CN103759472A - Micro heat exchanger with throttling function - Google Patents
Micro heat exchanger with throttling function Download PDFInfo
- Publication number
- CN103759472A CN103759472A CN201410044416.3A CN201410044416A CN103759472A CN 103759472 A CN103759472 A CN 103759472A CN 201410044416 A CN201410044416 A CN 201410044416A CN 103759472 A CN103759472 A CN 103759472A
- Authority
- CN
- China
- Prior art keywords
- cold
- producing medium
- plate
- fluid
- heat exchanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention provides a micro heat exchanger with a throttling function. The micro heat exchanger can achieve throttling and phase-change heat exchanging of refrigerating fluid simultaneously, can serve as an evaporator or a condenser and is a solid formed by laminating eight different kinds of etching plates in a certain sequence and welding the etching plates through vacuum diffusion welding. The micro heat exchanger comprises a fluid inlet/ outlet plate A, one or more fluid heat exchange plates B, one or more refrigerating fluid heat exchanger plates C, one or more fluid heat exchange plates D with refrigerating fluid collection cavities, one or more refrigerating fluid heat exchanger plates E with refrigerating fluid collection cavities, a refrigerating fluid heat exchanger plate F with refrigerating fluid micro throttling grooves and refrigerating fluid collection cavities and a blind plate G. Throttling evaporation of the refrigerating fluid is achieved through the micro throttling grooves etched in the refrigerating fluid heat exchanger plate F, and throttling elements such as capillary tubes are eliminated. The micro heat exchanger with the throttling function is compact in structure, small in size and capable of reducing volume and mass of the system when applied to a micro vapor compression refrigerating system.
Description
Technical field
The present invention relates to a kind of micro heat exchanger that can be used for miniature vapor compression type refrigerating system, can in single component, complete throttling and the phase-change heat-exchange of cold-producing medium, both can make evaporator duty, also can make condenser purposes, to realize the cooling of convection cell or heating.When the present invention is used for miniature vapor compression type refrigerating system, can effectively reduces volume and the quality of system, thereby make system compacter.
Background technology
The present invention relates to vacuum diffusion welding technology, laminated solid body manufacturing technology (vacuum diffusion welding of multilayer metal foil connects), photochemical etching technology, miniature steam compression type refrigerating technology and compact heat exchanger technology.
Vacuum diffusion welding is that (vacuum is not less than 10 under the condition of high vacuum
-2holder), the workpiece that will weld is placed between two pressing plates, applies high-pressure on pressing plate, workpiece is heated to not to the melt temperature higher than material simultaneously, and being incubated certain hour, the diffusion by the molecule on the surface of the work being in contact with one another or atom is by workpiece seam together.The advantage of vacuum diffusion welding is not need cored solder or solder flux, and two parts become as a whole completely after vacuum diffusion welding connects, and originally the place of two part contacts does not have the interface of phase, without any oxidative phenomena yet.Therefore can reprocess the part after welding, similarly be a single part of processing.Vacuum diffusion welding both can realize the welding between metal material of the same race, also can realize the welding between different metal materials, even can realize the welding between metal and ceramic material.
Laminated solid body manufacturing technology is to adopt multi-layered sheet or foil material, according to the requirement of two kinds of fluid heat transfers, designs and is processed into after different runners on thin plate, and multilayer stacks assembles and links together, thereby completes entity manufacture.Method of attachment between laminate has splicing, low temperature brazing or vacuum diffusion welding etc.The former is suitable for the laminated solid body manufacture that the materials such as paper, resin plate are done moulding, and the latter is suitable for the entity manufacture that metal is done moulding.By vacuum diffusion welding technology, multiple layer metal heat exchanger fin is linked together, can realize freely designing of runner between different metal plate, thereby create conditions for efficient, the compact heat exchanger of structure.The material that is applicable to being used as the vacuum diffusion welding of multilayer metal foil has stainless steel, titanium alloy and aluminum alloy flake etc.
Photochemical etching technology is to adopt photomechanical production technology to form photoetching offset plate figure in metal surface, then uses strong oxidizing property etchant solution, carves the technology of high accuracy (can be less than ± 10 μ m of error), complex figure on material.Photochemical etching is a kind of high-quality, precision component process technology cheaply, is particularly suitable for etching on sheet metal for the different fluid required runner that flows, and etch depth can be from tens microns to several millimeters.
Miniature vapor compression type refrigerating system is owing to having advantages of that refrigerating efficiency is high, the refrigerating capacity of unit volume is large, thereby can replace the thermoelectric cooling unit that efficiency is low, volume is heavy, for the point-to-point cooling occasion of many needs, as cooling in laser instrument, large power, electrically sub-element is cooling, high-power chip is cooling, portable body is cooling etc.The appearance of minisize refrigeration compressor makes that design volume is small and exquisite, the miniature vapor compression type refrigerating system of compact conformation becomes possibility, but only accomplishes that the microminiaturization of compressor is inadequate, also needs supporting microminiaturized heat exchanger.
Brazing plate type heat exchanger is a kind of compact heat exchanger, can effectively reduce the volume of system during for common refrigeration system, but the minimum heat exchange amount of current existing brazing plate type heat exchanger is also more than thousands of watts.The Miniature refrigerating device that only has several hectowatts for heat exchange amount, also not having at present can at the plate type heat exchanger of a few hectowatt magnitudes for supporting heat exchange amount.Braze welding type plate type heat exchanger generally adopts copper or nickel as soldering flux.The plate type heat exchanger that adopts copper to make soldering flux can not be applied to the cooling occasion of the laser instrument of copper ion sensitivity, and this is because the copper ion of soldering flux is water-soluble, is easily deposited in the micro-channel heat sink of laser instrument, thereby causes the obstruction of laser instrument cooling duct.Adopt nickel as copper ions not in the plate type heat exchanger of soldering flux, can be used for the cooling occasion of laser instrument, but nickel brazing plate type heat exchanger is withstand voltage but very little, is generally less than 1MPa.Because the pressure of conventional compressor refrigeration system is easy to surpass 1MPa, therefore adopt the plate type heat exchanger of nickel soldering very easily because the hypertonia of refrigeration system causes leakage.Because the plate of brazing plate type heat exchanger is by diel moulding, and diel is expensive, the construction cycle is long, so it is not suitable for carrying out customized processing for mini-refrigerator system.Visible, brazing plate type heat exchanger is not too applicable to mini-refrigerator system to be used, and is badly in need of a kind of micro heat exchanger novel, high-efficiency compact of exploitation.
In addition,, after having realized the microminiaturization of heat exchanger, the microminiaturization of supporting throttling arrangement is also a problem with it.The throttling arrangements such as the electric expansion valve using in conventional refrigeration system, heating power expansion valve and restricting orifice due to interface size and refrigerating capacity scope all excessive, be difficult to be used in conjunction with micro heat exchanger; Though capillary can be used in conjunction with miniature evaporimeter, but when adopting welding method that capillary is connected to micro heat exchanger, be difficult to operation, welding quality is difficult to guarantee, very easily causes capillary to stop up in welding process.
Summary of the invention
The object of the present invention is to provide a kind of throttling-heat-exchange integrated micro heat exchanger of compactness, the problem that volume is excessive, heat exchange amount is not mated and restricting element is difficult to welding existing in mini-refrigerator system time to solve existing heat exchanger applications.
The present invention is based on aforesaid photochemical etching technology, and the vacuum diffusion welding connection technology of layered metal thin slice is realized:
First by photochemical etching technique, on the sheet metals such as stainless steel or copper, etch respectively the runner for cold-producing medium and fluid heat transfer, and the runner that supplies cold-producing medium throttling.Then the multilayer metal foil that surface etching is had to cold-producing medium heat exchange runner, fluid heat transfer runner, a cold-producing medium throttling runner is lamination in certain sequence.Finally by vacuum diffusion welding technique, weld together, thereby make it to become the micro heat exchanger entity that carries cold-producing medium throttling function.
Beneficial effect of the present invention is mainly reflected in:
The present invention program can construct extremely compact micro heat exchanger, changes cold and can be as small as several watts to several hectowatts, thereby fill up current brazing plate type heat exchanger in the blank of less heat exchange weight range.Can effectively reduce volume and the quality of mini-refrigerator system, improve the portability of mini-refrigerator system.
Because the heat exchange plate of the micro heat exchanger forming based on laminated solid body Pervasion Weld Technology is very thin, between plate, thermal conduction resistance is less; Because utilizing photochemical etching technology, the fluid course on plate forms again, so the flexible arrangement of runner, can on plate, form the MCA with high heat transfer coefficient.The heat exchange efficiency of whole heat exchanger is very high, far above heat exchangers such as common bushing type, shell-tube types.
Due to the micro-channel having formed in photochemical etching process for cold-producing medium throttling, the throttling function of cold-producing medium can realize in the inside of micro heat exchanger, therefore having saved throttling arrangement is connected with the pipeline between heat exchanger, reduced the total length of refrigeration pipe, solder joint number and leakage point in whole refrigeration system are reduced, the layout of system pipeline is simpler, and whole mini-refrigerator system is more easily assembling also, has reduced the welding job amount of pipe fitting.
Can to separate out copper ion different from copper brazing plate type heat exchanger, micro heat exchanger provided by the invention, owing to not needing cored solder between heat exchange plate, can not produce foreign ion, thereby can be applicable to the ordinary copper brazing plate type heat exchanger cooling field of not applicable laser instrument.Compare micro heat exchanger provided by the invention withstand voltage higher, thereby better reliability with nickel brazing plate type heat exchanger.
Heat exchange plate in the present invention program can adopt various material, as heat exchange plate can be selected titanium alloy material and ceramic material, thereby makes the present invention can be used for the occasion that heat exchanging fluid is severe corrosive solution.Due to the plate unlike common plate type heat exchanger, need expensive diel moulding, thereby the present invention is more flexible in the selection of appearance and size and plate area, during small lot batch manufacture, cost is lower.
Accompanying drawing explanation
Fig. 1 is the structure composition of a specific embodiment of the present invention and the assemble sequence schematic diagram of each etching plate.
Fig. 2 is the runner schematic diagram that the fluid in micro heat exchanger enters/go out plate (front shroud).
Fig. 3 is the runner schematic diagram of the fluid heat transfer plate in micro heat exchanger.
Fig. 4 is the runner schematic diagram of the cold-producing medium heat exchange plate in micro heat exchanger.
Fig. 5 is the runner schematic diagram of the fluid heat transfer plate with cold-producing medium manifold in micro heat exchanger.
Fig. 6 is the runner schematic diagram of the cold-producing medium heat exchange plate with cold-producing medium manifold in micro heat exchanger.
Fig. 7 is the runner schematic diagram of the cold-producing medium heat exchange plate with cold-producing medium micro-throttling conduit and cold-producing medium manifold in micro heat exchanger.
Fig. 8 is the structural representation of the outermost blind plate sheet (back shroud) in micro heat exchanger.
Fig. 9 is by the outward appearance of formed entity after vacuum diffusion welding method seam by each etching plate shown in Fig. 1.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, technical scheme of the present invention is described.In the following description, cold-producing medium refers to the refrigeration working medium using in vapor compression type refrigerating system, as R22, and R134a, R407c, R410a etc.; And fluid refers to the another kind of working medium of carrying out heat exchange with described cold-producing medium, as water, glycol water, air, cold-producing medium etc.
As shown in Figure 1, according to a specific embodiment of the present invention, described micro heat exchanger is by 8 kinds of dissimilar sheet metals (being typically the stainless sheet steel that thickness is less than 1mm) in certain sequence after lamination, then connects and an entity forming through vacuum diffusion welding.These 8 kinds of plates are respectively: fluid enters/go out plate A, fluid heat transfer plate B, cold-producing medium heat exchange plate C, with the fluid heat transfer plate D of cold-producing medium manifold, with the cold-producing medium heat exchange plate E of cold-producing medium manifold, cold-producing medium heat exchange plate F, blind plate sheet G with cold-producing medium micro-throttling conduit and cold-producing medium manifold.
On above-mentioned 8 kinds of plates, by photochemical etching method, be processed with the conduit for fluid circulation, according to the etched degree of depth of conduit, can be divided into: full etching region and partially etching area.Total eclipse is carved and is referred to that this etching area is worn by erosion, and etch depth equals sheet; Etch partially and refer to that this etching area is not worn by erosion, etch depth is less than sheet.Full etching region be assignment system cryogen or fluid to the flow region of different plates, partially etching area is the region at this plate surface heat convection for cold-producing medium or fluid.
As shown in Figure 2, fluid enters/goes out the front shroud that plate A has formed described micro heat exchanger, has two apertures that flow into and flow out for fluid thereon: full etch-hole A1 and full etch-hole A2.
As shown in Figure 3, fluid heat transfer plate B is the plate that mainly supplies fluid circulation and heat exchange, etching thereon has: for the full etch-hole B1 of fluid inflow or outflow, as the partially etching area B3 of fluid heat transfer wall, the full etch-hole B2 that flows into or flow out for fluid, and the full etch-hole B4 and full etch-hole B5 that supply cold-producing medium to be communicated with between each plate.
As shown in Figure 4, cold-producing medium heat exchange plate C is the plate that mainly supplies cold-producing medium circulation and heat exchange, etching thereon has: for the full etch-hole C4 of cold-producing medium inflow or outflow, as the partially etching area C3 of cold-producing medium heat exchange wall, the full etch-hole C5 that flows into or flow out for cold-producing medium, and the full etch-hole C1 and full etch-hole C2 that supply fluid to be communicated with between each plate.
As shown in Figure 5, fluid heat transfer plate D with cold-producing medium manifold is the plate that mainly supplies fluid circulation and heat exchange, etching thereon has: for the full etch-hole D1 of fluid inflow or outflow, as the partially etching area D3 of fluid heat transfer wall, the full etch-hole D2 that flows into or flow out for fluid, the full etch-hole D4 being communicated with between each plate for cold-producing medium and full etch-hole D5, and the full etching region D6 that flows into or flow out and play afflux effect for cold-producing medium.
As shown in Figure 6, cold-producing medium heat exchange plate E with cold-producing medium manifold is the plate that mainly supplies cold-producing medium circulation and heat exchange, etching thereon has: for the full etch-hole E4 of cold-producing medium inflow or outflow, as the partially etching area E3 of cold-producing medium heat exchange wall, the full etch-hole E5 that flows into or flow out for cold-producing medium, the full etch-hole E1 being communicated with between each plate for fluid and full etch-hole E2, and the full etching region E6 that flows into or flow out and play afflux effect for cold-producing medium.
As shown in Figure 7, with cold-producing medium micro-throttling conduit and be mainly for the plate of cold-producing medium circulation and heat exchange with the cold-producing medium heat exchange plate F of cold-producing medium manifold, and a cold-producing medium throttling action.Etching thereon has: for the full etch-hole F4 of cold-producing medium inflow or outflow, as the partially etching area F3 of cold-producing medium heat exchange wall, the full etching region F5 that flows into or flow out for cold-producing medium, the full etch-hole F1 being communicated with between each plate for fluid and full etch-hole F2, for cold-producing medium, flow into or flow out and play the full etching region F6 of afflux effect, and the micro-throttling conduit F7 that plays cold-producing medium throttling action.Micro-throttling conduit F7 is an elongated aperture, and its mechanism is similar to restriction sleeve and the throttle capillary tube that small refrigeration systems is used.When liquid refrigerant is flowed through micro-throttling conduit F7, due to orifice restriction effect, make by the refrigerant pressure after micro-throttling conduit F7 reduce, volumetric expansion, thereby realize sweat cooling effect.Micro-throttling conduit F7 can etch partially, and can be also entirely etched.When micro-throttling conduit F7 is that total eclipse is carved, and etched width is while equaling lamella thickness, and the hydraulic diameter of micro-throttling conduit F7 equals thickness of slab.
As shown in Figure 8, blind plate sheet G is as the back shroud of described micro heat exchanger, works to block the full etch-hole of a heat exchange plate before it, to realize sealing.Do not establish any etching region thereon, it is a tabula rasa.
Complex chart 2 ~ Fig. 9, laminated layer sequence and the position relationship of above 8 kinds of plates are:
1 with cold-producing medium micro-throttling conduit and be positioned at the centre position of heat exchanger with the cold-producing medium heat exchange plate F of cold-producing medium manifold;
With the fluid heat transfer plate D of cold-producing medium manifold be one group with two of the cold-producing medium heat exchange plate E of cold-producing medium manifold, repeated arrangement is with cold-producing medium micro-throttling conduit and with the both sides of the cold-producing medium heat exchange plate F of cold-producing medium manifold, its number of repetition is not limit;
Fluid heat transfer plate B and two of cold-producing medium heat exchange plate C are one group, and repeated arrangement is at the fluid heat transfer plate D with cold-producing medium manifold with the outside of the cold-producing medium heat exchange plate E of cold-producing medium manifold, and its number of repetition is not limit;
1 fluid enters/goes out the outermost that plate A and 1 blind plate sheet G lay respectively at described micro heat exchanger, and its position is interchangeable;
The partially etching area of each plate is all towards same direction;
The aligned in position of the full etch-hole on each plate, i.e. A1, B1, C1, D1, E1 and F1 alignment, A2, B2, C2, D2, E2 and F2 alignment, B4, C4, D4, E4 and F4 alignment, B5, C5, D5, E5 and F5 alignment, D6, E6 and F6 alignment.
As shown in Figure 9, more than inciting somebody to action, 8 kinds of plates carry out lamination as stated above, and with vacuum diffusion welding method, each layer is combined into after an entity 1, portion has formed staggered layer by layer refrigerant flow path and heat exchanging fluid runner within it, thereby has formed the described micro heat exchanger with throttling function.Between each plate of the entity 1 that vacuum diffusion welding forms, formed the combination of intermetallic phase, therefore can realize airtight completely, and non-dismountable.
After having welded, on the surface of entity 1, formed respectively for fluid and cold-producing medium flows into and the interface of outflow heat exchanger: fluid enters/go out the fluid import/export 2 that full etch-hole A1 on plate A has formed described micro heat exchanger; Fluid enters/goes out the fluid import/export 3 that full etch-hole A2 on plate A has formed described micro heat exchanger; Fluid heat transfer plate D D6 district, cold-producing medium heat exchange plate E E6 district, cold-producing medium heat exchange plate F6 district have constituted the cold-producing medium import/export 4 of described micro heat exchanger; Fluid heat transfer plate D D5 district, cold-producing medium heat exchange plate E5 district, cold-producing medium heat exchange plate F5 district have constituted the cold-producing medium import/export 5 of described micro heat exchanger.The plane of the opening of cold-producing medium import/export 4 and cold-producing medium import/export 5 is positioned on the side plane being formed by the lateral edges combination of multilayer metal foil.
According to above-described embodiment, when the present invention is used as evaporimeter, the high pressure liquid refrigerant next by the condenser of mini-refrigerator system flowed into by cold-producing medium import/export 4, thin long eyelet throttling through micro-throttling conduit F7, flash into low-pressure gas-liquid mixture, the partially etching area that this gas-liquid mixture flows on each cold-producing medium heat exchange plate carries out evaporation endothermic, cooling so that the fluid of each fluid heat transfer plate of flowing through of partition is carried out, the gaseous refrigerant finally having evaporated flows out micro heat exchanger via cold-producing medium import/export 5.The flow direction of fluid of being now cooled is: by fluid import/export 2, flow into micro heat exchangers, by fluid import/export 3, flow out micro heat exchangers.
According to above-described embodiment, when the present invention is used as condenser, the high-pressure gaseous refrigerant next by the compressor of mini-refrigerator system flowed into by cold-producing medium import/export 5, the partially etching area of then flowing through on each cold-producing medium heat exchange plate carries out condensation heat release, become liquid, when then the refrigerant liquid of high pressure is flowed through micro-throttling conduit F7, by reducing pressure by regulating flow, become low-pressure gas-liquid mixture, finally by cold-producing medium import/export 4, flowed out, to supply with the evaporimeter in downstream, use.Now the flow direction of fluid is: by fluid import/export 3, flow into micro heat exchanger, by fluid import/export 2, flow out micro heat exchanger.Fluid, when flowing through heat exchanger, will be heated by the cold-producing medium under condensing state of partition.
According to above-described embodiment, when by micro heat exchanger of the present invention as evaporator duty, and while adopting water as heat exchanging fluid, only need externally connect after micro-compressor, Miniature condenser and other pipeline, can form a miniature cooling-water machine.Can be used for producing the cold water lower than environment temperature, with the low-temperature receiver as cooling electronic components, high-power chip, laser instrument etc.
According to above-described embodiment, when by micro heat exchanger of the present invention as condenser purposes, and while adopting water as heat exchanging fluid, only need externally connect after micro-compressor, miniature evaporimeter and other pipeline, can form a miniature heat pump.Can be used for producing the hot water higher than environment temperature, with the thermal source as some instrument and equipment of heating.
According to a preferred embodiment of the present invention, partially etching area at cold-producing medium heat exchange plate and fluid heat transfer plate can also etch various patterns, as etched parallel shape or undulatory fin and water conservancy diversion conduit, also the method for useful etch forms the flow channel shapes such as microchannel or spoiler, to strengthen disturbance and the convection transfer rate of cold-producing medium and fluid, improve heat exchange efficiency.
Vacuum diffusion welding method of the present invention is owing to having the advantage that does not need soldering flux, so material is not limited to sheet metal or the alloy sheets such as stainless steel, titanium alloy, aluminium alloy, can be also that pottery waits nonmetallic slices.So long as the similar heat exchanger assembly that composite wafer material that can seam by means of vacuum diffusion welding forms all belongs to protection scope of the present invention.
In above-described embodiment, mobile the be parallel form of same fluid on various heat exchange plate, but flow form of the present invention is without any restriction.After the position of the flow channel shape on heat exchange plate and intercommunicating pore is slightly made an amendment, same fluid flowing on different plates can be arranged to series connection form equally, or the form of series and parallel mixing.
In above-described embodiment, the cold and hot fluid that participates in heat exchange all only has a loop, is applicable to the refrigeration system of single compressor, but the present invention to the feeder number of cold-producing medium without any restriction.The present invention program is equally also applicable to multiloop system, as can be micro heat exchanger made to the corresponding fluid circuit of two refrigerant loops by the various combination of heat exchange plate, thereby goes for the mini-refrigerator system of double-compressor.
Below be only concrete exemplary applications of the present invention, protection scope of the present invention is not constituted any limitation.All employing equivalents or equivalence are replaced and the technical scheme of formation, within all dropping on rights protection scope of the present invention.
Claims (10)
1. with the micro heat exchanger of throttling function, for the heat exchange between cold-producing medium and the second fluid, and the throttling of cold-producing medium, it is characterized in that, described micro heat exchanger is by following 8 kinds of thin plates or paillon foil, connects the entity forming by vacuum diffusion welding:
1 fluid enters/goes out plate A;
1 or multi-disc fluid heat transfer plate B;
1 or multi-disc cold-producing medium heat exchange plate C;
The fluid heat transfer plate D of 1 or multi-disc band cold-producing medium manifold;
The cold-producing medium heat exchange plate E of 1 or multi-disc band cold-producing medium manifold;
1 cold-producing medium heat exchange plate F with micro-throttling conduit and cold-producing medium manifold;
1 blind plate sheet G;
At fluid, enter/go out on plate A, fluid heat transfer plate B/D, cold-producing medium heat exchange plate C/E/F, to have the runner forming through photochemical etching.
2. micro heat exchanger according to claim 1, is characterized in that, at described fluid, entering/go out etching on plate A has full etch-hole A1 and the full etch-hole A2 that flows into or flow out for fluid.
3. micro heat exchanger according to claim 1, is characterized in that, on described fluid heat transfer plate B, etching has:
The full etch-hole B1 that flows into or flow out for fluid;
Partially etching area B3 as fluid heat transfer wall;
The full etch-hole B2 that flows into or flow out for fluid;
The full etch-hole B4 being communicated with between each plate for cold-producing medium and full etch-hole B5.
4. micro heat exchanger according to claim 1, is characterized in that, on described cold-producing medium heat exchange plate C, etching has:
The full etch-hole C4 that flows into or flow out for cold-producing medium;
Partially etching area C3 as cold-producing medium heat exchange wall;
The full etch-hole C5 that flows into or flow out for cold-producing medium;
The full etch-hole C1 being communicated with between each plate for fluid and full etch-hole C2.
5. micro heat exchanger according to claim 1, is characterized in that, on described fluid heat transfer plate D, etching has:
The full etch-hole D1 that flows into or flow out for fluid;
Partially etching area D3 as fluid heat transfer wall;
The full etch-hole D2 that flows into or flow out for fluid;
The full etch-hole D4 being communicated with between each plate for cold-producing medium and full etch-hole D5;
For cold-producing medium, flow into or flow out and play the full etching region D6 of afflux effect.
6. micro heat exchanger according to claim 1, is characterized in that, on described cold-producing medium heat exchange plate E, etching has:
The full etch-hole E4 that flows into or flow out for cold-producing medium;
Partially etching area E3 as cold-producing medium heat exchange wall;
The full etch-hole E5 that flows into or flow out for cold-producing medium;
The full etch-hole E1 being communicated with between each plate for fluid and full etch-hole E2;
For cold-producing medium, flow into or flow out and play the full etching region E6 of afflux effect.
7. micro heat exchanger according to claim 1, is characterized in that, on described cold-producing medium heat exchange plate F, etching has:
The full etch-hole F4 that flows into or flow out for cold-producing medium;
Partially etching area F3 as cold-producing medium heat exchange wall;
The full etch-hole F5 that flows into or flow out for cold-producing medium;
The full etch-hole F1 being communicated with between each plate for fluid and full etch-hole F2;
For cold-producing medium, flow into or flow out and play the full etching region F6 of afflux effect;
And for the micro-throttling conduit F7 of cold-producing medium throttling.
8. micro-throttling conduit F7 according to claim 7, is characterized in that, it is the elongate channels of the full etching region F6 of connection that forms by engraving method on plate and full etch-hole F4, and this conduit can be one of following two types:
Etch depth equals the full etched channels of sheet;
Etch depth is less than the passage that etches partially of sheet.
9. micro heat exchanger according to claim 1, is characterized in that, on described blind plate sheet G, there is no etching region, and it is a tabula rasa.
10. micro heat exchanger according to claim 1, is characterized in that, the laminated layer sequence and the position relationship that form 8 kinds of plates of micro heat exchanger are:
1 cold-producing medium heat exchange plate F with micro-throttling conduit and cold-producing medium manifold is positioned at the centre position of heat exchanger;
Fluid heat transfer plate D with cold-producing medium manifold is one group with two of the cold-producing medium heat exchange plate E with cold-producing medium manifold, and repeated arrangement is in the both sides of the cold-producing medium heat exchange plate F with micro-throttling conduit and cold-producing medium manifold, and its number of repetition is not limit;
Fluid heat transfer plate B and two of cold-producing medium heat exchange plate C are one group, and repeated arrangement is at the fluid heat transfer plate D with cold-producing medium manifold with the outside of the cold-producing medium heat exchange plate E of cold-producing medium manifold, and its number of repetition is not limit;
1 fluid enters/goes out the outermost that plate A and 1 blind plate sheet G lay respectively at described micro heat exchanger, and its position is interchangeable;
The partially etching area of each plate is all towards same direction;
The aligned in position of the full etch-hole on each plate, i.e. A1, B1, C1, D1, E1 and F1 alignment, A2, B2, C2, D2, E2 and F2 alignment, B4, C4, D4, E4 and F4 alignment, B5, C5, D5, E5 and F5 alignment, D6, E6 and F6 alignment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410044416.3A CN103759472B (en) | 2014-02-06 | 2014-02-06 | There is the micro heat exchanger of throttling function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410044416.3A CN103759472B (en) | 2014-02-06 | 2014-02-06 | There is the micro heat exchanger of throttling function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103759472A true CN103759472A (en) | 2014-04-30 |
| CN103759472B CN103759472B (en) | 2016-09-21 |
Family
ID=50526749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410044416.3A Active CN103759472B (en) | 2014-02-06 | 2014-02-06 | There is the micro heat exchanger of throttling function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103759472B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104315757A (en) * | 2014-10-28 | 2015-01-28 | 武汉微冷科技有限公司 | Miniature heat exchanger integrating condensing, throttling and evaporation |
| US20170276408A1 (en) * | 2014-08-26 | 2017-09-28 | Syracuse University | Micro environmental control system |
| CN110762876A (en) * | 2019-11-11 | 2020-02-07 | 中国科学院上海技术物理研究所 | Liquid helium temperature zone throttling and evaporation integrated device |
| CN112066598A (en) * | 2019-06-11 | 2020-12-11 | 广东美的制冷设备有限公司 | Heat exchanger and air conditioning equipment |
| CN116642353A (en) * | 2023-07-24 | 2023-08-25 | 中国核动力研究设计院 | Current collecting structure, heat exchange core and heat exchanger |
| CN117680802A (en) * | 2024-01-11 | 2024-03-12 | 贵州永红航空机械有限责任公司 | Titanium alloy microchannel heat exchanger manufacturing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656352A (en) * | 2002-05-29 | 2005-08-17 | 阿尔法拉瓦尔股份有限公司 | Plate heat exchanger device and a heat exchanger plate |
| US20060011323A1 (en) * | 2004-07-16 | 2006-01-19 | Calsonic Kansei Corporation | Heat exchanger |
| CN101476830A (en) * | 2009-01-22 | 2009-07-08 | 辛娟姣 | Slit type throttle structure of plate heat exchanger medium entrance |
| CN102494547A (en) * | 2011-11-30 | 2012-06-13 | 北京航空航天大学 | Miniature micro-channel plate-fin heat exchanger |
| CN202869326U (en) * | 2012-09-12 | 2013-04-10 | 江苏宝得换热设备有限公司 | Triple-channel plate heat exchanger with throttle |
-
2014
- 2014-02-06 CN CN201410044416.3A patent/CN103759472B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656352A (en) * | 2002-05-29 | 2005-08-17 | 阿尔法拉瓦尔股份有限公司 | Plate heat exchanger device and a heat exchanger plate |
| US20060011323A1 (en) * | 2004-07-16 | 2006-01-19 | Calsonic Kansei Corporation | Heat exchanger |
| CN101476830A (en) * | 2009-01-22 | 2009-07-08 | 辛娟姣 | Slit type throttle structure of plate heat exchanger medium entrance |
| CN102494547A (en) * | 2011-11-30 | 2012-06-13 | 北京航空航天大学 | Miniature micro-channel plate-fin heat exchanger |
| CN202869326U (en) * | 2012-09-12 | 2013-04-10 | 江苏宝得换热设备有限公司 | Triple-channel plate heat exchanger with throttle |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170276408A1 (en) * | 2014-08-26 | 2017-09-28 | Syracuse University | Micro environmental control system |
| US10782052B2 (en) * | 2014-08-26 | 2020-09-22 | Syracuse University | Micro environmental control system |
| CN104315757A (en) * | 2014-10-28 | 2015-01-28 | 武汉微冷科技有限公司 | Miniature heat exchanger integrating condensing, throttling and evaporation |
| CN104315757B (en) * | 2014-10-28 | 2016-08-24 | 武汉麦丘科技有限公司 | Condensation-throttling-evaporation integral micro heat exchanger |
| CN112066598A (en) * | 2019-06-11 | 2020-12-11 | 广东美的制冷设备有限公司 | Heat exchanger and air conditioning equipment |
| CN110762876A (en) * | 2019-11-11 | 2020-02-07 | 中国科学院上海技术物理研究所 | Liquid helium temperature zone throttling and evaporation integrated device |
| CN110762876B (en) * | 2019-11-11 | 2023-11-10 | 中国科学院上海技术物理研究所 | Liquid helium temperature zone throttling and evaporating integrated device |
| CN116642353A (en) * | 2023-07-24 | 2023-08-25 | 中国核动力研究设计院 | Current collecting structure, heat exchange core and heat exchanger |
| CN116642353B (en) * | 2023-07-24 | 2023-10-24 | 中国核动力研究设计院 | Current collecting structure, heat exchange core and heat exchanger |
| CN117680802A (en) * | 2024-01-11 | 2024-03-12 | 贵州永红航空机械有限责任公司 | Titanium alloy microchannel heat exchanger manufacturing method |
| CN117680802B (en) * | 2024-01-11 | 2024-05-10 | 贵州永红航空机械有限责任公司 | Titanium alloy microchannel heat exchanger manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103759472B (en) | 2016-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103727706B (en) | With the integrated micro heat exchanger assembly of dry filter and throttling function | |
| CN102494547B (en) | Miniature micro-channel plate-fin heat exchanger | |
| CN103759472B (en) | There is the micro heat exchanger of throttling function | |
| JP6429804B2 (en) | Combined condenser and evaporator | |
| US20140076526A1 (en) | Heat exchanger and refrigeration cycle apparatus including same | |
| CN104315757A (en) | Miniature heat exchanger integrating condensing, throttling and evaporation | |
| CN103759560A (en) | Micro heat exchanger with small hole throttling function | |
| US20170248373A1 (en) | Plate heat exchanger and heat pump outdoor unit | |
| EP2676094B1 (en) | Method of producing a heat exchanger and a heat exchanger | |
| JP2021025718A (en) | Heat exchanger having header | |
| CN104613796A (en) | Micro heat exchanger with vacuum heat insulation function | |
| JP6116696B2 (en) | Laminated header, heat exchanger, and heat pump device | |
| JP5744316B2 (en) | Heat exchanger and heat pump system equipped with the heat exchanger | |
| KR20080076222A (en) | Laminated heat exchanger and fabricating method thereof | |
| CN114683013A (en) | Processing method of aluminum alloy micro-channel heat exchanger | |
| JP2006093293A (en) | Cooler | |
| JP5540409B2 (en) | Linked pressure heat exchanger and manufacturing method thereof | |
| US20080066487A1 (en) | Condenser and radiator of air conditioning refrigeration system | |
| JP2005024109A (en) | Heat exchanger | |
| JP2010117102A (en) | Heat exchanger | |
| KR102673571B1 (en) | Peltier element module and air conditioner including the same | |
| CN101762113B (en) | Heat pump | |
| JP2006220387A (en) | Heat exchanger and production method therefor | |
| JP6601380B2 (en) | Heat exchanger and air conditioner | |
| JPH01244282A (en) | Laminate-type heat exchanger |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Yang Yufei Inventor before: Yang Yufei Inventor before: Zhou Xiaoping Inventor before: Yang Yuxiang |
|
| COR | Change of bibliographic data | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160309 Address after: 430074 Hubei city of Wuhan Province, East Lake New Technology Development Zone Road King terrace 107 Zi song 8 Room 03 Applicant after: Yang Yufei Address before: 430074 Hubei city of Wuhan Province, East Lake New Technology Development Zone, Road No. 289 King Zi song terrace 107 8 floor No. 03 Applicant before: MICROCOOL TECHNOLOGIES CO., LTD. |
|
| C14 | Grant of patent or utility model | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| GR01 | Patent grant | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160829 Address after: 430074 Hubei city of Wuhan province Guan Shan Cun poly era K17 block East Lake New Technology Development Zone, two District 2 Building 1 unit 705 room Applicant after: WUHAN MICROCHILL TECHNOLOGIES CO., LTD. Address before: 430074 Hubei city of Wuhan Province, East Lake New Technology Development Zone Road King terrace 107 Zi song 8 Room 03 Applicant before: Yang Yufei |