CN103763669A - High temperature-resistant surface-mounting microphone - Google Patents
High temperature-resistant surface-mounting microphone Download PDFInfo
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- CN103763669A CN103763669A CN201310493811.5A CN201310493811A CN103763669A CN 103763669 A CN103763669 A CN 103763669A CN 201310493811 A CN201310493811 A CN 201310493811A CN 103763669 A CN103763669 A CN 103763669A
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Abstract
The invention discloses a high temperature-resistant surface-mounting microphone comprising a housing with a polarized bottom surface, a gasket, a plastic ring, a vibrating diaphragm, a metal polar ring, and a PCB assembly. A plurality of sound holes are formed in the bottom surface of the housing; and the top surface of the housing is sealed by the PCB assembly. The gasket is arranged at the bottom surface of the housing and separates the housing bottom surface from the vibrating diaphragm. One end surface of the metal polar ring is electrically connected with the PCB and the other end surface is electrically connected with the vibrating diaphragm. The plastic ring accommodates the metal polar ring and the vibrating diaphragm, so that the three components are fixed inside the housing. According to the invention, the plastic ring is made from the special high temperature-resistant resin and fiber, so that the metal polar ring and the vibrating diaphragm arranged in the plastic ring can be well protected; and during the reflow soldering of the high temperature-resistant surface-mounting microphone, the sensitivity change of the high temperature-resistant surface-mounting microphone is small.
Description
Technical field
The present invention relates to microphone equipment field, relate in particular to a kind of high temperature resistant paster microphone.
Background technology
Along with continuous miniaturization and the application of microphone on the portable sets such as mobile phone, panel computer of microphone, the technique that tradition is prepared microphone has been unwell to the production of the microphone of miniaturization.
Because element employing SMT technique and the reflow soldering process of Mobile phone PCB are made, if microphone itself also can adopt SMT technique and reflow soldering process, can coordinate other elements of pcb board to process at one time.Yet existing microphone is because resistance to elevated temperatures is poor, and when adopting reflow soldering process, high temperature during Reflow Soldering can make the vibrating diaphragm of microphone and the sensitivity of other elements sharply decline, and has a strong impact on the normal use of microphone.
Existing SMD microphone solves by following method the problem that paster microphone can not high temperature reflux weldering, the Chinese patent " paster-type electret capacitor microphone " that for example publication number is 200944665Y, it is connected on wiring board brazing to adapt to surface mount elements basic demand with soldering by metal shell is replaced with to copper by aluminium; The Chinese patent that and for example publication number is CN201854427U " a kind of surface pasting electret capacitor microphone module "; thereby it,, by setting up high temperature resistant protection and weakened the thermal shock that surface pasting electret capacitor microphone module internal components and parts are subject to shell being external, reduces and because of Reflow Soldering, causes product sensitivity phenomenon on the low side.
Yet the disclosed SMD microphone of existing patent all only openly adopts exotic material, unexposed concrete material type selecting.
Summary of the invention
Technical problem to be solved by this invention is, for the above-mentioned deficiency of prior art, proposes a kind of low high temperature resistant paster microphone of change of sensitivity after Reflow Soldering and Reflow Soldering that is suitable for.
The technical scheme that the present invention solves its technical problem employing is, a kind of high temperature resistant paster microphone is proposed, its by the polarized shell in bottom surface, pad, mould ring, vibrating diaphragm, metal polar ring and pcb board assembly and form, described shell bottom surface offers a plurality of sound hole, end face by pcb board component sealing, pad is arranged on shell bottom surface shell bottom surface and vibrating diaphragm is separated, metal polar ring one end face is electrically connected to pcb board, other end is electrically connected to vibrating diaphragm, moulds ring and makes three can be fixed on enclosure metal polar ring and vibration module containing; The described ring of moulding adopts the material of following percentage by weight to make:
Polytetrafluoroethylene fibre: 12%-17%;
Glass fibre: 5.5%-7.5%;
Silicon dioxide: 2.5%-3.5%;
Aluminum trichloride (anhydrous): 4%-7%;
Curing agent: 8%-10%;
3,4-epoxide ring cyclohexyl methyl 3,4-epoxycyclohexyl formic acid esters: 30%-45%;
Surplus is bi-phthalonitrile resin;
Described shell adopts the material of following percentage by weight to make:
Cr:21%-23%, Mn:0.52%-1.5%, Cu:1.3%-2.7%, Ti:1.5%-2.0%, S:0.02%-0.07%, Se:2%-5%, Co:0.05%-0.12%, surplus is Ni.
Preferably, described in, moulding ring adopts the material of following percentage by weight to make:
Polytetrafluoroethylene fibre: 15%;
Glass fibre: 6%;
Nano silicon: 3.5%;
Aluminum trichloride (anhydrous): 5%;
Curing agent: 8%
3,4-epoxide ring cyclohexyl methyl 3,4-epoxycyclohexyl formic acid esters: 38%;
Surplus is bi-phthalonitrile resin;
Described shell adopts the material of following percentage by weight to make:
Cr:23%, Mn:0.52%, Cu:2%, Ti:1.8%, S:0.05%, Se:3%, Co:0.1%, surplus is Ni.
Further, described in, moulding ring prepares as follows:
S1: weigh 3,4-epoxide ring cyclohexyl methyl 3 by formula, 4-epoxycyclohexyl formic acid esters, curing agent and bi-phthalonitrile resin are placed in beaker, stir at 55 to 65 ℃ of temperature of constant temperature; Then add aluminum trichloride (anhydrous) to stir 15-20 minute;
S2: the mixture that step S1 is obtained is poured into and moulded in ring mould groove, and add after stirring after nano silicon, polytetrafluoroethylene fibre and glass fibre and vacuumize removal bubble;
S3: mould is solidified with three sections of curing heating-up temperatures, be respectively 160 ℃ and solidify heating 20 minutes, 250 ℃ solidify heating 30 minutes, and 350 ℃ solidify heating 20 minutes.
Further, described nano silicon, before being added into mixture, is first used titanate esters modification, and titanate esters consumption is the 20%-25% of nano silicon quality, modification time 1 hour.
Further, described polytetrafluoroethylene fibre and glass fibre, before being added into mixture, are first used sodium-Nai treatment fluid modification of 0.8mol/L.
Further, described curing agent is methyl carbic anhydride.
Further, described shell is prepared as follows:
S1: take the simple metal of each element by formula, heating and melting becomes aluminium alloy;
S2: the aluminium alloy of melting is blowed to the iron cooler pan that linear resonance surface velocity reaches 150-200m/s by argon gas and make aluminium alloy be cooled to alloy powder with the speed of 125-135 ℃/S;
S3: by alloy powder compacting, sinter molding.
Further, the quantity in described a plurality of sound hole be 4 and wherein the line in the center of circle in three sound holes form equilateral triangle, the center of circle in another sound hole is positioned at this equilateral triangle center.
Further, on described sound hole, be also coated with water proof and dust proof net.
The present invention compared with prior art has following beneficial effect:
1, high temperature resistant paster microphone of the present invention has saved the back pole plate of traditional paster microphone, and the function of back pole plate is replaced by shell bottom surface.Because back pole plate is very little, assembling is very inconvenient, removes after back pole plate, and packaging efficiency greatly promotes.
2, mould ring and adopt special fire resistant resin and fiber to form, can be good at protection and be positioned at metal polar ring and vibrating diaphragm wherein, when high temperature resistant paster microphone carries out Reflow Soldering, the change of sensitivity of high temperature resistant paster microphone is less.
3, by quantity and the position relationship in sound hole are set, while making sound be passed to vibrating diaphragm through 4 sound holes, film surface pressurized is even, and thin vibration of membrane approaches the vibration of fire plug more, and the generation of harmonic reduction, reduces distortion greatly.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the high temperature resistant paster microphone of the present invention;
Fig. 2 is the perspective view of housing of the present invention.
Embodiment
Be below specific embodiments of the invention by reference to the accompanying drawings, technical scheme of the present invention is further described, but the present invention be not limited to these embodiment.
Please refer to Fig. 1, high temperature resistant paster microphone of the present invention, its by the polarized shell 1 in bottom surface, pad 2, mould ring 8, vibrating diaphragm 6, metal polar ring 7 and pcb board assembly 4 and form.
Sound is passed to shell 1 inside through sound hole 5, cause vibrating diaphragm 6 vibrations, because pad 2 separates shell 1 and vibrating diaphragm 6, therefore the vibration of vibrating diaphragm 6 changes the capacitance between the two, the variation of this capacitance is passed to pcb board assembly 4 by metal polar ring 7, thereby completes acoustical signal to the transformation of the signal of telecommunication.
In the present embodiment, by shell 1 bottom surface polarization, make accumulation on shell bottom surface, thus can and vibrating diaphragm between form electric capacity, saved traditional back pole plate assembly.
Owing to moulding ring, be not metal material, and mould ring vibrating diaphragm and metal polar ring are surrounded, therefore, when chip capacitor Reflow Soldering, the resistance to elevated temperatures of moulding ring will directly affect the sensitivity of paster microphone.
In the present invention, for strengthening the resistance to elevated temperatures of moulding ring, mould ring and make by following three embodiment.
According to following percentage by weight, take raw material:
Polytetrafluoroethylene fibre: 12%;
Glass fibre: 5.5%;
Silicon dioxide: 2.5%;
Aluminum trichloride (anhydrous): 4%;
Curing agent: 8%; Described curing agent is methyl carbic anhydride;
3,4-epoxide ring cyclohexyl methyl 3,4-epoxycyclohexyl formic acid esters: 30%;
Surplus is bi-phthalonitrile resin.
By 3,4-epoxide ring cyclohexyl methyl 3,4-epoxycyclohexyl formic acid esters, bi-phthalonitrile resin and methyl carbic anhydride are placed in beaker, and 60 ℃ of constant temperature stir; Then add aluminum trichloride (anhydrous) to stir 15-20 minute.
Mixture obtained above is poured into and moulded in ring mould groove, and add after stirring after nano silicon, polytetrafluoroethylene fibre and glass fibre and vacuumize removal bubble;
Mould is solidified with three sections of curing heating-up temperatures, be respectively 160 ℃ and solidify heating 20 minutes, 250 ℃ solidify heating 30 minutes, and 350 ℃ solidify heating 20 minutes.
The ring of moulding making is put into the paster microphone change of sensitivity that high temperature reflux welds test patch microphone after 5 times at 260 ℃, and changing value test result is in Table 1.
According to following percentage by weight, take raw material:
Polytetrafluoroethylene fibre: 15%;
Glass fibre: 6%;
Silicon dioxide: 3.5%;
Aluminum trichloride (anhydrous): 5%;
Curing agent: 8%; Described curing agent is methyl carbic anhydride;
3,4-epoxide ring cyclohexyl methyl 3,4-epoxycyclohexyl formic acid esters: 38%;
Surplus is bi-phthalonitrile resin.
By 3,4-epoxide ring cyclohexyl methyl 3,4-epoxycyclohexyl formic acid esters, bi-phthalonitrile resin and methyl carbic anhydride are placed in beaker, and 60 ℃ of constant temperature stir; Then add aluminum trichloride (anhydrous) to stir 15-20 minute.
Mixture obtained above is poured into and moulded in ring mould groove, and add after stirring after nano silicon, polytetrafluoroethylene fibre and glass fibre and vacuumize removal bubble;
Described nano silicon, before being added into mixture, is first used titanate esters modification, and titanate esters consumption is the 20%-25% of nano silicon quality, modification time 1 hour.
Described polytetrafluoroethylene fibre and glass fibre, before being added into mixture, are first used sodium-Nai treatment fluid modification of 0.8mol/L.
Mould is solidified with three sections of curing heating-up temperatures, be respectively 160 ℃ and solidify heating 20 minutes, 250 ℃ solidify heating 30 minutes, and 350 ℃ solidify heating 20 minutes.
The ring of moulding making is put into the paster microphone change of sensitivity that high temperature reflux welds test patch microphone after 5 times at 260 ℃, and changing value test result is in Table 1.
According to following percentage by weight, take raw material:
Polytetrafluoroethylene fibre: 17%;
Glass fibre: 7.5%;
Silicon dioxide: 3.5%;
Aluminum trichloride (anhydrous): 7%;
Curing agent: 10%; Described curing agent is methyl carbic anhydride;
3,4-epoxide ring cyclohexyl methyl 3,4-epoxycyclohexyl formic acid esters: 45%;
Surplus is bi-phthalonitrile resin.
By 3,4-epoxide ring cyclohexyl methyl 3,4-epoxycyclohexyl formic acid esters, bi-phthalonitrile resin and methyl carbic anhydride are placed in beaker, and 65 ℃ of constant temperature stir; Then add aluminum trichloride (anhydrous) to stir 15-20 minute.
Mixture obtained above is poured into and moulded in ring mould groove, and add after stirring after nano silicon, polytetrafluoroethylene fibre and glass fibre and vacuumize removal bubble;
Described nano silicon, before being added into mixture, is first used titanate esters modification, and titanate esters consumption is the 20%-25% of nano silicon quality, modification time 1 hour.
Described polytetrafluoroethylene fibre and glass fibre, before being added into mixture, are first used sodium-Nai treatment fluid modification of 0.8mol/L.
Mould is solidified with three sections of curing heating-up temperatures, be respectively 160 ℃ and solidify heating 20 minutes, 250 ℃ solidify heating 30 minutes, and 350 ℃ solidify heating 20 minutes.
In addition, traditional shell adopts the materials such as aluminium, copper or aluminium alloy, copper alloy to make, although traditional shell has possessed certain resistance to elevated temperatures, yet because paster microphone size is little, thin thickness, in general, paster microphone outside dimension is only 4 millimeters, be highly only 1 millimeter, if now adopt traditional metal materials to make shell, its one side heat resistance, because the reason of thickness reduces, also makes on the other hand heat be passed in a large number and moulds ring inside.In the present invention, by specific alloy, prepare shell, strengthen its heat resistance and heat-proof quality.
Shell of the present invention adopts the material of following percentage by weight to make:
Cr:23%, Mn:0.52%, Cu:2%, Ti:1.8%, S:0.05%, Se:3%, Co:0.1%, surplus is Ni.
In sheathing material of the present invention, not containing materials such as the good aluminium of heat conductivility, iron, other materials effect of heat insulation, hot strength etc. are all better simultaneously, are relatively suitable for preparing shell.
Above-mentioned shell is prepared in the following way:
S1: take the simple metal of each element by formula, heating and melting becomes aluminium alloy;
S2: the aluminium alloy of melting is blowed to the iron cooler pan that linear resonance surface velocity reaches 150-200m/s by argon gas and make aluminium alloy be cooled to alloy powder with the speed of 125-135 ℃/S;
S3: by alloy powder compacting, sinter molding.
Shell of the present invention adopts method for rapid cooling to prepare alloy, has strengthened its mechanical performance.
The shell making is put into the paster microphone change of sensitivity that high temperature reflux welds test patch microphone after 5 times at 260 ℃ with moulding to encircle, and changing value test result is in Table 1.
Table 1
| Embodiment | Change of sensitivity value (dB) |
| |
Positive 1.2 |
| |
Negative 0.7 |
| |
Positive 0.5 |
As seen from the above table, adopt of the present invention moulding after ring, the resistance to elevated temperatures of SMD microphone obviously improves, and during high temperature reflux weldering, change of sensitivity value is at positive and negative 1.5dB and so on.
Preferably, in order to reduce the distortion of high temperature resistant paster microphone itself, the quantity in sound hole is made as to 4, and wherein the line in the center of circle in three sound holes forms equilateral triangle, the center of circle in another sound hole is positioned at this equilateral triangle center.
More preferably, in order to reach better practical function, also on sound hole, be coated with water proof and dust proof net.
Specific embodiment described herein is only to the explanation for example of the present invention's spirit.Those skilled in the art can make various modifications or supplement or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Claims (9)
1. a high temperature resistant paster microphone, it is characterized in that: its by the polarized shell in bottom surface, pad, mould ring, vibrating diaphragm, metal polar ring and pcb board assembly and form, described shell bottom surface offers a plurality of sound hole, end face by pcb board component sealing, pad is arranged on shell bottom surface shell bottom surface and vibrating diaphragm is separated, metal polar ring one end face is electrically connected to pcb board, other end is electrically connected to vibrating diaphragm, moulds ring and makes three can be fixed on enclosure metal polar ring and vibration module containing; The described ring of moulding adopts the material of following percentage by weight to make:
Polytetrafluoroethylene fibre: 12%-17%;
Glass fibre: 5.5%-7.5%;
Silicon dioxide: 2.5%-3.5%;
Aluminum trichloride (anhydrous): 4%-7%;
Curing agent: 8%-10%;
3,4-epoxide ring cyclohexyl methyl 3,4-epoxycyclohexyl formic acid esters: 30%-45%;
Surplus is bi-phthalonitrile resin;
Described shell adopts the material of following percentage by weight to make:
Cr:23%, Mn:0.52%, Cu:2%, Ti:1.8%, S:0.05%, Se:3%, Co:0.1%, surplus is Ni.
2. high temperature resistant paster microphone according to claim 1, is characterized in that: described in mould ring and adopt the material of following percentage by weight to make:
Polytetrafluoroethylene fibre: 15%;
Glass fibre: 6%;
Nano silicon: 3.5%;
Aluminum trichloride (anhydrous): 5%;
Curing agent: 8%
3,4-epoxide ring cyclohexyl methyl 3,4-epoxycyclohexyl formic acid esters: 38%;
Surplus is bi-phthalonitrile resin.
3. high temperature resistant paster microphone according to claim 1 and 2, is characterized in that: described in mould ring and prepare as follows:
S1: weigh 3,4-epoxide ring cyclohexyl methyl 3 by formula, 4-epoxycyclohexyl formic acid esters, curing agent and bi-phthalonitrile resin are placed in beaker, stir at 55 to 65 ℃ of temperature of constant temperature; Then add aluminum trichloride (anhydrous) to stir 15-20 minute;
S2: the mixture that step S1 is obtained is poured into and moulded in ring mould groove, and add after stirring after nano silicon, polytetrafluoroethylene fibre and glass fibre and vacuumize removal bubble;
S3: mould is solidified with three sections of curing heating-up temperatures, be respectively 160 ℃ and solidify heating 20 minutes, 250 ℃ solidify heating 30 minutes, and 350 ℃ solidify heating 20 minutes.
4. described high temperature resistant paster microphone according to claim 3, is characterized in that: described nano silicon, before being added into mixture, is first used titanate esters modification, and titanate esters consumption is the 20%-25% of nano silicon quality, modification time 1 hour.
5. described high temperature resistant paster microphone according to claim 3, is characterized in that: polytetrafluoroethylene fibre and glass fibre, before being added into mixture, are first used sodium-Nai treatment fluid modification of 0.8mol/L.
6. described high temperature resistant paster microphone according to claim 3, is characterized in that: described curing agent is methyl carbic anhydride.
7. described high temperature resistant paster microphone according to claim 1, is characterized in that: described shell is prepared as follows:
S1: take the simple metal of each element by formula, heating and melting becomes aluminium alloy;
S2: the aluminium alloy of melting is blowed to the iron cooler pan that linear resonance surface velocity reaches 150-200m/s by argon gas and make aluminium alloy be cooled to alloy powder with the speed of 125-135 ℃/S;
S3: by alloy powder compacting, sinter molding.
8. described high temperature resistant paster microphone according to claim 1, is characterized in that: the quantity in described a plurality of sound hole be 4 and wherein the line in the center of circle in three sound holes form equilateral triangle, the center of circle in another sound hole is positioned at this equilateral triangle center.
9. described high temperature resistant paster microphone according to claim 8, is characterized in that: described sound is also coated with water proof and dust proof net on hole.
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|---|---|---|---|
| CN201310493811.5A CN103763669B (en) | 2013-10-18 | 2013-10-18 | High temperature-resistant surface-mounting microphone |
| CN201611140638.0A CN106700419A (en) | 2013-10-18 | 2013-10-18 | Plastic manufacture method |
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| CN201310493811.5A CN103763669B (en) | 2013-10-18 | 2013-10-18 | High temperature-resistant surface-mounting microphone |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104113807A (en) * | 2014-06-20 | 2014-10-22 | 宁波兴隆电子有限公司 | Polar ring coverage membrane-contained ultra-thin microphone |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3894467A1 (en) * | 2018-12-14 | 2021-10-20 | 3M Innovative Properties Company | Curable fluoropolymer compositions comprising a bis phthalonitrile-containing compound and cured articles therefrom |
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| CN1071179A (en) * | 1991-09-29 | 1993-04-21 | 中国人民解放军工程兵工程学院 | Carbon-fibre reinforced polytetrafluorethylesealing sealing material and preparation method thereof |
| KR20030048940A (en) * | 2001-12-13 | 2003-06-25 | 주식회사 비에스이 | An electret condenser microphone for surface mount technology |
| CN1672456A (en) * | 2003-07-29 | 2005-09-21 | 宝星电子株式会社 | Surface mountable electret condenser microphone |
| JP2009267649A (en) * | 2008-04-23 | 2009-11-12 | Nitto Denko Corp | Method of manufacturing heat-resistance electret material for electrostatic sound transducer |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101831173B (en) * | 2010-01-15 | 2012-06-27 | 电子科技大学 | Bi-phthalonitrile resin glass fiber composite material toughened by poly(arylene ether nitrile) and preparation method thereof |
| CN101914038A (en) * | 2010-07-15 | 2010-12-15 | 电子科技大学 | Bisphenol A type bis-phthalonitrile resin with aryl ether nitrile segments, cured product and preparation method thereof |
| CN102936340A (en) * | 2012-11-30 | 2013-02-20 | 吉林大学 | Bisphthalonitrile resin/aromatic amine organic montmorillonite nano composite material and preparation method thereof |
| CN103581813B (en) * | 2013-09-27 | 2016-08-24 | 宁波生大电子有限公司 | A kind of High-temperature-respatcht patcht microphone |
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2013
- 2013-10-18 CN CN201310493811.5A patent/CN103763669B/en active Active
- 2013-10-18 CN CN201611140638.0A patent/CN106700419A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1071179A (en) * | 1991-09-29 | 1993-04-21 | 中国人民解放军工程兵工程学院 | Carbon-fibre reinforced polytetrafluorethylesealing sealing material and preparation method thereof |
| KR20030048940A (en) * | 2001-12-13 | 2003-06-25 | 주식회사 비에스이 | An electret condenser microphone for surface mount technology |
| CN1672456A (en) * | 2003-07-29 | 2005-09-21 | 宝星电子株式会社 | Surface mountable electret condenser microphone |
| JP2009267649A (en) * | 2008-04-23 | 2009-11-12 | Nitto Denko Corp | Method of manufacturing heat-resistance electret material for electrostatic sound transducer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104113807A (en) * | 2014-06-20 | 2014-10-22 | 宁波兴隆电子有限公司 | Polar ring coverage membrane-contained ultra-thin microphone |
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| CN106700419A (en) | 2017-05-24 |
| CN103763669B (en) | 2017-01-18 |
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Effective date of registration: 20190603 Address after: 226000 No. 266 Century Avenue, Nantong High-tech Zone, Jiangsu Province Patentee after: Nantong whole plasma technology Co., Ltd. Address before: 318017 No. 071 Yucai Road, Zilin Village, Zhang'an Street, Jiaojiang District, Taizhou City, Zhejiang Province Patentee before: Ke Lijun |