TWM611905U - Packaging structure of edge-lit LED - Google Patents

Abstract

This creation provides a side-emitting light-emitting diode (LED) packaging structure, which includes a supporting substrate, a plurality of LED chips, a driver chip, a packaging layer, and a retaining wall. The supporting substrate is perpendicular to the mounting surface, and a plurality of LED chips are arranged on the supporting substrate and electrically connected to the supporting substrate. The driving chip is flip-chip arranged on the supporting substrate, and the packaging layer covers a plurality of LED chips and the outside of the driving chip. The retaining wall is arranged on the supporting substrate and surrounds the packaging layer. The side-emitting LED package structure in this creation encapsulates the LED chip into a single-sided light-emitting body, so that the light irradiated to the surroundings is blocked by the retaining wall, and the light-emitting angle is more concentrated and gathered, which improves the utilization rate of the light source and the brightness of the light. High; It also uses flip-chip LED chips and driver chips, so that the final molded side-emitting LED products can effectively reduce the product volume and realize the miniaturization of the product structure.

Description

Packaging structure of side-emitting light-emitting diode

This creation relates to the technical field of a semiconductor element, in particular to a packaging structure of a side-emitting LED.

LED (light emitting diode) is a light emitting diode, a solid-state semiconductor element that can convert electrical energy into visible light. Because LEDs have the advantages of energy saving, high efficiency, fast response time, long life cycle time, and environmental protection, LED products have gradually become mainstream products in technical fields such as display or lighting, and have received more and more attention.

LED products are divided into top-emitting LEDs and side-emitting LEDs according to the light-emitting direction. Among them, the light-emitting direction is perpendicular to the mounting surface, called top-emitting LED; the light-emitting direction is parallel to the mounting surface, called side-emitting LED.

With the rapid development of technology, the speed of updating and repetitive operation of side-emitting LED products is getting faster and faster. The market application requires brighter and more miniaturized side-emitting LED products. However, for side-emitting LED products, the current packaging technology makes the luminous angle of the packaged LED products 180° astigmatism, which is not conducive to the concentration of light emitted by the LED chip and the requirements for high brightness; and, the driving chip, the LED chip and the circuit board pass The wire bonding method is connected, and the wire arc has a certain height, which affects the size of the entire LED product and cannot meet the market's miniaturization requirements for the product.

In order to solve the technical problems of light scattering and large volume of side-emitting LED products in the conventional technology, the technical solution of this creation is as follows:

On the one hand, this creation provides a side-emitting LED packaging structure, which includes a support substrate, a plurality of LED chips, a driver chip, a packaging layer, and a retaining wall. The supporting substrate is perpendicular to the mounting surface, and the mounting surface is used for fixing an external circuit substrate. A plurality of LED chips are arranged on the supporting substrate and electrically connected with the supporting substrate. The driving chip is flip-chip arranged on the supporting substrate and electrically connected to the supporting substrate for driving a plurality of LED chips. The packaging layer covers the exterior of the plurality of LED chips and the driving chip. The retaining wall is arranged on the supporting substrate and surrounded by the packaging layer, and is used to shield the surrounding light from a plurality of LED chips, and the lower side of the retaining wall is located on the mounting surface.

The packaging structure of the side-emitting LED in this creation is aimed at the traditional side-emitting LED without walls surrounding it, the light source presents a wide angle of 180°, and the light is not concentrated enough to meet the market’s requirements for LED highlighting. Multiple LED chips are packaged It is a single-sided light-emitting body with only one light-emitting port, so that the light irradiated to the surroundings is blocked by the retaining wall. The light emitted by multiple LED chips can only be emitted from one light-emitting port, which makes the light-emitting angle more concentrated and condensed. The utilization rate of the light source is higher, and the light brightness is higher. At the same time, the defect of light leakage of multiple LED chips is avoided. The side-emitting LED package structure of this embodiment can output uniform light and improve the light-emitting performance; The flip-chip multiple LED chips and driver chips enable the final molded side-emitting LED product to effectively reduce the product volume and achieve the effect of miniaturization of the product structure.

In one possible design, the plurality of LED chips include blue chips, red chips, and green chips.

In a possible design, the driver chip has a plurality of electrical contacts, and the plurality of electrical contacts includes a first electrical contact, a second electrical contact, a third electrical contact, and a fourth electrical contact. Electrical contacts, fifth electrical contacts, sixth electrical contacts, and seventh electrical contacts, the negative electrode of the blue light chip is electrically connected to the sixth electrical contact, and the negative electrode of the red light chip The fourth electrical contact is electrically connected, and the negative electrode of the green chip is electrically connected to the fifth electrical contact.

In a possible design, the support substrate has a plurality of pins exposed on the mounting surface, the plurality of pins include a data output terminal, a ground terminal, a power supply terminal, and a data registration terminal; the support substrate is a multilayer Structure, the multi-layer structure includes a first wiring layer facing the encapsulation layer, the data output terminal, the ground terminal, and the power supply terminal all extend into the first wiring layer, and the second wiring layer The electrical contact is fixedly connected to the data output terminal, the seventh electrical contact is fixedly connected to the ground terminal, the positive electrode of the blue light chip, the positive electrode of the red light chip, and the positive electrode of the green light chip are all The power supply terminal is fixedly connected.

In a possible design, the supporting substrate is further provided with a first electroplating hole, a second electroplating hole, a third electroplating hole, a fourth electroplating hole, a fifth electroplating hole, a sixth electroplating hole, and a seventh electroplating hole; The multilayer structure further includes a second wiring layer and a third wiring layer from the inside to the outside; in the first wiring layer, the first electrical contact is connected to the first electroplating hole, and the third electrical The electrical contact is connected to the second electroplating hole, the fourth electrical contact is connected to the third electroplating hole, the fifth electrical contact is connected to the fourth electroplating hole, the blue chip The negative electrode of the red light chip is connected to the sixth electrical contact, the negative electrode of the red light chip is connected to the sixth plating hole, the negative electrode of the green light chip is connected to the seventh plating hole, and the power supply terminal Connected to the fifth plating hole; in the second wiring layer, the fourth plating hole is connected to the seventh plating hole, and the third plating hole is connected to the sixth plating hole; In the third wiring layer, the second plating hole is connected to the fifth plating hole, and the first plating hole is connected to the data registration terminal.

In a possible design, the plurality of pins exposed in the mounting surface are used for soldering on the external circuit substrate, and the supporting substrate is used for being vertically arranged on the external circuit substrate.

In a possible design, a plurality of LED chips are all flip-chip arranged on the first wiring layer.

In a possible design, the space enclosed by the retaining wall is triangular, rectangular, pentagonal or hexagonal.

In a possible design, the encapsulation layer is a resin glue layer.

In a possible design, the encapsulation layer is a resin glue layer mixed with fluorescent particles.

Due to the use of the side-emitting LED package structure, the light emitting angle of the light emitting device is more concentrated and condensed, which improves the utilization rate of the light source, and the brightness of the light is higher. At the same time, it also avoids the defect of light leakage of multiple LED chips, and can output uniformly. The light, which improves the luminous performance; and adopts a plurality of flip-chip LED chips and driver chips, so that the final molded side-emitting LED product effectively reduces the product volume and achieves the effect of miniaturization of the product structure.

The technical solution in this creation will be described below in conjunction with the drawings. Obviously, the described embodiments are only a part of the embodiments of this creation, rather than all the embodiments.

In the description of this creation, it should be noted that the terms "installation", "connected", and "connected" should be understood in a broad sense unless otherwise clearly specified and limited. For example, it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relationship. For those with ordinary knowledge in the technical field, they can understand the specific meaning of the above terms in this creation according to the specific situation.

In the description of this creation, it should be understood that the terms "upper", "lower", "side", "inner", "outer", "top", "bottom", etc. indicate the orientation or positional relationship based on the installation The orientation or positional relationship of is only for the convenience of describing the creation and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the creation .

It should also be noted that in this creative embodiment, the same reference numeral is used to denote the same component or the same component. For the same component in this creative embodiment, only one of the components or components may be used as an example. With reference signs, it should be understood that the reference signs are also applicable to other identical parts or components.

Hereinafter, the terms “first”, “second”, etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of these features.

This embodiment describes a package structure of a side-emitting LED. As shown in FIGS. 1-3, the packaging structure of the side-emitting LED includes a supporting substrate 10, a plurality of LED chips 20, a driving chip 50, a packaging layer 30, and a retaining wall 40.

Specifically, in this embodiment, the support substrate 10 is perpendicular to the mounting surface, and the mounting surface is used to fix the external circuit substrate 60. A plurality of LED chips 20 are disposed on the supporting substrate 10 and are electrically connected to the supporting substrate 10. The supporting substrate 10 is, for example, a printed circuit board. The printed circuit board has an integrated circuit and is electrically connected to the plurality of LED chips 20. The driving chip 50 is flip-chip mounted on the supporting substrate 10 and electrically connected to the supporting substrate 10 for driving a plurality of LED chips 20. The encapsulation layer 30 covers the exterior of the plurality of LED chips 20 and the driving chip 50. The encapsulation layer 30 is a transparent resin glue layer, and the light emitted by the plurality of LED chips 20 can be transmitted outward through the encapsulation layer 30. The retaining wall 40 is provided on the support substrate 10 and surrounded by the packaging layer 30. The retaining wall 40 is an opaque resin glue layer that blocks the light irradiated by the plurality of LED chips 20 to the surroundings. In other words, the retaining wall 40 is only A plurality of LED chips 20 are directed toward the light parallel to the support substrate 10 for blocking, and the light perpendicular to the support substrate 10 is not blocked, so that the light is emitted as concentrated as possible, which effectively solves the problem of astigmatism at the light emitting angle. The lower side of the retaining wall 40 is the installation surface.

It should be noted that when assembling the side-emitting LED package structure of this embodiment, the external circuit substrate 60 supplies power to the plurality of LED chips 20 through the support substrate 10, and the support substrate 10 is arranged perpendicular to the mounting surface so as to be located on the support substrate. The light emitted by the plurality of LED chips 20 on 10 is emitted in parallel along the mounting surface, thereby forming a side light emitting effect on the mounting surface.

The driving chip plays a role of controlling the light emission of a plurality of LED chips 20. The flip-chip technology is to connect the positive and negative poles of the LED chip or the plurality of electrical contacts 51 of the driving chip with the electrical contacts or conductive lines on the circuit board by soldering or hot pressing of the electrical contacts. Among them, The solder soldering method uses reflow soldering to solder electrical contacts of Pb-Sn solder, and the electrical contact hot pressing method uses a flip chip soldering machine to solder hard electrical contacts such as Au, Ni/Au, and Cu.

In summary, in this embodiment, a plurality of LED chips 20 can be welded and fixedly joined to the support substrate 10 by flip-chip technology; the driving chip 50 can be connected to the support substrate 10 by flip-chip technology. Weld and join together, as shown in Figure 5.

It should be noted that, in addition to the above flip-chip technology, there is also a way to connect the LED chip or the driver chip to the circuit board: through the wire connection, the electrical contacts of the LED chip or the driver chip are connected with the conductive gold wire. The circuit boards are connected. In the conventional technology, the LED chip and the driver chip are connected by wire, that is, the wire connection, and the lead wire arc has a certain height, which affects the entire LED product, making it relatively large, and unable to reduce the size of the product , Can not meet the market's requirements for thinner and smaller products. Therefore, in this embodiment, a plurality of flip-chip LED chips 20 and driver chips 50 are used, so that the final molded side-emitting LED product can effectively reduce the product volume and achieve the effect of miniaturization of the product structure.

The light source of the traditional side-emitting LED presents a wide angle of 180°, and there is no surrounding wall 40 surrounded, and the light is not concentrated enough to meet the market's requirements for LED highlighting. The packaging structure of the side-emitting LED in this embodiment addresses the above-mentioned problems. A plurality of LED chips 20 are packaged into a single-sided light-emitting body with only one light-emitting port, so that the light irradiated to the surroundings is blocked by the barrier and propagated. The light emitted by the chip 20 can only be emitted from one light outlet, the angle of light is more concentrated and converged, the utilization rate of the light source is improved, the brightness of the light is higher, and the defect of light leakage of multiple LED chips 20 is avoided. This implementation is adopted The side-emitting LED package structure of the example can output uniform light and improve the light-emitting performance.

As shown in FIG. 4, in one embodiment, in order to further improve the assembly diversity of the side-emitting LED package structure and meet more mounting requirements, the external circuit substrate 60 is arranged perpendicular to the support substrate 10, and the external circuit substrate 60 It is electrically connected to the supporting substrate 10. As mentioned above, the support substrate 10 is arranged perpendicular to the mounting surface, so that the light emitted by the plurality of LED chips 20 on the support substrate 10 is emitted parallel to the mounting surface, thereby forming a side light emitting effect on the mounting surface. In this embodiment, the support substrate 10 is electrically connected to the external circuit substrate 60 through the mounting surface. At this time, the external circuit substrate 60 and the mounting surface are arranged in parallel, and the support substrate 10 and the mounting surface are still arranged vertically. Power is supplied to the plurality of LED chips 20 through the external circuit board 60.

It should be noted that the above-mentioned support substrate 10 and the external circuit substrate 60 are, for example, printed circuit boards (printed circuit board, PCB), or printed circuit board for short.

In an embodiment, the supporting substrate 10 has a plurality of pins 11 exposed on the mounting surface, and the plurality of pins 11 are used for soldering on the external circuit substrate 60. The external circuit substrate 60 is provided with pads 61 corresponding to the pins 11 and The pad 61 is soldered.

In one embodiment, the plurality of LED chips 20 includes a blue chip 21, a red chip 22 and a green chip 23, which can emit light of three colors.

In one embodiment, the driver chip 50 has a plurality of electrical contacts 51, and the plurality of electrical contacts 51 includes a first electrical contact 511, a second electrical contact 512, a third electrical contact 513, The fourth electrical contact 514, the fifth electrical contact 515, the sixth electrical contact 516, the seventh electrical contact 517, the negative electrode of the blue chip 21 is electrically connected to the sixth electrical contact 516, red light The negative electrode of the chip 22 is electrically connected to the fourth electrical contact 514, and the negative electrode of the green light chip 23 is electrically connected to the fifth electrical contact 515.

In one embodiment, in order to further reduce the volume of the package structure of the present invention, make the structure compact and have a reasonable layout, the circuit design of the support substrate 10 is as follows: the support substrate 10 has a plurality of pins 11, and the plurality of pins 11 include data output Terminal (DOUT) 111, ground terminal (GND) 112, power supply terminal (VDD) 113 and data registration terminal (DIN) 114; the support substrate 10 is also provided with a first plating hole (PTH) 121, a second plating hole 122, The third plated hole 123, the fourth plated hole 124, the fifth plated hole 125, the sixth plated hole 126, and the seventh plated hole 127. The supporting substrate 10 has a multilayer structure, and the multilayer structure sequentially includes a first wiring layer, a second wiring layer, and a third wiring layer. The first wiring layer faces the encapsulation layer 30. As shown in FIG. 5, in the first wiring layer, the data output terminal 111, the ground terminal 112 and the power supply terminal 113 all extend into the first wiring layer, and the first electrical contact 511 is connected to the first plating hole 121. The second electrical contact 512 is fixedly connected to the data output terminal 111, the third electrical contact 513 is connected to the second electroplating hole 122, the fourth electrical contact 514 is connected to the third electroplating hole 123, and the fifth electrical contact is 515 is connected to the fourth plating hole 124, the seventh electrical contact 517 is fixedly connected to the ground terminal 112, the positive electrode of the blue light chip 21, the positive electrode of the red light chip 22 and the positive electrode of the green light chip 23 are fixedly connected to the power supply terminal 113, blue light The negative electrode of the wafer 21 is connected to the conductive sheet of the sixth electrical contact 516, the negative electrode of the red light chip 22 is connected to the conductive sheet of the sixth electroplating hole 126, and the negative electrode of the green light chip 23 is connected to the conductive sheet of the seventh electroplating hole 127 , The power supply terminal 113 is directly connected to the fifth plating hole 125; as shown in FIG. 6, in the second wiring layer, the fourth plating hole 124 is connected to the conductive sheet of the seventh plating hole 127, and the third plating hole 123 is connected to the The conductive plates of the six electroplated holes 126 are connected; as shown in FIG. 7, in the third wiring layer, the second electroplated holes 122 are connected to the conductive plates of the fifth electroplated holes 125, and the conductive plates of the first electroplated holes 121 and the data registration terminal 114 are connected.片连接。 Piece connection.

In one embodiment, a plurality of LED chips 20 and driving chips 50 are all flip-chip arranged on the first wiring layer, and the electroplating holes, electrical contacts, and electrical contacts in the first wiring layer, the second wiring layer, and the third wiring layer The pins 11 can be electrically connected by conductive wires or conductive sheets.

In an embodiment, in order to limit the contours of the light emitted by the plurality of LED chips 20, the space enclosed by the retaining wall 40 may be triangular, rectangular, pentagonal or hexagonal, so that from the middle of the retaining wall 40 The contour of the light emitted from the light exit port of the light source is also the corresponding shape.

Preferably, the space enclosed by the retaining wall 40 is rectangular.

In one embodiment, the support substrate 10 is a opaque plastic with conductive circuits provided thereon, and the encapsulation layer 30 is a resin glue layer mixed with fluorescent particles. Of course, in other embodiments, the encapsulation layer 30 may not include the aforementioned fluorescent particle resin glue layer, that is, the encapsulation layer 30 is a single-color resin glue layer. Specifically, by using fluorescent particles, the advantages of high luminous efficiency in certain wavelength bands of the LED chip 20 can be used to prepare light in other wavelength bands, so as to improve the luminous efficiency of this wavelength band.

In one embodiment, in order to enable the barrier wall 40 to better shield light, so as to avoid the problem of side light leakage. The retaining wall 40 is a resin glue layer mixed with carbon particles. Of course, in other embodiments, the retaining wall 40 can also be mixed with other particles suitable for LED chip packaging, as long as the light shielding effect can be achieved. It can be selected according to actual needs.

The packaging structure of the side-emitting LED in this creation, the packaging steps are as follows:

Step 1, as shown in FIG. 1, a plurality of LED chips 20 and driving chips 50 are soldered on the supporting substrate 10.

Step 2, as shown in FIG. 2, through a circuit board molding process, after molding and cutting, a packaging layer 30 is formed, covering a plurality of LED chips 20 and driving chips 50;

Step three, as shown in FIG. 3, the molding process forms a retaining wall 40, and a plurality of LED chips 20 and driving chips 50 are enclosed in the middle, so that the product emits light on a single side.

The above are only specific implementations of this creation, but the protection scope of this creation is not limited to this. Any person familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in this creation. All should be covered within the scope of protection of this creation. Therefore, the protection scope of this creation should be based on the protection scope of the applied patent.

10: Support substrate 11: Pin 111: Data output terminal 112: Ground terminal 113: power supply 114: Data Logging Terminal 121: The first plating hole 122: second plating hole 123: The third plating hole 124: The fourth plated hole 125: Fifth Plating Hole 126: The sixth plating hole 127: Seventh Plating Hole 20: LED chip 21: Blu-ray chip 22: Red light chip 23: Green chip 30: Encapsulation layer 40: retaining wall 50: driver chip 51: Electrical contact 511: first electrical contact 512: second electrical contact 513: Third electrical contact 514: Fourth electrical contact 515: Fifth electrical contact 516: sixth electrical contact 517: seventh electrical contact 60: External circuit board 61: pad

Fig. 1 is a schematic diagram of a supporting substrate provided by an embodiment in this creation; Fig. 2 is a schematic diagram of a supporting substrate and an encapsulation layer provided by an embodiment in this creation; Fig. 3 is a schematic diagram of a package structure of a side-emitting LED provided by an embodiment in the present creation; Fig. 4 is a schematic diagram of a package structure of a side-emitting LED provided by another embodiment in this creation; FIG. 5 is a schematic diagram of a first wiring layer of a supporting substrate provided by an embodiment in this creation; Fig. 6 is a schematic diagram of the second wiring layer of the supporting substrate provided by an embodiment in the present creation; and FIG. 7 is a schematic diagram of the third wiring layer of the supporting substrate provided by an embodiment in the present creation.

11: Pin

20: LED chip

30: Encapsulation layer

40: retaining wall

50: driver chip

51: Electrical contact

Claims (10)

A package structure of a side-emitting light-emitting diode, which includes: A support substrate (10), perpendicular to a mounting surface, the mounting surface is used to fix an external circuit substrate (60); A plurality of light emitting diode (LED) chips (20) are arranged on the support substrate (10) and are electrically connected to the support substrate (10); A driving chip (50), flip-chip mounted on the supporting substrate (10), and electrically connected to the supporting substrate (10), for driving the plurality of LED chips (20); An encapsulation layer (30) covering the exterior of the plurality of LED chips (20) and the driver chip (50); A retaining wall (40) is arranged on the supporting substrate (10) and surrounded by the packaging layer (30), and is used to block the light from the plurality of LED chips (20) to the surroundings. The retaining wall ( 40) The lower side is located on the mounting surface. The package structure of a side-emitting light-emitting diode according to claim 1, wherein the plurality of LED chips (20) include a blue chip (21), a red chip (22) and a green chip (23) . The package structure of the side-emitting light-emitting diode according to claim 2, wherein the driver chip (50) has a plurality of electrical contacts (51), and the plurality of electrical contacts (51) includes a first Electrical contact (511), a second electrical contact (512), a third electrical contact (513), a fourth electrical contact (514), a fifth electrical contact (515) ), a sixth electrical contact (516), a seventh electrical contact (517), the negative pole of the blue chip (21) is electrically connected to the sixth electrical contact (516), the red chip The negative pole of (22) is electrically connected to the fourth electrical contact (514), and the negative pole of the green chip (23) is electrically connected to the fifth electrical contact (515). The package structure of the side-emitting light-emitting diode according to claim 3, wherein the supporting substrate (10) has a plurality of pins (11) exposed in the mounting surface, and the plurality of pins (11) include A data output terminal (111), a ground terminal (112), a power supply terminal (113) and a data registration terminal (114); the support substrate (10) has a multilayer structure, and the multilayer structure includes facing the packaging layer (30) the first wiring layer, the data output terminal (111), the ground terminal (112) and the power supply terminal (113) all extend into the first wiring layer, the second electrical contact (512) ) The data output terminal (111) is fixedly connected, the seventh electrical contact (517) is fixedly connected to the ground terminal (112), the anode of the blue chip (21), the anode of the red chip (22), and the The positive electrodes of the green chip (23) are fixedly connected to the power supply terminal (113). The package structure of the side-emitting light-emitting diode according to claim 4, wherein the supporting substrate (10) is further provided with a first electroplating hole (121), a second electroplating hole (122), and a third electroplating hole (123), a fourth plating hole (124), a fifth plating hole (125), a sixth plating hole (126), a seventh plating hole (127); the multilayer structure also includes a second wiring layer And a third wiring layer; in the first wiring layer, the first electrical contact (511) is connected to the first electroplating hole (121), and the third electrical contact (513) is connected to the second The electroplated hole (122) is connected, the fourth electrical contact (514) is connected to the third electroplated hole (123), the fifth electrical contact (515) is connected to the fourth electroplated hole (124), the The negative electrode of the blue light chip (21) is connected to the sixth electrical contact (516), the negative electrode of the red light chip (22) is connected to the sixth electroplating hole (126), and the negative electrode of the green light chip (23) is connected to The seventh plating hole (127) is connected, and the power supply terminal (113) is connected to the fifth plating hole (125); in the second wiring layer, the fourth plating hole (124) is connected to the seventh plating hole (127) connection, the third plating hole (123) is connected to the sixth plating hole (126); in the third wiring layer, the second plating hole (122) is connected to the fifth plating hole (125) , The first plating hole (121) is connected to the data registration terminal (114). The package structure of the side-emitting light-emitting diode according to claim 4, wherein the plurality of pins (11) exposed in the mounting surface are used for soldering on the external circuit substrate (60), and the support The substrate (10) is used to be vertically arranged on the external circuit substrate (60). The package structure of the side-emitting light-emitting diode according to claim 4, wherein the plurality of LED chips (20) are all flip-chip arranged on the first wiring layer. The packaging structure of the side-emitting light-emitting diode according to claim 1, wherein the space enclosed by the retaining wall (40) is triangular, rectangular, pentagonal or hexagonal. The packaging structure of the side-emitting light-emitting diode according to claim 1, wherein the packaging layer (30) is a resin glue layer. The packaging structure of a side-emitting light-emitting diode according to claim 1, wherein the packaging layer (30) is a resin glue layer mixed with fluorescent particles.

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