CN103715189A - Lighting device and illuminating device - Google Patents
Lighting device and illuminating device Download PDFInfo
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- CN103715189A CN103715189A CN201310376563.6A CN201310376563A CN103715189A CN 103715189 A CN103715189 A CN 103715189A CN 201310376563 A CN201310376563 A CN 201310376563A CN 103715189 A CN103715189 A CN 103715189A
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- distribution
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- emitting device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention provides a lighting device and an illuminating device. A plurality of lighting elements can be densely installed on the lighting device. In the embodiments, the lighting device comprises a substrate, a plurality of lighting elements installed on the substrate and wirings. A plurality of referential recesses for installing the lighting elements are arranged on the substrate and electrically connected with the lighting elements.
Description
Technical field
The present invention relates to a kind of light-emitting device and lighting device.
Background technology
The light emitting module using in luminescence unit as lighting device (module) (light-emitting device), for example, have and a plurality of LED (Light Emitting Diode, light-emitting diode) are installed on the substrate that becomes substrate (base) and carry out resin-sealed form.And, in the lighting device of large light quantity, accommodating a plurality of light emitting modules.Yet, with regard to carrying out the lens (lens) of the distribution controls of lighting device or the design of reflecting plate, to compare with the device of accommodating a plurality of light emitting modules, the design with the device of 1 light emitting module is more prone to.The light emitting module that therefore, need to have the large light quantity that a plurality of light-emitting components are installed to high-density.
[background technology document]
[patent documentation]
[patent documentation 1] Japanese Patent Laid-Open 2011-060961 communique
Summary of the invention
[problem that invention will solve]
Execution mode provides a kind of lighting device that the light-emitting device of a plurality of light-emitting components can be installed to high-density and use this light-emitting device.
[solving the technological means of problem]
Light-emitting device in execution mode comprises: substrate; A plurality of light-emitting components, are arranged on described substrate; And distribution, on described substrate, there are a plurality of recesses of the benchmark of the installation site that becomes described a plurality of light-emitting components, and be electrically connected at described a plurality of light-emitting component.
[effect of invention]
Execution mode is realized the lighting device that the light-emitting device of a plurality of light-emitting components can be installed to high-density and use this light-emitting device.
Accompanying drawing explanation
Fig. 1 (a), Fig. 1 (b) mean the schematic diagram of the light-emitting device in the 1st execution mode.
Fig. 2 is the vertical view that schematically shows the distribution of the light-emitting device in the 1st execution mode.
Fig. 3 (a), Fig. 3 (b), Fig. 3 (c) mean the schematic diagram of the reference mark (fiducial mark) of the light-emitting device in the 1st execution mode.
Fig. 4 is another vertical view that schematically shows the distribution of the light-emitting device in the 1st execution mode.
Fig. 5 is the stereogram that schematically shows the one pole connector in the 1st execution mode.
Fig. 6 (a), Fig. 6 (b) mean the schematic diagram of the luminescence unit of the lighting device in the 2nd execution mode.
Fig. 7 means the calcspar of the formation of the lighting device in the 2nd execution mode.
The explanation of symbol:
1: light-emitting device
10: substrate
13、13a、13b、15:LED
17: periphery frame
19,19a～19d: coated with glass
20,30:LED group
20a:LED group
21,23,27,29,55,57: distribution
21a, 23a, 27a, 29a: terminal
21b, 23b, 27b, 29b: all frames are overlapped in the part of distribution
21f, 23f: the region that reference mark is set
21w, 23w: the region of jointing metal line
22,24: terminal group
25: resin bed
26,28: metal level
31,33: chip capacitor
35: metal wire
37,37a, 37b, 39: reference mark
40: one pole connector
43: jack portion
43a: insert port
43b: basal part
43c: sheath portion
44: fluorophor
45: intercalation part
45a: ca(u)lk portion
45b: heart yearn fixed part
45c: insertion section
46: adhesive
47,47a～47d: wire
51a, 55a, 57a: contact portion
60: framework
60a, 67: opening
63: heating panel
65: bottom surface
69: speculum
71: light transmission outer cover
75,77: lamp circuit
82: source power supply
100: lighting device
110: luminescence unit
120: lighting unit
AL: straight line
ID: direction of insertion
W
m, W
c: arrangement pitches
Embodiment
Below, with reference to graphic, embodiments of the present invention are described.In addition, also suitably description is omitted for the same section in graphic, to mark identical numbering, and different piece is described.In addition, sometimes with reference to the XY orthogonal coordinates shown in figure, inscape is described.
[the 1st execution mode]
Fig. 1 (a), Fig. 1 (b) mean the schematic diagram of the light-emitting device 1 in the 1st execution mode.Fig. 1 (a) means the vertical view of the light-emitting area of light-emitting device 1.Fig. 1 (b) is along the I shown in Fig. 1 (a)
b-I
bthe cutaway view of line.
Light-emitting device 1 in example is the light emitting module that a plurality of light-emitting components, for example light-emitting diode (Light Emitting Diode:LED) are installed on substrate 10.
In light-emitting device 1, on substrate 10, comprise the distribution 21,23 being electrically connected with a plurality of LED13 and the distribution 27,29 being electrically connected with a plurality of LED15.And a plurality of recesses that each distribution has the benchmark of the installation site that becomes LED13 and 15 are reference mark (fiducial mark) 37.
For example,, when want to install to high-density LED13 and 15 and while realizing the light-emitting device 1 of large light quantity, if do not determine exactly the installation site of each LED chip, so easily produce the unfavorable condition that chip contacts with each other on substrate 10.In order to prevent this situation, advantageously on substrate 10, set reference mark.Yet, if append reference mark on substrate 10, may cause so comprising the configuration space of reference mark between each interior inscape and narrow down, and insulation property or migration (migration) tolerance are reduced.
Therefore, in execution mode, by distribution 21,23,27 and 29, reference mark 37 being set respectively, maintain on the one hand insulation property or the migration tolerance of substrate 10, on the one hand LED chip can accurately be installed.Thus, the high-density installation of LED13 and 15 can be realized, thereby the light-emitting device 1 of small-sized and large light quantity can be realized.
Below, with reference to Fig. 1～Fig. 5, light-emitting device 1 is elaborated.
Light-emitting device 1 shown in Fig. 1 comprises: the 1st light-emitting component group (hereinafter referred to as LED group 20), comprises a plurality of the 1st light-emitting components (hereinafter referred to as LED13) that are arranged on substrate 10; And the 2nd light-emitting component group (LED group 30), comprise a plurality of the 2nd light-emitting components (hereinafter referred to as LED15) that are arranged on equally on substrate 10.LED group 20 and LED group 30 are that directions X is installed abreast along the 1st direction on substrate 10.
Light-emitting device 1 has a plurality of terminal 21a, 23a, 27a and the 29a that is electrically connected at LED group 20 and LED group 30.And, jack (receptacle) portion 43 of the one pole connector 40 that a plurality of terminals comprise each end that is arranged on respectively each distribution.In addition, in this specification, said terminal represents the end of each distribution itself sometimes, sometimes represent to comprise be arranged on its end jack portion 43 interior.
The terminal group that comprises terminal 21a, 23a, 27a and 29a is arranged on LED group 20 a side contrary with LED group 30 abreast along directions X.That is to say, LED group 20 is arranged between LED group 30 and terminal group.
In addition, light-emitting device 1 comprises the periphery frame 17 that is arranged on substrate 10 and surrounds LED group 20 and LED group 30.And, in the inner side of periphery frame 17, the resin bed 25 that covers LED group 20 and LED group 30 is being set.
As shown in Fig. 1 (b), resin bed 25 is resins of sealing LED group 20 and 30, for example, comprise fluorophor 44.Fluorophor 44 is excited by the radiating light of LED group 20 and 30, and radiates the light with this exciting light different wave length.
In resin bed 25, for example, can use silicone resin (silicone resin).In addition, periphery frame 17 also comprises resin, for example, comprise silicone (silicone).The LED15 comprising in the LED13 comprising in LED group 20 and LED group 30 is for example blue led, and fluorophor 44 is for example Yttrium-Aluminium-Garnet (Yttrium Aluminum Garnet, YAG) fluorophor.And light-emitting device 1 is emitted the white light being formed by the blue light radiating from LED13 and LED15 and the yellow light mix radiating from fluorophor 44.
As mentioned below, periphery frame 17 covers distribution 21, distribution 23, distribution 27 and distribution 29 part separately.And, as shown in Fig. 1 (b), in the part being covered by periphery frame of each distribution, carry out coated with glass (glass coat) 19.Thus, can improve the adhesive force between each distribution and periphery frame 17.
In addition, as shown in Fig. 1 (b), a plurality of LED13 that are arranged between distribution 21 and distribution 23 are connected in series via metal wire 35.And the anode (anode) that is positioned at the LED13a of the one end being connected in series is to be electrically connected at distribution 21 via metal wire 35.The negative electrode (cathode) that is positioned at the LED13b of the other end being connected in series is also via metal wire 35, to be electrically connected at distribution 23.In addition, a plurality of LED15 that are arranged between distribution 27 and distribution 29 are connected in series via metal wire 35.And the anode that is positioned at the LED15 of this one end being connected in series is to be connected in distribution 27 via metal wire 35, the negative electrode that is positioned at the LED15 of the other end is via metal wire 35, to be connected in distribution 29.
In the present embodiment, the LED group 20 who is arranged between distribution 21 and distribution 23 comprises 4 LED group 20a that are connected in series, and each LED group 20a comprises respectively 57 LED13.And, can be between distribution 21 and distribution 23, the voltage that for example applies 160V makes LED group 20 luminous.Also identical with the LED group 30 between distribution 29 about being arranged on distribution 27.
In addition, LED13 and LED15 are arranged on substrate 10 via adhesive 46, and between each LED, utilize metal wire and connect.Therefore, without be formed for the joint sheet (bonding pad) that chip is installed the welding disk pattern (land pattern) of (chip mount) and engaged (wire bonding) for routing in LED group 20 region and installation LED group's 30 region are installed.Therefore, can be to consider that the beeline of thermal diffusivity or workability installs each LED.Thus, can realize the miniaturization of light-emitting device 1.In addition, can realize the luminous pattern without speck, easy thereby the control of light distribution characteristic also becomes.
On distribution 21,23,27 and 29, reference mark 37 is being set.Reference mark 37 is for example from the surface of each distribution, to arrive the through hole of substrate 10, and is patterned with each distribution simultaneously.Like this, by the part at Wiring pattern, reference mark 37 is set, and can realizes reduction or the save space of the processing cost of substrate 10.
In addition, the both sides of the periphery frame 17 on directions X, are installed with chip capacitor (chip capacitor) 31 and 33.Chip capacitor 31 is removed the power supply noise (noise) between distribution 21 and distribution 23, and chip capacitor 33 is removed the power supply noise between distribution 27 and distribution 29.
Fig. 2 is the vertical view that schematically shows the distribution of the light-emitting device 1 in the 1st execution mode.In figure, represent to remove the state after periphery frame 17, chip capacitor 31,33 and jack portion 43 from the layout (layout) shown in Fig. 1 (a).
Thus, can make to be arranged on the LED group 20 of inner side of periphery frame 17 and LED group 30 is connected to independently lamp circuit and moves.That is to say, can increase the quantity of the LED that is arranged on light-emitting zone in the situation that use not drive the larger lamp circuit of current capacity of all LED, make its light quantity become large.
In addition, upper in the 2nd direction (Y-direction) that is orthogonal to the 1st direction, distribution 21 and distribution 27 are adjacent to the one end in the region that LED group 20 is installed and configure.And distribution 23 and distribution 29 are adjacent to the other end in the region that LED group 20 is installed and configure.In addition, distribution 21 is arranged between distribution 27 and LED group 20, and distribution 23 is arranged between distribution 29 and LED group 20.
Thus, can make by the length of the metal wire 35 being connected between LED group 20 and distribution 21 equal in length with by the metal wire 35 being connected between LED group 30 and distribution 27.In addition, also can make by the length of the metal wire 35 being connected between LED group 20 and distribution 23 equal in length with by the metal wire 35 being connected between LED group 30 and distribution 29.Thus, can make the joint of metal wire 35 become easily, thereby improve operating efficiency.In addition, can make the loop (looping) of metal wire 35 keep most suitable state.Thus, can reduce the risk (risk) of the caused broken string of thermal cycle (heat cycle) being produced by the connection disconnection (on/off) because of drive current.
The terminal group 22 that comprises terminal 21a and terminal 27a (the 1st terminal group) and the terminal group 24 (the 2nd terminal group) that comprises terminal 23a and terminal 29a arrange abreast along the Y-direction Yi Zuwei unit on substrate 10.That is to say, by be connected in the anode of LED13 and 15 distribution 21 and 27, be connected in the distribution 23 and 29 of negative electrode, collect respectively the both sides that are configured in LED group 20 installation region.And, because the potential difference between distribution 21 and distribution 27 and between distribution 23 and distribution 29 is less, so can suppress each, approach the metal migration in portion.Thus, can improve the reliability of light-emitting device 1.
Fig. 3 means the schematic diagram of the reference mark of the light-emitting device in the 1st execution mode.Fig. 3 (a) represents to be arranged on the position relationship of reference mark 37 on distribution 21 and 23 and LED13.Fig. 3 (b) and Fig. 3 (c) are respectively the III along distribution 23
b-III
bthe section of line, the structure of two kinds of different reference marks of expression.
As mentioned above, distribution 21 and 23 is separately positioned on the both sides of LED group 20 installation region.Reference mark 37 is arranged on distribution 21 and distribution 23 on the two.
As shown in Fig. 3 (a), a plurality of LED13 that comprise in LED group 20 are for example matrix (matrix) shape and are configured between distribution 21 and distribution 23.A plurality of LED13 are in the Y direction mounted in and will be arranged on the straight line AL being connected between reference mark 37a on distribution 21 and the reference mark 37b being arranged on distribution 23 side by side.And, be arranged on the arrangement pitches W of the reference mark 37 on distribution 21 and 23
marrangement pitches W with the directions X of LED13
cidentical.
The LED group 20a that LED group 20 comprises a plurality of LED13 of comprising that are connected in series.And the anode and the distribution 21 that are positioned at the LED13a of the one end being connected in series are to be electrically connected via metal wire 35.In addition, the negative electrode and the distribution 23 that are positioned at the LED13b of the other end are to be electrically connected via metal wire 35.
Described formation is also identical for distribution 27 and 29 with the LED group 30 who is installed on therebetween.
In addition, as each distribution, for example, aluminium base or epoxy glass substrate, used gold-plated on the Copper Foil distribution through etching and processing or the silver-colored distribution forming so if.Ceramic substrate if, is used take that silver is principal component utilize the silver-colored printed wiring that printing paste (paste) forms or be further the gold-plated distribution forming thereon so.
For example, identification is arranged on the reference mark 37a on distribution 21 and is arranged on the reference mark 37b on distribution 23, and on the line AL connecting therebetween, sets the installation site of LED13.Then, LED13 is arranged on the position setting.Secondly, make substrate 10 on directions X, only be offset W
m, on the line connecting respectively with the reference mark 37 of reference mark 37a and 37b adjacency, set the installation site of LED13, and LED13 be installed.By repeatedly carrying out this operation, can a plurality of LED13 be installed precision well.
In the example shown in Fig. 3 (c), distribution 23 comprises metal level 26 and metal level 28.And reference mark 39 is arrive the recess of metal level 28 and form as the upper surface from metal level 26.And, if the image pickup part at the erecting device of LED chip has under the optical wavelength of sensitivity, the reflectivity of metal level 26 is different from the reflectivity of metal level 28, and the surperficial reflectivity of distribution 23 is different from the reflectivity of the bottom surface of recess so, thereby erecting device can be identified reference mark 39.
For example, if metal level 28 is made as to Copper Foil distribution, metal level 26 is made as to the coating of gold or silver, in visible region, both reflectivity are different so, thereby can identify reference mark 39.In addition, also metal level 28 can be made as to silver-colored printed wiring, metal level 26 is made as to Gold plated Layer.
Like this, in execution mode, by making the erecting device identification reference mark of LED chip, and can set exactly the installation site of LED chip.Thus, the high-density installation of LED chip can be realized, thereby the light-emitting device of large light quantity can be realized.
Fig. 4 is another vertical view that schematically shows the distribution of the light-emitting device 1 in the 1st execution mode.In this figure, represent arranging the state of the coated with glass 19 that covers distribution 21,23,27 and 29.As shown in the drawing, coated with glass 19 is arranged on a plurality of parts on substrate 10.
Coated with glass 19a covers the part 27b that periphery frame 17 is overlapped in the part 21b of distribution 21 and is overlapped in distribution 27.In addition also cover except the 51a of contact portion installing for jack portion 43 and terminal 21a and the 27a 51b.
Coated with glass 19b covers the part 29b that periphery frame 17 is overlapped in the part 23b of distribution 23 and is overlapped in distribution 29.In addition also cover except the 51a of contact portion installing for jack portion 43 and terminal 23a and the 29a 51b.
Coated with glass 19c is covered in the part 29c that periphery frame 17 covers the part 27c of distribution 27 and covers distribution 29.In addition,, except the 57a of contact portion of chip capacitor 33, coated with glass 19c covers distribution 57.
Except the 55a of contact portion of chip capacitor 31, coated with glass 19d covers distribution 55.
Like this, except the part of jointing metal line 35 and arranging the part of reference mark 37, coated with glass 19 covers each distributions.Thus, protect the surface of each distribution, such as suppressing to get rusty or corrosion etc.In addition, in the part contacting with periphery frame 17, improve the adhesive force of periphery frame 17.
The part of jointing metal the line 35 and sealed LED13 of part of reference mark 37 is being set and the resin bed 25 of LED15 and cover (with reference to Fig. 1).Therefore, be preferably, the bottom surface of the recess of the part of jointing metal line 35 and reference mark 37 is larger to the adhesive force of resin 25.For example, in Fig. 3, in the situation that the tack of 26 pairs of resins 25 of metal level is poor, be preferably the use material larger to the adhesive force of resin bed 25 in metal level 28.
Fig. 5 is the stereogram that schematically shows the one pole connector 40 in the 1st execution mode.The intercalation part 45 that one pole connector 40 has jack portion 43 and inserts for jack portion 43.Fig. 5 represents the state that jack portion 43 is separated with intercalation part 45.
In the layout shown in Fig. 1, the direction of insertion ID that is arranged on each jack portion 43 on terminal 21a, 23a, 27a and 29a is all parallel to directions X.Thus, light-emitting device 1 becomes easily and workability raising with the combination of wire 47.
In addition, the width of Y-direction in region of each terminal is being set narrower than width and the arbitrary wider side that is installed with in LED group 30 the width of Y-direction in region of Y-direction in region that LED group 20 is installed.Thus, make, under the chimeric state of jack portion 43 and intercalation part 45, can to make the amplitude of the Y-direction of wire 47 narrow down.Its result is to realize the miniaturization of the lighting device of mounting light emitting device 1.
[the 2nd execution mode]
Fig. 6 means the schematic diagram of the luminescence unit 110 of the lighting device 100 in the 2nd execution mode.Fig. 6 (a) means the side of luminescence unit 110 and the schematic diagram of a part of section, and Fig. 6 (b) is upward view.Fig. 7 means the calcspar of the formation of the lighting device 100 in the 2nd execution mode.
As shown in Fig. 6 (a), luminescence unit 110 has framework 60 and a plurality of heating panel 63.Framework 60 has the downward opening 60a of expansion.Light-emitting device 1 is arranged on the bottom surface 65 of opening 60a, and its light-emitting area downward.Framework 60 is for example the aluminium framework being shaped through die casting (die-cast), and via heating panel 63, from bottom surface 65 efficiency of opening 60a, discharges well the heat of light-emitting device 1.
In the side of opening 60a, speculum 69 is being set.And, below light-emitting device 1, configuring the light transmission outer cover 71 that is connected in speculum 69.That is to say, light-emitting device 1 is contained in the bottom surface 65 and the space between light transmission outer cover 71 of opening 60a.
In light-emitting device 1, via one pole connector 40, connecting multiple conducting wires 47.And, via being arranged on the opening 67 in framework 60, be drawn out to outside wire 47 and be connected in not shown lighting unit 120.
As shown in Figure 7, lighting device 100 comprises: luminescence unit 110, comprises LED group 20 and LED group 30; And lighting unit 120, to LED group 20 and LED group 30, supply with electric power.Lighting unit 120 has the 1st lamp circuit (hereinafter referred to as lamp circuit 75) and the 2nd lamp circuit (hereinafter referred to as lamp circuit 77) that is connected in luminescence unit 110 via multiple conducting wires 47.
The jack portion 43 of one pole connector 40 is installed respectively on a plurality of terminal 21a, 23a, 27a and 29a.And, in each end of multiple conducting wires 47a～47d, connecting respectively the intercalation part 45 that is embedded in jack portion 43.And, by making jack portion 43 and intercalation part 45 chimeric, and will between distribution 21 and wire 47a, between distribution 23 and wire 47b, between distribution 27 and wire 47c and between distribution 29 and wire 47d, be connected via one pole connector 40.
That is to say, lamp circuit 75 via be connected in LED13 anode terminal 21a and be connected in the terminal 23a of negative electrode of LED13 and driving LED group 20.In addition, lamp circuit 77 via be connected in LED15 anode terminal 27a and be connected in the terminal 29a of negative electrode of LED15 and driving LED group 30.
On the other hand, lamp circuit 75 and lamp circuit 77 are for example connected in source power supply 82 via concentric plug (concentric plug).In addition, lamp circuit 75 and lamp circuit 77 have and can supply with the capacity of electric current to half being arranged in a plurality of LED on substrate 10, can reach half capacity in the situation of utilizing 1 lamp circuit to supply with electric power.That is to say lamp circuit that can use cost is low and reliability is higher.In addition, also can be more than 3 LED group is installed on substrate 10, and make them be connected to the form of lamp circuit.
Above, according to execution mode, by reference mark is set on distribution, LED chip can be arranged on substrate exactly.Thus, LED chip is installed accessibly to high-density, thereby can be realized the light-emitting device 1 of large light quantity.In addition, can make the installation region of light-emitting component diminish and realize miniaturization, and can eliminate luminance nonuniformity.
That is to say, light-emitting device 1 can be regarded as and comprises to high-density the LED13 that installs and 1 area source of LED15.Therefore, the distribution controls of speculum 69 becomes easily, can reduce the manufacturing cost of lighting device 100.
In said embodiment, the LED being arranged on substrate is divided into a plurality of groups, and the distribution being connected with them is respectively being set, but is not limited to this example.For example, also can be there are a plurality of LED of being arranged on substrate, 1 lamp circuit and by the form of the distribution connecting therebetween.
Some execution modes of the present invention have below been described, but these execution modes only present as example, be not intended to limit scope of invention.These novel execution modes can be implemented with other various forms, and can, within not departing from the scope of inventive concept, carry out various omissions, displacement and change.These execution modes and distortion thereof belong in scope of invention or purport, and belong in the invention described in claim and the scope equal with it.
Claims (4)
1. a light-emitting device, is characterized in that, comprises:
Substrate;
Be arranged on a plurality of light-emitting components on described substrate;
Distribution, on described substrate, has a plurality of recesses of the benchmark of the installation site that becomes described a plurality of light-emitting components, and is electrically connected at described a plurality of light-emitting component.
2. light-emitting device according to claim 1, is characterized in that: described recess is from the surface of described distribution, to arrive the through hole of described substrate.
3. light-emitting device according to claim 1, is characterized in that: described distribution comprises for the different a plurality of metal levels of the reflection of light rate of provision wavelengths, and
In the bottom surface of described recess, expose the metal level different from the surface reflectivity of described distribution.
4. a lighting device, is characterized in that, comprises:
Luminescence unit, has light-emitting device as claimed any one in claims 1 to 3; And lighting unit, there is the lamp circuit that drives described light-emitting device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012222941A JP5999341B2 (en) | 2012-10-05 | 2012-10-05 | Light emitting device and lighting device |
| JP2012-222941 | 2012-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103715189A true CN103715189A (en) | 2014-04-09 |
Family
ID=50408032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310376563.6A Pending CN103715189A (en) | 2012-10-05 | 2013-08-26 | Lighting device and illuminating device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5999341B2 (en) |
| CN (1) | CN103715189A (en) |
| TW (1) | TW201415605A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6406516B2 (en) * | 2015-02-12 | 2018-10-17 | 東芝ライテック株式会社 | Lighting device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006212825A (en) * | 2005-02-01 | 2006-08-17 | Oki Data Corp | Wiring board and led head |
| US20100079997A1 (en) * | 2005-07-15 | 2010-04-01 | Matsushita Electric Industrial Co., Ltd. | Light-emitting module and mounting board used therefor |
| TW201230268A (en) * | 2010-10-26 | 2012-07-16 | Toshiba Lighting & Technology Corp | Luminous module and lighting apparatus |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005134444A (en) * | 2003-10-28 | 2005-05-26 | Matsushita Electric Works Ltd | Optical waveguide module and its manufacturing method |
| JP5376404B2 (en) * | 2009-09-09 | 2013-12-25 | 東芝ライテック株式会社 | Light emitting device |
-
2012
- 2012-10-05 JP JP2012222941A patent/JP5999341B2/en not_active Expired - Fee Related
-
2013
- 2013-08-26 CN CN201310376563.6A patent/CN103715189A/en active Pending
- 2013-08-30 TW TW102131275A patent/TW201415605A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006212825A (en) * | 2005-02-01 | 2006-08-17 | Oki Data Corp | Wiring board and led head |
| US20100079997A1 (en) * | 2005-07-15 | 2010-04-01 | Matsushita Electric Industrial Co., Ltd. | Light-emitting module and mounting board used therefor |
| TW201230268A (en) * | 2010-10-26 | 2012-07-16 | Toshiba Lighting & Technology Corp | Luminous module and lighting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5999341B2 (en) | 2016-09-28 |
| JP2014075516A (en) | 2014-04-24 |
| TW201415605A (en) | 2014-04-16 |
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