CN103740997A - Zinc-containing multiphase liquid metal thermal interface material and preparation method thereof - Google Patents
Zinc-containing multiphase liquid metal thermal interface material and preparation method thereof Download PDFInfo
- Publication number
- CN103740997A CN103740997A CN201310640464.4A CN201310640464A CN103740997A CN 103740997 A CN103740997 A CN 103740997A CN 201310640464 A CN201310640464 A CN 201310640464A CN 103740997 A CN103740997 A CN 103740997A
- Authority
- CN
- China
- Prior art keywords
- interface material
- liquid metal
- zinc
- thermal interface
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention discloses a zinc-containing multiphase liquid metal thermal interface material and a preparation method thereof. The zinc-containing multiphase liquid metal thermal interface material comprises the following components: by weight, 30-40% of bismuth, 10-20% of tin, 10-20% of zinc, and the balance of indium. The multiphase structure liquid metal thermal interface material designed by the invention is a quaternary alloy, is completely in a solid structure at room temperature and rolling temperature, and in a liquid-solid state at working temperature. In the working status, the solid content is about 60%. The multiphase structure liquid metal thermal interface material can maintain the liquid-solid state in a large range of working temperature, can fully inhibit the heated melting fluidity of a low melting point alloy foil, and can eliminate the liquid droplet leak problem. In addition, the thermal interface material thickness remains in the vicinity of 0.04mm, and the liquid phase surface tension can be further used to achieve the anti leakage effect..
Description
Technical field
The present invention relates to a kind of heat sink material, specifically, relate to a kind of heterogeneous liquid metal heat interface material containing zinc and preparation method thereof.
Background technology
Microelectronics is towards superpower, high speed, and the trend development such as miniaturization, and the high flux of heat that related device produces must be in time and is removed efficiently, and electron device working-surface temperature is maintained under its safe working temperature.Electronic component works long hours at high temperature, understands the serviceability of serious reduction electron device, has a strong impact on work-ing life and the stability of device.Along with microelectronics high speed development, electronic radiation product constantly presents variation by innovating.Heat interfacial material is for filling gap between heating element and radiator, plays the medium that improves heat-transfer effect.Conventional heat interfacial material is silicone grease, and after adding the metal or ceramic particle of high thermal conductivity coefficient, heat transfer coefficient can reach 2W/mK left and right.Silicone grease is generally used for working temperature 60
othe chip device of about C, and this material can after Long contact time air, produce aging, heat-transfer effect thereby can sharply decline along with the time.Liquid metal has high thermal conductivity, generally can maintain 80W/mK left and right.The surface tension and the wetting ability that rely on liquid metal excellence, liquid metal can be filled the high efficiency and heat radiation object that hole between heating element and radiator reaches microelectronic device completely.Liquid metal is for the heat-transfer capability of essential domain, and for example LED industry and pc domain, more and more cause extensive concern, and the Commercialization Trends of related products also comes with obvious.
General liquid metal thermal interface material, even as multicomponent material, has the characteristic melting at a certain temperature.When working temperature is greater than temperature of fusion, whole liquid metal thermal interface material will occur with the form of complete liquid state.Completely the liquid metal thermal interface material of melting overflows from hot interface under may be in working order, thereby makes microelectronic device and circuit card short circuit.For the interface that liquid metal is possible, omit phenomenon, in order to adapt to the day by day harsh radiating requirements of microelectronic element, in the urgent need to there will not be the appearance of the heat interfacial material of interface omission.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of heterogeneous liquid metal heat interface material containing zinc with the excessive effect of resistance and preparation method thereof is provided.
To achieve these goals, the present invention adopts following technical scheme:
A heterogeneous liquid metal heat interface material, is comprised of indium, bismuth, tin and zinc, and its weight percentage is: 30-40% bismuth, and 10-20% tin, 10-20% zinc, surplus is indium.
The preparation method of above-mentioned heterogeneous liquid metal heat interface material, comprises the steps:
(1) according to formula, claim metallic substance, utilize plumbago crucible and vacuum induction furnace alloy to be carried out under vacuum to melting and homogenizing processing, and alloy melt is cast into the foundry goods that thickness is 1mm;
(2) roughing: alloy-steel casting is put into roughing mill, and lubricated by ROLLING OIL, the passage of depressing of roughing is: 1mm-0.4mm-0.2mm-0.1mm; In roll: during the woollen after roughing is carried out, roll, lubricated by ROLLING OIL, under middle roll compacting, passage is: 0.1mm-0.06mm; Finish rolling: by material after rolling drop into finishing mill, by ROLLING OIL, be lubricated, the passage of depressing of finish rolling is 0.06mm-0.04mm;
(3) utilize organic solvent to carry out de-oiling processing the Alloy Foil obtaining, afterwards the Alloy Foil making is tailored into the size of design width packing warehouse-in through cutting machine.Organic solvent is preferably acetone.
Compared with prior art, the present invention has following beneficial effect:
Traditional liquid metal thermal interface material can only melt at single temperature, and the excessive liquid metal that may cause of mobility when liquid overflows inside and outside heating element and radiator hole, finally causes the short circuit of electron device.The heterogeneous structure liquid metal thermal interface material of the present invention's design is quad alloy, has solid-state structure completely under room temperature and rolling temperature.Under working temperature in liquid-solid state.In working order, the content of solid phase is in 60% left and right.There is on a large scale the state that keeps liquid-solid phase in working temperature, can fully suppress the mobility of alloy foil sheet with low-melting point melted by heating, eliminate the problem that drop leaks.In addition, the thickness of heat interfacial material maintains near 0.04mm, can further utilize the surface tension of liquid phase to reach the effect of Drain Resistance.
Accompanying drawing explanation
Fig. 1 is the liquid-solid schematic diagram of heterogeneous liquid metal heat interface material under in working order.
Fig. 2 is that heterogeneous liquid metal heat interface material is for structural representation between heating element and radiator.
Embodiment
Embodiment 1
A heterogeneous liquid metal heat interface material, is comprised of indium, bismuth, tin and zinc, and the weight percent proportioning of each composition is 30% bismuth, 10% tin, 20% zinc and 40% indium.Fusing point is between 70-120 ℃.According to the alloy of this formulated, after vacuum induction melting, be cast into the foundry goods that thickness is 1mm left and right.Rolling technology is carrying out roughing lower than 60 ℃ as described above, in roll and finish rolling, lubricated by ROLLING OIL, the passage of depressing of roughing is: 1mm-0.4mm-0.2mm-0.1mm; In roll: during the woollen after roughing is carried out, roll, lubricated by ROLLING OIL, under middle roll compacting, passage is: 0.1mm-0.06mm; Finish rolling: by material after rolling drop into finishing mill, by ROLLING OIL, be lubricated, the passage of depressing of finish rolling is 0.06mm-0.04mm; Finally make the Alloy Foil with 0.04mm thickness.The liquid-solid schematic diagram of gained heterogeneous liquid metal heat interface material under in working order as shown in Figure 1.Heterogeneous liquid metal heat interface material for the structural representation between heating element and radiator as shown in Figure 2.Confirm by experiment, this Alloy Foil has desirable heterogeneous structure between 70-120 ℃ in temperature, and liquid content, in 40wt% left and right, can effectively dispel the heat and prevent the side leakage of liquid alloy.
Embodiment 2
A heterogeneous liquid metal heat interface material, is comprised of indium, bismuth, tin and zinc, and the weight percent proportioning of each composition is 40% bismuth, 20% tin, 10% zinc and 30% indium.Fusing point is between 70-120 ℃.According to the alloy of this formulated, after vacuum induction melting, be cast into the foundry goods that thickness is 1mm left and right.Rolling technology is carrying out roughing lower than 60 ℃ as described above, in roll and finish rolling, lubricated by ROLLING OIL, the passage of depressing of roughing is: 1mm-0.4mm-0.2mm-0.1mm; In roll: during the woollen after roughing is carried out, roll, lubricated by ROLLING OIL, under middle roll compacting, passage is: 0.1mm-0.06mm; Finish rolling: by material after rolling drop into finishing mill, by ROLLING OIL, be lubricated, the passage of depressing of finish rolling is 0.06mm-0.04mm; Finally make the Alloy Foil with 0.04mm thickness.The liquid-solid schematic diagram of gained heterogeneous liquid metal heat interface material under in working order as shown in Figure 1.Heterogeneous liquid metal heat interface material for the structural representation between heating element and radiator as shown in Figure 2.Confirm by experiment, this Alloy Foil has desirable heterogeneous structure between 70-120 ℃ in temperature, and liquid content, in 40wt% left and right, can effectively dispel the heat and prevent the side leakage of liquid alloy.
Embodiment 3
A heterogeneous liquid metal heat interface material, is comprised of indium, bismuth, tin and zinc, and the weight percent proportioning of each composition is 35% bismuth, 15% tin, 15% zinc and 35% indium.Fusing point is between 70-120 ℃.According to the alloy of this formulated, after vacuum induction melting, be cast into the foundry goods that thickness is 1mm left and right.Rolling technology is carrying out roughing lower than 60 ℃ as described above, in roll and finish rolling, lubricated by ROLLING OIL, the passage of depressing of roughing is: 1mm-0.4mm-0.2mm-0.1mm; In roll: during the woollen after roughing is carried out, roll, lubricated by ROLLING OIL, under middle roll compacting, passage is: 0.1mm-0.06mm; Finish rolling: by material after rolling drop into finishing mill, by ROLLING OIL, be lubricated, the passage of depressing of finish rolling is 0.06mm-0.04mm; Finally make the Alloy Foil with 0.04mm thickness.The liquid-solid schematic diagram of gained heterogeneous liquid metal heat interface material under in working order as shown in Figure 1.Heterogeneous liquid metal heat interface material for the structural representation between heating element and radiator as shown in Figure 2.Confirm by experiment, this Alloy Foil has desirable heterogeneous structure between 70-120 ℃ in temperature, and liquid content, in 40wt% left and right, can effectively dispel the heat and prevent the side leakage of liquid alloy.
Claims (3)
1. a heterogeneous liquid metal heat interface material, is characterized in that being comprised of indium, bismuth, tin and zinc, and its weight percentage is: 30-40% bismuth, and 10-20% tin, 10-20% zinc, surplus is indium.
2. the preparation method of heterogeneous liquid metal heat interface material described in claim 1, is characterized in that comprising the steps:
(1) according to formula, claim metallic substance, utilize plumbago crucible and vacuum induction furnace alloy to be carried out under vacuum to melting and homogenizing processing, and alloy melt is cast into the foundry goods that thickness is 1mm;
(2) roughing: alloy-steel casting is put into roughing mill, and lubricated by ROLLING OIL, the passage of depressing of roughing is: 1mm-0.4mm-0.2mm-0.1mm; In roll: during the woollen after roughing is carried out, roll, lubricated by ROLLING OIL, under middle roll compacting, passage is: 0.1mm-0.06mm; Finish rolling: by material after rolling drop into finishing mill, by ROLLING OIL, be lubricated, the passage of depressing of finish rolling is 0.06mm-0.04mm;
(3) utilize organic solvent to carry out de-oiling processing the Alloy Foil obtaining, afterwards the Alloy Foil making is tailored into the size of design width packing warehouse-in through cutting machine.
3. preparation method as claimed in claim 1, is characterized in that, described organic solvent is acetone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310640464.4A CN103740997B (en) | 2013-12-04 | 2013-12-04 | A kind of heterogeneous liquid metal heat interface material containing zinc and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310640464.4A CN103740997B (en) | 2013-12-04 | 2013-12-04 | A kind of heterogeneous liquid metal heat interface material containing zinc and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103740997A true CN103740997A (en) | 2014-04-23 |
| CN103740997B CN103740997B (en) | 2016-04-27 |
Family
ID=50498061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310640464.4A Active CN103740997B (en) | 2013-12-04 | 2013-12-04 | A kind of heterogeneous liquid metal heat interface material containing zinc and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103740997B (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9856404B2 (en) | 2015-11-11 | 2018-01-02 | International Business Machines Corporation | Self-heating sealant or adhesive employing multi-compartment microcapsules |
| US9878039B1 (en) | 2016-09-01 | 2018-01-30 | International Business Machines Corporation | Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction |
| US9896389B2 (en) | 2015-11-11 | 2018-02-20 | International Business Machines Corporation | Heat-generating multi-compartment microcapsules |
| US10278284B2 (en) | 2016-08-25 | 2019-04-30 | International Business Machines Corporation | Laminate materials with embedded heat-generating multi-compartment microcapsules |
| CN109728496A (en) * | 2018-12-11 | 2019-05-07 | 昆明品启科技有限公司 | A kind of method of tie point heating problem in solution electric system |
| US10309692B2 (en) | 2015-11-11 | 2019-06-04 | International Business Machines Corporation | Self-heating thermal interface material |
| US10328535B2 (en) | 2016-11-07 | 2019-06-25 | International Business Machines Corporation | Self-heating solder flux material |
| US10357921B2 (en) | 2017-05-24 | 2019-07-23 | International Business Machines Corporation | Light generating microcapsules for photo-curing |
| CN110142473A (en) * | 2019-06-05 | 2019-08-20 | 深圳市启晟新材科技有限公司 | A kind of liquid metal and technique for car surface scratch and pit reparation |
| US10392452B2 (en) | 2017-06-23 | 2019-08-27 | International Business Machines Corporation | Light generating microcapsules for self-healing polymer applications |
| US10696899B2 (en) | 2017-05-09 | 2020-06-30 | International Business Machines Corporation | Light emitting shell in multi-compartment microcapsules |
| US10900908B2 (en) | 2017-05-24 | 2021-01-26 | International Business Machines Corporation | Chemiluminescence for tamper event detection |
| CN112981207A (en) * | 2019-12-12 | 2021-06-18 | 有研工程技术研究院有限公司 | Liquid metal thermal interface material with self-packaging function and preparation method thereof |
| US11795529B1 (en) | 2022-06-20 | 2023-10-24 | Industrial Technology Research Institute | Low-melting-point alloy composite material and composite material structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006159278A (en) * | 2004-12-10 | 2006-06-22 | Napura:Kk | Lead-free solder alloy for glass low-temperature joining and method for producing powder thereof |
| CN101420835A (en) * | 2007-10-26 | 2009-04-29 | 财团法人工业技术研究院 | Low melting point alloy thermal interface material |
| CN101812623A (en) * | 2009-02-19 | 2010-08-25 | 上海神沃电子有限公司 | Novel environment-friendly low-temperature alloy and preparation method thereof |
-
2013
- 2013-12-04 CN CN201310640464.4A patent/CN103740997B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006159278A (en) * | 2004-12-10 | 2006-06-22 | Napura:Kk | Lead-free solder alloy for glass low-temperature joining and method for producing powder thereof |
| CN101420835A (en) * | 2007-10-26 | 2009-04-29 | 财团法人工业技术研究院 | Low melting point alloy thermal interface material |
| CN101812623A (en) * | 2009-02-19 | 2010-08-25 | 上海神沃电子有限公司 | Novel environment-friendly low-temperature alloy and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| DONG PING TAO: "Prediction of activities of all components in the lead-free solder systems Bi-In-Sn and Bi-In-Sn-Zn", 《JOURNAL OF ALLOYS AND COMPOUNDS》 * |
| DONG PING TAO: "Prediction of activities of all components in the lead-free solder systems Bi–In–Sn and Bi–In–Sn–Zn", 《JOURNAL OF ALLOYS AND COMPOUNDS》 * |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11085672B2 (en) | 2015-11-11 | 2021-08-10 | International Business Machines Corporation | Self-heating thermal interface material |
| US10309692B2 (en) | 2015-11-11 | 2019-06-04 | International Business Machines Corporation | Self-heating thermal interface material |
| US9896389B2 (en) | 2015-11-11 | 2018-02-20 | International Business Machines Corporation | Heat-generating multi-compartment microcapsules |
| US9926471B2 (en) | 2015-11-11 | 2018-03-27 | International Business Machines Corporation | Self-heating sealant or adhesive employing multi-compartment microcapsules |
| US10072185B2 (en) | 2015-11-11 | 2018-09-11 | International Business Machines Corporation | Self-heating sealant or adhesive employing multi-compartment microcapsules |
| US9856404B2 (en) | 2015-11-11 | 2018-01-02 | International Business Machines Corporation | Self-heating sealant or adhesive employing multi-compartment microcapsules |
| US11140779B2 (en) | 2016-08-25 | 2021-10-05 | International Business Machines Corporation | Laminate materials with embedded heat-generating multi-compartment microcapsules |
| US10278284B2 (en) | 2016-08-25 | 2019-04-30 | International Business Machines Corporation | Laminate materials with embedded heat-generating multi-compartment microcapsules |
| US9878039B1 (en) | 2016-09-01 | 2018-01-30 | International Business Machines Corporation | Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction |
| US11007268B2 (en) | 2016-09-01 | 2021-05-18 | International Business Machines Corporation | Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction |
| US10548978B2 (en) | 2016-09-01 | 2020-02-04 | International Business Machines Corporation | Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction |
| US10328535B2 (en) | 2016-11-07 | 2019-06-25 | International Business Machines Corporation | Self-heating solder flux material |
| US10610980B2 (en) | 2016-11-07 | 2020-04-07 | International Business Machines Corporation | Self-heating solder flux material |
| US10696899B2 (en) | 2017-05-09 | 2020-06-30 | International Business Machines Corporation | Light emitting shell in multi-compartment microcapsules |
| US10926485B2 (en) | 2017-05-24 | 2021-02-23 | International Business Machines Corporation | Light generating microcapsules for photo-curing |
| US10900908B2 (en) | 2017-05-24 | 2021-01-26 | International Business Machines Corporation | Chemiluminescence for tamper event detection |
| US10357921B2 (en) | 2017-05-24 | 2019-07-23 | International Business Machines Corporation | Light generating microcapsules for photo-curing |
| US10696761B2 (en) | 2017-06-23 | 2020-06-30 | International Business Machines Corporation | Light generating microcapsules for self-healing polymer applications |
| US10703834B2 (en) | 2017-06-23 | 2020-07-07 | International Business Machines Corporation | Light generating microcapsules for self-healing polymer applications |
| US10392452B2 (en) | 2017-06-23 | 2019-08-27 | International Business Machines Corporation | Light generating microcapsules for self-healing polymer applications |
| CN109728496A (en) * | 2018-12-11 | 2019-05-07 | 昆明品启科技有限公司 | A kind of method of tie point heating problem in solution electric system |
| CN110142473A (en) * | 2019-06-05 | 2019-08-20 | 深圳市启晟新材科技有限公司 | A kind of liquid metal and technique for car surface scratch and pit reparation |
| CN112981207A (en) * | 2019-12-12 | 2021-06-18 | 有研工程技术研究院有限公司 | Liquid metal thermal interface material with self-packaging function and preparation method thereof |
| US11795529B1 (en) | 2022-06-20 | 2023-10-24 | Industrial Technology Research Institute | Low-melting-point alloy composite material and composite material structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103740997B (en) | 2016-04-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103740997B (en) | A kind of heterogeneous liquid metal heat interface material containing zinc and preparation method thereof | |
| CN103740978A (en) | Multiphase liquid metal thermal interface material with overflow resistant effect and preparation method thereof | |
| CN106884107B (en) | A kind of liquid metal thermal interface material with anti-molten characteristic and preparation method thereof | |
| CN104218010B (en) | A kind of metal heat interface material | |
| CN105349866A (en) | Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy | |
| Hu et al. | Effects of rare earth element Nd on the solderability and microstructure of Sn–Zn lead-free solder | |
| CN107053786B (en) | With the liquid metal thermal interface material from molten characteristic | |
| CN103614602B (en) | Liquid metal thermal interface material used in 120 DEG C and preparation method thereof | |
| CN103643099B (en) | A kind of liquid metal thermal interface material for 150 DEG C and preparation method thereof | |
| CN104263994A (en) | Graphene alloy composite thermal conductive material and preparation method thereof | |
| CN111534282A (en) | Phase-change heat storage material with low melting point and high volume latent heat, and preparation method and application thereof | |
| Yu et al. | Suppression of Cu 3 Sn and Kirkendall voids at Cu/Sn-3.5 Ag solder joints by adding a small amount of Ge | |
| Xu et al. | Study on microstructure and properties of Sn–0.3 Ag–0.7 Cu solder bearing Nd | |
| CN104339099A (en) | Medium-temperature solder containing copper and copper alloy | |
| CN104911441B (en) | Low-melting metal and preparation method thereof | |
| CN110306091A (en) | A kind of high wellability low thermal resistance liquid metal sheet and preparation method thereof | |
| TWI519636B (en) | High thermal conductivity composite solder | |
| Chellaih et al. | Effect of thermal contact heat transfer on solidification of Pb–Sn and Pb-free solders | |
| CN103526069B (en) | Electric-conductivity heat-conductivity high copper selenium complex alloy material | |
| CN103722804B (en) | A kind of Quaternary liquid metal heat interface material with two melting point character | |
| CN106957980B (en) | With the liquid metal thermal interface material from gain performance | |
| CN106756382B (en) | A kind of liquid metal that there is anti-molten characteristic to be used for 54-61 DEG C of heat dissipation | |
| CN113755138A (en) | Thermal interface material and electronic device comprising same | |
| CN113677148A (en) | Self-sealing type super-gas-dredging immersion type phase-change liquid-cooling reinforced heat dissipation plate and preparation method and application thereof | |
| CN109881042A (en) | A kind of cladded type 160-200 degree heat transmission tinbase liquid metal material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 315016 Zhejiang Province, Ningbo city Haishu District Cuibai Road No. 89 Ningbo advanced manufacturing industry public platform building 15 room 1509 Applicant after: Cao Shuai Address before: 102209 No. 6, building 202, building 20, Holiday Garden, beautiful tree, Beiqijia Town, Changping District, Beijing Applicant before: Cao Shuai |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 102209 CHANGPING, BEIJING TO: 315016 NINGBO, ZHEJIANG PROVINCE |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161019 Address after: 315040 Zhejiang city of Ningbo province high tech Zone Juxian Road No. 1299 Building 9 floor, room 908 Patentee after: Ningbo Shinri branch metal materials Co. Ltd. Address before: 315016 Zhejiang Province, Ningbo city Haishu District Cuibai Road No. 89 Ningbo advanced manufacturing industry public platform building 15 room 1509 Patentee before: Cao Shuai |