其可用于射频识别（RFID）应用中以隔离和保护其上方的导电性银天线和其下方的聚碳酸酯基板两者。
背景技术
长久以来，电介质已被用于保护电元件。它们也已被用作隔离层。虽然它们已在这些类型的应用中使用多年，但在热成型程序期间将电介质用作阻隔层并不常见。这在其中使用高导电性银天线并且银与下面的基板不相容的RFID电路中尤其重要。本发明的目的之一是减轻这些问题并制备RFID天线构造，其中印刷的银天线可用于诸如聚碳酸酯的选择的基板上。
发明内容
本发明涉及聚合物厚膜阻隔层电介质组合物，所述组合物包含：
(a)80-98重量%的有机介质，其包含10-50重量%溶于第一有机溶剂中的热塑性氨基甲酸乙酯树脂，其中所述有机介质的重量百分比以所述聚合物厚膜阻隔层电介质组合物的总重量计，并且其中所述热塑性氨基甲酸乙酯树脂的重量百分比以所述有机介质的总重量计；以及
(b)2-20重量%的第二有机溶剂，其中所述第二有机溶剂为双丙酮醇，并且其中所述第二有机溶剂的重量百分比以所述聚合物厚膜阻隔层电介质组合物的总重量计。
本发明还涉及使用所述聚合物厚膜阻隔层电解质以形成RFID电路中，具体地讲，总构造的热成型中的保护和/或绝缘层。
具体实施方式
本发明涉及用于热成型电路，具体地讲RFID电路中的聚合物厚膜阻隔层电介质组合物。将一层阻隔层电介质印刷在基板上并干燥，以便保护该基板使其不受随后沉积在该阻隔层电介质上的其它层的影响。
通常用于聚合物厚膜RFID电路中的基板为聚碳酸酯（PC），聚酯（PET），例如聚萘二甲酸乙二醇酯（PEN），聚酰亚胺（PI）等。PC通常为优选的，因为其可以热成型。然而，PC对沉积在其上的层中使用的溶剂非常敏感。
聚合物厚膜（PTF）阻隔层电介质组合物由（i）包含溶解于第一有机溶剂中的聚合物树脂的有机介质和（ii）第二有机溶剂构成。另外，可添加粉末和印刷助剂以改善组合物。
有机介质
第一有机介质由溶解于第一有机溶剂中的热塑性氨基甲酸乙酯树脂构成。在一个实施例中，所述有机介质为所述聚合物厚膜阻隔层电介质组合物总重量的80-98重量%。氨基甲酸乙酯树脂必须实现对电元件（例如沉积在其上的RFID银层）以及下面的基板两者的良好粘附性。其必须与电元件的性能相容并且不会不利地影响电元件的性能。
在一个实施例中，热塑性氨基甲酸乙酯树脂为所述有机介质的总重量的10-50重量%。在另一个实施例中，热塑性氨基甲酸乙酯树脂为所述有机介质的总重量的25-45重量%，并且还在另一个实施例中，热塑性氨基甲酸乙酯树脂为所述有机介质的总重量的15-25重量%。在一个实施例中，热塑性氨基甲酸乙酯树脂为氨基甲酸乙酯均聚物。在另一个实施例中，热塑性氨基甲酸乙酯树脂为聚酯基的共聚物。
通常通过机械混合将聚合物树脂添加到有机溶剂中以形成介质。适用于聚合物厚膜组合物的溶剂是本领域技术人员已知的，包括乙酸酯和萜烯，如卡必醇乙酸酯和α-或β-萜品醇，或它们与其它溶剂的混合物，其它溶剂如煤油、邻苯二甲酸二丁酯、丁基卡必醇、丁基卡必醇乙酸酯、己二醇和高沸点醇以及醇酯。此外，可以包含挥发性液体，以用于促进在施用于基板上之后快速硬化。在本发明的多个实施例中，溶剂可以使用例如乙二醇醚、酮、酯和相似沸点（在180℃至250℃的范围内）的其它溶剂、以及它们的混合物。对这些溶剂和其它溶剂的各种组合进行配制，以获得所需的粘度和挥发性要求。所使用的溶剂必须使树脂溶解。
第二有机溶剂
第二有机溶剂为双丙酮醇。在一个实施例中，双丙酮醇为所述聚合物厚膜阻隔层电介质组合物的总重量的2-20重量%。在另一个实施例中，双丙酮醇为所述聚合物厚膜阻隔层电介质组合物的总重量的4-18重量%并且在另一实施例中，双丙酮醇为所述聚合物厚膜阻隔层电介质组合物的总重量的8-12重量%。
附加粉末
可将各种粉末添加到PTF阻隔层电介质组合物中以改善粘附性、改变流变特性并增加低剪切粘度从而改善印刷适性。一种此类粉末为热解法二氧化硅。
PTF阻隔层电介质组合物的施用
通常将也称为“浆料”的PTF阻隔层电介质组合物沉积在对气体和水分不可渗透的基板上，例如聚碳酸酯。基板也可为由塑性片材与沉积在其上的任选的金属或电介质层的组合组成的复合材料片材。
通常通过丝网印刷进行PTF阻隔层电介质组合物的沉积，但可使用其它沉积技术，如孔版印刷、注射式滴涂或涂覆技术。在使用丝网印刷的情况下，筛网的目尺寸控制沉积的厚膜的厚度。
一般来讲，厚膜组合物包含赋予组合物适当电功能性质的功能相。功能相包含分散在有机介质中的电功能粉末，所述有机介质充当功能相的载体。一般来讲，焙烧组合物以烧尽有机介质的聚合物和溶剂两者并赋予电功能性质。然而，在使用聚合物厚膜的情况下，有机介质的聚合物部分在干燥后仍作为组合物的整体部分。
可在除去所有溶剂所必需的时间和温度下加工PTF阻隔层电介质组合物。例如，通过暴露于140℃的热下通常10-15分钟来干燥沉积的厚膜。
RFID电路构造
使用的底部基板通常为10密耳厚的聚碳酸酯。按照上述条件印刷并干燥阻隔层电介质。可印刷并干燥多个层。然后在用于阻隔层的相同条件下印刷并干燥高度RFID银天线组合物，诸如DuPont5064。可包括整个单元的热成型的后续步骤在3D天线电路的生产中是典型的。如果不使用阻隔层电介质，则银天线组合物将使聚碳酸酯基板开裂或变形并且不能构建功能电路。
实例1
按以下方式制备PTF阻隔层电介质组合物。通过将20.0重量%的Desmocoll540聚氨酯(Bayer MaterialScience LLC(Pittsburgh,PA))与80.0重量%的二元酯（得自DuPont Co.(Wilmington,DE)）有机溶剂混合来制备有机介质。树脂的分子量为大约20,000。将该混合物在90℃下加热1-2小时以溶解所有树脂。向90重量%有机介质中加入10重量%双丙酮醇（得自Eastman Chemical(Kingsport,TN)）并混合。
以所述组合物的总重量计，PTF阻隔层电介质组合物为：
90.00重量% 的有机介质
10.00重量% 双丙酮醇溶剂
将该组合物在行星式搅拌器中混合30分钟。
然后按如下方法制造RFID电路。在10密耳厚的聚碳酸酯基板上，用280不锈钢筛网印刷上述PTF阻隔层电介质组合物的覆盖层印刷物并在120℃下干燥10分钟。使用280目的不锈钢筛网并用DuPont银浆5064（DuPont Co.(Wilmington,DE)）印刷一系列互相交叉的银线图案。在强制风箱炉中将图案化的线在120℃下干燥15分钟。检查所述部分，并且未发现下面的基板产生裂纹或变形的证据。
比较实验1
完全按实例1所述制备RFID电路。唯一的差别是未使用PTF阻隔层电介质组合物。基板的检测示出银组合物使得下面的聚碳酸酯基板开裂并严重变形。
比较实验2
完全按实例1所述制备RFID电路。唯一的差别是使用不包含任何双丙酮醇溶剂的PTF阻隔层电介质组合物。基板的检测示出PTF阻隔层电介质和银组合物两者使下面的聚碳酸酯基板开裂并严重变形。
从上文所示结果来看，阻隔层电介质引起的性能改善是显而易见的。另外，使用双丙酮醇的保护效果是非常明显的。
Claims (6)
1.聚合物厚膜阻隔层电介质组合物，包含：
(a)80-98重量%的有机介质，其包含10-50重量%溶于第一有机溶剂中的热塑性氨基甲酸乙酯树脂，其中所述有机介质的重量百分比以所述聚合物厚膜阻隔层电介质组合物的总重量计，并且其中所述热塑性氨基甲酸乙酯树脂的重量百分比以所述有机介质的总重量计；以及
(b)2-20重量%的第二有机溶剂，其中所述第二有机溶剂为双丙酮醇，并且其中所述第二有机溶剂的重量百分比以所述聚合物厚膜阻隔层电介质组合物的总重量计。
2.根据权利要求1所述的聚合物厚膜阻隔层电介质组合物，其中所述热塑性氨基甲酸乙酯树脂为氨基甲酸乙酯均聚物或聚酯基的共聚物。
3.根据权利要求2所述的聚合物厚膜阻隔层电介质组合物，其中所述热塑性氨基甲酸乙酯树脂为聚酯基的共聚物。
4.根据权利要求1所述的聚合物厚膜阻隔层电介质组合物，还包含热解法二氧化硅。
5.RFID电路，包含由权利要求1-4中任一项的聚合物厚膜阻隔层电介质组合物形成的阻隔层电介质。
6.RFID电路，包含由权利要求1-4中任一项的聚合物厚膜阻隔层电介质组合物形成的阻隔层电介质，其中所述RFID电路为热成型的。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/225,873 | 2011-09-06 | ||
| US13/225,873 US20130056537A1 (en) | 2011-09-06 | 2011-09-06 | Barrier layer dielectric for rfid circuits |
| PCT/US2012/051407 WO2013036369A1 (en) | 2011-09-06 | 2012-08-17 | Barrier layer dielectric for rfid circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103782445A true CN103782445A (zh) | 2014-05-07 |
Family
ID=46754774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280043141.0A Pending CN103782445A (zh) | 2011-09-06 | 2012-08-17 | 用于rfid电路的阻隔层电介质 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20130056537A1 (zh) |
| EP (1) | EP2754202A1 (zh) |
| JP (1) | JP2014526573A (zh) |
| CN (1) | CN103782445A (zh) |
| WO (1) | WO2013036369A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118428388B (zh) * | 2024-07-02 | 2024-09-10 | 欧科华创自动化(深圳)有限公司 | 一种超低温纸质电子标签及其制备方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5491377A (en) * | 1993-08-03 | 1996-02-13 | Janusauskas; Albert | Electroluminescent lamp and method |
| CN1160729A (zh) * | 1996-01-11 | 1997-10-01 | 纳幕尔杜邦公司 | 柔韧的厚膜导电组合物 |
| CN1180224A (zh) * | 1996-10-10 | 1998-04-29 | 三星电子株式会社 | 光记录介质 |
| CN101314698A (zh) * | 2007-05-28 | 2008-12-03 | 信越化学工业株式会社 | 耐磨涂料组合物及涂覆制品 |
| US20090169724A1 (en) * | 2007-12-27 | 2009-07-02 | Toshiaki Ogiwara | Conductive paste for use in membrane touch switch applications |
| WO2011096304A1 (ja) * | 2010-02-04 | 2011-08-11 | 株式会社トクヤマ | 光学物品用プライマー組成物及び光学物品 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4300184A (en) * | 1979-07-11 | 1981-11-10 | Johnson Controls, Inc. | Conformal coating for electrical circuit assemblies |
| DE3060766D1 (en) * | 1979-08-22 | 1982-10-14 | Lingner & Fischer Gmbh | Rubber adhesive compositions, gluesticks containing them and a process for their production |
| US4906596A (en) * | 1987-11-25 | 1990-03-06 | E. I. Du Pont De Nemours & Co. | Die attach adhesive composition |
| JPH05117582A (ja) * | 1991-10-29 | 1993-05-14 | Arakawa Chem Ind Co Ltd | コーテイング組成物 |
| JP2002274884A (ja) * | 2001-01-09 | 2002-09-25 | Mitsubishi Materials Corp | セラミックリブを形成するためのペースト及びその製造方法並びにそれを用いたリブ状物の形成方法 |
| CA2652104C (en) * | 2001-12-24 | 2012-02-14 | Digimarc Id Systems, Llc | Contact smart cards having a document core, contactless smart cards including multi-layered structure, pet-based identification document, and methods of making same |
| US7224280B2 (en) * | 2002-12-31 | 2007-05-29 | Avery Dennison Corporation | RFID device and method of forming |
| JP2005132966A (ja) * | 2003-10-30 | 2005-05-26 | Hitachi Chem Co Ltd | 環境対応ディスプレイパネル用防湿絶縁塗料 |
| EP1819211A4 (en) * | 2004-12-03 | 2011-02-23 | Nitta Corp | ELECTROMAGNETIC INTERFERENCE INHIBITOR, ANTENNA DEVICE AND ELECTRONIC COMMUNICATION APPARATUS |
| KR101489008B1 (ko) * | 2006-11-06 | 2015-02-04 | 조셉 펠드먼 | 다층구조의 신분증 |
| US8129494B2 (en) * | 2006-12-26 | 2012-03-06 | Asahi Kasei E-Materials Corporation | Resin composition for printing plate |
| WO2008118771A1 (en) * | 2007-03-23 | 2008-10-02 | Zih Corp. | Rfid tag with reduced detuning characteristics |
| US7786871B2 (en) * | 2007-05-23 | 2010-08-31 | Radiant Rfid, L.L.C. | Radio frequency identification devices with separated antennas |
| US20090277582A1 (en) * | 2008-05-09 | 2009-11-12 | E. I. Du Pont De Nemours And Company | Thick film recycling method |
| WO2010098210A1 (ja) * | 2009-02-25 | 2010-09-02 | 日本ポリウレタン工業株式会社 | プライマー組成物 |
-
2011
- 2011-09-06 US US13/225,873 patent/US20130056537A1/en not_active Abandoned
-
2012
- 2012-08-17 EP EP12751413.1A patent/EP2754202A1/en not_active Withdrawn
- 2012-08-17 WO PCT/US2012/051407 patent/WO2013036369A1/en active Application Filing
- 2012-08-17 CN CN201280043141.0A patent/CN103782445A/zh active Pending
- 2012-08-17 JP JP2014529732A patent/JP2014526573A/ja not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5491377A (en) * | 1993-08-03 | 1996-02-13 | Janusauskas; Albert | Electroluminescent lamp and method |
| CN1160729A (zh) * | 1996-01-11 | 1997-10-01 | 纳幕尔杜邦公司 | 柔韧的厚膜导电组合物 |
| CN1180224A (zh) * | 1996-10-10 | 1998-04-29 | 三星电子株式会社 | 光记录介质 |
| CN101314698A (zh) * | 2007-05-28 | 2008-12-03 | 信越化学工业株式会社 | 耐磨涂料组合物及涂覆制品 |
| US20090169724A1 (en) * | 2007-12-27 | 2009-07-02 | Toshiaki Ogiwara | Conductive paste for use in membrane touch switch applications |
| WO2011096304A1 (ja) * | 2010-02-04 | 2011-08-11 | 株式会社トクヤマ | 光学物品用プライマー組成物及び光学物品 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20130056537A1 (en) | 2013-03-07 |
| EP2754202A1 (en) | 2014-07-16 |
| JP2014526573A (ja) | 2014-10-06 |
| WO2013036369A1 (en) | 2013-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103827977A (zh) | 可热成型的聚合物厚膜银导体及其在电容式开关电路中的用途 | |
| US8692131B2 (en) | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits | |
| JP6535081B2 (ja) | 熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 | |
| US9245666B2 (en) | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits | |
| JP6592080B2 (ja) | 熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 | |
| CN103910991A (zh) | 用于可热成型电路的防潮层电介质 | |
| CN103782445A (zh) | 用于rfid电路的阻隔层电介质 | |
| JP6553705B2 (ja) | 熱成形可能容量性回路のための高ｋ誘電組成物 | |
| JP6523280B2 (ja) | 熱成形可能回路のための熱伝導性誘電体 | |
| CN106459577A (zh) | 具有触觉响应的可热成型的聚合物厚膜透明导体及其在电容式开关电路中的用途 | |
| EP3027687B1 (en) | Flexible white reflective dielectric for electronic circuits |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20170301 |