CN103779261A - Clamping stand top surface positioning module and lead-wire bonding machine with module - Google Patents
Clamping stand top surface positioning module and lead-wire bonding machine with module Download PDFInfo
- Publication number
- CN103779261A CN103779261A CN201210410087.0A CN201210410087A CN103779261A CN 103779261 A CN103779261 A CN 103779261A CN 201210410087 A CN201210410087 A CN 201210410087A CN 103779261 A CN103779261 A CN 103779261A
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- China
- Prior art keywords
- support frame
- vertical support
- grain
- face
- clamping table
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/77—Apparatus for connecting with strap connectors
- H01L2224/777—Means for aligning
- H01L2224/77703—Mechanical holding means
Abstract
The invention provides a clamping stand top surface positioning module and a lead-wire bonding machine with the module, and relates to the technical field of chip processing and manufacturing. The clamping stand top surface positioning module is used for positioning a vertical bracket and comprises a positioning block which is used for being arranged above the vertical bracket and movable and an up-ejection device which is used for being arranged below the vertical bracket and capable of up-ejecting the vertical bracket. The positioning block is connected with a driver. A top surface is adopted to position, height of the left and right ends of the top surface (welding surface) of the vertical bracket can be the same only by adjusting the positioning block and a Z-direction error can be the minimum after the vertical bracket is clamped. With the positioning mode, Z-direction positioning accuracy can be enhanced, a height searching value in automatic wire welding of the machine can be reduced and speed of the automatic wire welding of the machine can be enhanced.
Description
Technical field
The present invention relates to chip manufacture manufacturing technology field, refer to especially a kind of grain-clamping table end face locating module and there is the wire bonder of this module.
Background technology
Full-automatic vertical support frame wire bonder is the semiconductor production key equipment that connects chip bonding pad and package pins with metal lead wire, and it is to utilize ultrasonic wave, pressure and heat to reach semiconductor chip and external terminal are realized to a kind of technique being electrically connected.The necessary requirement that welding temperature, pressure and three factors of ultrasonic wave are bonding wires, in bonding wire process, grain-clamping table not only will be heated to working temperature by vertical support frame, and in clamping process, must guarantee that vertical support frame possesses certain stability and precision, otherwise can affect the quality of bonding wire and the speed of bonding wire.
Generally, grain-clamping table can guarantee stability in clamping process, otherwise machine can not bonding wire.Traditional grain-clamping table adopts location, vertical support frame bottom surface, when clamping, the bottom surface of vertical support frame is put in orbit, and then grain-clamping table is clamped.In the time of automatic bonding wire, in order to guarantee speed of welding requirement, vertical support frame end face need be controlled in certain scope at the difference in height △ of Z-direction.Vertical support frame 1 adopts punch forming, and its structure as shown in Figure 1, is spill by detecting known its end face (solder side) 11, bottom surface 12 is convex, and this also meets forming materials principle, and model as shown in Figure 2, for vertical support frame, the difference in height of himself end face 11 is △ 0.
Vertical support frame bottom surface locate mode schematic diagram as shown in Figure 3, working face 13 in the error of Z-direction from aspect three: 1, the error △ 0 of vertical support frame end face self; 2, material strip bottom is to the height error of end face; 3, vertical support frame bottom surface 12 is placed on track 2 and can be simplified to seesaw models, and this will bring larger error, and three kinds of situations as shown in Fig. 3 a to Fig. 3 c are several situations that may occur in the position fixing process of bottom surface, and wherein 21 is rail supported face.The vertical support frame that is 152mm for length, detects knownly by reality, difference in height △ is far longer than the difference in height △ 0 of vertical support frame self end face.The vertical support frame of tradition grain-clamping table clamping 152mm needs 2～3 clampings, by improving the precision of supporting track and adopting the high vertical support frame of precision, within substantially the difference in height △ of Z-direction can being controlled to claimed range.But for the lower situation of the precision of vertical support frame, within difference in height △ is just difficult to be controlled at claimed range, in the face of this problem, for improving efficiency and the quality of wire bonder, we need to adopt a kind of new method to solve this problem.
For improving machine efficiency, the clamping length of grain-clamping table increased relatively in the past greatly at present.If now still adopt bottom surface location, vertical support frame end face will be far longer than the requirement of technique at the difference in height △ of Z-direction so, so just must increase considerably and seek high value, thereby reduce the speed of automatic bonding wire.
Summary of the invention
The technical problem to be solved in the present invention is to provide the grain-clamping table end face locating module that a kind of Z-direction positioning precision is high and automatic welding linear velocity is fast and has the wire bonder of this module.
For solving the problems of the technologies described above, embodiments of the invention provide technical scheme as follows:
On the one hand, a kind of grain-clamping table end face locating module is provided, be used for locating vertical support frame, comprise top for being arranged on described vertical support frame locating piece and for being arranged on the below of described vertical support frame the upper ejection device of vertical support frame described in jack-up upwards movably, described locating piece is connected with driver.
Further, described locating piece is strip, and the two ends of described locating piece cross out the registration arm at the two ends that are useful on the described vertical support frame of contact.
Further, described upper ejection device is ejection device in elasticity.
Further, described upper ejection device is two.
Further, described two upper ejection devices are symmetricly set on the both sides of described vertical support frame.
On the other hand, a kind of wire bonder is provided, there is vertical support frame and grain-clamping table, on the end face of described grain-clamping table, be provided with the grain-clamping table end face locating module for locating described vertical support frame, described grain-clamping table end face locating module comprises and is arranged on the top of described vertical support frame locating piece and be arranged on the below of described vertical support frame and the upper ejection device of vertical support frame described in jack-up upwards movably, and described locating piece is connected with driver.
Further, described locating piece is strip, and the two ends of described locating piece cross out the registration arm at the two ends that are useful on the described vertical support frame of contact.
Further, described upper ejection device is ejection device in elasticity.
Further, described upper ejection device is two.
Further, described two upper ejection devices are symmetricly set on the both sides of described vertical support frame.
Embodiments of the invention have following beneficial effect:
In such scheme, employing end face location, only need to regulate locating piece just can make end face (solder side) two ends, the left and right height of vertical support frame identical, it is minimum that Z-direction error after vertical support frame is held just can reach, this locate mode can improve the positioning precision of Z-direction, reduce the high value of seeking of the automatic bonding wire of machine, improve the speed of the automatic bonding wire of machine.
Accompanying drawing explanation
Fig. 1 is the structural representation of the vertical support frame of wire bonder in prior art;
Fig. 2 is the illustraton of model of the vertical support frame shown in Fig. 1;
Fig. 3 a to Fig. 3 c is the model schematic diagram of the three kinds of situations that may occur in its bottom surface position fixing process of the vertical support frame shown in Fig. 1;
Fig. 4 is the structural representation of grain-clamping table end face locating module of the present invention;
Fig. 5 is the work schematic diagram of the grain-clamping table end face locating module shown in Fig. 4.
Embodiment
For technical problem, technical scheme and advantage that embodiments of the invention will be solved are clearer, be described in detail below in conjunction with the accompanying drawings and the specific embodiments.
Embodiments of the invention adopt location, bottom surface for the vertical support frame of wire bonder in prior art, Z-direction height error is large, cause seeking high value large, the problem that automatic welding linear velocity reduces, provides the grain-clamping table end face locating module that a kind of Z-direction positioning precision is high and automatic welding linear velocity is fast and has the wire bonder of this module.
On the one hand, the invention provides a kind of grain-clamping table end face locating module, be used for locating vertical support frame 1, as shown in Figure 4 and Figure 5, comprise top for being arranged on vertical support frame 1 locating piece 3 and for being arranged on the below of vertical support frame 1 the upper ejection device 4 of jack-up vertical support frame 1 upwards movably, locating piece 3 is connected with driver 5.
When application, as shown in Figure 5, locating piece 3 can move along Y-direction under the effect of driver 5, first driver 5 moves to locating piece 3 top face of vertical support frame 1 to Y-direction negative sense, then go up ejection device 4 by vertical support frame 1 jack-up, until the end face of vertical support frame 1 touches on the locating surface of locating piece 3, now grain-clamping table clamps vertical support frame 1, then locating piece 3 moves to Y-direction forward under the effect of driver 5, leave the end face of vertical support frame 1, now can carry out bonding wire at the end face of vertical support frame 1.
The present invention changes the mode of location, traditional grain-clamping table bottom surface, adopt end face to locate to meet Z-direction clamp precision, this locate mode makes Z-direction source of error only have the error of vertical support frame end face, and vertical support frame height error and orbit error will can not exert an influence to final Z-direction precision, rail supported, in the face of vertical support frame only has the effect of supporting and leading, does not have the function of location.
The present invention is with respect to traditional grain-clamping table, bottom has increased upper ejection device 4, top has increased transportable locating piece 3, and upper ejection device 4 is by top on vertical support frame 1 to the locating surface of locating piece 3, and locating piece 3 need to can move forward and backward according to clamping under the effect of driver 5.
Advantage of the present invention is to adopt end face location, only need to regulate locating piece just can make end face (solder side) two ends, the left and right height of vertical support frame identical, it is minimum that Z-direction error after vertical support frame is held just can reach, this locate mode can improve the positioning precision of Z-direction, reduce the high value of seeking of the automatic bonding wire of machine, improve the speed of machine automatic bonding wire, it is not only applicable to the grain-clamping table of large stroke, is equally applicable to the grain-clamping table of little stroke yet.
And grain-clamping table end face locating module of the present invention is not only applicable to full-automatic vertical support frame wire bonder, is equally also applicable to other and has with the semiconductor production equipment of wire bonder process similarity requirement and need pinpoint electromechanical equipment.
In the present invention, the structure of locating piece 3 is preferably strip, and the two ends of locating piece 3 cross out the registration arm 31 at the two ends that are useful on contact vertical support frame 1.
For improving job stability and accuracy, upper ejection device 4 is preferably two, and these two upper ejection devices 4 are preferably symmetricly set on the both sides of vertical support frame 1.
On the other hand, the present invention also provides a kind of wire bonder, there is vertical support frame 1 and grain-clamping table (not shown), on the end face of grain-clamping table, be provided with above-mentioned for locating the grain-clamping table end face locating module of vertical support frame 1, as shown in Figure 4 and Figure 5, grain-clamping table end face locating module comprises and is arranged on the top of vertical support frame 1 locating piece 3 and be arranged on the below of vertical support frame 1 and the upper ejection device 4 of jack-up vertical support frame 1 upwards movably, and locating piece 3 is connected with driver 5.
The present invention adopts end face location, only need to regulate locating piece just can make end face (solder side) two ends, the left and right height of vertical support frame identical, it is minimum that Z-direction error after vertical support frame is held just can reach, this locate mode can improve the positioning precision of Z-direction, reduce the high value of seeking of the automatic bonding wire of machine, improve the speed of the automatic bonding wire of machine.
In the present invention, the structure of locating piece 3 is preferably strip, and its two ends cross out the registration arm 31 at the two ends that are useful on contact vertical support frame 1.The factor such as integrated cost, application demand, upper ejection device 4 preferably adopts ejection device (can be built-in as flexible members such as springs) in elasticity.For improving job stability and accuracy, upper ejection device 4 is preferably two, and these two upper ejection devices 4 are preferably symmetricly set on the both sides of vertical support frame 1.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of principle of the present invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. a grain-clamping table end face locating module, be used for locating vertical support frame, it is characterized in that, comprise top for being arranged on described vertical support frame locating piece and for being arranged on the below of described vertical support frame the upper ejection device of vertical support frame described in jack-up upwards movably, described locating piece is connected with driver.
2. grain-clamping table end face locating module according to claim 1, is characterized in that, described locating piece is strip, and the two ends of described locating piece cross out the registration arm at the two ends that are useful on the described vertical support frame of contact.
3. grain-clamping table end face locating module according to claim 1, is characterized in that, described upper ejection device is ejection device in elasticity.
4. according to the grain-clamping table end face locating module described in arbitrary claim in claims 1 to 3, it is characterized in that, described upper ejection device is two.
5. grain-clamping table end face locating module according to claim 4, is characterized in that, described two upper ejection devices are symmetricly set on the both sides of described vertical support frame.
6. a wire bonder, there is vertical support frame and grain-clamping table, it is characterized in that, on the end face of described grain-clamping table, be provided with the grain-clamping table end face locating module for locating described vertical support frame, described grain-clamping table end face locating module comprises and is arranged on the top of described vertical support frame locating piece and be arranged on the below of described vertical support frame and the upper ejection device of vertical support frame described in jack-up upwards movably, and described locating piece is connected with driver.
7. wire bonder according to claim 6, is characterized in that, described locating piece is strip, and the two ends of described locating piece cross out the registration arm at the two ends that are useful on the described vertical support frame of contact.
8. wire bonder according to claim 6, is characterized in that, described upper ejection device is ejection device in elasticity.
9. according to the wire bonder described in arbitrary claim in claim 6 to 8, it is characterized in that, described upper ejection device is two.
10. wire bonder according to claim 9, is characterized in that, described two upper ejection devices are symmetricly set on the both sides of described vertical support frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210410087.0A CN103779261B (en) | 2012-10-24 | 2012-10-24 | Grain-clamping table end face locating module and there is the wire bonder of this module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210410087.0A CN103779261B (en) | 2012-10-24 | 2012-10-24 | Grain-clamping table end face locating module and there is the wire bonder of this module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103779261A true CN103779261A (en) | 2014-05-07 |
| CN103779261B CN103779261B (en) | 2016-05-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210410087.0A Expired - Fee Related CN103779261B (en) | 2012-10-24 | 2012-10-24 | Grain-clamping table end face locating module and there is the wire bonder of this module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103779261B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4892245A (en) * | 1988-11-21 | 1990-01-09 | Honeywell Inc. | Controlled compression furnace bonding |
| CN2892355Y (en) * | 2006-03-23 | 2007-04-25 | 艾逖恩机电(深圳)有限公司 | Automatically shifting clamp used on wire solder |
| CN201632794U (en) * | 2009-12-22 | 2010-11-17 | 亿光电子(中国)有限公司 | Welding wire fixture of welding wire machine |
| CN202317430U (en) * | 2011-10-31 | 2012-07-11 | 先进光电器材（深圳）有限公司 | Welding wire machine and support clamping head mechanism thereof |
-
2012
- 2012-10-24 CN CN201210410087.0A patent/CN103779261B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4892245A (en) * | 1988-11-21 | 1990-01-09 | Honeywell Inc. | Controlled compression furnace bonding |
| CN2892355Y (en) * | 2006-03-23 | 2007-04-25 | 艾逖恩机电(深圳)有限公司 | Automatically shifting clamp used on wire solder |
| CN201632794U (en) * | 2009-12-22 | 2010-11-17 | 亿光电子(中国)有限公司 | Welding wire fixture of welding wire machine |
| CN202317430U (en) * | 2011-10-31 | 2012-07-11 | 先进光电器材（深圳）有限公司 | Welding wire machine and support clamping head mechanism thereof |
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| Publication number | Publication date |
|---|---|
| CN103779261B (en) | 2016-05-18 |
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Granted publication date: 20160518 Termination date: 20181024 |
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| CF01 | Termination of patent right due to non-payment of annual fee |