CN103763669B - High temperature-resistant surface-mounting microphone - Google Patents
High temperature-resistant surface-mounting microphone Download PDFInfo
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- CN103763669B CN103763669B CN201310493811.5A CN201310493811A CN103763669B CN 103763669 B CN103763669 B CN 103763669B CN 201310493811 A CN201310493811 A CN 201310493811A CN 103763669 B CN103763669 B CN 103763669B
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Abstract
The invention discloses a high temperature-resistant surface-mounting microphone comprising a housing with a polarized bottom surface, a gasket, a plastic ring, a vibrating diaphragm, a metal polar ring, and a PCB assembly. A plurality of sound holes are formed in the bottom surface of the housing; and the top surface of the housing is sealed by the PCB assembly. The gasket is arranged at the bottom surface of the housing and separates the housing bottom surface from the vibrating diaphragm. One end surface of the metal polar ring is electrically connected with the PCB and the other end surface is electrically connected with the vibrating diaphragm. The plastic ring accommodates the metal polar ring and the vibrating diaphragm, so that the three components are fixed inside the housing. According to the invention, the plastic ring is made from the special high temperature-resistant resin and fiber, so that the metal polar ring and the vibrating diaphragm arranged in the plastic ring can be well protected; and during the reflow soldering of the high temperature-resistant surface-mounting microphone, the sensitivity change of the high temperature-resistant surface-mounting microphone is small.
Description
Technical field
The present invention relates to microphone equipment field, more particularly, to a kind of High-temperature-respatcht patcht microphone.
Background technology
Being increasingly miniaturized and application on the portable sets such as mobile phone, panel computer for the microphone with microphone,
Tradition prepare microphone technique be unsuitable for miniaturization microphone production.
Element due to mobile phone pcb plate is made using smt technique and reflow soldering process, if microphone itself also can adopt
If smt technique and reflow soldering process, then the other elements of pcb plate can be coordinated to process at one time.But it is existing transaudient
Device is poor due to resistance to elevated temperatures, when using reflow soldering process, high temperature during Reflow Soldering can make microphone vibrating diaphragm and
The sensitivity of other elements drastically declines, and has a strong impact on the normal use of microphone.
By following method, existing SMD microphone solves the problems, such as that patcht microphone is unable to high temperature reflux weldering, for example
The Chinese patent " paster-type electret capacitor microphone " of Publication No. 200944665y, it by being replaced metal shell by aluminum
For copper, with soldering, brazing is connected on wiring board to adapt to surface mount elements basic demand；And for example Publication No. cn201854427u
Chinese patent " a kind of surface pasting electret capacitor microphone module ", it passes through to set up high temperature resistant protection shell is external
Meeting with thus weakening the thermal shock that surface pasting electret capacitor microphone module internal components and parts are subject to, reducing because Reflow Soldering
And lead to the low phenomenon of product sensitivity.
But SMD microphone disclosed in existing patent is all only open adopts exotic material, specific material is not disclosed
Type selecting.
Content of the invention
The technical problem to be solved is, for the above-mentioned deficiency of prior art, proposes one kind and is suitable for back
The low High-temperature-respatcht patcht microphone of change of sensitivity after fluid welding and Reflow Soldering.
The present invention solves its technical problem and employed technical scheme comprise that, proposes a kind of High-temperature-respatcht patcht microphone, it is bottom of by
The polarized shell in face, pad, mould ring, vibrating diaphragm, metal polar ring and pcb board component composition, described enclosure bottom opens up
Multiple acoustic aperture, top surface is had to be sealed by pcb board component, pad is arranged at and on enclosure bottom is separated enclosure bottom with vibrating diaphragm,
Metal polar ring end face is electrically connected with pcb plate, and other end is electrically connected with vibrating diaphragm, moulds ring by metal polar ring and vibration module
Containing enables three to be fixed on enclosure；Described ring of moulding is made using the material of following percentage by weight:
Polytetrafluoroethylene fibre: 12%-17%；
Glass fibre: 5.5%-7.5%；
Silicon dioxide: 2.5%-3.5%；
Aluminum trichloride (anhydrous): 4%-7%；
Firming agent: 8%-10%；
3,4- epoxide ring cyclohexyl methyl 3,4- epoxycyclohexyl formic acid esters: 30%-45%；
Balance of bi-phthalonitrile resin；
Described shell is made using the material of following percentage by weight:
Cr:21%-23%, mn:0.52%-1.5%, cu:1.3%-2.7%, ti:1.5%-2.0%, s:0.02%-0.07%, se:
2%-5%, co:0.05%-0.12%, balance of ni.
Preferably, described ring of moulding is made using the material of following percentage by weight:
Polytetrafluoroethylene fibre: 15%；
Glass fibre: 6%；
Nano silicon: 3.5%；
Aluminum trichloride (anhydrous): 5%；
Firming agent: 8%
3,4- epoxide ring cyclohexyl methyl 3,4- epoxycyclohexyl formic acid esters: 38%；
Balance of bi-phthalonitrile resin；
Described shell is made using the material of following percentage by weight:
Cr:23%, mn:0.52%, cu:2%, ti:1.8%, s:0.05%, se:3%, co:0.1%, balance of ni.
Further, described ring of moulding is made by the steps:
S1: weigh 3,4- epoxide ring cyclohexyl methyl 3,4- epoxycyclohexyl formic acid esters, firming agent and double neighbour by formula
Phthalonitrile resin is placed in beaker, stirs at a temperature of 55 to 65 DEG C of constant temperature；Then add aluminum trichloride (anhydrous) stirring 15-
20 minutes；
S2: the mixture that step s1 is obtained is poured into and is moulded in ring mold groove, and adds nano silicon, polytetrafluoroethyl-ne
After stirring after alkene fiber and glass fibre, evacuation removes bubble removing；
S3: mould is solidified heating-up temperatures solidification with three sections, respectively 160 DEG C solidifications are heated 20 minutes, and 250 DEG C of solidifications add
Heat 30 minutes, 350 DEG C of solidifications are heated 20 minutes.
Further, described nano silicon add to mixture before, first ester modified using metatitanic acid, titanate esters consumption
For the 20%-25% of nano silicon quality, modification time 1 hour.
Further, described polytetrafluoroethylene fibre and glass fibre be before adding to mixture, first using 0.8mol/l
The treatment fluid of sodium-how modified.
Further, described firming agent is methylnadic anhydride.
Further, described shell is made by the steps:
S1: weigh the simple metal of each element by formula, heating and melting becomes aluminium alloy；
S2: the aluminium alloy of melting is blowed to linear resonance surface velocity by argon reach the iron cooler pan of 150-200m/s and make
Aluminium alloy is cooled to alloy powder with the speed of 125-135 DEG C/s；
S3: alloy powder is suppressed, sinter molding.
Further, the quantity of the plurality of acoustic aperture be 4 and wherein the center of circle of three acoustic aperture line constitute equilateral three
Angular, the center of circle of another acoustic aperture is located at this equilateral triangle center.
Further, described acoustic aperture is also covered with water proof and dust proof net.
The present invention compared with prior art has the advantages that
1st, the High-temperature-respatcht patcht microphone of the present invention eliminates the back pole plate of conventional patch microphone, the function of back pole plate by
Enclosure bottom replaces.Because back pole plate is very little, assembling is extremely inconvenient, and after removing back pole plate, packaging efficiency significantly increases.
2nd, moulding ring adopts special fire resistant resin and fiber to constitute, and can be good at protection and is located at metal polar ring therein
And vibrating diaphragm, when High-temperature-respatcht patcht microphone carries out Reflow Soldering, the change of sensitivity of High-temperature-respatcht patcht microphone is less.
3rd, by the quantity and position relationship of setting acoustic aperture so that sound is when 4 acoustic aperture are transferred to vibrating diaphragm, thin
Film surface is pressurized uniformly, and thin vibration of membrane is more nearly fire plug vibration, greatly reduces the generation of harmonic wave, reduces distortion.
Brief description
Fig. 1 is the cross-sectional view of High-temperature-respatcht patcht microphone of the present invention；
Fig. 2 is the perspective view of shell in the present invention.
Specific embodiment
The following is the specific embodiment of the present invention and combine accompanying drawing, technical scheme is further described,
But the present invention is not limited to these embodiments.
Refer to Fig. 1, the High-temperature-respatcht patcht microphone of the present invention, its by the polarized shell in bottom surface 1, pad 2, mould ring 8,
Vibrating diaphragm 6, metal polar ring 7 and pcb board component 4 form.
Shell 1 bottom surface offers multiple acoustic aperture 5, and top surface is sealed by pcb board component 4；Pad 2 is arranged on enclosure bottom will
Enclosure bottom is separated with vibrating diaphragm 6, and metal polar ring 7 end face is electrically connected with pcb plate, and other end is electrically connected with vibrating diaphragm 6
Connect, mould ring 8 and enable three to be fixed on enclosure with vibration module 6 containing metal polar ring 7.
Sound is transferred to inside shell 1 through acoustic aperture 5, causes vibrating diaphragm 6 to vibrate, because pad 2 by shell 1 and vibrates
Diaphragm 6 separates, and the vibration of therefore vibrating diaphragm 6 makes capacitance therebetween change, and the change of this capacitance is passed through
Metal polar ring 7 is transferred to pcb board component 4, thus completing the transformation to the signal of telecommunication for the acoustical signal.
In the present embodiment, by the polarization of shell 1 bottom surface so that accumulation on enclosure bottom such that it is able to and vibrating diaphragm
Form electric capacity between piece, eliminate traditional backplane board component.
It is not metal material due to moulding ring, and moulds ring to surround vibrating diaphragm and metal polar ring, therefore in chip capacitor
During Reflow Soldering, the resistance to elevated temperatures moulding ring will directly affect the sensitivity of patcht microphone.
It is to strengthen the resistance to elevated temperatures moulding ring in the present invention, mould ring and made by following three embodiment.
Embodiment 1
Weigh raw material according to following percentage by weight:
Polytetrafluoroethylene fibre: 12%；
Glass fibre: 5.5%；
Silicon dioxide: 2.5%；
Aluminum trichloride (anhydrous): 4%；
Firming agent: 8%；Described firming agent is methylnadic anhydride；
3,4- epoxide ring cyclohexyl methyl 3,4- epoxycyclohexyl formic acid esters: 30%；
Balance of bi-phthalonitrile resin.
3,4- epoxide ring cyclohexyl methyl 3,4- epoxycyclohexyl formic acid esters, bi-phthalonitrile resin and methyl are received
Dick anhydride is placed in beaker, and 60 DEG C of constant temperature stirs；Then add aluminum trichloride (anhydrous) stirring 15-20 minute.
Mixture obtained above is poured into and moulds in ring mold groove, and add nano silicon, fibrillated polytetrafluoroethylene
After stirring after peacekeeping glass fibre, evacuation removes bubble removing；
By mould with three sections of solidification heating-up temperature solidifications, respectively 160 DEG C solidifications are heated 20 minutes, 250 DEG C of solidification heating
30 minutes, 350 DEG C of solidifications were heated 20 minutes.
The ring of moulding being obtained is put in patcht microphone high temperature reflux at 260 DEG C and welded 5 test patcht microphone afterwards
Change of sensitivity, changing value test result is shown in Table 1.
Embodiment 2
Weigh raw material according to following percentage by weight:
Polytetrafluoroethylene fibre: 15%；
Glass fibre: 6%；
Silicon dioxide: 3.5%；
Aluminum trichloride (anhydrous): 5%；
Firming agent: 8%；Described firming agent is methylnadic anhydride；
3,4- epoxide ring cyclohexyl methyl 3,4- epoxycyclohexyl formic acid esters: 38%；
Balance of bi-phthalonitrile resin.
3,4- epoxide ring cyclohexyl methyl 3,4- epoxycyclohexyl formic acid esters, bi-phthalonitrile resin and methyl are received
Dick anhydride is placed in beaker, and 60 DEG C of constant temperature stirs；Then add aluminum trichloride (anhydrous) stirring 15-20 minute.
Mixture obtained above is poured into and moulds in ring mold groove, and add nano silicon, fibrillated polytetrafluoroethylene
After stirring after peacekeeping glass fibre, evacuation removes bubble removing；
Described nano silicon is before adding to mixture, first ester modified using metatitanic acid, and titanate esters consumption is nanometer two
The 20%-25% of siliconoxide mass, modification time 1 hour.
Described polytetrafluoroethylene fibre and glass fibre before adding to mixture, first using the sodium-how to locate of 0.8mol/l
Reason liquid is modified.
By mould with three sections of solidification heating-up temperature solidifications, respectively 160 DEG C solidifications are heated 20 minutes, 250 DEG C of solidification heating
30 minutes, 350 DEG C of solidifications were heated 20 minutes.
The ring of moulding being obtained is put in patcht microphone high temperature reflux at 260 DEG C and welded 5 test patcht microphone afterwards
Change of sensitivity, changing value test result is shown in Table 1.
Embodiment 3
Weigh raw material according to following percentage by weight:
Polytetrafluoroethylene fibre: 17%；
Glass fibre: 7.5%；
Silicon dioxide: 3.5%；
Aluminum trichloride (anhydrous): 7%；
Firming agent: 10%；Described firming agent is methylnadic anhydride；
3,4- epoxide ring cyclohexyl methyl 3,4- epoxycyclohexyl formic acid esters: 45%；
Balance of bi-phthalonitrile resin.
3,4- epoxide ring cyclohexyl methyl 3,4- epoxycyclohexyl formic acid esters, bi-phthalonitrile resin and methyl are received
Dick anhydride is placed in beaker, and 65 DEG C of constant temperature stirs；Then add aluminum trichloride (anhydrous) stirring 15-20 minute.
Mixture obtained above is poured into and moulds in ring mold groove, and add nano silicon, fibrillated polytetrafluoroethylene
After stirring after peacekeeping glass fibre, evacuation removes bubble removing；
Described nano silicon is before adding to mixture, first ester modified using metatitanic acid, and titanate esters consumption is nanometer two
The 20%-25% of siliconoxide mass, modification time 1 hour.
Described polytetrafluoroethylene fibre and glass fibre before adding to mixture, first using the sodium-how to locate of 0.8mol/l
Reason liquid is modified.
By mould with three sections of solidification heating-up temperature solidifications, respectively 160 DEG C solidifications are heated 20 minutes, 250 DEG C of solidification heating
30 minutes, 350 DEG C of solidifications were heated 20 minutes.
In addition, traditional shell made using the material such as aluminum, copper or aluminium alloy, copper alloy although traditional shell
Through possessing certain resistance to elevated temperatures, yet with patcht microphone size is little, thickness of thin, in general, outside patcht microphone
Footpath size is only 4 millimeters, and height is only 1 millimeter, now makes shell according to traditional metal materials, its one side heat resistance
Reduced due to due to thickness, on the other hand so that heat is passed in a large number and mould inside ring.By special conjunction in the present invention
Gold prepares shell, strengthens its heat resistance and heat-proof quality.
The shell of the present invention is made using the material of following percentage by weight:
Cr:23%, mn:0.52%, cu:2%, ti:1.8%, s:0.05%, se:3%, co:0.1%, balance of ni.
In the sheathing material of the present invention, without the materials such as the preferable aluminum of heat conductivility, ferrum, the heat-insulated effect of other materials simultaneously
Really, tensile strength etc. is all preferable, is relatively more suitable for preparing shell.
Above-mentioned shell is prepared as follows:
S1: weigh the simple metal of each element by formula, heating and melting becomes aluminium alloy；
S2: the aluminium alloy of melting is blowed to linear resonance surface velocity by argon reach the iron cooler pan of 150-200m/s and make
Aluminium alloy is cooled to alloy powder with the speed of 125-135 DEG C/s；
S3: alloy powder is suppressed, sinter molding.
The shell of the present invention prepares alloy using method for rapid cooling, strengthens its mechanical performance.
By the shell being obtained and mould ring put in patcht microphone high temperature reflux at 260 DEG C weld 5 times afterwards test paster pass
The change of sensitivity of sound device, changing value test result is shown in Table 1.
Table 1
| Embodiment | Change of sensitivity value (db) |
| Embodiment 1 | Positive 1.2 |
| Embodiment 2 | Minus 0.7 |
| Embodiment 3 | Positive 0.5 |
As seen from the above table, mould after ring using the present invention, the resistance to elevated temperatures of SMD microphone significantly improves, and high temperature returns
During fluid welding, change of sensitivity value is in positive and negative 1.5db etc.
Preferably, in order to reduce the distortion of High-temperature-respatcht patcht microphone itself, the quantity of acoustic aperture is set to 4, and wherein
The line in the center of circle of three acoustic aperture constitutes equilateral triangle, and the center of circle of another acoustic aperture is located at this equilateral triangle center.
It is highly preferred that in order to reach more preferable practical function, water proof and dust proof net is also coated with acoustic aperture.
Specific embodiment described herein is only explanation for example to present invention spirit.The affiliated technology of the present invention is led
The technical staff in domain can be made various modifications or supplement or replaced using similar mode to described specific embodiment
Generation, but the spirit without departing from the present invention or surmount scope defined in appended claims.
Claims (7)
1. a kind of High-temperature-respatcht patcht microphone it is characterised in that: its by the polarized shell in bottom surface, pad, mould ring, vibrating diaphragm
Piece, metal polar ring and pcb board component composition, described enclosure bottom offers multiple acoustic aperture, top surface is sealed by pcb board component,
Pad is arranged at and on enclosure bottom is separated enclosure bottom with vibrating diaphragm, and metal polar ring end face is electrically connected with pcb plate, another
End face is electrically connected with vibrating diaphragm, moulds ring and enables three to be fixed on enclosure with vibrating diaphragm containing metal polar ring；Institute
State and mould ring and made using the material of following percentage by weight:
Polytetrafluoroethylene fibre: 12%-17%；
Glass fibre: 5.5%-7.5%；
Silicon dioxide: 2.5%-3.5%；
Aluminum trichloride (anhydrous): 4%-7%；
Firming agent: 8%-10%；
3,4- epoxycyclohexyl-methyl 3,4- epoxycyclohexyl formic acid esters: 30%-45%；
Balance of bi-phthalonitrile resin；
Described ring of moulding is made by the steps:
S1: weigh 3,4- epoxycyclohexyl-methyl 3,4- epoxycyclohexyl formic acid esters, firming agent and double O-phthalic by formula
Nitrile resin is placed in beaker, stirs at a temperature of 55 to 65 DEG C of constant temperature；Aluminum trichloride (anhydrous) stirring 15-20 is then added to divide
Clock；
S2: the mixture that step s1 is obtained is poured into and is moulded in ring mold groove, and add silicon dioxide, polytetrafluoroethylene fibre and
After stirring after glass fibre, evacuation removes bubble removing；
S3: by mould with three sections of solidification heating-up temperature solidifications, respectively 160 DEG C solidifications are heated 20 minutes, 250 DEG C of solidification heating 30
Minute, 350 DEG C of solidifications are heated 20 minutes.
2. High-temperature-respatcht patcht microphone according to claim 1 it is characterised in that: described mould ring adopt following weight percent
The material of ratio is made:
Polytetrafluoroethylene fibre: 15%；
Glass fibre: 6%；
Silicon dioxide: 3.5%；
Aluminum trichloride (anhydrous): 5%；
Firming agent: 8%
3,4- epoxycyclohexyl-methyl 3,4- epoxycyclohexyl formic acid esters: 38%；
Balance of bi-phthalonitrile resin.
3. High-temperature-respatcht patcht microphone according to claim 1 it is characterised in that: described silicon dioxide add to mix
Before thing, first ester modified using metatitanic acid, titanate esters consumption is the 20%-25% of silicon dioxide quality, modification time 1 hour.
4. High-temperature-respatcht patcht microphone according to claim 1 it is characterised in that: polytetrafluoroethylene fibre and glass fibre
Before adding to mixture, first the treatment fluid of sodium-how using 0.8mol/l is modified.
5. High-temperature-respatcht patcht microphone according to claim 1 it is characterised in that: described firming agent be methyl nadic acid
Acid anhydride.
6. High-temperature-respatcht patcht microphone according to claim 1 it is characterised in that: the quantity of the plurality of acoustic aperture be 4
And the line in the wherein center of circle of three acoustic aperture constitutes equilateral triangle, the center of circle of another acoustic aperture is located in this equilateral triangle
The heart.
7. High-temperature-respatcht patcht microphone according to claim 6 it is characterised in that: be also covered with described acoustic aperture waterproof prevent
Dirt net.
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| CN201611140638.0A CN106700419A (en) | 2013-10-18 | 2013-10-18 | Plastic manufacture method |
| CN201310493811.5A CN103763669B (en) | 2013-10-18 | 2013-10-18 | High temperature-resistant surface-mounting microphone |
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| CN201310493811.5A CN103763669B (en) | 2013-10-18 | 2013-10-18 | High temperature-resistant surface-mounting microphone |
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| CN201611140638.0A Division CN106700419A (en) | 2013-10-18 | 2013-10-18 | Plastic manufacture method |
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| CN103763669B true CN103763669B (en) | 2017-01-18 |
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| CN104113807A (en) * | 2014-06-20 | 2014-10-22 | 宁波兴隆电子有限公司 | Polar ring coverage membrane-contained ultra-thin microphone |
| CN113166472B (en) * | 2018-12-14 | 2023-03-28 | 3M创新有限公司 | Curable fluoropolymer compositions comprising bisphthalonitrile-containing compounds and cured articles thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1071179A (en) * | 1991-09-29 | 1993-04-21 | 中国人民解放军工程兵工程学院 | Carbon-fibre reinforced polytetrafluorethylesealing sealing material and preparation method thereof |
| KR20030048940A (en) * | 2001-12-13 | 2003-06-25 | 주식회사 비에스이 | An electret condenser microphone for surface mount technology |
| CN1672456A (en) * | 2003-07-29 | 2005-09-21 | 宝星电子株式会社 | Surface mountable electret condenser microphone |
| JP2009267649A (en) * | 2008-04-23 | 2009-11-12 | Nitto Denko Corp | Method of manufacturing heat-resistance electret material for electrostatic sound transducer |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101831173B (en) * | 2010-01-15 | 2012-06-27 | 电子科技大学 | Bi-phthalonitrile resin glass fiber composite material toughened by poly(arylene ether nitrile) and preparation method thereof |
| CN101914038A (en) * | 2010-07-15 | 2010-12-15 | 电子科技大学 | Bisphenol A type bis-phthalonitrile resin with aryl ether nitrile segments, cured product and preparation method thereof |
| CN102936340A (en) * | 2012-11-30 | 2013-02-20 | 吉林大学 | Bisphthalonitrile resin/aromatic amine organic montmorillonite nano composite material and preparation method thereof |
| CN103581813B (en) * | 2013-09-27 | 2016-08-24 | 宁波生大电子有限公司 | A kind of High-temperature-respatcht patcht microphone |
-
2013
- 2013-10-18 CN CN201611140638.0A patent/CN106700419A/en active Pending
- 2013-10-18 CN CN201310493811.5A patent/CN103763669B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1071179A (en) * | 1991-09-29 | 1993-04-21 | 中国人民解放军工程兵工程学院 | Carbon-fibre reinforced polytetrafluorethylesealing sealing material and preparation method thereof |
| KR20030048940A (en) * | 2001-12-13 | 2003-06-25 | 주식회사 비에스이 | An electret condenser microphone for surface mount technology |
| CN1672456A (en) * | 2003-07-29 | 2005-09-21 | 宝星电子株式会社 | Surface mountable electret condenser microphone |
| JP2009267649A (en) * | 2008-04-23 | 2009-11-12 | Nitto Denko Corp | Method of manufacturing heat-resistance electret material for electrostatic sound transducer |
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| CN106700419A (en) | 2017-05-24 |
| CN103763669A (en) | 2014-04-30 |
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Effective date of registration: 20190603 Address after: 226000 No. 266 Century Avenue, Nantong High-tech Zone, Jiangsu Province Patentee after: Nantong whole plasma technology Co., Ltd. Address before: 318017 No. 071 Yucai Road, Zilin Village, Zhang'an Street, Jiaojiang District, Taizhou City, Zhejiang Province Patentee before: Ke Lijun |
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