CN103733260B - 非易失性存储器阵列中的保存单元信息的非易失性存储器 - Google Patents

非易失性存储器阵列中的保存单元信息的非易失性存储器 Download PDF

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Publication number
CN103733260B
CN103733260B CN201280037360.8A CN201280037360A CN103733260B CN 103733260 B CN103733260 B CN 103733260B CN 201280037360 A CN201280037360 A CN 201280037360A CN 103733260 B CN103733260 B CN 103733260B
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China
Prior art keywords
mram
address
circuit
unit
element address
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Chinese (zh)
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CN103733260A (zh
Inventor
金正丕
金泰焕
哈利·M·拉奥
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Qualcomm Inc
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Qualcomm Inc
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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70Masking faults in memories by using spares or by reconfiguring
    • G11C29/78Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/785Masking faults in memories by using spares or by reconfiguring using programmable devices with redundancy programming schemes
    • G11C29/789Masking faults in memories by using spares or by reconfiguring using programmable devices with redundancy programming schemes using non-volatile cells or latches
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70Masking faults in memories by using spares or by reconfiguring
    • G11C29/78Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/84Masking faults in memories by using spares or by reconfiguring using programmable devices with improved access time or stability
    • G11C29/846Masking faults in memories by using spares or by reconfiguring using programmable devices with improved access time or stability by choosing redundant lines at an output stage
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C2029/4402Internal storage of test result, quality data, chip identification, repair information

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
CN201280037360.8A 2011-07-25 2012-07-25 非易失性存储器阵列中的保存单元信息的非易失性存储器 Active CN103733260B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/189,784 US8638596B2 (en) 2011-07-25 2011-07-25 Non-volatile memory saving cell information in a non-volatile memory array
US13/189,784 2011-07-25
PCT/US2012/048208 WO2013016467A1 (en) 2011-07-25 2012-07-25 Non-volatile memory saving cell information in a non-volatile memory array

Publications (2)

Publication Number Publication Date
CN103733260A CN103733260A (zh) 2014-04-16
CN103733260B true CN103733260B (zh) 2016-12-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280037360.8A Active CN103733260B (zh) 2011-07-25 2012-07-25 非易失性存储器阵列中的保存单元信息的非易失性存储器

Country Status (7)

Country Link
US (1) US8638596B2 (enExample)
EP (1) EP2737484A1 (enExample)
JP (2) JP6086451B2 (enExample)
KR (2) KR20160029871A (enExample)
CN (1) CN103733260B (enExample)
IN (1) IN2014CN00296A (enExample)
WO (1) WO2013016467A1 (enExample)

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KR102083266B1 (ko) * 2013-11-29 2020-03-03 삼성전자주식회사 반도체 메모리 장치의 테스트 방법 및 반도체 메모리 시스템
US9747967B2 (en) 2014-09-26 2017-08-29 Intel Corporation Magnetic field-assisted memory operation
US9401226B1 (en) * 2015-09-14 2016-07-26 Qualcomm Incorporated MRAM initialization devices and methods
US10415408B2 (en) * 2016-02-12 2019-09-17 General Electric Company Thermal stress relief of a component
US10283212B2 (en) 2016-11-29 2019-05-07 International Business Machines Corporation Built-in self-test for embedded spin-transfer torque magnetic random access memory
US9805828B1 (en) * 2017-02-21 2017-10-31 Micron Technology, Inc. Memory apparatus with post package repair
US11532783B2 (en) * 2020-03-05 2022-12-20 Tdk Corporation Magnetic recording array, neuromorphic device, and method of controlling magnetic recording array
CN114187954B (zh) * 2020-09-15 2024-08-23 长鑫存储技术有限公司 存储器装置及其测试方法和使用方法、存储器系统
EP4036917B1 (en) 2020-09-15 2023-05-24 Changxin Memory Technologies, Inc. Memory device, testing method therefor and usage method therefor, and memory system

Citations (5)

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US6285620B1 (en) * 1999-12-28 2001-09-04 United Microelectronics Corp. Semiconductor device and method for repairing failed memory cell by directly programming fuse memory cell
US6809976B2 (en) * 2002-07-25 2004-10-26 Renesas Technology Corp. Non-volatile semiconductor memory device conducting read operation using a reference cell
CN1849671A (zh) * 2003-09-10 2006-10-18 海珀斯通股份公司 管理闪存内的故障块
CN1862706A (zh) * 2005-05-12 2006-11-15 恩益禧电子股份有限公司 易失性半导体存储器
US7257020B2 (en) * 2002-06-04 2007-08-14 Renesas Technology Corp. Thin film magnetic memory device having redundant configuration

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JPS63219045A (ja) * 1987-03-09 1988-09-12 Hitachi Ltd Icカ−ド
JP2914171B2 (ja) * 1994-04-25 1999-06-28 松下電器産業株式会社 半導体メモリ装置およびその駆動方法
JPH11249969A (ja) * 1997-10-09 1999-09-17 Matsushita Electric Ind Co Ltd アドレス変換回路およびアドレス変換システム
JP2002015595A (ja) * 2000-06-29 2002-01-18 Sanyo Electric Co Ltd 冗長メモリ回路
JP2003208796A (ja) * 2002-01-15 2003-07-25 Mitsubishi Electric Corp 薄膜磁性体記憶装置
US6801471B2 (en) 2002-02-19 2004-10-05 Infineon Technologies Ag Fuse concept and method of operation
JP2005276276A (ja) 2004-03-23 2005-10-06 Toshiba Corp 半導体集積回路装置
JP4686350B2 (ja) * 2005-12-09 2011-05-25 株式会社東芝 不揮発性半導体記憶装置及びその自己テスト方法
KR101228519B1 (ko) * 2005-12-12 2013-02-01 삼성전자주식회사 반도체 메모리 장치, 그것을 포함한 테스트 시스템, 그리고반도체 메모리 장치의 리페어 방법
US7362644B2 (en) * 2005-12-20 2008-04-22 Magic Technologies, Inc. Configurable MRAM and method of configuration
US7764537B2 (en) 2007-04-05 2010-07-27 Qualcomm Incorporated Spin transfer torque magnetoresistive random access memory and design methods
KR101373183B1 (ko) * 2008-01-15 2014-03-14 삼성전자주식회사 3차원 어레이 구조를 갖는 메모리 장치 및 그것의 리페어방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6285620B1 (en) * 1999-12-28 2001-09-04 United Microelectronics Corp. Semiconductor device and method for repairing failed memory cell by directly programming fuse memory cell
US7257020B2 (en) * 2002-06-04 2007-08-14 Renesas Technology Corp. Thin film magnetic memory device having redundant configuration
US6809976B2 (en) * 2002-07-25 2004-10-26 Renesas Technology Corp. Non-volatile semiconductor memory device conducting read operation using a reference cell
CN1849671A (zh) * 2003-09-10 2006-10-18 海珀斯通股份公司 管理闪存内的故障块
CN1862706A (zh) * 2005-05-12 2006-11-15 恩益禧电子股份有限公司 易失性半导体存储器

Also Published As

Publication number Publication date
JP2015228274A (ja) 2015-12-17
US8638596B2 (en) 2014-01-28
IN2014CN00296A (enExample) 2015-04-03
JP2014522074A (ja) 2014-08-28
JP6400535B2 (ja) 2018-10-03
EP2737484A1 (en) 2014-06-04
US20130028009A1 (en) 2013-01-31
CN103733260A (zh) 2014-04-16
KR20160029871A (ko) 2016-03-15
JP6086451B2 (ja) 2017-03-01
KR20140047145A (ko) 2014-04-21
WO2013016467A1 (en) 2013-01-31

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