CN103779282A - 一种便于安装的功率半导体模块 - Google Patents
一种便于安装的功率半导体模块 Download PDFInfo
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- CN103779282A CN103779282A CN201410033330.0A CN201410033330A CN103779282A CN 103779282 A CN103779282 A CN 103779282A CN 201410033330 A CN201410033330 A CN 201410033330A CN 103779282 A CN103779282 A CN 103779282A
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- power semiconductor
- copper
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- circuit
- shell
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 52
- 229910052802 copper Inorganic materials 0.000 claims abstract description 36
- 239000010949 copper Substances 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000012544 monitoring process Methods 0.000 claims abstract description 9
- 238000005219 brazing Methods 0.000 claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 6
- 238000003486 chemical etching Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims abstract description 4
- 238000009434 installation Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 4
- 238000012856 packing Methods 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract 3
- 238000003466 welding Methods 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
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Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410033330.0A CN103779282B (zh) | 2014-01-24 | 2014-01-24 | 一种便于安装的功率半导体模块 |
Applications Claiming Priority (1)
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CN201410033330.0A CN103779282B (zh) | 2014-01-24 | 2014-01-24 | 一种便于安装的功率半导体模块 |
Publications (2)
Publication Number | Publication Date |
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CN103779282A true CN103779282A (zh) | 2014-05-07 |
CN103779282B CN103779282B (zh) | 2016-08-24 |
Family
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Family Applications (1)
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CN201410033330.0A Active CN103779282B (zh) | 2014-01-24 | 2014-01-24 | 一种便于安装的功率半导体模块 |
Country Status (1)
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CN (1) | CN103779282B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104867897A (zh) * | 2015-05-06 | 2015-08-26 | 嘉兴斯达微电子有限公司 | 一种二极管功率模块 |
CN104952807A (zh) * | 2015-05-04 | 2015-09-30 | 嘉兴斯达半导体股份有限公司 | 一种可适配多种不同厚度pcb板的功率半导体模块 |
CN111370381A (zh) * | 2020-03-27 | 2020-07-03 | 广东芯聚能半导体有限公司 | 连接组件、功率半导体及适用于功率半导体的连接方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN200997399Y (zh) * | 2006-12-31 | 2007-12-26 | 淄博市临淄银河高技术开发有限公司 | 一种电力电子模块 |
CN201490187U (zh) * | 2009-09-10 | 2010-05-26 | 嘉兴斯达微电子有限公司 | 一种新型功率端子直接键合功率模块 |
CN102522389A (zh) * | 2011-12-31 | 2012-06-27 | 嘉兴斯达微电子有限公司 | 一种小型的功率半导体模块 |
CN102569271A (zh) * | 2011-12-28 | 2012-07-11 | 嘉兴斯达微电子有限公司 | 一种高可靠性的大功率绝缘栅双极性晶体管模块 |
CN203746821U (zh) * | 2014-01-24 | 2014-07-30 | 嘉兴斯达微电子有限公司 | 一种便于安装的功率半导体模块 |
-
2014
- 2014-01-24 CN CN201410033330.0A patent/CN103779282B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN200997399Y (zh) * | 2006-12-31 | 2007-12-26 | 淄博市临淄银河高技术开发有限公司 | 一种电力电子模块 |
CN201490187U (zh) * | 2009-09-10 | 2010-05-26 | 嘉兴斯达微电子有限公司 | 一种新型功率端子直接键合功率模块 |
CN102569271A (zh) * | 2011-12-28 | 2012-07-11 | 嘉兴斯达微电子有限公司 | 一种高可靠性的大功率绝缘栅双极性晶体管模块 |
CN102522389A (zh) * | 2011-12-31 | 2012-06-27 | 嘉兴斯达微电子有限公司 | 一种小型的功率半导体模块 |
CN203746821U (zh) * | 2014-01-24 | 2014-07-30 | 嘉兴斯达微电子有限公司 | 一种便于安装的功率半导体模块 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104952807A (zh) * | 2015-05-04 | 2015-09-30 | 嘉兴斯达半导体股份有限公司 | 一种可适配多种不同厚度pcb板的功率半导体模块 |
CN104867897A (zh) * | 2015-05-06 | 2015-08-26 | 嘉兴斯达微电子有限公司 | 一种二极管功率模块 |
CN111370381A (zh) * | 2020-03-27 | 2020-07-03 | 广东芯聚能半导体有限公司 | 连接组件、功率半导体及适用于功率半导体的连接方法 |
CN111370381B (zh) * | 2020-03-27 | 2022-04-01 | 广东芯聚能半导体有限公司 | 连接组件、功率半导体及适用于功率半导体的连接方法 |
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Publication number | Publication date |
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CN103779282B (zh) | 2016-08-24 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171228 Address after: Jiaxing City, Zhejiang province 314006 Nanhu District Branch Road No. 988 Patentee after: STARPOWER SEMICONDUCTOR Ltd. Address before: Jiaxing City, Zhejiang province 314006 Ring Road No. 18 Sidalu Patentee before: JIAXING STARPOWER MICROELECTRONICS Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: No.988, Kexing Road, Nanhu District, Jiaxing City, Zhejiang Province Patentee after: Star Semiconductor Co.,Ltd. Address before: No.988, Kexing Road, Nanhu District, Jiaxing City, Zhejiang Province Patentee before: STARPOWER SEMICONDUCTOR Ltd. |