CN103759472B - There is the micro heat exchanger of throttling function - Google Patents
There is the micro heat exchanger of throttling function Download PDFInfo
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- CN103759472B CN103759472B CN201410044416.3A CN201410044416A CN103759472B CN 103759472 B CN103759472 B CN 103759472B CN 201410044416 A CN201410044416 A CN 201410044416A CN 103759472 B CN103759472 B CN 103759472B
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Abstract
The present invention provides a kind of micro heat exchanger having throttling function, can realize throttling and the phase-change heat-exchange of cold-producing medium in single device, both can do evaporator duty, and also can make condenser purposes.It is by 7 kinds of etching plate laminations in certain sequence, the entity formed by vacuum diffusion welding again, including: 1 fluid entry/exit plate A, 1 or multi-disc fluid heat transfer plate B, 1 or multi-disc refrigerant heat exchanger plate C, 1 or the fluid heat transfer plate D of multi-disc band cold-producing medium manifold, 1 or the refrigerant heat exchanger plate E of multi-disc band cold-producing medium manifold, 1 band cold-producing medium micro-throttling conduit and the refrigerant heat exchanger plate F of cold-producing medium manifold, and 1 blind plate sheet G.The throttling and evaporation of cold-producing medium is realized by the fine conduit of etching on refrigerant heat exchanger plate F, thus eliminates the use of the restricting elements such as capillary tube.Present configuration is compact, compact, can effectively reduce volume and the quality of system when being used in miniature vapor compression type refrigerating system.
Description
Technical field
The present invention relates to a kind of micro heat exchanger that can be used for miniature vapor compression type refrigerating system, throttling and the phase-change heat-exchange of cold-producing medium can be completed in single component, both can make evaporator duty, it is possible to make condenser purposes, to realize cooling or the heating of convection cell.When the present invention is in miniature vapor compression type refrigerating system, volume and the quality of system can be effectively reduced, so that system is compacter.
Background technology
The present invention relates to diffusion in vacuum welding technology, layer separated growth technology (vacuum diffusion bonding of multilayer metal foil), photochemical etching technique, miniature steam compression type refrigerating technology and compact heat exchanger technology.
Vacuum diffusion welding is that (vacuum is not less than 10 under conditions of fine vacuum-2Torr), the workpiece that will weld is placed between two pressing plates, applies high-pressure, simultaneously by the melt temperature of workpiece heat to not higher than material on pressing plate, and held for some time, by the diffusion of the molecule on the surface of the work that contacts with each other or atom by workpiece seam together.The advantage of vacuum diffusion welding is to need not cored solder or solder flux, and two parts go completely into an entirety, the originally place of two feature contacts after vacuum diffusion bonding does not has the separating surface of phase, does not has any oxidative phenomena yet.Therefore the part after welding can be reprocessed, similarly be one single part of processing.Vacuum diffusion welding both can realize the welding between same metal material, it is also possible to realizes the welding between different metal materials, it might even be possible to realizes the welding between metal and ceramic material.
Layer separated growth technology is to use multi-layered sheet or foil material, and according to the requirement of two kinds of fluid heat transfers, after designing on thin plate and being processed into different runners, multilamellar stacks assembling and links together, thus completes entity manufacture.Method of attachment between laminate has splicing, low temperature brazing or vacuum diffusion welding etc..The former is suitable for the material such as paper, resin plate and does the layer separated growth of moulding, and the latter is suitable for metal and does the entity manufacture of moulding.By diffusion in vacuum welding technology, multiple layer metal heat exchanger fin is linked together, it is possible to achieve freely the designing of runner between different metal plate, thus create conditions for constructing efficient, compact heat exchanger.The material being suitable for being used as the vacuum diffusion welding of multilayer metal foil has rustless steel, titanium alloy and aluminum alloy flake etc..
Photochemical etching technique is to use photomechanical production technology to form photoetching offset plate figure in metal surface, then uses strong oxidizing property etchant solution, carves high accuracy (error is smaller than ± 10 μm), the technology of complex figure on material.Photochemical etching is the precision component process technology of a kind of high-quality, low cost, is particularly suitable for etching the runner needed for flowing for different fluid on sheet metal, and etch depth can be from tens microns to several millimeters.
The advantage that miniature vapor compression type refrigerating system is big owing to having refrigerating efficiency refrigerating capacity high, unit volume, such that it is able to replace the thermoelectric cooling unit that efficiency is low, volume is heavy, the occasion of point-to-point cooling is needed, such as laser instrument cooling, the cooling of great-power electronic element, high-power chip cooling, portable body cooling etc. for many.The appearance of Minitype refrigeration compressor makes design volume miniature vapor compression type refrigerating system small and exquisite, compact conformation become possibility, but only accomplishes that the miniaturization of compressor is inadequate, in addition it is also necessary to the heat exchanger of supporting miniaturization.
Brazing plate type heat exchanger is a kind of compact heat exchanger, can effectively reduce the volume of system, but the minimum heat exchange amount of current existing brazing plate type heat exchanger is also more than thousands of watts time in common refrigeration system.For the Miniature refrigerating device that heat exchange amount only has a few hectowatt, there is presently no and be available for supporting heat exchange amount and can use at the plate type heat exchanger of a few hectowatt magnitudes.Soldering formula plate type heat exchanger typically uses copper or nickel as soldering flux.The plate type heat exchanger using copper to make soldering flux may not apply to the laser instrument cooling occasion sensitive to copper ion, and this is owing to the copper ion of soldering flux is dissolved in water, is easily deposited in the micro-channel heat sink of laser instrument, thus causes the blocking of laser instrument cooling duct.Use nickel as not copper ions in the plate type heat exchanger of soldering flux, can be used for the occasion of laser instrument cooling, but nickel brazing plate type heat exchanger is pressure the least, generally less than 1MPa.Owing to the pressure of conventional compressor refrigeration system can easily exceed 1MPa, the plate type heat exchanger of nickel soldering is therefore used easily to cause leakage because of the hypertonia of refrigeration system.Owing to the plate of brazing plate type heat exchanger is by diel molding, and diel is expensive, the construction cycle is long, and therefore it carries out customized processing not for mini-refrigerator system.Visible, brazing plate type heat exchanger uses unsuitable for mini-refrigerator system, is badly in need of developing a kind of novel, micro heat exchanger of high-efficiency compact.
Additionally, after the miniaturization achieving heat exchanger, the miniaturization of matched throttling arrangement is also a problem.In conventional refrigerant system use electric expansion valve, heating power expansion valve and restricting orifice constant pitch throttling arrangement due to interface size and refrigerating capacity scope the most excessive, it is difficult to and micro heat exchanger with the use of；Though capillary tube can with miniature roses with the use of, but be difficult to operate when using welding method that capillary tube is connected to micro heat exchanger, welding quality is difficult to ensure that, easily causes capillary tube to block in welding process.
Summary of the invention
It is an object of the invention to provide a kind of compact throttling-heat-exchange integrated micro heat exchanger, with solve existing heat exchanger applications in mini-refrigerator system time exist the problem that volume is excessive, heat exchange amount is not mated and restricting element is difficult to solder to.
The present invention is based on aforesaid photochemical etching technique, and the vacuum diffusion welding connection technology of layered metal thin slice realizes:
First pass through photochemical etching process, the foil such as rustless steel or copper etches respectively for cold-producing medium and the runner of fluid heat transfer, and the runner for cold-producing medium throttling.Then surface is etched with refrigerant heat exchanger runner, fluid heat transfer runner, the multilayer metal foil lamination in certain sequence of cold-producing medium throttling runner.Weld together finally by diffusion in vacuum Welding, thus make the micro heat exchanger entity carrying cold-producing medium throttling function.
The beneficial effects are mainly as follows:
The present invention program can construct the compactest micro heat exchanger, change cold can be as small as several watts to several hectowatts, thus fill up the current brazing plate type heat exchanger blank at less heat exchange weight range.Volume and the quality of mini-refrigerator system can be effectively reduced, improve the portability of mini-refrigerator system.
The heat exchange plate of the micro heat exchanger owing to being formed based on laminated solid body Diffusion Welding technology is the thinnest, and between plate, thermal conduction resistance is less；Utilize photochemical etching technique to be formed due to the fluid course on plate again, therefore the flexible arrangement of runner, the MCA with high heat transfer coefficient can be formed on plate.The heat exchange efficiency of whole heat exchanger is higher, far above heat exchangers such as common bushing type, shell-tube types.
Owing to defining the micro-channel for cold-producing medium throttling during photochemical etching, the throttling function of cold-producing medium can realize in the inside of micro heat exchanger, therefore the pipeline eliminated between throttling arrangement with heat exchanger is connected, decrease the total length of refrigeration pipe, solder joint number in whole refrigeration system and leakage point are reduced, the layout of system pipeline is simpler, and whole mini-refrigerator system is also easier to assembling, decreases the welding job amount of pipe fitting.
Copper ion can be separated out different from copper brazing plate type heat exchanger, the micro heat exchanger that the present invention provides, owing to need not cored solder between heat exchange plate, foreign ion will not be produced, thus can be applicable to ordinary copper brazing plate type heat exchanger institute the most applicable laser instrument cooling field.Compared with nickel brazing plate type heat exchanger, micro heat exchanger pressure higher that the present invention provides, thus better reliability.
Heat exchange plate in the present invention program can use various material, as heat exchange plate can be selected for titanium alloy material and ceramic material, so that the present invention can be used for the occasion that heat exchanging fluid is severe corrosive solution.Owing to needing the diel molding of costliness unlike the plate of common plate type heat exchanger, thus the present invention is more flexible in the selection of overall dimensions and plate area, and during small lot batch manufacture, cost is lower.
Accompanying drawing explanation
Fig. 1 is the structure composition of a specific embodiment of the present invention and each assemble sequence schematic diagram etching plate.
Fig. 2 is the runner schematic diagram of fluid entry/exit plate (front shroud) in micro heat exchanger.
Fig. 3 is the runner schematic diagram of the fluid heat transfer plate in micro heat exchanger.
Fig. 4 is the runner schematic diagram of the refrigerant heat exchanger plate in micro heat exchanger.
Fig. 5 is the runner schematic diagram of the fluid heat transfer plate of the band cold-producing medium manifold in micro heat exchanger.
Fig. 6 is the runner schematic diagram of the refrigerant heat exchanger plate of the band cold-producing medium manifold in micro heat exchanger.
Fig. 7 is the runner schematic diagram of the refrigerant heat exchanger plate of the band cold-producing medium manifold in micro heat exchanger and micro-throttling conduit.
Fig. 8 is the structural representation of outermost blind plate sheet (back shroud) in micro heat exchanger.
Fig. 9 is by each outward appearance etching the plate entity by being formed after vacuum diffusion welding method seam shown in Fig. 1.
Detailed description of the invention
With detailed description of the invention, technical scheme is described below in conjunction with the accompanying drawings.In the following description, cold-producing medium refers to the refrigeration working medium used in vapor compression type refrigerating system, such as R22, R134a,
R407c, R410a etc.；And fluid refers to carry out the another kind of working medium of heat exchange, such as water, glycol water, air, cold-producing medium etc. with described cold-producing medium.
As shown in Figure 1, a specific embodiment according to the present invention, described micro heat exchanger be by 7 kinds of different types of foils (typically thickness is less than the stainless sheet steel of 1mm) lamination in certain sequence after, then the entity formed through vacuum diffusion bonding.These 7 kinds of plates are respectively: fluid entry/exit plate A, fluid heat transfer plate B, refrigerant heat exchanger plate C, the fluid heat transfer plate D of band cold-producing medium manifold, the refrigerant heat exchanger plate E of band cold-producing medium manifold, band cold-producing medium micro-throttling conduit and the throttling plate F of cold-producing medium manifold, blind plate sheet G.
Above-mentioned 7 kinds of plates are machined with the conduit for fluid circulation by Photochemical etching methods, can be divided into according to the etched degree of depth of conduit: full etching region or partially etching area.Total eclipse is carved and is referred to that this etching area is worn by erosion, i.e. etch depth is equal to sheet；Half-etching refers to that this etching area is not worn by erosion, i.e. etch depth is less than sheet.Full etching region is the distribution fluid flow region to different plates, and partially etching area is in the region of this sheet surface heat convection for fluid.
As in figure 2 it is shown, fluid entry/exit plate A constitutes the front shroud of described micro heat exchanger, have two apertures flowed in and out for fluid thereon: full etch-hole A1 and full etch-hole A2.
As shown in Figure 3, fluid heat transfer plate B is mainly for fluid circulation and the plate of heat exchange, it is etched with thereon: the full etch-hole B1 that flows in or out for fluid, the partially etching area B3 as fluid heat transfer wall, the full etch-hole B2 that flows in or out for fluid, and the full etch-hole B4 that connects between each plate for cold-producing medium and full etch-hole B5.
As shown in Figure 4, refrigerant heat exchanger plate C is mainly for cold-producing medium circulation and the plate of heat exchange, it is etched with thereon: the full etch-hole C4 that flows in or out for cold-producing medium, the partially etching area C3 as refrigerant heat exchanger wall, the full etch-hole C5 that flows in or out for cold-producing medium, and the full etch-hole C1 that connects between each plate for fluid and full etch-hole C2.
As shown in Figure 5, fluid heat transfer plate D with cold-producing medium manifold is mainly for fluid circulation and the plate of heat exchange, it is etched with thereon: the full etch-hole D1 that flows in or out for fluid, the partially etching area D3 as fluid heat transfer wall, the full etch-hole D2 that flows in or out for fluid, the full etch-hole D4 connected between each plate for cold-producing medium and full etch-hole D5, and flow in or out for cold-producing medium and play the full etching region D6 of afflux effect.
As shown in Figure 6, refrigerant heat exchanger plate E with cold-producing medium manifold is mainly for cold-producing medium circulation and the plate of heat exchange, it is etched with thereon: the full etch-hole E4 that flows in or out for cold-producing medium, the partially etching area E3 as refrigerant heat exchanger wall, the full etch-hole E5 that flows in or out for cold-producing medium, the full etch-hole E1 connected between each plate for fluid and full etch-hole E2, and flow in or out for cold-producing medium and play the full etching region E6 of afflux effect.
As it is shown in fig. 7, the cold-producing medium throttling plate F of band cold-producing medium manifold and band cold-producing medium throttling passage is mainly for cold-producing medium circulation and the plate of heat exchange, and play cold-producing medium throttling action.It is etched with thereon: the full etch-hole F4 that flows in or out for cold-producing medium, the partially etching area F3 as refrigerant heat exchanger wall, the full etching region F5 that flows in or out for cold-producing medium, the full etch-hole F1 connected between each plate for fluid and full etch-hole F2, flow in or out and play the full etching region F6 of afflux effect for cold-producing medium, and play the micro-throttling conduit F7 of cold-producing medium throttling action.Micro-throttling conduit F7 is an elongated aperture, and its mechanism is similar to restriction sleeve and the throttle capillary tube that small refrigeration systems uses.When liquid refrigerant flows through micro-throttling conduit F7, due to orifice restriction effect so that by the refrigerant pressure reduction after micro-throttling conduit F7, volumetric expansion, thus realize sweat cooling effect.Micro-throttling conduit F7 can be half-etching, it is also possible to be that total eclipse is carved.When micro-throttling conduit F7 is that total eclipse is carved, and when etched width is equal to lamella thickness, the hydraulic diameter of micro-throttling conduit F7 is i.e. equal to thickness of slab.
As shown in Figure 8, blind plate sheet G is used as the back shroud of described micro heat exchanger, acts the effect of the full etch-hole of one piece of heat exchange plate before it of blocking, to realize sealing.The most not setting any etching region, i.e. it is one piece of tabula rasa.
Complex chart 2 ~ Fig. 9, laminated layer sequence and the position relationship of above 7 kinds of plates be:
The cold-producing medium throttling plate F of 1 band cold-producing medium manifold and band cold-producing medium micro-throttling conduit is positioned at the centre position of heat exchanger；
Fluid heat transfer plate D and the refrigerant heat exchanger plate E two panels of band cold-producing medium manifold with cold-producing medium manifold are one group, and repeated arrangement is in the both sides of the cold-producing medium throttling plate F of band cold-producing medium manifold and band cold-producing medium micro-throttling conduit, and its number of repetition does not limits；
Fluid heat transfer plate B and refrigerant heat exchanger plate C two panels are one group, and repeated arrangement is in the fluid heat transfer plate D of band cold-producing medium manifold and the outside of the refrigerant heat exchanger plate E of band cold-producing medium manifold, and its number of repetition does not limits；
1 fluid entry/exit plate A and 1 blind plate sheet G lays respectively at the outermost of described micro heat exchanger, and its position is interchangeable；
The partially etching area of each plate is all towards same direction；
The aligned in position of the full etch-hole on each plate, i.e. A1, B1, C1, D1, E1 and F1 alignment, A2, B2, C2, E2 and F2 alignment, B4, C4, E4 and F4 alignment, B5, C5, E5 and F5 alignment, D6, E6 and F6 align.
As shown in Figure 9, above 7 kinds of plates are being carried out lamination as stated above, and after each layer being combined into an entity 1 with vacuum diffusion welding method, define refrigerant flow path staggered layer by layer and heat exchanging fluid runner the most therein, thus constitute the micro heat exchanger of described band throttling function.Define the combination of intermetallic phase between each plate of the entity 1 that vacuum diffusion welding is formed, therefore can realize the most airtight and non-dismountable.
After having welded, the surface of entity 1 form respectively the interface flowing in and out heat exchanger for fluid and cold-producing medium: the full etch-hole A1 on fluid entry/exit plate A constitutes the fluid import/export 2 of described micro heat exchanger；Full etch-hole A2 on fluid entry/exit plate A constitutes the fluid import/export 3 of described micro heat exchanger；The D6 district of fluid heat transfer plate D, the E6 district of refrigerant heat exchanger plate E, the F6 district of refrigerant heat exchanger plate combine the cold-producing medium import/export 4 constituting described micro heat exchanger；The D5 district of fluid heat transfer plate D, the E5 district of refrigerant heat exchanger plate, the F5 district of refrigerant heat exchanger plate combine the cold-producing medium import/export 5 constituting described micro heat exchanger.The plane of the opening of cold-producing medium import/export 4 and cold-producing medium import/export 5 is positioned on the side plane combined by the lateral edges of multilayer metal foil and formed.
According to above-described embodiment, when the present invention is used as vaporizer, the high pressure liquid refrigerant come by the condenser of mini-refrigerator system is flowed into by cold-producing medium import/export 4, thin long eyelet throttling through micro-throttling conduit F7, flash into low-pressure gas-liquid mixture, this gas-liquid mixture flows to the partially etching area on each refrigerant heat exchanger plate and is evaporated heat absorption, cooling down so that partition to flow through the fluid of each fluid heat transfer plate, the gaseous refrigerant that final evaporation completes flows out micro heat exchanger via cold-producing medium import/export 5.The flow direction of fluid of being now cooled is: is flowed into micro heat exchanger by fluid import/export 2, fluid import/export 3 flows out micro heat exchanger.
According to above-described embodiment, when the present invention is used as condenser, the high-pressure gaseous refrigerant come by the compressor of mini-refrigerator system is flowed into by cold-producing medium import/export 5, then flow through the partially etching area on each refrigerant heat exchanger plate to carry out condensing heat release, becoming liquid, then the refrigerant liquid of high pressure is throttled blood pressure lowering when flowing through micro-throttling conduit F7, becomes low-pressure gas-liquid mixture, finally flowed out by cold-producing medium import/export 4, to supply the vaporizer use in downstream.Now the flow direction of fluid is: flowed into micro heat exchanger by fluid import/export 3, fluid import/export 2 flow out micro heat exchanger.Fluid is when flowing through heat exchanger, by by the refrigerant heat being under condensing state of partition.
According to above-described embodiment, when micro heat exchanger of the present invention being used as evaporator duty, and adopting when using water as heat exchanging fluid, only in external connection after micro-compressor, Miniature condenser and other pipeline, need to i.e. may make up a miniature cooling-water machine.Can be used for producing the cold water less than ambient temperature, for use as the low-temperature receiver of cooling electronic component, high-power chip, laser instrument etc..
According to above-described embodiment, when micro heat exchanger of the present invention being used as condenser purposes, and adopting when using water as heat exchanging fluid, only in external connection after micro-compressor, miniature roses and other pipeline, need to i.e. may make up a miniature heat pump.Can be used for producing the hot water higher than ambient temperature, for use as the thermal source heating some instrument and equipment.
According to a preferred embodiment of the present invention, partially etching area at refrigerant heat exchanger plate and fluid heat transfer plate can also etch various pattern, as parallel shape or undulatory fin and water conservancy diversion conduit can be etched, also the method for useful etch forms the flow channel shape such as microchannel or spoiler, to strengthen cold-producing medium and the disturbance of fluid and convection transfer rate, improve heat exchange efficiency.
Vacuum diffusion welding method of the present invention is not required to the advantage of soldering flux owing to having, and therefore material is not limited to foil or the alloy sheets such as rustless steel, titanium alloy, aluminium alloy, it is also possible to be the nonmetallic slices such as pottery.As long as the similar heat exchanger assembly that can be constituted with the composite wafer material of seam by means of vacuum diffusion welding, belong to protection scope of the present invention.
In above-described embodiment, the flowing on various heat exchange plate of the same fluid is parallel form, but the present invention does not has any restriction to liquid form.After slightly being made an amendment the position of the flow channel shape on heat exchange plate and intercommunicating pore, the flowing on different plates of the same fluid is equally arranged to cascade, or string, the form of connection mixing.
In above-described embodiment, participate in the cold and hot fluid equal only one of which loop of heat exchange, be i.e. applicable to the refrigeration system of single compressor, but the present invention does not has any restriction to the feeder number of cold-producing medium.The present invention program can equally be well applied to multiloop system, as micro heat exchanger made the corresponding fluid circuit of two refrigerant loops, such that it is able to be applicable to the mini-refrigerator system of double-compressor by the various combination of heat exchange plate.
Below it is only the concrete exemplary applications of the present invention, protection scope of the present invention is not constituted any limitation.The technical scheme that all employing equivalents or equivalence are replaced and formed, within the scope of all falling within rights protection of the present invention.
Claims (9)
1. with a micro heat exchanger for throttling function, the heat exchange between cold-producing medium and the second fluid, and the throttling of cold-producing medium, it is characterised in that described micro heat exchanger is by following 7 kinds of thin plates or paillon foil, the entity formed by vacuum diffusion bonding:
1 fluid entry/exit plate A；
1 or multi-disc fluid heat transfer plate B;
1 or multi-disc refrigerant heat exchanger plate C；
1 or the fluid heat transfer plate D of multi-disc band cold-producing medium manifold；
1 or the refrigerant heat exchanger plate E of multi-disc band cold-producing medium manifold；
The cold-producing medium throttling plate F of 1 band micro-throttling conduit and cold-producing medium manifold；
1 blind plate sheet G；
Fluid entry/exit plate A, fluid heat transfer plate B/D, refrigerant heat exchanger plate C/E, throttling plate F there is the runner formed through photochemical etching.
Micro heat exchanger the most according to claim 1, it is characterised in that be etched with full etch-hole A1 and full etch-hole A2 that confession fluid flows in or out in described fluid entry/exit plate A.
Micro heat exchanger the most according to claim 1, it is characterised in that be etched with on described fluid heat transfer plate B:
The full etch-hole B1 flowed in or out for fluid；
Partially etching area B3 as fluid heat transfer wall；
The full etch-hole B2 flowed in or out for fluid；
The full etch-hole B4 connected between each plate for cold-producing medium and full etch-hole B5.
Micro heat exchanger the most according to claim 1, it is characterised in that be etched with on described refrigerant heat exchanger plate C:
The full etch-hole C4 flowed in or out for cold-producing medium；
Partially etching area C3 as refrigerant heat exchanger wall；
The full etch-hole C5 flowed in or out for cold-producing medium；
The full etch-hole C1 connected between each plate for fluid and full etch-hole C2.
Micro heat exchanger the most according to claim 1, it is characterised in that be etched with on described fluid heat transfer plate D:
The full etch-hole D1 flowed in or out for fluid；
Partially etching area D3 as fluid heat transfer wall；
The full etch-hole D2 flowed in or out for fluid；
The full etch-hole D4 connected between each plate for cold-producing medium and full etch-hole D5；
Flow in or out for cold-producing medium and play the full etching region D6 of afflux effect.
Micro heat exchanger the most according to claim 1, it is characterised in that be etched with on described refrigerant heat exchanger plate E:
The full etch-hole E4 flowed in or out for cold-producing medium；
Partially etching area E3 as refrigerant heat exchanger wall；
The etch-hole E5 flowed in or out for cold-producing medium；
The full etch-hole E1 connected between each plate for fluid and full etch-hole E2；
Flow in or out for cold-producing medium and play the full etching region E6 of afflux effect.
Micro heat exchanger the most according to claim 1, it is characterised in that be etched with on described cold-producing medium throttling plate F:
The full etch-hole F4 flowed in or out for cold-producing medium；
Partially etching area F3 as refrigerant heat exchanger wall；
The full etch-hole F5 flowed in or out for cold-producing medium；
The full etch-hole F1 connected between each plate for fluid and full etch-hole F2；
Flow in or out for cold-producing medium and play the full etching region F6 of afflux effect;
Micro-throttling conduit F7 for cold-producing medium throttling；
Micro-throttling conduit F7 is characterised by, it is the full etching region F6 of communication and the elongate channels of full etch-hole F4 formed by engraving method on plate.
Micro heat exchanger the most according to claim 1, it is characterised in that do not have etching region on described blind plate sheet G, it is one piece of tabula rasa.
Micro heat exchanger the most according to claim 1, it is characterised in that the laminated layer sequence of 7 kinds of plates and the position relationship that constitute micro heat exchanger be:
1 cold-producing medium throttling plate F is positioned at the centre position of heat exchanger；
Fluid heat transfer plate D and refrigerant heat exchanger plate E two panels are one group, and repeated arrangement is in the both sides of throttling plate F, and its number of repetition does not limits；
Fluid heat transfer plate B and refrigerant heat exchanger plate C two panels are one group, and repeated arrangement is in fluid heat transfer plate D and the outside of refrigerant heat exchanger plate E, and its number of repetition does not limits；
1 fluid entry/exit plate A and 1 blind plate sheet G lays respectively at the outermost of described micro heat exchanger, and its position is interchangeable；
The partially etching area of each plate is all towards same direction；
The aligned in position of the full etch-hole on each plate, the most full etch-hole A1, B1, C1, D1, E1 and full etch-hole F1 alignment, full etch-hole A2, B2, C2, E2 and full etch-hole F2 alignment, full etch-hole B4, C4, E4 and full etch-hole F4 alignment, full etch-hole B5, C5, E5 and full etch-hole F5 alignment, full etch-hole D6, E6 and full etch-hole F6 alignment.
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| EP3186569A4 (en) * | 2014-08-26 | 2018-03-21 | Hussein Ezzat Khalifa | Micro environmental control system |
| CN104315757B (en) * | 2014-10-28 | 2016-08-24 | 武汉麦丘科技有限公司 | Condensation-throttling-evaporation integral micro heat exchanger |
| CN112066598A (en) * | 2019-06-11 | 2020-12-11 | 广东美的制冷设备有限公司 | Heat exchanger and air conditioning equipment |
| CN110762876B (en) * | 2019-11-11 | 2023-11-10 | 中国科学院上海技术物理研究所 | Liquid helium temperature zone throttling and evaporating integrated device |
| CN116642353B (en) * | 2023-07-24 | 2023-10-24 | 中国核动力研究设计院 | Current collecting structure, heat exchange core and heat exchanger |
| CN117680802B (en) * | 2024-01-11 | 2024-05-10 | 贵州永红航空机械有限责任公司 | Titanium alloy microchannel heat exchanger manufacturing method |
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