CN207939732U - Electret microphone - Google Patents
Electret microphone Download PDFInfo
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- CN207939732U CN207939732U CN201820278902.5U CN201820278902U CN207939732U CN 207939732 U CN207939732 U CN 207939732U CN 201820278902 U CN201820278902 U CN 201820278902U CN 207939732 U CN207939732 U CN 207939732U
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- wiring board
- pole plate
- electret microphone
- back pole
- vibrating diaphragm
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Abstract
The utility model discloses a kind of electret microphones, including：Bottom offers the shell of sound hole, set on outer casing bottom and with enter vibrating diaphragm component, the insulation spacer on vibrating diaphragm component, the back pole plate on insulation spacer that sound hole is oppositely arranged, set on shell top open part outer wiring board, the interior wiring board set on enclosure and on back pole plate, interior wiring board electrical connection back pole plate and outer wiring board, improve sensitivity and stability.By back pole plate storing charge, without the concern for the ability of vibrating diaphragm component storing charge, the material that the diaphragm of vibrating diaphragm component can select acoustic characteristic good promotes acoustical quality；Electret microphone can replace MEMS microphone, solve the problems, such as that the acoustic pressure limitation of MEMS microphone itself, cost are higher.
Description
Technical field
The utility model is related to mike technique fields, specifically, being related to a kind of electret microphone.
Background technology
Currently, microphone is generally divided into ECM (electret microphone) by structure constituted mode, (MEMS passes MEMS
Sound device).MEMS is the microphone manufactured based on MEMS technology, by MEMS sound pressure sensor chips, asic chip, sound chamber and circuit
Board group at.MEMS sound pressure sensors are a button capacitors being made of silicon vibrating diaphragm and silicon back pole plate, can turn sound pressure variations
Capacitance variations are turned to, then convert capacitance variations to electric signal by asic chip, realize " sound-electric " conversion.When in use by
It is restricted in the acoustic pressure that MEMS sound pressure sensor chips are born, can not normally it make needing the when of inputting larger acoustic pressure and air blowing
With；Simultaneously because MEMS microphone size and structure limitation, it is higher to will appear sensitivity in frequency response curve high frequency section, is also easy to produce
It utters long and high-pitched sounds phenomenon；Excessively frivolous design causes that the element that can filter out interference can not be placed inside microphone, causes anti-interference ability
It is weak；MEMS sound pressure sensors use the technique of manufacture of semiconductor bonding, do vibrate, fall-down test when be easy to shake bonding line
It is disconnected, therefore when some need the use occasion of high reliability, strong anti-interference ability and flat frequency response curve, MEMS microphone is still
It can be restricted.In addition, MEMS chip relies primarily on external import, cost is higher.
Utility model content
The purpose of this utility model is to provide a kind of electret microphones instead of MEMS microphone, it is intended to solve existing
There is the acoustic pressure that MEMS microphone is born in technology limited, sensitivity, stability is bad, the higher technical problem of cost.
The utility model provides a kind of electret microphone, including：
Shell, bottom are offered into sound hole；
Vibrating diaphragm component, set on the outer casing bottom and with it is described enter sound hole be oppositely arranged；
Insulation spacer is set on the vibrating diaphragm component；
Back pole plate is set on the insulation spacer；
Interior wiring board and outer wiring board, the outer wiring board are set to the top open part of the shell, the interior wiring board
Set on the enclosure and on the back pole plate, the interior wiring board is configured to be electrically connected the back pole plate and institute
State outer wiring board.
Wherein, the vibrating diaphragm component includes the metalwork set on the outer casing bottom and the film on the metalwork
Piece.
Wherein, two surfaces of the interior wiring board be respectively equipped with the upper firing point of the outer wiring board electrical connection and
With the lower firing point of back pole plate electrical connection, the upper firing point and the lower firing point electrical connection.
Wherein, the upper firing point and the lower firing point are an integral molding structure.
Wherein, the upper firing point is welded with the outer wiring board, and the lower firing point is welded with the back pole plate.
Wherein, the lower firing point and the back pole plate are welded using surface mounting technology.
Wherein, the interior wiring board is loop configuration, to form internal sound chamber.
Wherein, the lower surface of the outer wiring board is equipped with electronic component, and the electronic component stretches into the shell
Portion.
Wherein, the electronic component includes IC chip, resistance and capacitance, and the IC chip passes through institute
It states resistance and the supply terminals of the upper surface of the outer wiring board is electrically connected, the IC chip passes through the capacitance and institute
State the output point electrical connection of the upper surface of outer wiring board.
Wherein, the electret microphone is cuboid structure.
A kind of electret microphone that the utility model embodiment provides, by being contained in enclosure and being set to vibrating diaphragm portion
Back pole plate storing charge on part, without the concern for the ability of vibrating diaphragm component storing charge, the diaphragm of vibrating diaphragm component can select
The good material of acoustic characteristic promotes acoustical quality；In addition, being electrically connected back pole plate and outer wiring board by interior wiring board, improve
Sensitivity and stability.Electret microphone can replace MEMS microphone, solve MEMS microphone itself acoustic pressure limitation, at
This higher problem.
Description of the drawings
Fig. 1 is the cross-sectional view of the electret microphone of one embodiment of the utility model；
Fig. 2 is the configuration schematic diagram of electret microphone in Fig. 1；
Fig. 3 is the vertical view of the wiring board of electret microphone China and foreign countries shown in Fig. 1.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
It is explicitly described, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole implementation
Example.Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
As shown in Figure 1, Figure 2 and Figure 3, Fig. 1 is cuing open for the electret microphone 10 of an embodiment provided by the utility model
Face structural schematic diagram, Fig. 2 are the configuration schematic diagrams of electret microphone 10 in Fig. 1, and Fig. 3 is that electret shown in Fig. 1 passes
The vertical view of 10 China and foreign countries' wiring board 600 of sound device.
Electret microphone 10 includes：Shell 100, vibrating diaphragm component 200, insulation spacer 300, back pole plate 400, interior wiring board
500 and outer wiring board 600.
Shell 100 can be integrally formed metal material, such as stainless steel material, for another example aluminum alloy materials, for another example aluminium
Magnesium alloy materials.The bottom of shell 100 is offered into sound hole 110.
Vibrating diaphragm component 200 is set to 100 bottom of shell and is oppositely arranged with sound hole 110 is entered, in the utility model embodiment,
Vibrating diaphragm component 200 includes the metalwork 210 set on 100 bottom of shell and the diaphragm 220 on metalwork 210, so that film
Piece 220 is electrically connected by metalwork 210 and shell 100.Since diaphragm 220 does not need storing charge, diaphragm 220 can be selected
High temperature resistant and frivolous PPS materials are conducive to the acoustical quality for improving electret microphone 10.
Insulation spacer 300 is set on the diaphragm 220 of vibrating diaphragm component 200, and back pole plate 400 is set on insulation spacer 300.Insulation
Gasket 300 plays the role of the diaphragm 220 and 400 electrical isolation of back pole plate of vibrating diaphragm component 200.Insulation spacer 300 is loop configuration,
The middle part of insulation spacer 300 forms air gap.
Outer wiring board 600 is set to the top open part of shell 100, and interior wiring board 500 is set to 100 inside of shell and positioned at the back of the body
On pole plate 400, interior wiring board 500 is configured to electrical connection back pole plate 400 and outer wiring board 600.
In the utility model embodiment, two surfaces of interior wiring board 500 are respectively equipped with electrically to be connected with outer wiring board 600
The upper firing point 510 connect and the lower firing point 520 being electrically connected with back pole plate 400, i.e., above firing point 510 is formed in interior wiring board
500 upper surface, lower firing point 520 are formed in the lower surface of interior wiring board 500.Upper firing point 510 and lower firing point 520 are electrical
Connection, upper firing point 510 and lower firing point 520 be an integral molding structure, and upper firing point 510 and lower firing point 520 can also be through
It is electrically connected by the conducting wire of interior wiring board 500.
In the utility model embodiment, upper firing point 510 is welded with outer wiring board 600, lower firing point 520 and back pole plate
400 welding.Specifically, lower firing point 520 and back pole plate 400 can be welded using surface mounting technology.In other embodiment
In, upper firing point 510 can also be with the contact pads on outer wiring board 600 to realize electrical connection, similarly, lower firing point 520
It can also be contacted with back pole plate 400 to realize electrical connection.
In the utility model embodiment, interior wiring board 500 is loop configuration, to form internal sound chamber 530.Outer wiring board
600 lower surface is equipped with electronic component, and electronic component stretches into inside shell 100.Specifically, electronic component stretches into inside
Sound chamber 530 effectively reduces the whole height of electret microphone 10, is advantageously implemented volume miniaturization.
Electronic component may include：IC chip 610, resistance 620 and capacitance 630, IC chip 610 are logical
It crosses resistance 620 and the supply terminals 640 of the upper surface of outer wiring board 600 is electrically connected, IC chip 610 passes through capacitance 630
It is electrically connected with the output point 650 of the upper surface of outer wiring board 600.The upper surface of outer wiring board 600 is also provided at least one
A earth point 660.Since the upper surface of outer wiring board 600 is formed and the general supply terminals 640 of MEMS microphone, output point 650
And earth point 660 so that electret microphone 10 can replace MEMS microphone to use, and reduce cost.
In the utility model embodiment, electret microphone 10 is cuboid structure, in other embodiments, electret
Microphone 10 is cylindrical structure.Using the electret microphone 10 of cuboid structure solve rectangular diaphragm 220 stretch tight film when
The problem of power consistency difference.
In practical applications, first by vibrating diaphragm component 200, insulation spacer 300, welded together using surface mounting technology
Back pole plate 400 and interior wiring board 500 are packed into shell 100, recycle Reflow Soldering welding technique by electronic component, interior wiring board
500 are welded on outer wiring board 600, to form electret microphone 10.Compared to MEMS microphone using binding technique anti-
Vibration performance, anti-dropping capability, anti-air blowing test performance improve a lot.
A kind of electret microphone 10 that the utility model embodiment provides, by being contained in 100 inside of shell and being set to
400 storing charge of back pole plate on vibrating diaphragm component 200, without the concern for the ability of 200 storing charge of vibrating diaphragm component, vibrating diaphragm component
The material that 200 diaphragm 220 can select acoustic characteristic good promotes acoustical quality；In addition, electrically being connected by interior wiring board 500
Back pole plate 400 and outer wiring board 600 are connect, sensitivity and stability are improved.Electret microphone 10 can replace MEMS microphone, solution
The acoustic pressure limitation of MEMS microphone of having determined itself, the higher problem of cost.
Finally it should be noted that above example is only to illustrate the technical solution of the utility model, rather than to this reality
With the limitation of novel protected range, although being explained in detail to the utility model with reference to preferred embodiment, this field it is general
Lead to it will be appreciated by the skilled person that can be modified or replaced equivalently to the technical solution of the utility model, without departing from this
The spirit and scope of utility model technical solution.
Claims (10)
1. a kind of electret microphone, which is characterized in that including：
Shell, bottom are offered into sound hole；
Vibrating diaphragm component, set on the outer casing bottom and with it is described enter sound hole be oppositely arranged；
Insulation spacer is set on the vibrating diaphragm component；
Back pole plate is set on the insulation spacer；
Interior wiring board and outer wiring board, the outer wiring board are set to the top open part of the shell, and the interior wiring board is set to
The enclosure and on the back pole plate, the interior wiring board are configured to be electrically connected the back pole plate and described outer
Wiring board.
2. electret microphone according to claim 1, which is characterized in that the vibrating diaphragm component includes being set to the shell
The metalwork of bottom and the diaphragm on the metalwork.
3. electret microphone according to claim 1, which is characterized in that two surfaces of the interior wiring board are set respectively
Have and the upper firing point of the outer wiring board electrical connection and the lower firing point being electrically connected with the back pole plate, the upper conducting
Point and the lower firing point electrical connection.
4. electret microphone according to claim 3, which is characterized in that the upper firing point and the lower firing point are
Integrated formed structure.
5. electret microphone according to claim 3, which is characterized in that the upper firing point is welded with the outer wiring board
It connects, the lower firing point is welded with the back pole plate.
6. electret microphone according to claim 5, which is characterized in that utilize surface mounting technology by the lower conducting
Point is welded with the back pole plate.
7. electret microphone according to claim 1, which is characterized in that the interior wiring board is loop configuration, with shape
At internal sound chamber.
8. electret microphone according to claim 7, which is characterized in that the lower surface of the outer wiring board is equipped with electronics
Component, the electronic component stretch into the enclosure.
9. electret microphone according to claim 8, which is characterized in that the electronic component includes ic core
Piece, resistance and capacitance, the IC chip are electrical by the resistance and the supply terminals of the upper surface of the outer wiring board
Connection, the IC chip are electrically connected by the capacitance and the output point of the upper surface of the outer wiring board.
10. according to the electret microphone described in any one of claim 1-9, which is characterized in that the electret is transaudient
Device is cuboid structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820278902.5U CN207939732U (en) | 2018-02-28 | 2018-02-28 | Electret microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820278902.5U CN207939732U (en) | 2018-02-28 | 2018-02-28 | Electret microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207939732U true CN207939732U (en) | 2018-10-02 |
Family
ID=63653334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820278902.5U Active CN207939732U (en) | 2018-02-28 | 2018-02-28 | Electret microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207939732U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156564A (en) * | 2018-02-28 | 2018-06-12 | 深圳捷力泰科技开发有限公司 | Electret microphone |
| CN109547907A (en) * | 2019-01-23 | 2019-03-29 | 东莞泉声电子有限公司 | Lesser electret capacitor microphone of noise coefficient and preparation method thereof |
-
2018
- 2018-02-28 CN CN201820278902.5U patent/CN207939732U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156564A (en) * | 2018-02-28 | 2018-06-12 | 深圳捷力泰科技开发有限公司 | Electret microphone |
| CN109547907A (en) * | 2019-01-23 | 2019-03-29 | 东莞泉声电子有限公司 | Lesser electret capacitor microphone of noise coefficient and preparation method thereof |
| CN109547907B (en) * | 2019-01-23 | 2024-01-05 | 东莞泉声电子有限公司 | Electret capacitor microphone and manufacturing method thereof |
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