WO2023116864A1

WO2023116864A1 - Bone voiceprint sensor

Info

Publication number: WO2023116864A1
Application number: PCT/CN2022/141274
Authority: WO
Inventors: 孙延娥; 端木鲁玉; 田峻瑜
Original assignee: 歌尔微电子股份有限公司
Priority date: 2021-12-24
Filing date: 2022-12-23
Publication date: 2023-06-29
Also published as: CN114401478A; CN114401478B

Abstract

A bone voiceprint sensor, comprising a housing, a PCB and a built-in assembly. A closed cavity is formed between the housing and the PCB. The built-in assembly is arranged in the closed cavity. The built-in assembly comprises a base, a vibration assembly and a microphone assembly. The base is arranged on the PCB. The vibration assembly and the microphone assembly are arranged on the base. A vibration cavity is formed between the base, the vibration assembly, the microphone assembly and the PCB. The vibration assembly senses an external vibration signal and drives the airflow in the vibration cavity to change, and the microphone assembly senses the change of the airflow in the vibration cavity so as to convert the vibration signal into an electric signal.

Description

A bone voiceprint sensor

This disclosure claims the priority of the Chinese patent application with the application number 202111602991.7 and the application name “A Bone Voiceprint Sensor” filed with the China Patent Office on December 24, 2021, the entire contents of which are incorporated in this disclosure by reference.

technical field

The present disclosure relates to a bone voiceprint sensor.

Background technique

The current bone voiceprint sensor usually includes two parts, a vibrating component and a microphone component, and the vibrating component is bonded to the microphone component by glue. Among them, the vibration component is used to sense external vibration signals; the microphone component is used to convert airflow changes generated during vibration into electrical signals, so as to express external vibration signals.

However, the structure design of the current bone voiceprint sensor is unreasonable, the process is complicated, and the volume is large, which is not conducive to the miniaturization design of the bone voiceprint sensor.

Contents of the invention

An object of the embodiments of the present disclosure is to provide a new technical solution for a bone voiceprint sensor.

According to an aspect of an embodiment of the present disclosure, a bone voiceprint sensor is provided, including:

The shell and the PCB board, a closed cavity is formed between the shell and the PCB board;

A built-in component, the built-in component is arranged in the airtight cavity, the built-in component includes a base, a vibrating component and a microphone component, the base is set on the PCB, the vibrating component and the microphone component are respectively set on the On the base, a vibration cavity is formed between the base, the vibration assembly, the microphone assembly, and the PCB board;

The vibration component senses external vibration signals and drives the airflow in the vibration cavity to change, and the microphone component senses the change of the airflow in the vibration cavity to convert the vibration signals into electrical signals.

Optionally, the vibrating component includes a vibrating membrane and a vibrating mass;

The base is provided with a first through hole, the diaphragm is fixed on the base and covers the first through hole; the vibrating block is disposed on a side of the diaphragm close to the PCB board.

Optionally, a groove is provided at a position of the PCB board corresponding to the vibrating mass.

Optionally, the base includes a first support platform and a second support platform; the height of the first support platform is greater than the height of the second support platform;

forming a first through hole on the first support platform, the diaphragm is fixed on the first support platform and covers the first through hole;

The microphone assembly is fixed on the second supporting platform.

Optionally, the built-in component further includes a baffle, the baffle is arranged on a side of the first support table close to the PCB board and extends to the PCB board, and the baffle plate vibrates the The chamber is divided into a first chamber corresponding to the vibration assembly and a second chamber corresponding to the microphone assembly;

A third through hole communicating the first chamber and the second chamber is provided on the separator.

Optionally, the microphone assembly includes a MEMES chip, and the MEMES chip is disposed on a side of the base away from the PCB board;

A second through hole is provided on the base, and the second through hole communicates with the MEMES chip and the vibration cavity.

Optionally, the vibration component further includes an ASIC chip, the ASIC chip is on a side of the base away from the PCB board, and the MEMS chip is electrically connected to the ASIC chip.

Optionally, the MEMS chip and the ASIC chip are arranged side by side, and the MEMS chip is in contact with the ASIC chip.

Optionally, the ASIC chip is connected to the PCB board through a gold wire.

Optionally, the housing is provided with a pressure relief hole.

A technical effect of the embodiments of the present disclosure lies in:

In the embodiment of the present disclosure, the built-in component is composed of the base, the vibrating component and the microphone component, and is arranged in a closed cavity formed by the casing and the PCB board. The packaging method is relatively simple, which is conducive to improving packaging efficiency and saving packaging cost.

Moreover, the bone voiceprint sensor in the embodiment of the present disclosure has a very reasonable structural design. The vibration component and the microphone component share a vibration cavity, which makes full use of the space inside the bone voiceprint sensor, which is beneficial to reduce the volume of the bone voiceprint sensor. It is convenient for the miniaturization design of the bone voiceprint sensor.

Other features of the present disclosure and advantages thereof will become apparent through the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate the embodiments of the disclosure and together with the description serve to explain the principles of the disclosure.

FIG. 1 is a schematic structural diagram of a first implementation of a bone voiceprint sensor provided by an embodiment of the present disclosure;

FIG. 2 is a schematic structural diagram of a second implementation of a bone voiceprint sensor provided by an embodiment of the present disclosure;

Fig. 3 is a schematic structural diagram of a third implementation manner of a bone voiceprint sensor provided by an embodiment of the present disclosure.

In the figure: 1, shell; 101, airtight chamber; 102, pressure relief hole; 103, first chamber; 104, second chamber; 105, vibration chamber; 2, PCB board; 21, groove; 31, base ; 311, the first support platform; 3111, the first through hole; 3112, the second through hole; 312, the second support platform; 32, the vibration assembly; 321, the diaphragm; 322, the vibration block; 33, the microphone assembly; 331 . MEMES chip; 332. ASIC chip; 34. partition; 341. third through hole; 4. gold wire.

Detailed ways

Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present disclosure unless specifically stated otherwise.

Embodiments of the present disclosure will be described in detail below, examples of which are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present disclosure and should not be construed as limiting the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present disclosure.

The features of the terms "first" and "second" in the description and claims of the present disclosure may explicitly or implicitly include one or more of these features. In the description of the present disclosure, unless otherwise specified, "plurality" means two or more. In addition, "and/or" in the specification and claims means at least one of the connected objects, and the character "/" generally means that the related objects are an "or" relationship.

In describing the present disclosure, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientations or positional relationships indicated by "radial", "circumferential", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying the referred devices or elements Must be in a particular orientation, constructed, and operate in a particular orientation, and thus should not be construed as limiting on the present disclosure.

In the description of the present disclosure, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present disclosure in specific situations.

As shown in Figures 1 to 3, the embodiments of the present disclosure provide a bone voiceprint sensor, which uses the slight vibration of the head and neck bones caused by human speech to collect sound signals and convert them into electrical signals. signal. Because it is different from traditional microphones that collect sound through air conduction, it can transmit high-definition sound in a very noisy environment, and the transmission accuracy is high.

Specifically, referring to FIG. 1, the bone voiceprint sensor includes a housing 1, a PCB board 2, and built-in components; a closed cavity 101 is formed between the housing 1 and the PCB board 2, and the cavity is used to house the built-in components. The shell 1 can better protect the built-in components.

More specifically, the built-in components are arranged in the airtight cavity 101, and the built-in components include a base 31, a vibrating component 32 and a microphone component 33, wherein the base 31, the vibrating component 32 and the microphone component 33 can be Assemble the bone voiceprint sensor to form an overall structure first, then fix the overall structure on the PCB board 2, and then assemble the shell on the PCB board 2, which greatly simplifies the packaging method of the bone voiceprint sensor and improves the packaging efficiency , reducing packaging cost.

In a specific embodiment, the vibrating component 32 and the base 31 are integrally formed, and the two are assembled together as one material. The advantages of such packaging, on the one hand, make full use of the length and width dimensions of the airtight cavity 101 of the bone voiceprint sensor, and on the other hand, effectively reduce the height of the bone voiceprint sensor. At the same time, the base 31 can provide a platform for mounting the MEMS chip of the microphone assembly 33 and the ASIC chip 332 , facilitating the mounting of the MEMS chip and the ASIC chip 332 .

For example, only a corresponding soldering ring needs to be designed on the PCB 2, and the soldering of the built-in components can be easily realized through solder paste or silver paste. The advantage of using solder paste or silver paste is that on the one hand, it can improve the soldering strength, and on the other hand, it can ground the built-in components to reduce static electricity or other performance risks. Of course, when not grounded, it can also be bonded with glue, so as to facilitate the packaging of the bone voiceprint sensor.

In this embodiment, the base 31 is arranged on the PCB board 2, the vibration assembly 32 and the microphone assembly 33 are respectively arranged on the base 31, the base 31 is used to support the vibration assembly 32 and the microphone assembly 33, At the same time, it can simplify the arrangement of the microphone component 33 and the vibration component 32 in the bone voiceprint sensor. A vibration chamber 105 is formed between the base 31 , the vibration assembly 32 , the microphone assembly 33 , and the PCB board 2 . The vibration assembly 32 can compress the vibration chamber 105 when vibrating, so that the airflow in the vibration chamber 105 can change the sound.

In the embodiment of the present disclosure, the vibration component 32 senses the external vibration signal and drives the airflow in the vibration cavity 105 to change, and the microphone component 33 senses the change of the airflow in the vibration cavity 105 to convert the vibration signal into electric signal. Wherein, the vibration component 32 and the microphone component 33 share the same vibration cavity 105, thereby making full use of the internal space of the bone voiceprint sensor, which is beneficial to reduce the volume of the bone voiceprint sensor. Simultaneously, vibrating assembly 32 and microphone assembly 33 share the same vibrating chamber 105, and vibrating assembly 32 vibrates in vibrating chamber 105; The airflow change in the vibrating chamber 105 that microphone assembly 33 detects has improved the precision that microphone assembly 33 detects, thereby facilitates Accurately convert vibration signals into electrical signals.

In the embodiment of the present disclosure, the built-in components are composed of the base 31, the vibration component 32 and the microphone component 33 and are arranged in the airtight cavity 101 formed by the shell 1 and the PCB board 2. The packaging method is relatively simple, which is conducive to improving the packaging efficiency and saving packaging. cost.

Moreover, the bone voiceprint sensor in the embodiment of the present disclosure has a very reasonable structural design. The vibration component 32 and the microphone component 33 share a vibration cavity 105, which makes full use of the space inside the bone voiceprint sensor, which is beneficial to reduce the size of the bone voiceprint sensor. The volume is convenient for the miniaturization design of the bone voiceprint sensor.

Optionally, referring to FIG. 1 , the vibration assembly 32 includes a diaphragm 321 and a vibration mass 322;

The base 31 is provided with a first through hole 3111, the diaphragm 321 is fixed on the base 31 and covers the first through hole 3111; One side of the PCB board 2.

In the above embodiments, the diaphragm 321 covers the first through hole 3111, and the vibrating block 322 is provided on the side of the diaphragm 321 close to the PCB board 2, thereby helping to improve the vibration amplitude of the vibrating assembly 32, and thus better Ground drives the airflow in the driving chamber to change the sound, so that the microphone assembly 33 converts the vibration signal into an acoustic signal.

In addition, the MEMS chips in the vibration component 32 and the microphone component 33 share a vibration cavity 105 . When the bone voiceprint sensor feels external vibrations, the mass will move relative to each other, thereby compressing the air in the vibration cavity 105, and then the MEMS chip senses the fluctuation of the air in the vibration cavity 105 through the second through hole 3112 and outputs an electrical signal . The vibration component 32 and the MEMS chip share the same vibration cavity 105, and only need to open a third through hole 341 on the base 31 to transmit the vibration signal felt by the vibration component 32 to the MEMS chip, without the need for traditional bone voiceprint The product also makes two airtight cavities 101, and there is no need to punch holes in the mass block to balance the airflow in the product, so as to prevent the bone voiceprint product from bursting during reflow. Therefore, the bone voiceprint sensor provided by the present disclosure saves internal space. At the same time, the processing difficulty of related materials of the bone voiceprint sensor is reduced.

Preferably, the vibrating component 32 is located on a side of the base 31 close to the PCB 2 , and the microphone component 33 is located on a side of the base 31 away from the PCB 2 . The vibration assembly 32 and the microphone assembly 33 are respectively located on opposite sides of the base 31, on the one hand, it helps to fix the vibration assembly 32 and the microphone assembly 33 on the base 31, and on the other hand, it helps to make full use of the structure of the base 31 surface, which helps to further optimize the structure of the bone voiceprint sensor, thereby further reducing the volume of the bone voiceprint sensor.

Optionally, referring to FIG. 1 , a groove 21 is provided on the PCB board 2 at a position corresponding to the vibrating mass 322 .

In the above embodiment, the groove 21 increases the vibration space of the mass, so that the mass and the diaphragm 321 can better vibrate in the vibration cavity 105, so that the airflow in the vibration cavity 105 can be better driven to change, It helps to improve the accuracy of the microphone assembly 33 in sensing airflow changes.

Further, the groove 21 can be designed as a cuboid structure, and its width, length, and height can be designed according to the size of the vibrating mass 322 and the performance requirements of the bone voiceprint sensor. Certainly, the shape of the groove 21 is not limited to a cuboid, and may also be other shapes, such as an ellipsoid.

Optionally, referring to FIG. 2 , the base 31 includes a first support platform 311 and a second support platform 312 ; the height of the first support platform 311 is greater than the height of the second support platform 312 . A first through hole 3111 is formed on the first supporting platform 311, the diaphragm 321 is fixed on the first supporting platform 311 and covers the first through hole 3111;

The microphone assembly 33 is fixed on the second supporting platform 312 .

In the above-mentioned embodiment, since the microphone assembly 33 is arranged on the side away from the PCD board of the second supporting platform 312, and the mass block is located on the side of the diaphragm 321 close to the PCB board 2, the first supporting platform 311 and the second supporting platform 311 The supporting platform 312 is set with a certain height difference, which helps to further reduce the height of the built-in components, thereby further reducing the volume of the bone voiceprint sensor.

Optionally, referring to FIG. 3 , the built-in assembly further includes a partition 34, and the partition 34 is arranged on a side of the first supporting platform 311 close to the PCB 2 and extends to the PCB 2 , the partition 34 divides the vibration chamber 105 into a first chamber 103 corresponding to the vibration assembly 32 and a second chamber 104 corresponding to the microphone assembly 33;

The partition plate 34 is provided with a third through hole 341 communicating with the first chamber 103 and the second chamber 104 .

In the above-mentioned embodiment, in order to improve the strength of the built-in components to meet the stress suffered when the MEMS chip and the ASIC chip 332 are mounted, a partition 34 is arranged on the built-in component to ensure the structural strength of the bone voiceprint sensor and improve the The overall stability of the bone voiceprint sensor. At the same time, a third through hole 341 is opened on the partition 34, so that the vibration signal can be better transmitted to the MEMS chip.

Optionally, the microphone assembly 33 includes a MEMES chip 331, and the MEMES chip 331 is disposed on a side of the base 31 away from the PCB board 2;

The base 31 is provided with a second through hole 3112 , and the second through hole 3112 communicates with the MEMES chip 331 and the vibration cavity 105 .

In the above embodiment, the second through hole 3112 can better transmit the vibration signal of the vibration component 32 to the microphone component 33 , which is beneficial for the microphone component 33 to convert the vibration signal into an electrical signal accurately and quickly.

Optionally, the vibrating component 32 further includes an ASIC chip 332 , the ASIC chip 332 is on the side of the base 31 away from the PCB 2 , and the MEMS chip is electrically connected to the ASIC chip 332 . The capacitance of the MEMS chip will change accordingly with the change of the incoming sound, and then use the ASIC chip 332 to process and output the changed capacitance signal so as to realize the sound pickup. This enables the microphone assembly 33 to better convert the vibration signal into an electrical signal and output it.

Optionally, the MEMS chip and the ASIC chip 332 are arranged side by side, and the MEMS chip is in contact with the ASIC chip 332 . This helps to further optimize the structural design in the bone voiceprint sensor, facilitates quickly setting the ASIC chip 332 and the MEMS chip on the base 31, and can further reduce the space occupied by the microphone component 33 on the inside of the bone voiceprint sensor. It is beneficial to further reduce the volume of the bone voiceprint sensor.

Optionally, the ASIC chip 332 is connected to the PCB board 2 through a gold wire 4 . This makes the electrical connection between the ASIC chip 332 and the PCB board 2 very stable, and helps realize the signal transmission between the microphone assembly 33 and the PCB board 2 .

Optionally, the housing 1 is provided with a pressure relief hole 102 . The pressure relief hole 102 helps to better balance the air pressure in the airtight cavity 101, effectively prevents the shell of the bone voiceprint sensor from bursting, and improves the safety of the bone voiceprint sensor. The bone voiceprint sensor provided by the embodiments of the present disclosure has a reasonable structural design and a simple packaging method, which not only improves the packaging efficiency, but also facilitates the miniaturization design of the bone voiceprint sensor.

Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are for illustration only, and not intended to limit the scope of the present disclosure. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

A bone voiceprint sensor, comprising:

A housing (1) and a PCB board (2), wherein a closed cavity (101) is formed between the housing (1) and the PCB board (2);

A built-in component, the built-in component is arranged in the airtight cavity (101), the built-in component includes a base (31), a vibrating component (32) and a microphone component (33), and the base (31) is set on the PCB board (2), the vibration assembly (32) and the microphone assembly (33) are respectively arranged on the base (31), the base (31), the vibration assembly (32), the microphone assembly (33 ), forming a vibration cavity (105) between the PCB boards (2);

The vibration component (32) senses the external vibration signal and drives the airflow in the vibration cavity (105) to change, and the microphone component (33) senses the change of the airflow in the vibration cavity (105) to convert the vibration signal for electrical signals.
The bone voiceprint sensor according to claim 1, wherein the vibration assembly (32) comprises a diaphragm (321) and a vibration mass (322);

The base (31) is provided with a first through hole (3111), the diaphragm (321) is fixed on the base (31) and covers the first through hole (3111); the vibration block ( 322) is arranged on a side of the diaphragm (321) close to the PCB board (2).
The bone voiceprint sensor according to claim 1 or 2, wherein a groove (21) is provided on the PCB board (2) at a position corresponding to the vibrating mass (322).
The bone voiceprint sensor according to any one of claims 1-3, wherein the base (31) comprises a first support platform (311) and a second support platform (312); the first support platform (311 ) is greater than the height of the second support platform (312);

A first through hole (3111) is formed on the first support platform (311), the diaphragm (321) is fixed to the first support platform (311) and covers the first through hole (3111);

The microphone assembly (33) is fixed on the second supporting platform (312).
The bone voiceprint sensor according to any one of claims 1-4, wherein the built-in component further comprises a partition (34), and the partition (34) is arranged on the first supporting platform (311) Close to one side of the PCB board (2) and extend to the PCB board (2), the partition plate (34) divides the vibration cavity (105) into a first corresponding to the vibration assembly (32). a chamber (103) and a second chamber (104) corresponding to the microphone assembly (33);

The partition plate (34) is provided with a third through hole (341) communicating with the first chamber (103) and the second chamber (104).
The bone voiceprint sensor according to any one of claims 1-5, wherein the microphone assembly (33) includes a MEMES chip (331), and the MEMES chip (331) is arranged at a distance from the base (31). One side of the PCB board (2);

The base (31) is provided with a second through hole (3112), and the second through hole (3112) communicates with the MEMES chip (331) and the vibration cavity (105).
The bone voiceprint sensor according to any one of claims 1-6, wherein the vibration component (32) further includes an ASIC chip (332), and the ASIC chip (332) is far away from the base (31). One side of the PCB board (2), and the MEMS chip and the ASIC chip (332) are electrically connected.
The bone voiceprint sensor according to any one of claims 1-7, wherein the MEMS chip and the ASIC chip (332) are arranged side by side, and the MEMS chip is in contact with the ASIC chip (332).
The bone voiceprint sensor according to any one of claims 1-8, wherein the ASIC chip (332) is connected to the PCB board (2) through a gold wire (4).
The bone voiceprint sensor according to any one of claims 1-9, wherein a pressure relief hole (102) is provided on the casing (1).