CN206322668U - The apparatus for bending of stamp-mounting-paper diode - Google Patents
The apparatus for bending of stamp-mounting-paper diode Download PDFInfo
- Publication number
- CN206322668U CN206322668U CN201720003346.6U CN201720003346U CN206322668U CN 206322668 U CN206322668 U CN 206322668U CN 201720003346 U CN201720003346 U CN 201720003346U CN 206322668 U CN206322668 U CN 206322668U
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- Prior art keywords
- bending
- stamp
- mounting
- paper diode
- flat board
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Abstract
The apparatus for bending of stamp-mounting-paper diode.Be related to diode, more particularly to stamp-mounting-paper diode apparatus for bending.Simple in construction there is provided one kind, convenient processing improves the apparatus for bending of the stamp-mounting-paper diode of Product processing reliability.The upper die component is located at the top of lower mold assemblies, the upper die component includes suspension bracket, hydraulic cylinder and foldable component, the foldable component includes flat board and the bending plate of a pair of parallel setting, and a pair of bending plates are located at the bottom surface two ends of flat board respectively, and the flat board is connected on suspension bracket by hydraulic cylinder；The inner of the pin is located on the outside of fagging provided with section pre- indent triangular in shape, the pre- indent.The bending plate is movably connected on flat board by horizontal push one.The fagging is movably connected on pedestal by horizontal push two.The utility model is convenient to be processed, and improves product quality.
Description
Technical field
The utility model is related to diode, more particularly to stamp-mounting-paper diode apparatus for bending.
Background technology
Stamp-mounting-paper diode is also known as crystal diode, the vacuum electronic diode of abbreviation diode (diode), also early stage；
It is a kind of electronic device for having and unidirectionally conducting electric current.There are two lead terminals of a PN junction inside semiconductor diode,
This electronic device possesses the transducing of unidirectional current according to the direction of applied voltage.
In stamp-mounting-paper diode processing, traditional wrap direction is that mould is pushed, tool plane extruding pin, by pin bending
Shaping, but the position of bending, not by management and control, the dimensional uniformity of product is very poor, reduces the reliability of product.
Utility model content
The utility model, there is provided one kind is simple in construction, is conveniently processed for problem above, improves Product processing reliability
Stamp-mounting-paper diode apparatus for bending.
The technical solution of the utility model is：Including upper die component and lower mold assemblies, the upper die component is located at lower module
The top of part, the upper die component includes suspension bracket, hydraulic cylinder and foldable component, and the foldable component includes flat board and a pair of parallel
The bending plate of setting, a pair of bending plates are located at the bottom surface two ends of flat board respectively, and the flat board is connected on suspension bracket by hydraulic cylinder；
The lower mold assemblies include pedestal and the fagging of a pair of parallel setting, and a pair of faggings are located at the top surface of pedestal, a pair
Fagging is used to support stamp-mounting-paper diode, and the stamp-mounting-paper diode includes packaging body and stretches out the pin at packaging body two ends, described
The bottom surface that fagging is located at pin is inner, and the bending plate is located at the top surface outer end of pin；
The inner of the pin is located on the outside of fagging provided with section pre- indent triangular in shape, the pre- indent.
The depth of the pre- indent is the 1/3-1/2 of pin thickness.
The angle of the pre- indent is 90-120 °.
The bending plate is movably connected on flat board by horizontal push one.
The fagging is movably connected on pedestal by horizontal push two.
The inside lower end of the bending plate is provided with rectangular channel.
The utility model at work, by the way that pre- indent is processed on pin in advance（That is folding line）, then, by the pole of paster two
Pipe is placed on a pair of faggings of lower mold assemblies and is supported, then drives foldable component to push by the hydraulic cylinder in upper die component
Action so that a pair of bending plates carry out bending and molding to pin；Due to pre-setting folding line so that flexing movement can be along folding line
Carry out bending, it is ensured that the reliability of flexing movement.The utility model is convenient to be processed, and improves product quality.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model,
Fig. 2 is the partial enlarged drawing at A in Fig. 1；
1 is suspension bracket in figure, and 2 be hydraulic cylinder, and 3 be flat board, and 4 be bending plate, and 40 be rectangular channel, and 5 be pedestal, and 6 be fagging, 7
It is packaging body, 8 be pin, and 9 be pre- indent, and 10 be horizontal push one, and 11 be horizontal push two.
Embodiment
As shown in Figure 1-2, including upper die component and lower mold assemblies, the upper die component are located at lower mold assemblies to the utility model
Top, the upper die component include suspension bracket 1, hydraulic cylinder 2 and foldable component, the foldable component include flat board 3 and a pair it is flat
The bending plate 4 that row is set, a pair of bending plates are located at the bottom surface two ends of flat board respectively, and the flat board is connected to suspension bracket by hydraulic cylinder
On, suspension bracket is fixed mount, in stationary state；
The lower mold assemblies include pedestal 5 and the fagging 6 of a pair of parallel setting, and a pair of faggings are located at the top surface of pedestal, one
Fagging is used to support stamp-mounting-paper diode, the stamp-mounting-paper diode includes packaging body 7 and stretches out the pin 8 at packaging body two ends,
The bottom surface that the fagging is located at pin is inner, and the bending plate is located at the top surface outer end of pin；
The inner of the pin is located on the outside of fagging provided with section pre- indent 9 triangular in shape, the pre- indent.
The depth of the pre- indent 9 is the 1/3-1/2 of pin thickness, pre-sets bending track, and improving flexing movement can
Lean on, stability.
The angle of the pre- indent is 90-120 °, is easy to follow-up flexing movement reliable.
The bending plate is movably connected on flat board by horizontal push 1, is easy to the distance between a pair of bending plates can
Adjust, adapt to the processing request of the stamp-mounting-paper diode of different size.
The fagging is movably connected on pedestal by horizontal push 2 11, and distance is adjustable between being easy to a pair of faggings, makes
Obtain secure support stamp-mounting-paper diode.
The inside lower end of the bending plate 4 is provided with rectangular channel 40 so that bending edges are located in rectangular channel, it is ensured that bent for shaping
It is reliable.
Claims (6)
1. the apparatus for bending of stamp-mounting-paper diode, it is characterised in that including upper die component and lower mold assemblies, the upper die component is located at
The top of lower mold assemblies, the upper die component includes suspension bracket, hydraulic cylinder and foldable component, and the foldable component includes flat board and one
To the bending plate be arrangeding in parallel, a pair of bending plates are located at the bottom surface two ends of flat board respectively, and the flat board is connected to by hydraulic cylinder
On suspension bracket；
The lower mold assemblies include pedestal and the fagging of a pair of parallel setting, and a pair of faggings are located at the top surface of pedestal, a pair of faggings
For supporting stamp-mounting-paper diode, the stamp-mounting-paper diode includes packaging body and stretches out the pin at packaging body two ends, the fagging
Bottom surface positioned at pin is inner, and the bending plate is located at the top surface outer end of pin；
The inner of the pin is located on the outside of fagging provided with section pre- indent triangular in shape, the pre- indent.
2. the apparatus for bending of stamp-mounting-paper diode according to claim 1, it is characterised in that the depth of the pre- indent is to draw
The 1/3-1/2 of pin thickness.
3. the apparatus for bending of stamp-mounting-paper diode according to claim 1 or 2, it is characterised in that the angle of the pre- indent
For 90-120 °.
4. the apparatus for bending of stamp-mounting-paper diode according to claim 1, it is characterised in that the bending plate is pushed away by level
Bar one is movably connected on flat board.
5. the apparatus for bending of stamp-mounting-paper diode according to claim 1, it is characterised in that the fagging passes through horizontal push
Two are movably connected on pedestal.
6. the apparatus for bending of stamp-mounting-paper diode according to claim 1, it is characterised in that the inside lower end of the bending plate
Provided with rectangular channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720003346.6U CN206322668U (en) | 2017-01-04 | 2017-01-04 | The apparatus for bending of stamp-mounting-paper diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720003346.6U CN206322668U (en) | 2017-01-04 | 2017-01-04 | The apparatus for bending of stamp-mounting-paper diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206322668U true CN206322668U (en) | 2017-07-11 |
Family
ID=59261392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720003346.6U Active CN206322668U (en) | 2017-01-04 | 2017-01-04 | The apparatus for bending of stamp-mounting-paper diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206322668U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112916760A (en) * | 2021-01-25 | 2021-06-08 | 互创(东莞)电子科技有限公司 | Surface mount diode pin forming equipment and forming process thereof |
-
2017
- 2017-01-04 CN CN201720003346.6U patent/CN206322668U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112916760A (en) * | 2021-01-25 | 2021-06-08 | 互创(东莞)电子科技有限公司 | Surface mount diode pin forming equipment and forming process thereof |
| CN112916760B (en) * | 2021-01-25 | 2021-12-31 | 互创(东莞)电子科技有限公司 | Surface mount diode pin forming equipment and forming process thereof |
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