CN103762282A - LED fluorescent film manufacturing method - Google Patents
LED fluorescent film manufacturing method Download PDFInfo
- Publication number
- CN103762282A CN103762282A CN201110459151.XA CN201110459151A CN103762282A CN 103762282 A CN103762282 A CN 103762282A CN 201110459151 A CN201110459151 A CN 201110459151A CN 103762282 A CN103762282 A CN 103762282A
- Authority
- CN
- China
- Prior art keywords
- led
- fluorescence membrane
- fluorescence
- manufacture method
- fluorescent film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED fluorescent film manufacturing method. According to the LED fluorescent film manufacturing method, a fluorescent film is attached to an LED device through adopting a sol-gel method or a spraying method; organic components which are not led in a preparation process are removed from an obtained determined fluorescent film; and therefore, the physicochemical properties of the fluorescent film can be improved, and requirements of a follow-up packaging process, for the physicochemical properties of a fluorescent powder layer, can be better satisfied. With the fluorescent film adopted, the heat dissipation of an LED can be improved, and the service life of the LED device can be prolonged; unevenness of the concentration of fluorescent powder in silica gel or resin can be avoided, and the improvement of the consistency of LED products can be benefitted; and at the same time, the fluorescent film has favorable flexibility and mechanical strength, and the surface-mount process of the fluorescent film is simple, which is greatly beneficial to the batch production of planar LED devices.
Description
Technical field
The present invention relates to field of photoelectric technology, be specifically related to a kind of method of preparing fluorescence fluorescence membrane at LED chip light output surface.
Background technology
In recent years, no matter be inorganic or organic luminescent device (LED/OLED), the great attention white light LEDs generation white light that white light LED part and the application study in illumination association area thereof have all been subject to academic and industrial circle mainly contains two approach: the first is by three kinds of LED combination results white lights of red, green, blue; The second is to be mixed to form white light with LED deexcitation light conversion phosphor, and this approach has two kinds of implementations, and to be wherein blue-light LED chip arrange in pairs or groups to realize white light emission with the yellow fluorescent powder such as (as YAG:Ce3+) to the method for comparative maturity.
For the white light LEDs of photic conversion, the structure of fluorescent coating, characteristic have vital impact to the performance of device.
Current technique is that fluorescent powder grain is mixed with transparent colloid (as epoxy glue, silica gel etc.), by a glue, applies the mixture layer of fluorescent material and colloid on LED chip.Concrete technology method is: the first step is fixed on LED wafer on the support with rim of a cup, gold thread bonding LED wafer both positive and negative polarity for second step, the 3rd step is mixed with fluorescent material with silica gel or epoxy resin, and the 4th step takes fluorescent material mixed liquor to carry out a glue to point gum machine.
But the phosphor powder layer structure obtaining like this has several shortcomings: 1, fluorescent material mixed liquor can be subject to the impact of carrier cup mouth-shaped and produce yellow circle or blue circle phenomenon; 2, the mode of selecting glue is by LED chip parcel, so the method that there is no in LED light-emitting area reaches even after using gravity allow to include the mixed liquor of fluorescent material and colloid to flow; Above-mentioned shortcoming all can cause the lack of homogeneity of LED bright dipping.3, the phosphor powder layer poor repeatability between device, has greatly restricted mass production and rate of finished products.
Summary of the invention
Problem to be solved by this invention is how a kind of LED preparation of phosphor layer method is provided, the method can overcome defect of the prior art, the physicochemical properties of phosphor powder layer have been improved simultaneously, can meet better the requirement of follow-up packaging technology to phosphor powder layer physicochemical characteristic, be conducive to realize efficient fluorescent material conversion hysteria LED device.
In order to address the above problem, the technical solution used in the present invention is:
A manufacture method for LED fluorescence membrane, is characterized in that: comprise the following steps:
(1), high-molecular organic material and the fluorescence powder that contains rare earth element are made to presoma, under liquid phase, above-mentioned raw materials is evenly mixed, and be hydrolyzed, condensation chemical reaction, in solution, form stable vitreosol system, colloidal sol is slowly polymerization through between ageing micelle, forms the fluorescence gel of three-dimensional space network structure.
(2), the fluorescence gel preparing is attached on thin-film material, and be dried, solidify and make fluorescence membrane.
(3), fluorescence membrane is peeled off to the transparent fluorescence membrane that obtains molecule and even nanometer substructure and there is certain pliability and mechanical strength.
The manufacture method of aforesaid a kind of LED fluorescence membrane, is characterized in that: the colloidal dispersion with fluid characteristics used in step (1) comprises: the one or more combination in PMMA, PVC, silica gel or other high-molecular organic material; The size of its dispersed particle is between 1～1000nm.
The manufacture method of aforesaid a kind of LED fluorescence membrane, is characterized in that: at phosphor material powder described in step (1), be containing strontium, and cerium, the oxide of uranium rare earth or nitride
The manufacture method of aforesaid a kind of LED fluorescence membrane, is characterized in that: in step (2), the fluorescence gel preparing is attached on thin-film material by the method for calendering, spraying or spin coating.
The manufacture method of aforesaid a kind of LED fluorescence membrane, is characterized in that: at thin-film material described in step (2), be the one of PET, PVC, PVE material, and thin-film material allows, at low temperatures together with fluorescence gel oven dry, not occur decomposing phenomenon.
The manufacture method of aforesaid a kind of LED fluorescence membrane, it is characterized in that: in step (2), by the method for heating, be dried, solidify, baking temperature is 100 ℃～140 ℃, or adopts ultra-violet curing method, in fluorescence membrane, mix ultra-violet curing agent, be directly cured.
A manufacture method for LED fluorescence membrane, is characterized in that: comprise the following steps:
(1), fluorescent material coating processed: by the particle that comprises fluorescent material and colloid, mix with the ratio of colloid 1%-10% in fluorescent material, dispersed, forming phosphor gel dispersion is fluorescent material coating;
(2), fluorescent material coating that step (1) is obtained utilizes spray gun or dish formula atomizer, by means of pressure or centrifugal force, is dispersed into even and fine droplet, be applied on film surface; Or pattern is directly printed on film by the method for similar inkjet printing.
(3), by dry the fluorescence membrane having sprayed, curing.
The manufacture method of aforesaid a kind of LED fluorescence membrane, is characterized in that: in described step (2), the method for spraying is the one or more combinations such as aerial spraying, airless spraying, electrostatic spraying; Or adopt the technique of laser printing that fluorescent material coating is printed on thin-film material.
The manufacture method of aforesaid a kind of LED fluorescence membrane, is characterized in that: in step (3), with heating method be dried, solidify, baking temperature is 100 ℃～140 ℃, or adopt ultra-violet curing method, in fluorescence membrane, mix ultra-violet curing agent, be directly cured.
The invention has the beneficial effects as follows: the present invention directly covers the uniform fluorescence membrane of a layer thickness on LED chip surface; compared with traditional gluing process; due to eliminated fluorescent material in silica gel or the resin concentration not etc.; the consistency of favourable raising LED product; this method makes that the light-emitting uniformity of flat film is better, pliability good; the thickness of fluorescence membrane is easily controlled simultaneously, belongs to planarization technology, is applicable to the production of integrated scale.
The present invention has using value especially in the fluorescent material preparation of sections process of PCLED type white light LEDs, both can be applied on the LED chip of well cutting, meet the industrial technology requirement that current most LED encapsulates enterprise, also can be applied to (wafer is in wafer scale) before LED wafer cutting, after the surface coverage fluorescent material thin slice of LED chip group, carry out again chip cutting, encapsulation, there is very high repetitive operation and volume production consistency.
Accompanying drawing explanation
Fig. 1 is the process chart that the present invention makes LED fluorescence membrane.
Fig. 2 is the LED chip schematic diagram that the present invention covers fluorescence membrane.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in Figure 1, a kind of manufacture method of LED fluorescence membrane, comprises the following steps:
1, fluorescent material is mixed Ce aluminate with colloidal sol (as PMMA/PVA), evenly mix.
2, the fluorescence gel system and the deionized water that have an integument mix, and form the dispersion of stable fluorescent powder grain in PMMA/PVA.
3, the method for passing through calendering on extruder, obtains having certain thickness fluorescence membrane.
4, will have fluorescent powder film and put into air drying cabinet and heat and solidify, and keep a period of time, after the organic solvent volatilization in film, just cooling taking-up obtains fluorescence membrane.
5, by the method for machine cuts, obtain thering is the fluorescence membrane that certain size requires.
6, the fluorescence membrane preparing is directly overlayed on the LED device that die bond is good by the method for a glue or cold pad pasting under vacuum condition.
As shown in Figure 2, the present invention covers the LED device schematic diagram of fluorescence membrane, comprises LED chip 1, conducting wire 2, fluorescence membrane 3, pottery or plastic 4.Described each LED chip 1 interconnects by conducting wire 2, and the two ends that stretch out described conducting wire 2 are connected with outer electrode respectively, are coated with fluorescence membrane 3 on LED chip 1, in the arranged outside of fluorescence membrane 3, has pottery or plastic 4.
The manufacture process of a kind of fluorescence membrane of lower mask body:
Fluorescent material: LED gold-tinted fluorescent material Y6Al10O12,
LED white light glue: JS-03 white light special glue,
LED white light curing agent: Type B curing agent.
LED white light glue: LED white light curing agent: the weight ratio of fluorescent material is 1:1:(0.085～0.12) carry out condensation reaction, form the fluorescence gel of three-dimensional space network structure.Then 125 ℃-135 ℃ of curing temperatures, solidify and within 60 minutes, make fluorescence membrane, finally by the release agent demoulding, coating layer thickness: 50-200 μ m.
More than show and described basic principle of the present invention, principal character and advantage.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that in above-described embodiment and specification, describes just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (9)
1. a manufacture method for LED fluorescence membrane, is characterized in that: comprise the following steps:
(1), high-molecular organic material and the fluorescence powder that contains rare earth element are made to presoma, under liquid phase, above-mentioned raw materials is evenly mixed, and be hydrolyzed, condensation chemical reaction, in solution, form stable vitreosol system, colloidal sol is slowly polymerization through between ageing micelle, forms the fluorescence gel of three-dimensional space network structure;
(2), the fluorescence gel preparing is attached on thin-film material, and be dried, solidify and make fluorescence membrane;
(3), fluorescence membrane is peeled off to the transparent fluorescence membrane that obtains molecule and even nanometer substructure and there is certain pliability and mechanical strength.
2. the manufacture method of a kind of LED fluorescence membrane according to claim 1, is characterized in that: the colloidal dispersion with fluid characteristics used in step (1) comprises: the one or more combination in PMMA, PVC, silica gel or other high-molecular organic material; The size of its dispersed particle is between 1～1000nm.
3. the manufacture method of a kind of LED fluorescence membrane according to claim 2, is characterized in that: at phosphor material powder described in step (1), be containing strontium, and cerium, the oxide of uranium rare earth or nitride.
4. the manufacture method of a kind of LED fluorescence membrane according to claim 3, is characterized in that: in step (2), the fluorescence gel preparing is attached on thin-film material by the method for calendering, spraying or spin coating.
5. the manufacture method of a kind of LED fluorescence membrane according to claim 4, it is characterized in that: at thin-film material described in step (2), be the one of PET, PVC, PVE material, and thin-film material allows together with fluorescence gel, to dry at low temperatures, does not occur decomposing phenomenon.
6. the manufacture method of a kind of LED fluorescence membrane according to claim 5, it is characterized in that: in step (2), by the method for heating, be dried, solidify, baking temperature is 100 ℃～140 ℃, or adopt ultra-violet curing method, in fluorescence membrane, mix ultra-violet curing agent, be directly cured.
7. a manufacture method for LED fluorescence membrane, is characterized in that: comprise the following steps:
(1), fluorescent material coating processed: by the particle that comprises fluorescent material and colloid, mix with the ratio of colloid 1%-10% in fluorescent material, dispersed, forming phosphor gel dispersion is fluorescent material coating;
(2), fluorescent material coating that step (1) is obtained utilizes spray gun or dish formula atomizer, by means of pressure or centrifugal force, is dispersed into even and fine droplet, be applied on film surface; Or pattern is directly printed on film by the method for similar inkjet printing;
(3), by dry the fluorescence membrane having sprayed, curing.
8. the manufacture method of a kind of LED fluorescence membrane according to claim 7, is characterized in that: in described step (2), the method for spraying is the one or more combinations such as aerial spraying, airless spraying, electrostatic spraying; Or adopt the technique of laser printing that fluorescent material coating is printed on thin-film material.
9. the manufacture method of a kind of LED fluorescence membrane according to claim 8, it is characterized in that: in step (3), with heating method be dried, solidify, baking temperature is 100 ℃～140 ℃, or adopt ultra-violet curing method, in fluorescence membrane, mix ultra-violet curing agent, be directly cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110459151.XA CN103762282A (en) | 2011-12-31 | 2011-12-31 | LED fluorescent film manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110459151.XA CN103762282A (en) | 2011-12-31 | 2011-12-31 | LED fluorescent film manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103762282A true CN103762282A (en) | 2014-04-30 |
Family
ID=50529489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110459151.XA Pending CN103762282A (en) | 2011-12-31 | 2011-12-31 | LED fluorescent film manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103762282A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101526179A (en) * | 2009-04-20 | 2009-09-09 | 南京工业大学 | Pre-packaged LED illuminating lamp and manufacture method thereof |
| CN101740707A (en) * | 2009-12-11 | 2010-06-16 | 晶科电子（广州）有限公司 | Preformed fluorescent powder patch and method for encapsulating same and light emitting diode |
| CN101847681A (en) * | 2009-12-21 | 2010-09-29 | 深圳市成光兴实业发展有限公司 | White light LED fluorescent powder film layer manufactured by adopting spraying process and manufacture method |
-
2011
- 2011-12-31 CN CN201110459151.XA patent/CN103762282A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101526179A (en) * | 2009-04-20 | 2009-09-09 | 南京工业大学 | Pre-packaged LED illuminating lamp and manufacture method thereof |
| CN101740707A (en) * | 2009-12-11 | 2010-06-16 | 晶科电子（广州）有限公司 | Preformed fluorescent powder patch and method for encapsulating same and light emitting diode |
| CN101847681A (en) * | 2009-12-21 | 2010-09-29 | 深圳市成光兴实业发展有限公司 | White light LED fluorescent powder film layer manufactured by adopting spraying process and manufacture method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102723424B (en) | Method for preparing fluorescent wafer for LED (light-emitting diode) | |
| KR102139777B1 (en) | Phosphor in inorganic binder for led applications | |
| US9343613B2 (en) | Phosphor in inorganic binder for LED applications | |
| CN101740707B (en) | Preformed fluorescent powder patch and method for encapsulating same and light emitting diode | |
| CN102718492A (en) | Method for producing transparent ceramic fluorescence substrate used for LED | |
| CN102034917A (en) | Optical-semiconductor encapsulating material | |
| CN101123286A (en) | LED encapsulation structure and method | |
| CN102237475A (en) | LED wafer level fluorescent powder coating technology based on organic colloid | |
| CN106972092B (en) | A kind of quantum spot white light LED of high-luminous-efficiency and preparation method thereof | |
| CN107342348B (en) | A kind of preparation method of LED component | |
| CN103545428A (en) | White light LED | |
| TW201507209A (en) | Light emitting diode package structure and manufacturing method thereof | |
| CN106449625A (en) | Fluorescent-substrate-based inverted LED lamp filament and packaging process thereof | |
| CN108538975A (en) | A kind of preparation method of LED fluorescence membranes | |
| CN107808923B (en) | A kind of preparation method of the fluorescence membrane structure for LED | |
| CN107579146B (en) | A kind of preparation method of white light LEDs " hamburger " structure fluorescence membrane | |
| CN102107178A (en) | Fluorescent material coating method and substrate prepared by same | |
| CN102637810A (en) | LED (light-emitting diode) packaging structure and packaging molding method | |
| CN104465965B (en) | A kind of fluorescent powder film preparation method for white light LEDs wafer-level packaging | |
| CN106159060A (en) | A kind of LED packaging technology | |
| CN102891235A (en) | High-output low-attenuation white light LED (light emitting diode) and manufacturing method thereof | |
| CN104263304B (en) | A kind of photocuring potting compound and application process | |
| CN202712260U (en) | Plane structure white light led chip | |
| CN103762282A (en) | LED fluorescent film manufacturing method | |
| CN103094461A (en) | Optics wavelength conversion module, preparation method of optics wavelength conversion module and white light light-emitting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140430 |