CN103703615B - 环形天线 - Google Patents
环形天线 Download PDFInfo
- Publication number
- CN103703615B CN103703615B CN201280036445.4A CN201280036445A CN103703615B CN 103703615 B CN103703615 B CN 103703615B CN 201280036445 A CN201280036445 A CN 201280036445A CN 103703615 B CN103703615 B CN 103703615B
- Authority
- CN
- China
- Prior art keywords
- conduction region
- bond pad
- electrical contact
- metal layer
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
Landscapes
- Details Of Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/189,135 | 2011-07-22 | ||
| US13/189,135 US8842046B2 (en) | 2011-07-22 | 2011-07-22 | Loop antenna |
| PCT/US2012/047868 WO2013016293A2 (en) | 2011-07-22 | 2012-07-23 | Loop antenna |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103703615A CN103703615A (zh) | 2014-04-02 |
| CN103703615B true CN103703615B (zh) | 2016-01-20 |
Family
ID=47555413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280036445.4A Active CN103703615B (zh) | 2011-07-22 | 2012-07-23 | 环形天线 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8842046B2 (https=) |
| JP (1) | JP6001071B2 (https=) |
| CN (1) | CN103703615B (https=) |
| WO (1) | WO2013016293A2 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9356352B2 (en) * | 2012-10-22 | 2016-05-31 | Texas Instruments Incorporated | Waveguide coupler |
| US8917210B2 (en) * | 2012-11-27 | 2014-12-23 | International Business Machines Corporation | Package structures to improve on-chip antenna performance |
| KR102029477B1 (ko) * | 2013-07-26 | 2019-10-07 | 삼성전기주식회사 | 무선통신모듈 |
| US9917372B2 (en) * | 2014-06-13 | 2018-03-13 | Nxp Usa, Inc. | Integrated circuit package with radio frequency coupling arrangement |
| US10103447B2 (en) | 2014-06-13 | 2018-10-16 | Nxp Usa, Inc. | Integrated circuit package with radio frequency coupling structure |
| US10225925B2 (en) | 2014-08-29 | 2019-03-05 | Nxp Usa, Inc. | Radio frequency coupling and transition structure |
| CN104465547B (zh) * | 2014-12-10 | 2017-06-30 | 华进半导体封装先导技术研发中心有限公司 | 高频天线信号反射的封装结构及制造方法 |
| US10361476B2 (en) * | 2015-05-26 | 2019-07-23 | Qualcomm Incorporated | Antenna structures for wireless communications |
| US20200212536A1 (en) * | 2018-12-31 | 2020-07-02 | Texas Instruments Incorporated | Wireless communication device with antenna on package |
| CN111262003B (zh) * | 2020-01-22 | 2021-09-14 | Oppo广东移动通信有限公司 | 天线封装模组和电子设备 |
| US11600581B2 (en) | 2021-04-15 | 2023-03-07 | Texas Instruments Incorporated | Packaged electronic device and multilevel lead frame coupler |
| US12444702B2 (en) | 2021-08-02 | 2025-10-14 | Texas Instruments Incorporated | Flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrate |
| US12519070B2 (en) | 2022-12-27 | 2026-01-06 | Texas Instruments Incorporated | System, electronic device and package with vertical to horizontal substrate integrated waveguide transition and horizontal grounded coplanar waveguide transition |
| US12489211B2 (en) | 2023-03-15 | 2025-12-02 | Texas Instruments Incorporated | Electronic device with patch antenna in packaging substrate |
| US12559363B2 (en) | 2023-08-28 | 2026-02-24 | Texas Instruments Incorporated | High reliability sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6154176A (en) * | 1998-08-07 | 2000-11-28 | Sarnoff Corporation | Antennas formed using multilayer ceramic substrates |
| CN1293791A (zh) * | 1999-01-19 | 2001-05-02 | 布尔Cp8公司 | 装有环状天线的芯片卡及附属的微模块 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001102817A (ja) * | 1999-09-29 | 2001-04-13 | Nec Corp | 高周波回路及び該高周波回路を用いたシールディドループ型磁界検出器 |
| US7119745B2 (en) | 2004-06-30 | 2006-10-10 | International Business Machines Corporation | Apparatus and method for constructing and packaging printed antenna devices |
| EP1777781B1 (en) | 2005-10-19 | 2016-05-11 | KOFinder Technologies Inc. | Antenna arrangement |
| US7423608B2 (en) * | 2005-12-20 | 2008-09-09 | Motorola, Inc. | High impedance electromagnetic surface and method |
| JP2007174153A (ja) * | 2005-12-21 | 2007-07-05 | Kyocera Corp | ループアンテナおよび通信機器 |
| US7855689B2 (en) | 2007-09-26 | 2010-12-21 | Nippon Soken, Inc. | Antenna apparatus for radio communication |
| JP2009260758A (ja) * | 2008-04-18 | 2009-11-05 | Murata Mfg Co Ltd | 無線icデバイス |
| WO2010087783A1 (en) | 2009-01-30 | 2010-08-05 | Agency For Science, Technology And Research | An antenna and method for manufacturing the same |
| JP5276463B2 (ja) * | 2009-02-09 | 2013-08-28 | Necトーキン株式会社 | アンテナ装置及びそれを備えたrfidタグ |
| US8674892B2 (en) * | 2010-06-20 | 2014-03-18 | Siklu Communication ltd. | Accurate millimeter-wave antennas and related structures |
| WO2012043432A1 (ja) * | 2010-09-30 | 2012-04-05 | 株式会社村田製作所 | 無線icデバイス |
| KR101874323B1 (ko) * | 2011-04-13 | 2018-07-05 | 타이코 파이어 앤 시큐리티 게엠베하 | 니어 필드 애플리케이션들을 위한 소형 광대역 루프 안테나 |
-
2011
- 2011-07-22 US US13/189,135 patent/US8842046B2/en active Active
-
2012
- 2012-07-23 CN CN201280036445.4A patent/CN103703615B/zh active Active
- 2012-07-23 JP JP2014522931A patent/JP6001071B2/ja active Active
- 2012-07-23 WO PCT/US2012/047868 patent/WO2013016293A2/en not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6154176A (en) * | 1998-08-07 | 2000-11-28 | Sarnoff Corporation | Antennas formed using multilayer ceramic substrates |
| CN1293791A (zh) * | 1999-01-19 | 2001-05-02 | 布尔Cp8公司 | 装有环状天线的芯片卡及附属的微模块 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103703615A (zh) | 2014-04-02 |
| WO2013016293A2 (en) | 2013-01-31 |
| WO2013016293A3 (en) | 2013-05-10 |
| US8842046B2 (en) | 2014-09-23 |
| WO2013016293A9 (en) | 2014-05-22 |
| JP2014522172A (ja) | 2014-08-28 |
| US20130021208A1 (en) | 2013-01-24 |
| WO2013016293A8 (en) | 2013-07-18 |
| JP6001071B2 (ja) | 2016-10-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |