CN103779304A - Solder connecting structure and manufacturing method thereof, surface mounting structure and mounting method thereof - Google Patents
Solder connecting structure and manufacturing method thereof, surface mounting structure and mounting method thereof Download PDFInfo
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- CN103779304A CN103779304A CN201310742923.XA CN201310742923A CN103779304A CN 103779304 A CN103779304 A CN 103779304A CN 201310742923 A CN201310742923 A CN 201310742923A CN 103779304 A CN103779304 A CN 103779304A
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- semiconductor device
- needle
- scolder
- described multiple
- pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The present invention discloses a pin array solder connecting structure and a manufacturing method thereof, a surface mounting structure and a surface mounting method. The pin array solder connecting structure comprises the components of: a semiconductor device; and a plurality of pin-shaped solders which are arranged below the semiconductor device in an array manner and is connected with an inner circuit of the semiconductor device through an array pad at the bottom of the semiconductor device. Therefore a more compact semiconductor device connection can be realized.
Description
Technical field
The present invention relates to a kind of pin array solder-connected structure, its manufacture method and surface installation structure and method of surface mounting, more particularly, thus the present invention relates to a kind of spacing that can reduce realizes more pin array solder-connected structure, its manufacture method and surface installation structure and the method for surface mounting of cramped construction.
Background technology
Due to SMT(surface mounting technology) there is the advantages such as reliability is high, shock resistance strong, welding point defect rate is low, therefore SMT is most popular a kind of technology and technique in current Electronic Assemblies industry.Its key step comprises: tin cream (scolder) printing, tin cream is bitten on the pad of PCB, for the welding of components and parts is prepared; Part mounts, and surface-assembled components and parts is accurately installed on the fixed position of PCB; Reflow soldering, by solder fusing, firmly welds together surface-assembled components and parts and pcb board.
Fig. 1 shows the schematic diagram of the structure of SMT technology of the prior art.In Fig. 1, BGA device 110 is arranged on substrate 120, and between BGA device 110 and substrate 120, multiple soldered balls 130 is set, then, make soldered ball fusing by reflow soldering, thereby BGA device 110 is welded to substrate 120.
But, in the Welding Structure of prior art, owing to must using soldering paste and soldered ball 130 to occupy larger volume, be therefore difficult to reduce spacing, and be difficult to realize compacter syndeton.
Summary of the invention
An aspect of of the present present invention provides a kind of pin array solder-connected structure, comprising: semiconductor device; Multiple needle-like scolders, are arranged on semiconductor device below with array format, and are connected to the internal circuit of semiconductor device by the array pad of semiconductor device bottom.
According to an aspect of the present invention, each in described multiple needle-like scolder has at least one in cylindrical, square column type, trapezoidal cylindricality, taper shape.
Another aspect of the present invention provides a kind of manufacture method of pin array solder-connected structure, and described method comprises the steps: to form multiple acicular pores in mould; Scolder is filled in described multiple acicular pores to form needle-like scolder; Semiconductor device is arranged on mould, makes to be filled into needle-like scolder in described multiple acicular pores and be connected respectively to the array pad of semiconductor device bottom; The semiconductor device and the mould that are connected with needle-like scolder are separated from each other.
According to an aspect of the present invention, mould can be ceramic die.
According to an aspect of the present invention, can utilize scraper plate printing that scolder is filled in described multiple acicular pores.
According to an aspect of the present invention, can utilize at least one in Sn/Pb, SAC305, SAC105, SnBi that needle-like scolder is connected with the array pad of semiconductor device.
According to an aspect of the present invention, described acicular pores can have at least one in cylindrical, square column type, trapezoidal cylindricality, taper shape.
Another aspect of the present invention provides a kind of surface installation structure, and described surface installation structure comprises: semiconductor device; Multiple needle-like scolders, are arranged on semiconductor device below with array format, and are connected to the internal circuit of semiconductor device by the array pad of semiconductor device bottom; Substrate, comprises the multiple depression pads corresponding with described multiple needle-like scolders on described substrate, wherein, described multiple needle-like scolders are inserted in described multiple depression pad and are connected to described multiple depression pad.
According to an aspect of the present invention, each in described multiple needle-like scolder can have at least one in cylindrical, square column type, trapezoidal cylindricality, taper shape.
Another aspect of the present invention provides a kind of method of surface mounting, and described method of surface mounting comprises the steps: to be inserted into according to the needle-like front line of the pin array solder-connected structure of each aspect of the present invention in multiple depression pads corresponding with described multiple needle-like scolders that are arranged on substrate; By backflow, described multiple needle-like scolder is connected with described multiple depression pads.
Accompanying drawing explanation
By the description to embodiment of carrying out below in conjunction with accompanying drawing, above-mentioned and/or other objects of the present invention and advantage will become apparent, wherein:
Fig. 1 is the schematic diagram that is arranged on the BGA device on substrate of the prior art;
Fig. 2 is according to the schematic diagram of the pin array solder-connected structure of exemplary embodiment of the present invention;
Fig. 3 A to Fig. 3 D is according to the indicative flowchart of the manufacture method of the pin array solder-connected structure of exemplary embodiment of the present invention;
Fig. 4 is according to the schematic diagram of the surface installation structure of exemplary embodiment of the present invention;
Fig. 5 A to Fig. 5 C is according to the indicative flowchart of the method for surface mounting of exemplary embodiment of the present invention.
Embodiment
The present invention is described below with reference to accompanying drawings in more detail, exemplary embodiment of the present invention shown in the drawings.It is only for illustrative object that these accompanying drawings are provided, rather than in order to limit the present invention.On the contrary, providing these drawings and Examples to make the disclosure will be thoroughly with complete, and scope of the present invention will be conveyed to those skilled in the art fully.
Fig. 2 is according to the schematic diagram of the pin array solder-connected structure of exemplary embodiment of the present invention.With reference to Fig. 2, according to exemplary embodiment of the present invention, pin array solder-connected structure comprises: semiconductor device 210; Multiple needle-like scolders 220, are arranged on semiconductor device below with array format, and are connected to the internal circuit of semiconductor device by the array pad (not shown) of semiconductor device bottom.
According to the embodiment shown in Fig. 2, the section of needle-like scolder 220 can have the shape of inverted trapezoidal, but the invention is not restricted to this, and for example, needle-like scolder can have the combination of the shapes such as cylinder, circular cone, prism, pyramid or these shapes.In one embodiment of the invention, needle-like scolder can have at least one in cylindrical, square column type, trapezoidal cylindricality, taper shape.According to embodiments of the invention, less spacing, much smaller than soldered ball of the prior art, therefore can be realized in the space that needle-like scolder occupies, thereby contributes to the compacter miniaturization surface mounted component of manufacturing structure.
Fig. 3 A to Fig. 3 D is according to the indicative flowchart of the manufacture method of the pin array solder-connected structure of exemplary embodiment of the present invention.
With reference to Fig. 3 A, first preparation is wherein formed with the mould 380 of multiple acicular pores 385.Wherein, the section of acicular pores 385 can have the shape of inverted trapezoidal.But, the invention is not restricted to this, the shape of acicular pores 385 can be corresponding with the shape of the needle-like scolder 220 in previous embodiment., can there is the combination of the shapes such as cylinder, circular cone, prism, pyramid or these shapes.In one embodiment of the invention, acicular pores can have at least one in cylindrical, square column type, trapezoidal cylindricality, taper shape.
Next, with reference to Fig. 3 B, scolder is filled in acicular pores 385, to form the needle-like scolder 320 with the shape corresponding with the shape of acicular pores 385.Can make in all sorts of ways is filled into scolder in acicular pores 385, for example, can carry out by scraper plate print process the filling of scolder., can, by solder-coated to the surface of mould 380, scolder be flow in acicular pores 385, and then utilize scraper plate to remove unnecessary scolder.In addition, can make to be retained in the solder solidification in acicular pores 385, thereby form needle-like scolder 320.For example, can make solder solidification by any means such as heating, light radiation.
Then, with reference to Fig. 3 C, semiconductor device 310 is attached to the upper surface of mould 380, the array pad (not shown) that makes semiconductor device 310 bottoms is with to be filled into needle-like scolder 320 in acicular pores 385 corresponding one by one.Can make together with needle-like scolder 320 is bonded to each other with array pad by Sn/Pb, SAC305, SAC105, SnBi etc. are set between needle-like scolder 320 and array pad, but the invention is not restricted to this.
Next, with reference to Fig. 3 D, the semiconductor device 310 that is connected with needle-like scolder 320 is separated with mould 380, thereby complete the manufacture of pin array solder-connected structure.
According to one embodiment of present invention, the mould by use with acicular pores forms needle-like scolder, scolder can be formed as to have predetermined shape, thereby has the advantages such as scolder spacing is little, bead height is high, the impact of packaging body distortion generation is little.
Fig. 4 shows the surface installation structure according to exemplary embodiment of the present invention.With reference to Fig. 4, a kind of surface installation structure comprises: semiconductor device 410; Multiple needle-like scolders 420, are arranged on semiconductor device 410 belows with array format, and the array pad (not shown) of bottom by semiconductor device 410 is connected to the internal circuit of semiconductor device; Substrate 430, comprises the multiple depression pads 440 corresponding with described multiple needle-like scolders 420 on it.According to one embodiment of present invention, needle-like scolder 420 is inserted in depression pad 440 and is connected to depression pad 440.
According to one embodiment of present invention, by needle-like scolder is inserted in the depression pad being arranged on substrate, the spacing between spacing and the needle-like scolder that can reduce by half between conductor device and substrate.Therefore, can the compacter miniaturization surface mounted component of manufacturing structure.
Fig. 5 A to Fig. 5 C is according to the indicative flowchart of the method for surface mounting of exemplary embodiment of the present invention.
With reference to Fig. 5 A, before carrying out surface installation, first the semiconductor device 510 with multiple needle-like scolders 520 is carried out to scaling powder coating.For example, multiple needle-like scolders 520 of semiconductor device 510 can be impregnated in scaling powder 580, thus make each needle-like scolder 520 surface uniform be coated with one deck scaling powder.Scaling powder can help and promote welding process in welding procedure, has the chemical substance of protective effect, prevention oxidation reaction simultaneously.The common scaling powder in this area all can be applicable to the present invention, therefore, here repeats no more.In addition, the invention is not restricted to this, according to one embodiment of present invention, also can omit the step that above-mentioned scaling powder applies.
With reference to Fig. 5 B, the needle-like scolder 520 of semiconductor device 510 is inserted in multiple depression pads 540 corresponding with needle-like scolder 520 that are arranged on substrate 530.Depression pad 540 can be formed on the surface of substrate 530, and is connected to the circuit being formed on substrate 530 or in substrate 530.Shape and the position of depression pad 540 can correspond to each other with needle-like scolder 520, but the invention is not restricted to this, and according to one embodiment of present invention, shape and the position of depression pad 540 can differ from one another with the shape of needle-like scolder 520 and position.
With reference to Fig. 5 C, by backflow, needle-like scolder 520 and depression pad 540 are connected to each other, thereby by needle-like scolder 520, the circuit in the internal circuit of semiconductor device 510 and substrate 530 are connected to each other.In addition, the invention is not restricted to this, also can needle-like scolder and depression pad 540 are connected to each other with additive method known in those skilled in the art.
According to one embodiment of present invention, because semiconductor device has needle-like scolder, and needle-like scolder can be inserted into the depression pad being formed on substrate, therefore can reduce the spacing between spacing and the needle-like scolder between semiconductor device and substrate.Therefore, can the compacter miniaturization surface mounted component of manufacturing structure.
In addition, owing to having needle-like scolder and supporting groove between packaging body and substrate, on packaging body, scolder can, picking direct insertion in groove after scaling powder, play fixation, therefore can in the situation that not using soldering paste, complete surface and install.
In addition, because scolder increases in the contact area of substrate recess, therefore surface installation structure of the present invention can have higher weld strength, and can have higher reliability.
Although described exemplary embodiment of the present invention with reference to the accompanying drawings, it will be appreciated by those skilled in the art that without departing from the spirit and scope of the present invention, can carry out various modifications and the change in form and details to these embodiment.Scope of the present invention is limited by claims and equivalent thereof.
Claims (10)
1. a pin array solder-connected structure, comprising:
Semiconductor device;
Multiple needle-like scolders, are arranged on semiconductor device below with array format, and are connected to the internal circuit of semiconductor device by the array pad of semiconductor device bottom.
2. pin array solder-connected structure as claimed in claim 1, wherein, that each in described multiple needle-like scolders has is cylindrical, at least one in square column type, trapezoidal cylindricality, taper shape.
3. a manufacture method for pin array solder-connected structure, described method comprises the steps:
In mould, form multiple acicular pores;
Scolder is filled in described multiple acicular pores to form needle-like scolder;
Semiconductor device is arranged on mould, makes to be filled into needle-like scolder in described multiple acicular pores and be connected respectively to the array pad of semiconductor device bottom;
The semiconductor device and the mould that are connected with needle-like scolder are separated from each other.
4. the manufacture method of pin array solder-connected structure as claimed in claim 3, wherein, mould is ceramic die.
5. the manufacture method of pin array solder-connected structure as claimed in claim 3, wherein, utilizes scraper plate printing that scolder is filled in described multiple acicular pores.
6. the manufacture method of pin array solder-connected structure as claimed in claim 3, wherein, utilizes at least one in Sn/Pb, SAC305, SAC105, SnBi that needle-like scolder is connected with the array pad of semiconductor device.
7. the manufacture method of pin array solder-connected structure as claimed in claim 1, wherein, that described acicular pores has is cylindrical, at least one in square column type, trapezoidal cylindricality, taper shape.
8. a surface installation structure, described surface installation structure comprises:
Semiconductor device;
Multiple needle-like scolders, are arranged on semiconductor device below with array format, and are connected to the internal circuit of semiconductor device by the array pad of semiconductor device bottom;
Substrate, comprises the multiple depression pads corresponding with described multiple needle-like scolders on described substrate,
Wherein, described multiple needle-like scolder is inserted in described multiple depression pad and is connected to described multiple depression pad.
9. surface installation structure as claimed in claim 8, wherein,
That each in described multiple needle-like scolder has is cylindrical, at least one in square column type, trapezoidal cylindricality, taper shape.
10. a method of surface mounting, described method of surface mounting comprises the steps:
To be inserted in multiple depression pads corresponding with described multiple needle-like scolders that are arranged on substrate according to the needle-like front line of at least one described pin array solder-connected structure in claim 1-3;
By backflow, described multiple needle-like scolder is connected with described multiple depression pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310742923.XA CN103779304A (en) | 2013-12-30 | 2013-12-30 | Solder connecting structure and manufacturing method thereof, surface mounting structure and mounting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310742923.XA CN103779304A (en) | 2013-12-30 | 2013-12-30 | Solder connecting structure and manufacturing method thereof, surface mounting structure and mounting method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN103779304A true CN103779304A (en) | 2014-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310742923.XA Pending CN103779304A (en) | 2013-12-30 | 2013-12-30 | Solder connecting structure and manufacturing method thereof, surface mounting structure and mounting method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10112474A (en) * | 1996-10-07 | 1998-04-28 | Fujitsu Ltd | Semiconductor device, its manufacture, method of forming contacts, and manufacturing electronic device |
| JPH11121527A (en) * | 1997-10-21 | 1999-04-30 | Pfu Ltd | Mounting of bare chip component, manufacture of ceramic board, the ceramic board and semiconductor device |
| JP2004247621A (en) * | 2003-02-17 | 2004-09-02 | Renesas Technology Corp | Semiconductor device and its manufacturing method |
| JP2005347513A (en) * | 2004-06-03 | 2005-12-15 | Matsushita Electric Ind Co Ltd | Semiconductor device and its manufacturing method |
-
2013
- 2013-12-30 CN CN201310742923.XA patent/CN103779304A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10112474A (en) * | 1996-10-07 | 1998-04-28 | Fujitsu Ltd | Semiconductor device, its manufacture, method of forming contacts, and manufacturing electronic device |
| JPH11121527A (en) * | 1997-10-21 | 1999-04-30 | Pfu Ltd | Mounting of bare chip component, manufacture of ceramic board, the ceramic board and semiconductor device |
| JP2004247621A (en) * | 2003-02-17 | 2004-09-02 | Renesas Technology Corp | Semiconductor device and its manufacturing method |
| JP2005347513A (en) * | 2004-06-03 | 2005-12-15 | Matsushita Electric Ind Co Ltd | Semiconductor device and its manufacturing method |
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Application publication date: 20140507 |