CN103781586A - Marking apparatus with a plurality of lasers and a combining deflection device - Google Patents
Marking apparatus with a plurality of lasers and a combining deflection device Download PDFInfo
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- CN103781586A CN103781586A CN201280042992.3A CN201280042992A CN103781586A CN 103781586 A CN103781586 A CN 103781586A CN 201280042992 A CN201280042992 A CN 201280042992A CN 103781586 A CN103781586 A CN 103781586A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0071—Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/07—Construction or shape of active medium consisting of a plurality of parts, e.g. segments
- H01S3/073—Gas lasers comprising separate discharge sections in one cavity, e.g. hybrid lasers
- H01S3/076—Folded-path lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/03—Constructional details of gas laser discharge tubes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08059—Constructional details of the reflector, e.g. shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/081—Construction or shape of optical resonators or components thereof comprising three or more reflectors
- H01S3/083—Ring lasers
- H01S3/0835—Gas ring lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/22—Gases
- H01S3/223—Gases the active gas being polyatomic, i.e. containing two or more atoms
- H01S3/2232—Carbon dioxide (CO2) or monoxide [CO]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
- H01S3/2383—Parallel arrangements
Abstract
The invention relates to a marking apparatus (100) for marking an object with laser light, comprising a plurality of lasers (10), in particular gas lasers (10), and a control unit for individually activating each of the lasers (10) to emit a laser beam according to a sign to be marked. A deflection device (30) is provided by which at least two laser beams are combined on a common spot.
Description
Technical field
According to claim 1 above described in, the present invention relates in one for by the mark instrument of laser marking objects.
Background technology
Conventionally, known marking arrangement uses a single laser instrument, for example, is for example CO
2the gas laser of laser instrument.Such laser instrument is launched a laser beam, and this laser beam is transferred on object to be marked.This object moves relative to this mark instrument on a conveyer belt.Typically, according to a symbol to be marked, one scan equipment is provided for directed this laser beam on object.
In order to increase handling capacity, general mark instrument has comprised a plurality of laser instruments, particularly multiple gas lasers.In addition,, according to a symbol to be marked, a control module is provided for the each laser instrument of independent activation and launches a laser beam.
The mark instrument of prior art, the intensity of the laser beam of one of them laser instrument can be controlled in a certain scope.But an extra high intensity can need excessively large laser instrument.
The shortcoming of one known mark instrument is only to have one can reach among compact design and high-intensity laser beam.
U.S. Pat 4,727,235 theme is a laser instrument Mk system, it has a plurality of laser instruments.The laser beam of transmitting is aligned to one-dimensional array and mutually has a fixed range.
U.S. Pat 4,131,782 relate to one for make the instrument in hole in an object by laser beam.This instrument has comprised a plurality of laser instruments, and the light beam of its transmitting is combined into a bit on body surface.For this reason, all laser beams are directed to a public arrangement for deflecting, such as a speculum.
From U.S. Pat 4,652, one known to 722 are for mark object laser instrument instrument.The laser instrument of some is provided, and the light beam of its transmitting is directed to a substrate to be marked with predefined distance to each other.
Japan Patent JP2011156574 relates to one for make the instrument of an object by laser beam.A plurality of laser beams are conditioned to form an adjacent making line.
U.S. Pat 6,229,940B1 has described out another Optical Maser System.This system has comprised a plurality of laser instruments, and the light beam of its transmitting is passed the shared condenser lens of all laser beams and is combined to a bit.
U.S. Pat 2009/0323753A1 is about for example, an instrument for inscribing container (bottle).This instrument uses a plurality of laser instruments, and the light beam of this laser instrument is directed into the release portion with a fixed position.For each laser instrument, it has a releaser.
U.S. Pat 5,115,446A relates to the bearing structure of the parts for laser instrument.This bearing structure allows the resonatron rectangular arranged of laser instrument.
Summary of the invention
The object of this invention is to provide a mark instrument with compact design, it allows to arrange the intensity of the laser beam of instrument under wide scope simultaneously.
Object of the present invention can solve by the mark instrument that includes claim 1 technical characterictic.
Preferred embodiment, in dependent claims and description afterwards, particularly provides by reference to the accompanying drawings mutually afterwards.
According to the present invention, above-mentioned this class mark instrument is characterised in that and provides a deflecting apparatus, is incorporated into a common point by least two laser beams of this deflecting apparatus.
Can be regarded as a basic conception of the present invention, its laser beam by least two various lasers of combination increases the sharp light intensity on the point being mapped on object to be marked.The laser beam of this combination can be understood to be on common point and overlap each other at least partly.The laser beam of combination can or form a single light beam, or they can cross one another at an a single point (, common point).
Useful, this has allowed to need high-intensity especially function.For example, thereby mark can be any change of body surface, the change of color, engraving, cutting.This mark instrument can be realized the operation that can be used for or be not used in mark extraly, such as, boring, burrows or punching.
Preferably, deflecting apparatus comprises an arrangement for deflecting group, its corresponding each laser beam comprises at least one arrangement for deflecting, specifically, corresponding at least one mapping mirror of each laser beam (mapping mirror) or a fiber waveguide, and each arrangement for deflecting is adjustable and/or displaceable separately separately at its yawing moment.If a laser beam is combined with another or several other laser beams, corresponding arrangement for deflecting can simply be adjusted accordingly.This arrangement for deflecting group can further allow the laser beam that is not incorporated into common point to be rearranged into the laser beam array needing.
In the present embodiment, each laser beam is directed to their corresponding arrangement for deflecting.It is adjustable each other that this arrangement for deflecting is independent of, and makes substantially can arrange the structure of any needs.The light beam of laser instrument transmitting forms one and specifically arranges, such as, the linear array of a parallel light beam of advancing.What can be regarded as a significant advantage is to allow linear array to be mapped to flexibly any other arrangement.Particularly, the interval between light beam can be changed or be reduced by this arrangement for deflecting group.
In the time that mark instrument moves or before operation, arrangement for deflecting can be set to a position needing.For this object, each arrangement for deflecting can be moved by the electro-motor of control module control by one.
In the situation that arrangement for deflecting is speculum, adjusting can realize by independent inclined mirror,, changes the direction of yawing moment or appointment speculum that is.Additional or optional, speculum can be shifted, and is displaceable in other words.Because laser beam can be rearranged by speculum, speculum also can be called as mapping mirror.
In context of the present invention, can be understood to whether any control one light beam is mapped to the process on object to be marked thereby activate each laser instrument transmitting one laser beam.Therefore, activate and also can pass through a beam shutter (beam shutter) realization.That is to say, one laser instrument keep activate, then the laser beam of a beam shutter control laser instrument by or stop.
Conventionally, laser instrument can be the laser instrument of any kind.If it is vital place that laser instrument is arranged into space, the present invention is useful especially.That is to say, if laser power depends on the size of laser instrument strongly.If the size of laser instrument forbids producing very close laser beam mutually, another advantage of the present invention can display.The present invention allows rearranging of laser beam to cause between laser beam to only have a bit of distance, therefore, have protrude mark resolution ratio.
The example of this class laser instrument is gas laser, chemical laser, fibre laser, dye laser and solid-state laser.In addition, semiconductor laser or metal vapor laser also can use.If use gas laser, is preferably CO
2laser instrument.But any Known Species all can provide, for example, He-Ne laser, CO laser instrument, argon laser, nitrogen laser, or excimer laser.These can be with continuous wave (continuous wave) or pulsing operation.
Symbol to be marked can be understood to any mark, for example, and a word, single pixel of a picture or figure.Symbol can comprise a series of point or line.That is to say, laser instrument can be by the activation of short time manufacturing place or be activated to produce the line of a certain length in a time range that can arrange on object.
In context of the present invention, object to be marked can be any article or have and can be affected surperficial product by the light of laser instrument.Specifically, object can be a packing, for example, for food or beverage, a fruit or a label.The material of object can comprise plastics, paper, metal, pottery, fiber, composite and organic organization.
Preferably, in order progressively to adjust and to be sent to the laser beam power of common point, control module is suitable for as power grade as required or is incorporated into the quantity of the laser beam of single point according to user's input setting.The laser beam power that is sent to common point is the summation of the power of each laser beam that is directed to common point.The combination of the quantity of laser instrument arranges accordingly each arrangement for deflecting by control module and reaches.Useful, can realize a very high intensity, this intensity reaches the overall strength of the laser beam of all combinations.The separation laser beam of higher quantity will be provided, if enough once lower intensity, such as the laser beam of two or three combinations, wherein each combined laser beam is made up of the laser beam of several laser instruments.Therefore, all laser instruments may can be used simultaneously in mark, and do not rely on the laser beam intensity of current needs.
According to a preferred embodiment of the invention, arrangement for deflecting is conditioned the beam spacing making between laser beam and has been reduced.The inferior position of the large beam spacing being produced by the large scale of laser instrument has been alleviated.With respect to the equipment for reducing beam spacing, in this equipment, all light beams are directed in a common optical element, for example, a suitable prism, the distortion that the arrangement for deflecting of instrument of the present invention causes light beam is still less.In addition,, in the case of the determined beam spacing in surface of object plays an important role, a protrude mark resolution ratio can be implemented.
One beam spacing reducing also causes more concentrated being mapped in common optical element of laser beam.In the time that spherical aberration occurs between paraxial ray and marginal ray, this is vital, and paraxial ray is mapped to the laser beam at the center of lens or speculum, and marginal ray, is mapped to the laser beam away from lens or speculum center.Useful, reduce beam spacing and be conducive to reduce spherical aberration.
Another preferred embodiment of the present invention is characterised in that, this arrangement for deflecting group comprises one first and 1 second mapping mirror group, and the corresponding each laser beam of each mapping mirror group comprises at least one mapping mirror, and the directed laser beam of the first mapping mirror group is to the second mapping mirror group.Therefore, each light beam is directed by least two mapping mirrors separately.This has allowed rearranging especially flexibly of light beam.Under these circumstances, arrangement for deflecting can be for the scanning motion of combined laser beam and implementation beam combination.
Conventionally, arrangement for deflecting can be by manual adjustments, particularly displaceable.But, be preferably the yawing moment that control module is applied to dislocation arrangement for deflecting and/or regulates arrangement for deflecting, particularly pass through gimbals.For expanded application field, each arrangement for deflecting can controlled unit regulate separately.In a relatively cost-saving example, at least one arrangement for deflecting of corresponding each laser beam can controlled unit regulate.Useful, gimbals can allow the arrangement for deflecting after installation to rotate freely angle or even all direction rotations at least two.
The adjusting of the arrangement for deflecting being undertaken by control module allows a variable Code location.Thereby the direction that this means the laser beam penetrating from instrument can be changed the position that changes the symbol to be generated by the laser beam on object.In addition, the height of code can be changed.
In addition, static mark is also feasible.In this situation, object is not moved whole mark is in service with respect to mark instrument.Arrangement for deflecting is moved to make laser beam flying to move, and like this, all symbols to be printed can be by continuous generation to static object.In the present embodiment, be particularly preferably for printing 2D figure, it needs high printed resolution.
Control module can also further be suitable for as automatically regulating arrangement for deflecting to be suitable for the variation of position of object, for example, and the vibration of compensation object.The variation of position can be passed through a sensor, as ultrasonic wave or Optical devices or approach switch are determined.
One preferred embodiment of instrument of the present invention is characterised in that, at least one scanning mirror device is provided, it comprises a public speculum, from all laser beams of this arrangement for deflecting group in the above, control module is suitable for as pivotable scanning mirror device simultaneously, particularly by a galvanometer (galvanometer).
Scanning mirror equipment can be understood to that any light beam that can cause is by the apparatus of some continuous locus.
One favourable may be, first, any amount of laser beam is deflected device combination, and then the laser beam of combination and any remaining laser beam not being combined are scanned mirror device and are redirected.In other words, scanning reflection mirror has formed a 2D beam direction system at a 2D plane interior orientation common point.
In simple situation, such scanning mirror equipment can comprise one or more rotatable mirrors.Equipment comprises the galvanometer being connected with a speculum, and it is commonly called galvanometer scanner.One galvanometer scanner can change input electrical signal into the position, angle of the speculum of galvanometer scanner.Preferably, provide at least two galvanometer scanners.After galvanometer scanner is arranged, each like this laser beam is directed to the second galvanometer scanner from the first galvanometer scanner, in a specific visual field, just advantageously may form any two-dimensional scan and move.
Scanning mirror equipment also can be understood to a light beam steering unit (BTU), and it also can be called as an installation component.
The task of scanning mirror equipment also can be performed by acousto-optic equipment.Among this, a sound wave and acousto-material coupling.The angle of the deflection of the laser beam of acousto-material is passed through in the domination of sound wave frequency.By change sound wave frequency fast, the short scan campaign that can reach laser beam.
For the object of mark in moving with respect to mark instrument, in another preferred embodiment, the information that control module is suitable for as moving according to object regulates arrangement for deflecting and/or at least one scanning reflection mirror device.Therefore object can be pursued or be followed the trail of.
According to another preferred embodiment of the invention, the first and second mapping mirror groups are arranged in linear array separately; And each mapping mirror is tiltable.In this embodiment, the spacing between the mapping mirror in two of shining upon in mirror groups can be fixed, and it allows to use a common mounting device with linear array Support Mapping mirror, and the inclination of speculum is still feasible simultaneously.The second mapping mirror group can tilt a plane being formed by the laser beam that is mapped to the first mapping mirror group.Can be provided for the positioner of the position of at least one linear array that regulates mapping mirror.Particularly, positioner can substitute common mounting device.
Another preferred embodiment of instrument of the present invention is characterised in that, control module is suitable for as controlling arrangement for deflecting arranges the convergence of a non-combined laser beam or the degree of dispersing, the laser beam of non-combination is launched from arrangement for deflecting, specifically, launches from the second arrangement for deflecting group.Therefore, arrangement for deflecting can be conditioned, make from instrument one give set a distance, produce the required separation distance between non-combined laser beam.The height of the word of laser beam manufacture and printed resolution are to be arranged by the interval of laser beam, and the degree that also can restrain by adjusting is revised simultaneously.
Laser instrument can be arranged and make parallel laser instrument and formation one linear array left of laser beam.But, according to different application, may need to change the linearly aligned direction of laser beam.For this reason, control module can be suitable for as regulating arrangement for deflecting, and the linear array that makes the laser beam that is mapped to arrangement for deflecting around the axle rotation of direct of travel of laser beam that is parallel to ejaculation, for example, is rotated 90 °.Thereby one horizontally can rotate to arranged vertically or vice versa.For the linear array of slewed laser beam, this arrangement for deflecting group can comprise one first mapping mirror group, and it uses together with at least one or two scanning mirror equipment.
In order to form a plurality of common points, each laser instrument can be assigned in a plurality of groups, and arrangement for deflecting is arranged, and makes the laser beam of the laser instrument of each group be incorporated into a corresponding common point.Preferably, the quantity that is assigned to the laser instrument of a group is identical for each group.The in the situation that of 9 laser instruments, for example, may there be 3 laser instruments of 3 groups, or have 4 groups, its every group has 2 laser instruments and 1 laser instrument being closed.
According in another preferred embodiment of the present invention, the telescopic equipment with at least two lens is provided for focal length integrally-regulated of laser beam.This is integrally-regulated can be understood to that all laser beams advance by telescopic equipment and be therefore affected in the same manner.Control module can be suitable for as the distance according to object arranges telescopic equipment, thereby particularly makes the focal length of laser beam corresponding to the distance of object.Useful, when object near or during away from this instrument, the spot size that is manufactured on the mark on object can keep constant.Preferably, telescopic equipment is arranged on after arrangement for deflecting, reduces because the largest beam interval between any two laser beams may be deflected device.It is less that therefore the optical element of telescopic equipment can be done.
In preferred a variation of instrument of the present invention, provide a retractor device group, for the convergence of each laser beam or the degree of dispersing are set, thereby the focal length of each laser beam is set.This can carry out separately each light beam.Useful, therefore can compensate path difference, path difference refers to and arrives before object, the length difference in the path of light beam separately.This may be because the different internal path lengths in the surface profile of object or mark instrument cause.
Each retractor device can comprise at least two optical elements, particularly at least two lens or curved mirror, and the distance between it is conditioned for arranging focal length.
Preferably, retractor device, it also can be called a light-beam forming unit, its controlled unit linear regulation, that is, the position of at least one optical element of each retractor device is changed in the direction of propagation of corresponding laser beam.
In order to compensate the path length difference between the laser beam that is combined to common point, control module can be suitable for as controlling retractor device, makes the laser beam after combination have a common foci or focus.In addition, the light beam focal length of different combinations also can be set, for reach high strength and a level and smooth or soft profile at center in the overlapping place of two light beams.One common foci can be considered to all combined laser beams and have same diameter or a spot size on object to be marked.
Control module can further be applied to control retractor device and compensate the path length difference between the laser beam not being combined.Path length difference may be caused by the particular arrangement of arrangement for deflecting.Depend on arrangement for deflecting in place, the beam path of laser beam may have different length, causes the different some size of the laser beam on object.Had retractor device, it is exactly feasible that flat field is proofreaied and correct, and in plane correction, each laser beam records identical focal length from an end of instrument.
Control module also can be suitable for as regulating in real time retractor device, is changed because of the adjusting of arrangement for deflecting when path.Additional or optional, control module can be suitable for as having the information changing about path or be redirected the information of laser beam by scanning device according to any, retractor device is set, and path changes the movement such as vibrations or any other object.
According to another embodiment of the present invention, control module is suitable for the activation for postponing separately each laser instrument, like this, when object at object moving direction in the situation that mark instrument moves, at least two laser beams are penetrated the same position on object in object moving direction.Can make the opportunity of the activation of laser instrument all laser beams in the moving direction of object, penetrate the same position at object.
In addition, no matter the location between Emission Lasers bundle and object moving direction, different laser beams can cause gauge point to become line, and line is perpendicular to object moving direction.The length of this line depends on the location between Emission Lasers bundle and object moving direction.
Preferably, laser instrument is stacked and makes the laser beam that laser instrument is launched form a laser beam array, particularly has the linear array of collimated laser beam.Each laser instrument can be gas laser, and it comprises the resonatron around an interior zone at least partly, and resonatron forms a closed loop or open loop.The laser beam of transmitting is directed to interior zone by light beam transmission apparatus, and light beam transmission apparatus is preferably a speculum group.General light beam transmission apparatus also can form by the output coupling mirror of gas laser.In such situation, a resonatron end portion of each gas laser can be indicated the direction at interior zone.Then, this arrangement for deflecting group can be arranged on interior zone.
Advantageously, some resonatron is beneficial to cooling, and these resonator tube are arranged on the opposite face of closed loop or open loop, and distance farthest, and is held in joint space-efficient mode at interior zone due to light element simultaneously relative to each other, and the overall size of instrument does not increase.
Light beam transmission apparatus also can be used as a part for retractor device.In addition, can be a part for retractor device for the output coupler of the gas laser that is coupled out laser beam.Output coupling can be partially reflecting mirror, and the wherein outer surface of each speculum, towards the surface away from laser gas, can have any shape that is conventionally.Therefore, preferred shape is that the behavior of each output coupling is similar to telescopical first lens.
The present invention's one advantageous variant is devoted to damage the situation of (failed) pixel, and damaged pixel refers to that laser instrument lost efficacy, and does not go out a laser beam.For the laser beam of replacing damaged laser instrument, thereby control module is deflected to the direction of damaging laser beam applicable to the laser beam of the laser instrument that regulates arrangement for deflecting and retractor device to work.Thereby thereby retractor device is controlled for regulating the path length difference between the laser rays that damages laser beam and replace this light beam.
Another preferred embodiment of the present invention is characterised in that, each arrangement for deflecting is a fiber waveguide.Fiber waveguide can be any fiber waveguide flexibly of guiding laser instrument emission of light, and this light has a certain wavelength, specifically a wavelength infrared light with 10 μ m.The example of fiber waveguide can be optical fiber or has the blank pipe of inner reflective surface.
Each fiber waveguide can be equipped with the input coupling optical part of the core for the laser beam of ejaculation is directed to fiber waveguide with suitable angle.Fiber waveguide can be equipped with output coupling optical part equally, and it comprises and is in particular at least two lens, for collecting the laser emission away from fiber waveguide.Output coupling optical part can be determined size, focal length and the depth of focus of laser beam.Especially, output coupling optical part can be formed retractor device.
Preferably, fiber waveguide has identical length.This has caused spot size and the quality of the mark on object more constant.
The invention further relates to a Mk system that includes a mark instrument as above, this system can further comprise a pivoting device, for a relative object moving direction, mark instrument is tilted.
By illustrating, by inclination mark instrument, can make to change printed resolution as subsequently, change one perpendicular to the direction of an object moving direction on object the distance of gauge point be possible.This be by one perpendicular to the direction of an object moving direction in beam spacing arrange.Because laser instrument can be delayed to, when object has moved when large as beam spacing in object moving direction, be just activated, thereby beam spacing in object moving direction does not play a decisive role to printed resolution.
Then, can change perpendicular to the beam spacing in the direction of an object moving direction by inclination mark instrument, and thereby change and swash the two-dimensional arrangements of wire harness.Preferably, the printed resolution that control module is applicable to based on required tilts mark instrument by pivoting device.
In the linearly aligned situation of laser beam, the angle of inclination between the linear array of laser beam and object moving direction has been arranged in the direction of vertical object moving direction, the distance between the gauge point on object.If the linear array of laser beam is perpendicular to object moving direction, the distance maximum between gauge point.For a less distance is set, angle of inclination can be reduced.Adding suitable launching time, laser instrument, angle of inclination can be set up, and makes gauge point form the gauge point of a continuous lines or separation.Overlapping mark point can manufacturedly be used for causing the varying strength of gauge point, such as, for gray scale printing.In addition, inclination angle can be zero, postpones between a corresponding igniting if select, and selects the activation of laser instrument, complete overlapping the reaching of gauge point.
The present invention understands more fully and other various different characteristics and advantage of the present invention become clearer in connection with accompanying drawing by following explanation.Below explanation is only some examples, but not any restriction to the application.Equivalent unit in accompanying drawing indicates with identical Reference numeral respectively.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the first embodiment of mark instrument of the present invention;
Fig. 2 is the schematic diagram of the first structure of light-beam forming unit group and arrangement for deflecting group;
Fig. 3 A and Fig. 3 B are the different views of the second structure of light-beam forming unit group and arrangement for deflecting group;
Fig. 4 A and Fig. 4 B are the different views of the 3rd structure of arrangement for deflecting group and light-beam forming unit group;
Fig. 5 is according to the schematic diagram of Mk system of the present invention and the object to be marked that moves with respect to Mk system.
The specific embodiment
Fig. 1 is according to the schematic diagram of the first embodiment of a mark instrument 100 of the present invention, and mark instrument 100 has comprised, a plurality of gas lasers 10, and each laser instrument is launched a laser beam, and it is used to manufacture a mark on object (not shown).In order to form and directed laser beam, this instrument 100 further comprises Optical devices 30,40,45,50.Although the present invention is below with reference to comprising that the mark instrument of gas laser is described, the laser instrument of other models also can be replaced and being adopted.
In an example shown, a plurality of gas lasers 10, have comprised 9 gas laser 10a-10i.Conventionally, it is desirable having a large amount of gas laser 10, such as, at least 4 or 6 laser instruments.Each gas laser 10 has comprised resonatron 12, and its mutual fluid connects (fluidic connection).Namely, the resonatron 12 of a gas laser forms a public resonatron three dimensions (resonator volume).It is also feasible that resonatron 12 fluids of different laser instruments 10 connect.
In described embodiment, gas laser refers to CO
2laser instrument, and correspondingly, gas laser can comprise other gases, as CO, and N
2and He.
Resonator tube 12, around an interior zone or free center space 5 therebetween, is set to the shape of an annular.The annular forming by linkage unit 16 is for connecting the adjacent resonatron 12 that belongs to identical laser.Connection Element 16 is set to the corner of stacking laser instrument, and is enclosed with the speculum for laser beam is reflected to other resonator tube from an adjacent resonators pipe 12.
In described example, resonatron 12 forms the sealing three dimensions of an annular or rectangle.Conventionally, the shape in any other at least part of closed interior region 5 can be selected, a for example triangle, square or a U-shaped.
The resonatron 12 of each gas laser 10a-10i can form a sealing three dimensions (sealed volume).Thereby the common sealing three dimensions of formation one can is separated by or interconnect to the three dimensions of laser instrument to each other.In the laser instrument of sealing, conventionally need in long-time, laser gas composition be remained unchanged.With this end in view, by an extra gas reservoir 19, total gas three dimensions can be enhanced.Gas in holder can not be excited to produce gas light.But holder 19 is connected with the gas three dimensions of one or more resonatrons 12.
The resonatron 12 of each laser instrument 10 is set to independently, separated plane layer.Laser instrument 10 is roughly the same and be stacked on each other and go up in a parallel manner.
The rectangular shape of laser instrument 10 can be opening on an angle.In illustrated embodiment, be the upper left corner, provide the output flange portion 17 of an integration thereon.On this angle, the three-dimensional end of gas has a mirror 18 backlight, and mirror 18 backlight is for being reflected back laser beam resonatron 12.Mirror 18 backlight can be connected with an end resonatron 12, and this end resonatron 12 is supported by integrated output flange 17, or mirror backlight 18 can link with integrated output flange 17.
Three-dimensional another end of gas is terminated on same angle by output coupler 13.Output coupler 13 is coupled out a laser beam, and can be connected to an end resonatron 12 or integrated output flange 17 again simultaneously.Output coupler 13 can be partially reflecting mirror 13 or also can be described as part reflection output coupler.The laser beam of transmitting can be directed in interior zone 5 by light beam transmission apparatus 14 subsequently.In illustrated embodiment, light beam transmission apparatus 14 comprises at least one speculum 14 being arranged on integrated output flange 17.
In interior zone 5, be provided with the Optical devices 30,40,45,50 for shaping and deflection laser bundle.This setting advantageously makes space requirement relatively low.
Be mapped to one group for the light-beam forming unit 40 of laser focusing bundle again from the laser beam of light beam transmission apparatus 14.Corresponding each laser beam of this group light-beam forming unit includes a light-beam forming unit 40a-40i.Therefore, the focusing of laser beam can be by each independent setting.Illustrated is for each light-beam forming unit 40a-40i, is provided with lens.But what each light-beam forming unit can replace comprises at least two optical elements, such as, speculum or lens, form a retractor device, useful, and the focal length of adjusting laser beam only needs the slight displacement of the optical element of retractor device thereupon.
After advancing by light-beam forming unit 40, laser beam is mapped on a deflecting apparatus 30, and it comprises an arrangement for deflecting group 30.But, this order can be changed or these two kinds of devices in single element can replace, light-beam forming unit 40 element can be arranged on two interelements of arrangement for deflecting 30.
Conventionally can be also light beam transmission apparatus 14 forming section retractor devices 40 or part arrangement for deflecting 30.In the situation that being part arrangement for deflecting, light beam transmission apparatus 14 can form the first mapping mirror group.The quantity of the optical element needing is then by useful minimizing.
In the embodiment describing, corresponding each laser beam of an arrangement for deflecting group 30 is provided with an arrangement for deflecting 33a-33i.These arrangements for deflecting 33a-33i can also be called as one first mapping device group or speculum 33.Conventionally, arrangement for deflecting can be any device that changes the direction of propagation of laser beam, comprises optical fiber.Mapping mirror can be independent of each other and be placed.Therefore the arrangement that, is mapped to the laser beam on arrangement for deflecting 30 can change by the position that regulates independent speculum 33a-33i.
At least two mapping mirror 33a, 33b is conditioned and corresponding laser beam is crossed one another go up on one point or more at least going up, and this point can be called as common point.This common point or the first common point are preferably in the outside of instrument 100, and object to be marked can be simply positioned on above-mentioned point.
Remaining mapping mirror 33c-33i can or be conditioned and makes their laser beam form at least one other common point, or makes their laser beam be mapped to point independent on object to be marked.
Control module is suitable for as regulating any remaining mapping mirror 33c-33i, makes the laser beam of their correspondences be mapped to the first common point being formed by two mapping mirror 33a, 33b.Therefore the intensity of the laser beam that hits the first common point of any needs can be set, until the combined strength of all laser beams.
After leaving arrangement for deflecting 30, laser beam is mapped in a series of common optical element, that is, and and the optical element that all laser beams are mapped to.These can comprise the telescopic equipment 45 of an across-the-board regulation for laser beam foucing.With respect to retractor device group 40 as above, telescopic equipment 45 affects all laser beams in the same manner.
Optical element in beam path also can comprise for changing or the device of the intensity distributions of homogenising light beam, for changing the device of polarization of light beam, particularly, for reaching the public polarization in the whole cross section of light beam, or for the light beam of depolarization.
Finally, laser beam is passed one scan mirror device 50 and is directed to outside instrument 100.This equipment 50 can comprise two galvanometer scanners 50, and each galvanometer scanner has a rotatable public speculum 50a, and all laser beams are mapped on this public speculum 50a.
As shown in Figure 2, be the first exemplary arrangement of arrangement for deflecting group 30 and light-beam forming unit group 40.
In the example illustrating, laser beam 90a-90i is mapped out by this arrangement for deflecting group 30, and the linear array of laser beam is rotated, for example, and 90 °.But the laser beam 90a-90i that is mapped to the first mapping mirror group 33 can parallelly advance, then after being redirected by the second mapping mirror group 34, the no longer parallel but convergence of at least some laser beam 90a-90i is advanced.Consequently, they overlap on a common point, on this common point, can place object to be marked.
Shown in structure therefore also can be called as the mapper as one level-vertical pixel.The first and second mapping mirror groups 33,34 are aligned to a plane and orthogonal.
After this arrangement for deflecting group 30, provide the light-beam forming unit group 40 of a beam shaping for laser beam 90a-90i and calibration.This light-beam forming unit group 40 has comprised a plurality of light-beam forming units, and each have at least two lens.Thereby in order to regulate the focus of each laser beam 90a-90i and to be adjusted in the spot size on object to be marked, lens can be offset on the direction of propagation of laser beam 90a-90i.Therefore light-beam forming unit forms retractor device.When correspondence, each laser beam 90a-90i has a retractor device, and light beam also can be conditioned for path length difference.Particularly importantly these show different paths conventionally at the overlapping laser beam of common point.
For Printing Marks is to object, the scanning motion of laser beam 90a-90i can be performed by the second mapping mirror group 34.Alternatively, the second mapping mirror group 34 can arrive one scan mirror device by directed laser beam 90a-90i.
Fig. 3 A and 3B show the different view of another structure of arrangement for deflecting group 30 and light-beam forming unit group 40.
This structure is different from the arrangement of the first and second mapping mirror groups 33,34 before.Under present case, this first mapping mirror group 33, the second mapping mirror group 34 form linear array, and its (being different from the former structure) be not in a plane.On the contrary, two linear arraies are reduced in the interval between laser beam 90a-90i take an angle (in this case as 45 °).Meanwhile, the linear array of laser beam 90a-90i is rotated 90 °.
Fig. 4 A and 4B show another useful structure of mapping mirror 33,34.Here being mapped to before arrangement for deflecting group 30, first pass through light-beam forming unit group 40 from the laser beam in left side.The same with situation before, the structure that Fig. 4 A and 4B describe has been shown the first and second mapping mirror groups 33,34, and every group is aligned to linear array 35,36.But in this subsidiary embodiment, the second mapping mirror group 34 is tilted as in the distance required apart from instrument, all laser beam 90a-90i that are reflected are overlapping and form a common point.By the degree of convergence of laser beam 90a-90i is set, common point place distance can be different.
Preferably, the mapping mirror of the second mapping mirror group 34 can tilt by gimbals controlled unit.The mapping mirror of the first mapping mirror group 33 can or be fixed these speculums can not be shifted in printing operation, or speculum also can be by universal rotational.
In the embodiment of Fig. 2 to Fig. 4 B, illustrated, the scanning motion of laser beam 90a-90i can be by the mapping mirror 34a-34i operation of the second mapping mirror group 34 that tilts.Scanning device, has one for being redirected the galvanometer scanner of the public speculum of all laser beam 90a-90i, does not exist in this case.But it may be also useful that such scanning device is provided.
For arrangement for deflecting being set to any Fig. 2 to the structure shown in Fig. 4 B, preferably provide a control module.
Fig. 5 schematically shows a Mk system 120 and object to be marked 1.
Object 1 moves in object moving direction 2, and shows in the drawings its situation three different positions, and they are sequentially on three different positions.Mk system 120 includes the pivoting device 110 of a mark instrument 100 and for mark instrument 100 is tilted.
Depend on shape and the position of object 1, as that indicates in the mark in Fig. 3 " d ", the changeable size of distance between object 1 and instrument 100.Further, sequentially on a point, for the laser beam 90a of each combination, 90b, 90c, its distance can be different.The laser beam 90a of the combination on object 1,90b, the spot size of 90c still equates.With this end in view, provide foregoing light-beam forming unit, it regulates by control module 20.
The useful layout flexibly that a plurality of laser instruments are provided of mark instrument of describing.One extra high laser beam intensity can be reached to a common point by the laser beam of the laser instrument of combination any amount.If desired laser beam intensity, lower than the laser instrument of all combinations, can form a plurality of common points, and it is each makes by a plurality of laser beams.Thereby advantageously provide the compact design of the high beam intensity of a permission, and use laser beam very flexibly.
Claims (13)
1. for by the mark instrument of laser labelling one object (1), comprise
-a plurality of laser instruments (10), particularly gas laser (10); And
-mono-for according to a symbol to be marked, activates separately each laser instrument (10) thereby the control module (20) of transmitting one laser beam (90a – 90i);
It is characterized in that,
Described instrument also comprises:
-mono-deflecting apparatus (30), by described deflecting apparatus, at least two laser beams (90a – 90i) are incorporated into a common point;
Described deflecting apparatus (30) comprises an arrangement for deflecting group (30), corresponding each laser beam (90a – 90i), and arrangement for deflecting group (30) has at least one arrangement for deflecting (33a – 33i, 34a – 34i); And
Each arrangement for deflecting (33a – 33i, 34a – 34i) is adjustable and/or displaceable separately separately at its yawing moment;
In order to combine a laser beam (90a – 90i) to another or several other laser beams (90a – 90i), corresponding deflection device (33a – 33i, 34a – 34i) is correspondingly adjustable; And
Arrangement for deflecting group (30) allows to rearrange laser beam (the 90a – 90i) array of needs of laser beam (90a – 90i) one-tenth that are not incorporated into common point.
2. mark instrument as claimed in claim 1, is characterized in that,
Corresponding each laser beam (90a-90i), described at least one arrangement for deflecting (33a – 33i, 34a – 34i) is one of following: corresponding each laser beam (90a-90i), at least one mapping mirror (33a – 33i, 34a – 34i) or corresponding each laser beam (90a-90i), at least one fiber waveguide; And
Each at least one mapping mirror (33a – 33i, 34a – 34i) or fiber waveguide is independent adjustable and/or displaceable separately at its yawing moment.
3. mark instrument as claimed in claim 1 or 2, is characterized in that,
In order progressively to adjust a laser beam power that is sent to common point, control module (20) is suitable for as according to a power grade needing or be incorporated into the quantity of the laser beam (90a – 90i) of a single point according to user's input setting.
4. the mark instrument as described in claim 1 to 3 any one, is characterized in that,
For the laser beam (90a – 90i) of orientation by deflecting apparatus (30) combination is to the direction of needs, provide at least one scanning mirror equipment (50);
Described scanning mirror equipment (50) has comprised a public speculum (50a), penetrates all laser beams (90a – 90i) from deflecting apparatus (30) on described public speculum (50a); And
Control module (20) is suitable for as pivotable scanning mirror equipment (50), particularly by a galvanometer.
5. the mark instrument as described in claim 2 to 4 any one, is characterized in that,
In order to form a plurality of common points, each laser instrument (10) is assigned in a plurality of groups, and
The laser beam (90a – 90i) that described arrangement for deflecting (33a – 33i, 34a – 34i) is arranged the laser instrument (10a-10i) that makes each group is incorporated into common point separately.
6. the mark instrument as described in claim 1 to 5 any one, is characterized in that,
Corresponding each laser beam (90a – 90i) provides retractor device group (40), and retractor device group (40) comprises at least one retractor device (40a – 40i);
Each retractor device (40a – 40i) is adjustable for the focal length of laser beam (90a – 90i) of a correspondence is set separately; And
For compensating the path length difference between the laser beam (90a – 90i) that is combined to common point, control module (20) is suitable for as controlling retractor device (40a – 40i) and makes the laser beam (90a – 90i) of combination have a common foci.
7. the mark instrument as described in claim 2 to 6 any one, is characterized in that,
Described arrangement for deflecting group (30) comprises one first and second mapping mirror group (33,34);
Each mapping mirror group (33,34) corresponding each laser beams (90a90i) comprise at least one mapping mirror (33a – 33i, 34a – 34i);
Described the first mapping directed described laser beam of mirror group (33) (90a – 90i) is to described the second mapping mirror group (34).
8. mark instrument as claimed in claim 7, is characterized in that,
Described control module (20) is suitable for the yawing moment into dislocation arrangement for deflecting (33a – 33i, 34a – 34i) and/or adjusting arrangement for deflecting (33a – 33i, 34a – 34i), particularly passes through gimbals.
9. the mark instrument as described in claim 2 to 8 any one, is characterized in that,
Described control module (20) is suitable for as controlling arrangement for deflecting (33a – 33i, 34a – 34i) arranges the convergence of a laser beam (90a – 90i) from arrangement for deflecting group (30) transmitting or the degree of dispersing.
10. the mark instrument as described in claim 1 to 9 any one, is characterized in that,
Be provided a telescopic equipment (45) with at least two lens, described telescopic equipment (45) is integrally-regulated for the focal length of laser beam (90a – 90i).
11. mark instruments as described in claim 1 to 10 any one, is characterized in that,
Each arrangement for deflecting comprises that a fiber waveguide and described fiber waveguide have identical length.
12. mark instruments as described in claim 1 to 11 any one, is characterized in that,
Arrangement for deflecting (33a – 33i, 34a – 34i) is conditioned the not beam spacing between the laser beam (90a – 90i) of common point combination is reduced.
13. Mk systems,
Include the mark instrument as described in claim 1 to 12 any one, and
For the pivoting device (110) of the described mark instrument (100) that tilts with respect to the object moving direction (2) of object to be marked (1).
Applications Claiming Priority (3)
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EP11007182.6 | 2011-09-05 | ||
EP11007182.6A EP2564973B1 (en) | 2011-09-05 | 2011-09-05 | Marking apparatus with a plurality of lasers and a combining deflection device |
PCT/EP2012/003066 WO2013034211A1 (en) | 2011-09-05 | 2012-07-19 | Marking apparatus with a plurality of lasers and a combining deflection device |
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CN103781586A true CN103781586A (en) | 2014-05-07 |
CN103781586B CN103781586B (en) | 2015-11-25 |
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US (1) | US9595801B2 (en) |
EP (1) | EP2564973B1 (en) |
CN (1) | CN103781586B (en) |
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DK (1) | DK2564973T3 (en) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108780975A (en) * | 2016-03-14 | 2018-11-09 | 康茂股份公司 | Lasing light emitter is especially used for the lasing light emitter of industrial process |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104267670B (en) * | 2014-09-10 | 2017-12-01 | 成都乐创自动化技术股份有限公司 | A kind of laser marking on the fly hardware compensating method |
CA172005S (en) * | 2016-12-01 | 2017-08-11 | Riegl Laser Measurement Systems Gmbh | Laser scanner for surveying, for topographical and distance measurement |
EP3711966B1 (en) * | 2019-03-20 | 2021-12-15 | Alltec Angewandte Laserlicht Technologie GmbH | Method for applying a marking on an object and marking apparatus |
MX2021012685A (en) | 2019-04-16 | 2021-11-12 | Aperam | Method for the creation of an iridescent effect on the surface of a material, and devices for carrying out said method. |
WO2023230703A1 (en) * | 2022-05-31 | 2023-12-07 | Husky Injection Molding Systems Ltd. | System for laser marking of products |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4727235A (en) * | 1986-08-07 | 1988-02-23 | Videojet Systems International, Inc. | Method and apparatus for equalizing power output in a laser marking system |
DE4212390A1 (en) * | 1992-04-13 | 1993-10-14 | Baasel Carl Lasertech | Laser engraving machine for print rollers - has beam guide for several laser beams to generate variable beam spot configuration on work surface |
CN1230268A (en) * | 1996-09-11 | 1999-09-29 | 多米诺印刷科学公开有限公司 | Laser appts. |
US6229940B1 (en) * | 1998-11-30 | 2001-05-08 | Mcdonnell Douglas Corporation | Incoherent fiber optic laser system |
CN1644297A (en) * | 2003-09-12 | 2005-07-27 | 奥博泰克有限公司 | Multiple beam micro-machining system and method |
JP2011156574A (en) * | 2010-02-02 | 2011-08-18 | Hitachi High-Technologies Corp | Focusing device for laser beam machining, laser beam machining apparatus and method for manufacturing solar panel |
Family Cites Families (274)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2359780A (en) | 1938-10-29 | 1944-10-10 | Muffly Glenn | Refrigerating mechanism |
GB1016576A (en) * | 1962-08-22 | 1966-01-12 | Varian Associates | Optical maser |
US3628175A (en) * | 1963-11-29 | 1971-12-14 | Perkin Elmer Corp | Optical maser having concentric reservoirs and cylindrical resonator |
US3564452A (en) * | 1965-08-23 | 1971-02-16 | Spectra Physics | Laser with stable resonator |
US3465358A (en) * | 1966-07-21 | 1969-09-02 | Bell Telephone Labor Inc | Q-switched molecular laser |
US3533012A (en) * | 1967-02-10 | 1970-10-06 | Optics Technology Inc | Laser apparatus and method of aligning same |
US3638137A (en) * | 1969-01-10 | 1972-01-25 | Hughes Aircraft Co | Method of q-switching and mode locking a laser beam and structure |
GB1269892A (en) * | 1969-03-20 | 1972-04-06 | Messerschmitt Boelkow Blohm | Weapon system for the detection of and use against stationary or moving objects |
US3596202A (en) * | 1969-03-28 | 1971-07-27 | Bell Telephone Labor Inc | Carbon dioxide laser operating upon a vibrational-rotational transition |
US3721915A (en) * | 1969-09-19 | 1973-03-20 | Avco Corp | Electrically excited flowing gas laser and method of operation |
US3646476A (en) * | 1969-11-24 | 1972-02-29 | Coherent Radiation Lab | Pulsed gas ion laser |
US3662281A (en) * | 1970-02-11 | 1972-05-09 | Union Carbide Corp | Method and means for compensating birefringence in laser systems |
US3602837A (en) * | 1970-03-31 | 1971-08-31 | Us Army | Method and apparatus for exciting an ion laser at microwave frequencies |
CH522287A (en) | 1970-04-13 | 1972-06-15 | Inst Angewandte Physik | Low pressure gas discharge tube for lasers |
US3801929A (en) * | 1972-07-31 | 1974-04-02 | Asahi Optical Co Ltd | Gas laser apparatus having low temperature sensitivity |
US3851272A (en) * | 1973-01-02 | 1974-11-26 | Coherent Radiation | Gaseous laser with cathode forming optical resonator support and plasma tube envelope |
US3900804A (en) * | 1973-12-26 | 1975-08-19 | United Aircraft Corp | Multitube coaxial closed cycle gas laser system |
US3919663A (en) | 1974-05-23 | 1975-11-11 | United Technologies Corp | Method and apparatus for aligning laser reflective surfaces |
US4053851A (en) * | 1975-07-10 | 1977-10-11 | The United States Of America As Represented By The United States Energy Research And Development Administration | Near 16 micron CO2 laser system |
GB1495477A (en) | 1975-10-31 | 1977-12-21 | Taiwan Fan Shun Co Ltd | Drinking water supply apparatus for vehicles |
IL49999A (en) * | 1976-01-07 | 1979-12-30 | Mochida Pharm Co Ltd | Laser apparatus for operations |
US4131782A (en) * | 1976-05-03 | 1978-12-26 | Lasag Ag | Method of and apparatus for machining large numbers of holes of precisely controlled size by coherent radiation |
US4122853A (en) * | 1977-03-14 | 1978-10-31 | Spectra-Med | Infrared laser photocautery device |
US4125755A (en) * | 1977-06-23 | 1978-11-14 | Western Electric Co., Inc. | Laser welding |
US4189687A (en) | 1977-10-25 | 1980-02-19 | Analytical Radiation Corporation | Compact laser construction |
US4170405A (en) | 1977-11-04 | 1979-10-09 | United Technologies Corporation | Resonator having coupled cavities with intercavity beam expansion elements |
US4376496A (en) | 1979-10-12 | 1983-03-15 | The Coca-Cola Company | Post-mix beverage dispensing system syrup package, valving system, and carbonator therefor |
JPS5764718A (en) | 1980-10-09 | 1982-04-20 | Hitachi Ltd | Laser beam printer |
US4404571A (en) | 1980-10-14 | 1983-09-13 | Canon Kabushiki Kaisha | Multibeam recording apparatus |
JPS5843588A (en) | 1981-09-09 | 1983-03-14 | Hitachi Ltd | Laser generating device |
US4500996A (en) * | 1982-03-31 | 1985-02-19 | Coherent, Inc. | High power fundamental mode laser |
US4477907A (en) * | 1982-05-03 | 1984-10-16 | American Laser Corporation | Low power argon-ion gas laser |
US4554666A (en) * | 1982-11-24 | 1985-11-19 | Rca Corporation | High-energy, single longitudinal mode hybrid laser |
WO1984002296A1 (en) * | 1982-12-17 | 1984-06-21 | Inoue Japax Res | Laser machining apparatus |
US4512639A (en) * | 1983-07-05 | 1985-04-23 | The United States Of American As Represented By The Secretary Of The Army | Erectable large optic for outer space application |
US4596018A (en) * | 1983-10-07 | 1986-06-17 | Minnesota Laser Corp. | External electrode transverse high frequency gas discharge laser |
FR2556262B1 (en) * | 1983-12-09 | 1987-02-20 | Ressencourt Hubert | THE PRESENT INVENTION CONCERNS A CENTER FOR FORMING SHEET MATERIALS WITH NUMERICAL CONTROL |
US4660209A (en) * | 1983-12-29 | 1987-04-21 | Amada Engineering & Service Co., Inc. | High speed axial flow type gas laser oscillator |
US4652722A (en) * | 1984-04-05 | 1987-03-24 | Videojet Systems International, Inc. | Laser marking apparatus |
US4614913A (en) * | 1984-04-30 | 1986-09-30 | The United States Of America As Represented By The Secretary Of The Army | Inherently boresighted laser weapon alignment subsystem |
US4655547A (en) * | 1985-04-09 | 1987-04-07 | Bell Communications Research, Inc. | Shaping optical pulses by amplitude and phase masking |
US4744090A (en) | 1985-07-08 | 1988-05-10 | Trw Inc. | High-extraction efficiency annular resonator |
DD256439A3 (en) * | 1986-01-09 | 1988-05-11 | Halle Feinmech Werke Veb | PROCESS FOR CONTROLLING THE INTERIORS AND SUPPRESSING THE OUTSIDE RADIATION RECEPTACTION OF A CO 2 LOW POWER LASER |
DD256440A3 (en) * | 1986-01-09 | 1988-05-11 | Halle Feinmech Werke Veb | ARRANGEMENT FOR SHAFT ALIGNMENT AND INTERNAL POWER MODULATION OF THE RADIATION OF HIGH-PERFORMANCE CO 2 LASERS |
WO1987005750A1 (en) * | 1986-03-12 | 1987-09-24 | Weiss Hardy P | Axial gas laser and process for stabilizing its operation |
US4672620A (en) * | 1986-05-14 | 1987-06-09 | Spectra-Physics, Inc. | Fast axial flow carbon dioxide laser |
US4720618A (en) | 1986-08-07 | 1988-01-19 | Videojet Systems International, Inc. | Method and apparatus for equalizing power output in a laser marking system |
US4831333A (en) * | 1986-09-11 | 1989-05-16 | Ltv Aerospace & Defense Co. | Laser beam steering apparatus |
JPS6394695A (en) | 1986-10-08 | 1988-04-25 | Nec Corp | Gas laser oscillator |
US4779278A (en) * | 1986-12-05 | 1988-10-18 | Laser Photonics, Inc. | Laser apparatus and method for discriminating against higher order modes |
US4846550A (en) * | 1987-01-07 | 1989-07-11 | Allied-Signal Inc. | Optical wedges used in beam expander for divergence control of laser |
US5162940A (en) * | 1987-03-06 | 1992-11-10 | The United States Of America As Represented By The Secretary Of The Air Force | Multiple energy level, multiple pulse rate laser source |
SE460570B (en) | 1987-10-13 | 1989-10-23 | Trumpf Gmbh & Co | DEVICE FOR A POWER LASER |
WO1989006872A1 (en) * | 1988-01-21 | 1989-07-27 | Siemens Aktiengesellschaft | Gas laser |
US5012259A (en) | 1988-01-28 | 1991-04-30 | Konica Corporation | Color recorder with gas laser beam scanning |
JP2592085B2 (en) * | 1988-02-09 | 1997-03-19 | マツダ株式会社 | Anti-lock device |
US4819246A (en) * | 1988-03-23 | 1989-04-04 | Aerotech, Inc. | Single frequency adapter |
US4770482A (en) * | 1988-07-17 | 1988-09-13 | Gte Government Systems Corporation | Scanning system for optical transmitter beams |
US5052017A (en) * | 1988-12-01 | 1991-09-24 | Coherent, Inc. | High power laser with focusing mirror sets |
US5023886A (en) * | 1988-12-01 | 1991-06-11 | Coherent, Inc. | High power laser with focusing mirror sets |
US4953176A (en) * | 1989-03-07 | 1990-08-28 | Spectra-Physics | Angular optical cavity alignment adjustment utilizing variable distribution cooling |
US4958900A (en) * | 1989-03-27 | 1990-09-25 | General Electric Company | Multi-fiber holder for output coupler and methods using same |
GB8912765D0 (en) * | 1989-06-02 | 1989-07-19 | Lumonics Ltd | A laser |
US5268921A (en) | 1989-07-03 | 1993-12-07 | Mclellan Edward J | Multiple discharge gas laser apparatus |
DE3937370A1 (en) | 1989-11-09 | 1991-05-16 | Otto Bihler | LASER |
US4991149A (en) | 1989-12-07 | 1991-02-05 | The United States Of America As Represented By The Secretary Of The Navy | Underwater object detection system |
US5065405A (en) * | 1990-01-24 | 1991-11-12 | Synrad, Incorporated | Sealed-off, RF-excited gas lasers and method for their manufacture |
US5109149A (en) | 1990-03-15 | 1992-04-28 | Albert Leung | Laser, direct-write integrated circuit production system |
US5214658A (en) * | 1990-07-27 | 1993-05-25 | Ion Laser Technology | Mixed gas ion laser |
DE4029187C2 (en) | 1990-09-14 | 2001-08-16 | Trumpf Lasertechnik Gmbh | Longitudinal flow CO¶2¶ laser |
GB2248140B (en) * | 1990-09-19 | 1994-06-01 | Trumpf Lasertechnik Gmbh | Gas laser |
GB2249843A (en) | 1990-10-25 | 1992-05-20 | Robert Peter Sunman | Image production |
US5653900A (en) * | 1991-01-17 | 1997-08-05 | United Distillers Plc | Dynamic laser marking |
US5229574A (en) * | 1991-10-15 | 1993-07-20 | Videojet Systems International, Inc. | Print quality laser marker apparatus |
US5229573A (en) * | 1991-10-15 | 1993-07-20 | Videojet Systems International, Inc. | Print quality laser marker apparatus |
JPH05129678A (en) | 1991-10-31 | 1993-05-25 | Shibuya Kogyo Co Ltd | Laser marking device |
ATE218904T1 (en) * | 1991-11-06 | 2002-06-15 | Shui T Lai | APPARATUS FOR CORNEA SURGERY |
US5199042A (en) * | 1992-01-10 | 1993-03-30 | Litton Systems, Inc. | Unstable laser apparatus |
JPH0645711A (en) * | 1992-01-14 | 1994-02-18 | Boreal Laser Inc | Array of slab-laser |
US5572538A (en) | 1992-01-20 | 1996-11-05 | Miyachi Technos Corporation | Laser apparatus and accessible, compact cooling system thereof having interchangeable flow restricting members |
JP2872855B2 (en) * | 1992-02-19 | 1999-03-24 | ファナック株式会社 | Laser oscillator |
US5337325A (en) | 1992-05-04 | 1994-08-09 | Photon Imaging Corp | Semiconductor, light-emitting devices |
US5339737B1 (en) | 1992-07-20 | 1997-06-10 | Presstek Inc | Lithographic printing plates for use with laser-discharge imaging apparatus |
JP2980788B2 (en) * | 1992-10-21 | 1999-11-22 | 三菱電機株式会社 | Laser device |
JP2725569B2 (en) * | 1992-11-18 | 1998-03-11 | 松下電器産業株式会社 | Laser oscillator |
US5274661A (en) * | 1992-12-07 | 1993-12-28 | Spectra Physics Lasers, Inc. | Thin film dielectric coating for laser resonator |
JP3022016B2 (en) * | 1992-12-28 | 2000-03-15 | 松下電器産業株式会社 | Axial laser oscillator |
US5729568A (en) | 1993-01-22 | 1998-03-17 | Deutsche Forschungsanstalt Fuer Luft-Und Raumfahrt E.V. | Power-controlled, fractal laser system |
US5294774A (en) * | 1993-08-03 | 1994-03-15 | Videojet Systems International, Inc. | Laser marker system |
US5431199A (en) | 1993-11-30 | 1995-07-11 | Benjey, Robert P | Redundant seal for vehicle filler neck |
JPH07211972A (en) * | 1994-01-20 | 1995-08-11 | Fanuc Ltd | Laser oscillator |
DE4402054A1 (en) * | 1994-01-25 | 1995-07-27 | Zeiss Carl Fa | Gas laser emitting at two wavelengths |
US5386427A (en) * | 1994-02-10 | 1995-01-31 | Massachusetts Institute Of Technology | Thermally controlled lenses for lasers |
EP0745282B1 (en) * | 1994-02-15 | 1999-05-12 | Coherent, Inc. | System for minimizing the depolarization of a laser beam due to thermally induced birefringence |
JPH07246488A (en) * | 1994-03-11 | 1995-09-26 | Fanuc Ltd | Laser beam machine |
US5767477A (en) * | 1994-03-23 | 1998-06-16 | Domino Printing Sciences Plc | Laser marking apparatus for marking twin-line messages |
US5568306A (en) * | 1994-10-17 | 1996-10-22 | Leonard Tachner | Laser beam control and imaging system |
JPH08139391A (en) * | 1994-11-02 | 1996-05-31 | Fanuc Ltd | Laser resonator |
US5929337A (en) | 1994-11-11 | 1999-07-27 | M & A Packaging Services Limited | Non-mechanical contact ultrasound system for monitoring contents of a moving container |
US5550853A (en) * | 1994-12-21 | 1996-08-27 | Laser Physics, Inc. | Integral laser head and power supply |
US5659561A (en) * | 1995-06-06 | 1997-08-19 | University Of Central Florida | Spatial solitary waves in bulk quadratic nonlinear materials and their applications |
US5689363A (en) * | 1995-06-12 | 1997-11-18 | The Regents Of The University Of California | Long-pulse-width narrow-bandwidth solid state laser |
JP3427573B2 (en) | 1995-06-27 | 2003-07-22 | 松下電器産業株式会社 | Microwave-excited gas laser oscillator |
US5646907A (en) | 1995-08-09 | 1997-07-08 | The United States Of America As Represented By The Secretary Of The Navy | Method and system for detecting objects at or below the water's surface |
DE29514319U1 (en) | 1995-09-07 | 1997-01-16 | Sator Alexander Paul | Device for labeling objects |
US5592504A (en) | 1995-10-10 | 1997-01-07 | Cameron; Harold A. | Transversely excited non waveguide RF gas laser configuration |
US5661746A (en) | 1995-10-17 | 1997-08-26 | Universal Laser Syatems, Inc. | Free-space gas slab laser |
US5682262A (en) * | 1995-12-13 | 1997-10-28 | Massachusetts Institute Of Technology | Method and device for generating spatially and temporally shaped optical waveforms |
US5720894A (en) * | 1996-01-11 | 1998-02-24 | The Regents Of The University Of California | Ultrashort pulse high repetition rate laser system for biological tissue processing |
FR2748519B1 (en) | 1996-05-10 | 1998-06-26 | Valeo Thermique Moteur Sa | ENGINE COOLING DEVICE WITH THERMALLY INSULATED FLUID TANK |
US5837962A (en) * | 1996-07-15 | 1998-11-17 | Overbeck; James W. | Faster laser marker employing acousto-optic deflection |
US5808268A (en) * | 1996-07-23 | 1998-09-15 | International Business Machines Corporation | Method for marking substrates |
US6050486A (en) | 1996-08-23 | 2000-04-18 | Pitney Bowes Inc. | Electronic postage meter system separable printer and accounting arrangement incorporating partition of indicia and accounting information |
DE19634190C2 (en) * | 1996-08-23 | 2002-01-31 | Baasel Carl Lasertech | Multi-head laser engraving machine |
US5864430A (en) * | 1996-09-10 | 1999-01-26 | Sandia Corporation | Gaussian beam profile shaping apparatus, method therefor and evaluation thereof |
US6064034A (en) * | 1996-11-22 | 2000-05-16 | Anolaze Corporation | Laser marking process for vitrification of bricks and other vitrescent objects |
US5815523A (en) | 1996-11-27 | 1998-09-29 | Mcdonnell Douglas Corporation | Variable power helix laser amplifier and laser |
JP3932207B2 (en) * | 1997-03-14 | 2007-06-20 | デマリア エレクトロオプティックス システムズ アイエヌシー | Radio frequency pumped waveguide laser |
US6141030A (en) | 1997-04-24 | 2000-10-31 | Konica Corporation | Laser exposure unit including plural laser beam sources differing in wavelength |
US6122562A (en) | 1997-05-05 | 2000-09-19 | Applied Materials, Inc. | Method and apparatus for selectively marking a semiconductor wafer |
FR2766115B1 (en) * | 1997-07-18 | 1999-08-27 | Commissariat Energie Atomique | DEVICE AND METHOD FOR LASER-EXTENDED REMOTE CUTTING, IN PULSE MODE |
DE19734715A1 (en) * | 1997-08-11 | 1999-02-25 | Lambda Physik Gmbh | Device for rinsing pathway of ultraviolet laser beam |
US6069843A (en) | 1997-08-28 | 2000-05-30 | Northeastern University | Optical pulse induced acoustic mine detection |
US6263007B1 (en) | 1998-03-23 | 2001-07-17 | T & S Team Incorporated | Pulsed discharge gas laser having non-integral supply reservoir |
JP3041599B2 (en) | 1998-05-14 | 2000-05-15 | セイコーインスツルメンツ株式会社 | Coordinate setting optical observation device and position information storage method |
US6898216B1 (en) * | 1999-06-30 | 2005-05-24 | Lambda Physik Ag | Reduction of laser speckle in photolithography by controlled disruption of spatial coherence of laser beam |
US6181728B1 (en) * | 1998-07-02 | 2001-01-30 | General Scanning, Inc. | Controlling laser polarization |
US6057871A (en) | 1998-07-10 | 2000-05-02 | Litton Systems, Inc. | Laser marking system and associated microlaser apparatus |
DE19840926B4 (en) * | 1998-09-08 | 2013-07-11 | Hell Gravure Systems Gmbh & Co. Kg | Arrangement for material processing by means of laser beams and their use |
JP2002529776A (en) * | 1998-11-02 | 2002-09-10 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Laser irradiation equipment for cathode ray tubes. |
TW444247B (en) * | 1999-01-29 | 2001-07-01 | Toshiba Corp | Laser beam irradiating device, manufacture of non-single crystal semiconductor film, and manufacture of liquid crystal display device |
EP1066666B1 (en) | 1999-02-03 | 2008-08-06 | TRUMPF LASERTECHNIK GmbH | Laser with device for modifying the distribution of laser light intensity across the laser beam cross-section |
US6678291B2 (en) * | 1999-12-15 | 2004-01-13 | Lambda Physik Ag | Molecular fluorine laser |
US6356575B1 (en) * | 1999-07-06 | 2002-03-12 | Raytheon Company | Dual cavity multifunction laser system |
JP2001023918A (en) * | 1999-07-08 | 2001-01-26 | Nec Corp | Semiconductor thin-film forming apparatus |
US6335943B1 (en) | 1999-07-27 | 2002-01-01 | Lockheed Martin Corporation | System and method for ultrasonic laser testing using a laser source to generate ultrasound having a tunable wavelength |
US6944201B2 (en) * | 1999-07-30 | 2005-09-13 | High Q Laser Production Gmbh | Compact ultra fast laser |
US20060249491A1 (en) * | 1999-09-01 | 2006-11-09 | Hell Gravure Systems Gmbh | Laser radiation source |
US6833911B2 (en) * | 1999-10-08 | 2004-12-21 | Identification Dynamics, Inc. | Method and apparatus for reading firearm microstamping |
US6653593B2 (en) * | 1999-10-08 | 2003-11-25 | Nanovia, Lp | Control system for ablating high-density array of vias or indentation in surface of object |
US6420675B1 (en) * | 1999-10-08 | 2002-07-16 | Nanovia, Lp | Control system for ablating high-density array of vias or indentation in surface of object |
US6886284B2 (en) * | 1999-10-08 | 2005-05-03 | Identification Dynamics, Llc | Firearm microstamping and micromarking insert for stamping a firearm identification code and serial number into cartridge shell casings and projectiles |
US6256121B1 (en) * | 1999-10-08 | 2001-07-03 | Nanovia, Lp | Apparatus for ablating high-density array of vias or indentation in surface of object |
US6310701B1 (en) * | 1999-10-08 | 2001-10-30 | Nanovia Lp | Method and apparatus for ablating high-density array of vias or indentation in surface of object |
US6735232B2 (en) * | 2000-01-27 | 2004-05-11 | Lambda Physik Ag | Laser with versatile output energy |
JP2001276986A (en) | 2000-03-29 | 2001-10-09 | Nec Corp | Laser processing apparatus and method |
EP1143584A3 (en) | 2000-03-31 | 2003-04-23 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser array |
US6791592B2 (en) * | 2000-04-18 | 2004-09-14 | Laserink | Printing a code on a product |
US7394591B2 (en) * | 2000-05-23 | 2008-07-01 | Imra America, Inc. | Utilization of Yb: and Nd: mode-locked oscillators in solid-state short pulse laser systems |
US6605799B2 (en) * | 2000-05-25 | 2003-08-12 | Westar Photonics | Modulation of laser energy with a predefined pattern |
US6895030B1 (en) * | 2000-05-30 | 2005-05-17 | Matsushita Electric Industrial Co., Ltd. | Laser oscillating device |
US6904073B2 (en) * | 2001-01-29 | 2005-06-07 | Cymer, Inc. | High power deep ultraviolet laser with long life optics |
DE20011508U1 (en) | 2000-06-30 | 2000-10-12 | Termotek Laserkuehlung Gmbh | Cooling device for a laser |
JP2002045371A (en) | 2000-08-01 | 2002-02-12 | Nidek Co Ltd | Laser treatment device |
DE10043269C2 (en) * | 2000-08-29 | 2002-10-24 | Jenoptik Jena Gmbh | Diode pumped laser amplifier |
US6585161B1 (en) | 2000-08-30 | 2003-07-01 | Psc Scanning, Inc. | Dense pattern optical scanner |
EP1184946B1 (en) | 2000-08-31 | 2010-08-18 | Trumpf Laser- und Systemtechnik GmbH | Gaslaser |
AU2001296283A1 (en) * | 2000-09-21 | 2002-04-02 | Gsi Lumonics Corporation | Digital control servo system |
DE10047020C1 (en) * | 2000-09-22 | 2002-02-07 | Trumpf Lasertechnik Gmbh | Coaxial laser has inner and outer cooling medium lines pressed into contact with inner and outer electrode tubes respectively |
US20020061045A1 (en) | 2000-11-21 | 2002-05-23 | Access Laser Company | Portable low-power gas discharge laser |
US6693930B1 (en) * | 2000-12-12 | 2004-02-17 | Kla-Tencor Technologies Corporation | Peak power and speckle contrast reduction for a single laser pulse |
ATE254812T1 (en) * | 2000-12-16 | 2003-12-15 | Trumpf Lasertechnik Gmbh | COAXIAL LASER HAVING A DEVICE FOR BEAM SHAPING OF A LASER BEAM |
US7496831B2 (en) | 2001-02-22 | 2009-02-24 | International Business Machines Corporation | Method to reformat regions with cluttered hyperlinks |
WO2002075865A2 (en) | 2001-03-19 | 2002-09-26 | Nutfield Technologies, Inc. | Monolithic ceramic laser structure and method of making same |
US6370884B1 (en) | 2001-03-30 | 2002-04-16 | Maher I. Kelada | Thermoelectric fluid cooling cartridge |
US6768765B1 (en) * | 2001-06-07 | 2004-07-27 | Lambda Physik Ag | High power excimer or molecular fluorine laser system |
WO2002101888A2 (en) * | 2001-06-13 | 2002-12-19 | Orbotech Ltd. | Multi-beam micro-machining system and method |
US6804269B2 (en) * | 2001-06-19 | 2004-10-12 | Hitachi Via Mechanics, Ltd. | Laser beam delivery system with trepanning module |
US6915654B2 (en) | 2001-06-20 | 2005-07-12 | Ross Johnson | Portable cooling mechanism |
US6914232B2 (en) * | 2001-10-26 | 2005-07-05 | Bennett Optical Research, Inc. | Device to control laser spot size |
US6897941B2 (en) | 2001-11-07 | 2005-05-24 | Applied Materials, Inc. | Optical spot grid array printer |
DE10202036A1 (en) * | 2002-01-18 | 2003-07-31 | Zeiss Carl Meditec Ag | Femtosecond laser system for precise processing of material and tissue |
US6804287B2 (en) | 2002-02-02 | 2004-10-12 | The Regents Of The University Of Colorado, A Body Corporate | Ultrashort pulse amplification in cryogenically cooled amplifiers |
WO2003067721A2 (en) * | 2002-02-07 | 2003-08-14 | Lambda Physik Ag | Solid-state diode pumped laser employing oscillator-amplifier |
US6750421B2 (en) * | 2002-02-19 | 2004-06-15 | Gsi Lumonics Ltd. | Method and system for laser welding |
US6756563B2 (en) * | 2002-03-07 | 2004-06-29 | Orbotech Ltd. | System and method for forming holes in substrates containing glass |
US6826219B2 (en) * | 2002-03-14 | 2004-11-30 | Gigatera Ag | Semiconductor saturable absorber device, and laser |
US7058100B2 (en) | 2002-04-18 | 2006-06-06 | The Boeing Company | Systems and methods for thermal management of diode-pumped solid-state lasers |
US20030219094A1 (en) * | 2002-05-21 | 2003-11-27 | Basting Dirk L. | Excimer or molecular fluorine laser system with multiple discharge units |
JPWO2004017392A1 (en) * | 2002-08-13 | 2005-12-08 | 株式会社東芝 | Laser irradiation method |
US20040202220A1 (en) * | 2002-11-05 | 2004-10-14 | Gongxue Hua | Master oscillator-power amplifier excimer laser system |
US6903824B2 (en) * | 2002-12-20 | 2005-06-07 | Eastman Kodak Company | Laser sensitometer |
US7145926B2 (en) * | 2003-01-24 | 2006-12-05 | Peter Vitruk | RF excited gas laser |
US20050094697A1 (en) | 2003-01-30 | 2005-05-05 | Rofin Sinar Laser Gmbh | Stripline laser |
TWI248244B (en) * | 2003-02-19 | 2006-01-21 | J P Sercel Associates Inc | System and method for cutting using a variable astigmatic focal beam spot |
US7321105B2 (en) * | 2003-02-21 | 2008-01-22 | Lsp Technologies, Inc. | Laser peening of dovetail slots by fiber optical and articulate arm beam delivery |
US7499207B2 (en) * | 2003-04-10 | 2009-03-03 | Hitachi Via Mechanics, Ltd. | Beam shaping prior to harmonic generation for increased stability of laser beam shaping post harmonic generation with integrated automatic displacement and thermal beam drift compensation |
US7408687B2 (en) * | 2003-04-10 | 2008-08-05 | Hitachi Via Mechanics (Usa), Inc. | Beam shaping prior to harmonic generation for increased stability of laser beam shaping post harmonic generation with integrated automatic displacement and thermal beam drift compensation |
WO2004097465A2 (en) * | 2003-04-24 | 2004-11-11 | Bae Systems Information And Electronic Systems Integration Inc. | Singlet telescopes with controllable ghosts for laser beam forming |
US20060287697A1 (en) | 2003-05-28 | 2006-12-21 | Medcool, Inc. | Methods and apparatus for thermally activating a console of a thermal delivery system |
GB0313887D0 (en) * | 2003-06-16 | 2003-07-23 | Gsi Lumonics Ltd | Monitoring and controlling of laser operation |
US6856509B2 (en) | 2003-07-14 | 2005-02-15 | Jen-Cheng Lin | Cartridge assembly of a water cooled radiator |
US7364952B2 (en) * | 2003-09-16 | 2008-04-29 | The Trustees Of Columbia University In The City Of New York | Systems and methods for processing thin films |
US6894785B2 (en) * | 2003-09-30 | 2005-05-17 | Cymer, Inc. | Gas discharge MOPA laser spectral analysis module |
WO2005037478A2 (en) * | 2003-10-17 | 2005-04-28 | Gsi Lumonics Corporation | Flexible scan field |
US20050205778A1 (en) * | 2003-10-17 | 2005-09-22 | Gsi Lumonics Corporation | Laser trim motion, calibration, imaging, and fixturing techniques |
DE602004031401D1 (en) * | 2003-10-30 | 2011-03-31 | L Livermore Nat Security Llc | Relay telescope, laser amplifier, and laser shock irradiation method and apparatus |
US7291805B2 (en) * | 2003-10-30 | 2007-11-06 | The Regents Of The University Of California | Target isolation system, high power laser and laser peening method and system using same |
AT412829B (en) * | 2003-11-13 | 2005-07-25 | Femtolasers Produktions Gmbh | SHORT PULSE LASER DEVICE |
JP2005144487A (en) * | 2003-11-13 | 2005-06-09 | Seiko Epson Corp | Laser beam machining device and laser beam machining method |
JP4344224B2 (en) * | 2003-11-21 | 2009-10-14 | 浜松ホトニクス株式会社 | Optical mask and MOPA laser device |
US7376160B2 (en) * | 2003-11-24 | 2008-05-20 | Raytheon Company | Slab laser and method with improved and directionally homogenized beam quality |
US7046267B2 (en) * | 2003-12-19 | 2006-05-16 | Markem Corporation | Striping and clipping correction |
US20050190809A1 (en) * | 2004-01-07 | 2005-09-01 | Spectra-Physics, Inc. | Ultraviolet, narrow linewidth laser system |
US7199330B2 (en) * | 2004-01-20 | 2007-04-03 | Coherent, Inc. | Systems and methods for forming a laser beam having a flat top |
US20050165590A1 (en) * | 2004-01-23 | 2005-07-28 | Yuhong Huang | System and method for virtual laser marking |
JP2005268445A (en) | 2004-03-17 | 2005-09-29 | Hamamatsu Photonics Kk | Semiconductor laser apparatus |
US7711013B2 (en) * | 2004-03-31 | 2010-05-04 | Imra America, Inc. | Modular fiber-based chirped pulse amplification system |
JP2005294393A (en) * | 2004-03-31 | 2005-10-20 | Fanuc Ltd | Laser oscillator |
US7486705B2 (en) * | 2004-03-31 | 2009-02-03 | Imra America, Inc. | Femtosecond laser processing system with process parameters, controls and feedback |
US7509692B2 (en) | 2004-05-11 | 2009-03-31 | Biocool Technologies, Llc | Wearable personal cooling and hydration system |
EP1751967A2 (en) | 2004-05-19 | 2007-02-14 | Intense Limited | Thermal printing with laser activation |
JP4182034B2 (en) * | 2004-08-05 | 2008-11-19 | ファナック株式会社 | Laser equipment for cutting |
DE502004001824D1 (en) * | 2004-09-30 | 2006-11-30 | Trumpf Laser Gmbh & Co Kg | Device for focusing a laser beam |
US20060092995A1 (en) * | 2004-11-01 | 2006-05-04 | Chromaplex, Inc. | High-power mode-locked laser system |
US7204298B2 (en) | 2004-11-24 | 2007-04-17 | Lucent Technologies Inc. | Techniques for microchannel cooling |
JP3998067B2 (en) * | 2004-11-29 | 2007-10-24 | オムロンレーザーフロント株式会社 | Solid state laser oscillator |
US20060114956A1 (en) * | 2004-11-30 | 2006-06-01 | Sandstrom Richard L | High power high pulse repetition rate gas discharge laser system bandwidth management |
US7346427B2 (en) | 2005-01-14 | 2008-03-18 | Flymg J, Inc. | Collecting liquid product volume data at a dispenser |
US7295948B2 (en) | 2005-01-15 | 2007-11-13 | Jetter Heinz L | Laser system for marking tires |
US7394479B2 (en) * | 2005-03-02 | 2008-07-01 | Marken Corporation | Pulsed laser printing |
US7430230B2 (en) * | 2005-04-07 | 2008-09-30 | The Boeing Company | Tube solid-state laser |
US7334744B1 (en) | 2005-05-23 | 2008-02-26 | Gentry Dawson | Portable mister and cooling assembly for outdoor use |
DE102005024931B3 (en) * | 2005-05-23 | 2007-01-11 | Ltb-Lasertechnik Gmbh | Transversely electrically excited gas discharge laser for generating light pulses with a high pulse repetition frequency and method for the production |
US8278590B2 (en) * | 2005-05-27 | 2012-10-02 | Resonetics, LLC | Apparatus for minimizing a heat affected zone during laser micro-machining |
GB2442650A (en) * | 2005-07-12 | 2008-04-09 | Gsi Group Corp | System and method for high power laser processing |
US20100220750A1 (en) * | 2005-07-19 | 2010-09-02 | James Hayden Brownell | Terahertz Laser Components And Associated Methods |
JP2007032869A (en) | 2005-07-22 | 2007-02-08 | Fujitsu Ltd | Cooling device and cooling method |
JP2007029972A (en) * | 2005-07-25 | 2007-02-08 | Fanuc Ltd | Laser beam machining apparatus |
WO2007042913A2 (en) * | 2005-10-11 | 2007-04-19 | Kilolambda Technologies Ltd. | Optical power limiting and switching combined device and a method for protecting imaging and non-imaging sensors |
US20070098024A1 (en) * | 2005-10-28 | 2007-05-03 | Laserscope | High power, end pumped laser with off-peak pumping |
CN101331592B (en) | 2005-12-16 | 2010-06-16 | 株式会社半导体能源研究所 | Laser irradiation apparatus, laser irradiation method and manufacturing method of semiconductor device |
US20090312676A1 (en) | 2006-02-02 | 2009-12-17 | Tylerton International Inc. | Metabolic Sink |
JP2007212118A (en) | 2006-02-08 | 2007-08-23 | Makoto Fukada | Water-cooled cooling air fan with improved feeling of coolness |
US7543912B2 (en) | 2006-03-01 | 2009-06-09 | Lexmark International, Inc. | Unitary wick retainer and biasing device retainer for micro-fluid ejection head replaceable cartridge |
US20070235458A1 (en) | 2006-04-10 | 2007-10-11 | Mann & Hummel Gmbh | Modular liquid reservoir |
US9018562B2 (en) * | 2006-04-10 | 2015-04-28 | Board Of Trustees Of Michigan State University | Laser material processing system |
US20070247499A1 (en) | 2006-04-19 | 2007-10-25 | Anderson Jr James D | Multi-function thermoplastic elastomer layer for replaceable ink tank |
US7545838B2 (en) * | 2006-06-12 | 2009-06-09 | Coherent, Inc. | Incoherent combination of laser beams |
JP4146867B2 (en) * | 2006-06-22 | 2008-09-10 | ファナック株式会社 | Gas laser oscillator |
US7626152B2 (en) * | 2006-08-16 | 2009-12-01 | Raytheon Company | Beam director and control system for a high energy laser within a conformal window |
CN100547863C (en) * | 2006-10-20 | 2009-10-07 | 香港理工大学 | Optical fibre gas laser device and have an optical fiber type ring lasergyro of this laser |
US7784348B2 (en) | 2006-12-22 | 2010-08-31 | Lockheed Martin Corporation | Articulated robot for laser ultrasonic inspection |
US20090323739A1 (en) * | 2006-12-22 | 2009-12-31 | Uv Tech Systems | Laser optical system |
US7733930B2 (en) * | 2007-04-10 | 2010-06-08 | Northrop Grumman Systems Corporation | Error control for high-power laser system employing diffractive optical element beam combiner with tilt error control |
US7729398B2 (en) * | 2007-04-10 | 2010-06-01 | Northrop Grumman Systems Corporation | Error control for high-power laser system employing diffractive optical element beam combiner |
DE102007023017B4 (en) | 2007-05-15 | 2011-06-01 | Thyssenkrupp Lasertechnik Gmbh | Apparatus and method for producing tailored blanks |
US20080297912A1 (en) * | 2007-06-01 | 2008-12-04 | Electro Scientific Industries, Inc., An Oregon Corporation | Vario-astigmatic beam expander |
JP5129678B2 (en) | 2007-07-18 | 2013-01-30 | 株式会社クボタ | Work vehicle |
US7924894B2 (en) * | 2008-01-18 | 2011-04-12 | Northrop Grumman Systems Corporation | Digital piston error control for high-power laser system employing diffractive optical element beam combiner |
US7756169B2 (en) * | 2008-01-23 | 2010-07-13 | Northrop Grumman Systems Corporation | Diffractive method for control of piston error in coherent phased arrays |
US8126028B2 (en) | 2008-03-31 | 2012-02-28 | Novasolar Holdings Limited | Quickly replaceable processing-laser modules and subassemblies |
GB0809003D0 (en) * | 2008-05-17 | 2008-06-25 | Rumsby Philip T | Method and apparatus for laser process improvement |
GB2460648A (en) * | 2008-06-03 | 2009-12-09 | M Solv Ltd | Method and apparatus for laser focal spot size control |
DE102008030868A1 (en) * | 2008-06-30 | 2009-12-31 | Krones Ag | Device for labeling containers |
US8038878B2 (en) | 2008-11-26 | 2011-10-18 | Mann+Hummel Gmbh | Integrated filter system for a coolant reservoir and method |
CN102318451B (en) * | 2008-12-13 | 2013-11-06 | 万佳雷射有限公司 | Method and apparatus for laser machining relatively narrow and relatively wide structures |
GB0900036D0 (en) * | 2009-01-03 | 2009-02-11 | M Solv Ltd | Method and apparatus for forming grooves with complex shape in the surface of apolymer |
CN104134928A (en) * | 2009-02-04 | 2014-11-05 | 通用医疗公司 | Apparatus and method for utilization of a high-speed optical wavelength tuning source |
US20100206882A1 (en) | 2009-02-13 | 2010-08-19 | Wessels Timothy J | Multi chamber coolant tank |
CN102438549B (en) * | 2009-03-04 | 2015-07-15 | 完美Ip有限公司 | System for forming and modifying lenses and lenses formed thereby |
US8184363B2 (en) * | 2009-08-07 | 2012-05-22 | Northrop Grumman Systems Corporation | All-fiber integrated high power coherent beam combination |
US8514485B2 (en) * | 2009-08-07 | 2013-08-20 | Northrop Grumman Systems Corporation | Passive all-fiber integrated high power coherent beam combination |
US8184361B2 (en) * | 2009-08-07 | 2012-05-22 | Northrop Grumman Systems Corporation | Integrated spectral and all-fiber coherent beam combination |
US8320056B2 (en) * | 2009-08-20 | 2012-11-27 | Lawrence Livermore National Security, Llc | Spatial filters for high average power lasers |
US8212178B1 (en) * | 2009-09-28 | 2012-07-03 | Klein Tools, Inc. | Method and system for marking a material using a laser marking system |
US8337618B2 (en) * | 2009-10-26 | 2012-12-25 | Samsung Display Co., Ltd. | Silicon crystallization system and silicon crystallization method using laser |
JP5634088B2 (en) | 2010-03-17 | 2014-12-03 | キヤノン株式会社 | Inkjet recording apparatus and ink tank |
US10072971B2 (en) * | 2010-04-16 | 2018-09-11 | Metal Improvement Company, Llc | Flexible beam delivery system for high power laser systems |
US8233511B2 (en) * | 2010-05-18 | 2012-07-31 | Lawrence Livermore National Security, Llc | Method and system for modulation of gain suppression in high average power laser systems |
US8432691B2 (en) | 2010-10-28 | 2013-04-30 | Asetek A/S | Liquid cooling system for an electronic system |
ES2438751T3 (en) | 2011-09-05 | 2014-01-20 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Device and procedure for marking an object by means of a laser beam |
EP2564972B1 (en) | 2011-09-05 | 2015-08-26 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Marking apparatus with a plurality of lasers, deflection means and telescopic means for each laser beam |
EP2564974B1 (en) | 2011-09-05 | 2015-06-17 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Marking apparatus with a plurality of gas lasers with resonator tubes and individually adjustable deflection means |
-
2011
- 2011-09-05 DK DK11007182.6T patent/DK2564973T3/en active
- 2011-09-05 EP EP11007182.6A patent/EP2564973B1/en active Active
- 2011-09-05 ES ES11007182.6T patent/ES2530069T3/en active Active
-
2012
- 2012-07-19 US US14/342,477 patent/US9595801B2/en active Active
- 2012-07-19 WO PCT/EP2012/003066 patent/WO2013034211A1/en active Application Filing
- 2012-07-19 BR BR112014003928A patent/BR112014003928A2/en not_active IP Right Cessation
- 2012-07-19 CN CN201280042992.3A patent/CN103781586B/en not_active Expired - Fee Related
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4727235A (en) * | 1986-08-07 | 1988-02-23 | Videojet Systems International, Inc. | Method and apparatus for equalizing power output in a laser marking system |
DE4212390A1 (en) * | 1992-04-13 | 1993-10-14 | Baasel Carl Lasertech | Laser engraving machine for print rollers - has beam guide for several laser beams to generate variable beam spot configuration on work surface |
CN1230268A (en) * | 1996-09-11 | 1999-09-29 | 多米诺印刷科学公开有限公司 | Laser appts. |
US6229940B1 (en) * | 1998-11-30 | 2001-05-08 | Mcdonnell Douglas Corporation | Incoherent fiber optic laser system |
CN1644297A (en) * | 2003-09-12 | 2005-07-27 | 奥博泰克有限公司 | Multiple beam micro-machining system and method |
JP2011156574A (en) * | 2010-02-02 | 2011-08-18 | Hitachi High-Technologies Corp | Focusing device for laser beam machining, laser beam machining apparatus and method for manufacturing solar panel |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108780975A (en) * | 2016-03-14 | 2018-11-09 | 康茂股份公司 | Lasing light emitter is especially used for the lasing light emitter of industrial process |
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US20140217072A1 (en) | 2014-08-07 |
EA026083B1 (en) | 2017-02-28 |
BR112014003928A2 (en) | 2017-03-14 |
EP2564973B1 (en) | 2014-12-10 |
ES2530069T3 (en) | 2015-02-26 |
WO2013034211A1 (en) | 2013-03-14 |
CN103781586B (en) | 2015-11-25 |
DK2564973T3 (en) | 2015-01-12 |
EA201490243A1 (en) | 2014-08-29 |
EP2564973A1 (en) | 2013-03-06 |
US9595801B2 (en) | 2017-03-14 |
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