CN103692301B - A kind of SiC single crystal crystal orientation angle compensation processing unit (plant) - Google Patents
A kind of SiC single crystal crystal orientation angle compensation processing unit (plant) Download PDFInfo
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- CN103692301B CN103692301B CN201310671401.5A CN201310671401A CN103692301B CN 103692301 B CN103692301 B CN 103692301B CN 201310671401 A CN201310671401 A CN 201310671401A CN 103692301 B CN103692301 B CN 103692301B
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- eccentric
- connecting axle
- crystal
- taper shank
- card
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- 239000013078 crystal Substances 0.000 title claims abstract description 81
- 238000012545 processing Methods 0.000 title claims abstract description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 27
- 235000013312 flour Nutrition 0.000 claims description 28
- 238000003801 milling Methods 0.000 claims description 28
- 238000000227 grinding Methods 0.000 abstract description 10
- 238000003754 machining Methods 0.000 abstract description 4
- 239000007767 bonding agent Substances 0.000 abstract description 2
- 238000000205 computational method Methods 0.000 abstract description 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 238000004064 recycling Methods 0.000 abstract 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 19
- 239000004065 semiconductor Substances 0.000 description 7
- 229910001651 emery Inorganic materials 0.000 description 5
- 244000309464 bull Species 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 230000005669 field effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of SiC single crystal crystal orientation angle compensation processing unit (plant), solve between the surface grinding machine of prior art and cylindrical grinder and change the brought problem that processed finished products rate is low and working (machining) efficiency is low.Comprise taper shank eccentric disc, rotating shaft, hold-down ring, eccentric connecting axle, pedestal.Taper shank eccentric disc is connected with eccentric connecting axle by rotating shaft, hold-down ring is utilized eccentric connecting axle and taper shank eccentric disc to be interfixed, ensure that eccentric connecting axle and taper shank eccentric disc closely cooperate, do not relatively rotate both during recycling cylindrical grinder cutting SiC crystal grown surface, pedestal can be fixed with crystal by bonding agent, the pedestal gluing crystal is fixed in the groove of eccentric connecting axle by pin, finally can completes the work of the round as a ball and angle compensation of SiC crystal according to supporting computational methods.This invention structure is simple, easy to operate, only utilizes cylindrical grinder just can complete SiC single crystal round as a ball and angle compensation work, effectively raising processed finished products rate and working (machining) efficiency.
Description
Technical field
Patent of the present invention relates to a kind of devices and methods therefor of the <0001> crystal orientation for compensating SiC single crystal.The method utilizes cylindrical grinder in conjunction with the adjust structure related in this patent, by a kind of computational methods, finally realize the compensation of SiC single crystal <0001> crystal orientation angle, meet the requirement of SiC base device making to SiC single crystal crystal orientation.Belong to electronics industry and technical field of semiconductor.
Background technology
Carborundum (SiC) is third generation wide bandgap semiconductor materials, there is the character such as broad stopband, high heat conductance, the saturated migration rate of high electronics, high breakdown electric field, with silicon be representative first generation semi-conducting material and with GaAs be representative second generation semi-conducting material compared with have obvious superiority.Have huge application prospect in fields such as radar communication, automotive electronics, wind-powered electricity generation, intelligent grid, Aero-Space, be considered to manufacture the semi-conducting material that opto-electronic device, Deep trench termination, high-temperature electronic device are desirable.At present, existing multiple SiC base device comes out, example SBD(Schottky-barrier diode), MESFET(metal-semiconductor field effect transistor), MOSFET(metal oxide layer semiconductor field-effect transistor), HEMT(HEMT) etc. device, different components has different requirements to SiC single crystal crystal orientation, wherein HEMT device require SiC substrate crystal orientation be <0001> ± 0.2 °.In order to meet the requirement of device to crystal orientation, need the work completing crystal orientation compensation in SiC single crystal front road processing, traditional SiC crystal orientation compensation method often adopt cylindrical grinder to combine with surface grinding machine work that crystal orientation compensates, concrete grammar is: utilize surface grinding machine by SiC native transistors surface rubbing, inevitably cause in this operation in plane of crystal direction and crystal crystal orientation there is a low-angle and depart from, then utilize x-ray direction finder to flat surface grinding is directed, determine maximum deviation angle.Recycle surface grinding machine subsequently low-angle is departed to compensate, finally again crystal is transferred to cylindrical grinder, utilizes cylindrical grinder to grind off the polycrystalline portion at edge, single-crystal region, and by round as a ball for crystal to normal diameter, finally complete the work of crystal front road processing.This conventional method needs to change between surface grinding machine and cylindrical grinder, inevitably there is rigging error, cause crystal pro cessing yield rate lower, and crystal pro cessing efficiency is lower.
Summary of the invention
The invention provides a kind of SiC single crystal crystal orientation angle compensation processing unit (plant) and processing method thereof, solve between the surface grinding machine of prior art and cylindrical grinder and change the brought technical problem that processed finished products rate is low and working (machining) efficiency is low.
The present invention solves above technical problem by the following technical programs:
A kind of SiC single crystal crystal orientation angle compensation processing unit (plant), comprise cylindrical grinder, the headstock of cylindrical grinder is connected with taper shank eccentric disc, on the tail end fixed clamp of the taper shank of the taper shank eccentric disc chuck on the headstock of cylindrical grinder, the eccentric card of taper shank eccentric disc is inclination card, angle between the vertical plane of the axis of eccentric card and taper shank is 1.5 degree, the left pin-and-hole of connection rotating shaft is provided with in the center of eccentric card, the cylindrical of eccentric card is evenly equipped with four eccentric connecting axle fixing holes, the left surface rotating the eccentric connecting axle of step is inclination disc, the angle rotated between the eccentric left surface of connecting axle of step and the vertical plane of the axis of taper shank is 1.5 degree, the right pin-and-hole of connection rotating shaft is provided with in the center of left surface, connection rotating shaft is provided with between the right pin-and-hole of connection rotating shaft and the left pin-and-hole of connection rotating shaft, hold-down ring is evenly equipped with four eccentric connecting axle hold-down apertures, hold-down ring is socketed on the step of the eccentric connecting axle of rotation step, connecting bolt is provided with between eccentric connecting axle hold-down apertures and eccentric connecting axle fixing hole, the right side rotating the eccentric connecting axle of step is provided with the pin joint hole of T-shaped pedestal, T-shaped pedestal is connected with in the pin joint hole of T-shaped pedestal, the bonding crystal needing flour milling on the right-hand member end face of T-shaped pedestal.
The card of eccentric card is provided with 360 degree of dials, corresponding 1 degree of every part of graduation mark.
oneplant SiC single crystal crystal orientation angle compensation processing method, comprise the following steps:
The first step, by on the chuck of the tail end fixed clamp of the taper shank of taper shank eccentric disc on the headstock of cylindrical grinder, the card of eccentric card arranges 360 degree of dials, corresponding 1 degree of every part of graduation mark, the eccentric card of taper shank eccentric disc is inclination card, angle between the vertical plane of the axis of eccentric card and taper shank is 1.5 degree, the left pin-and-hole of connection rotating shaft is set in the center of eccentric card, the cylindrical of eccentric card is evenly equipped with four eccentric connecting axle fixing holes, the left surface rotating the eccentric connecting axle of step is inclination disc, the angle rotated between the eccentric left surface of connecting axle of step and the vertical plane of the axis of taper shank is 1.5 degree, the right pin-and-hole of connection rotating shaft is set in the center of left surface, between the right pin-and-hole of connection rotating shaft and the left pin-and-hole of connection rotating shaft, connection rotating shaft is set, hold-down ring is evenly equipped with four eccentric connecting axle hold-down apertures, hold-down ring is socketed on the step of the eccentric connecting axle of rotation step, the right side rotating the eccentric connecting axle of step arranges the pin joint hole of T-shaped pedestal, the peak of left surface is corresponding with the minimum point of the eccentric card of taper shank eccentric disc, and the same minimum point of eccentric connecting axle card 15 is corresponding with the peak of the eccentric card of taper shank eccentric disc, and now angle compensation device is designated as zero point,
Second step, until the crystal of flour milling and pedestal fixing by AB glue after, insert rotate the eccentric connecting axle of step pin joint hole in and fix with jackscrew; With connecting bolt, hold-down ring and eccentric card are linked together;
3rd step, utilize the bull nose of emery wheel to cut the surface for the treatment of the crystal of flour milling, length of cut exceedes the radius of the crystal treating flour milling;
4th step, unload T-shaped pedestal and the crystal treating flour milling, utilize X-ray to the surface orientation treating the crystal of flour milling cut, determine the <0001> direction of crystal and surperficial maximum deviation angle size and offset direction, and at plane of crystal mark highs and lows;
5th step, then by T-shaped pedestal and treat that the crystal of flour milling is arranged on compensation arrangement, note now treating that the peak of the crystal of flour milling is corresponding with the peak of the left surface of step bias connecting axle, and by fixing with jackscrew;
6th step, according to the size and Orientation of deflecting angle of crystal treating flour milling, rotates the eccentric connecting axle of step, the deflecting angle of the crystal treating flour milling is compensated;
7th step, after adjusting the anglec of rotation rotating the eccentric connecting axle of step, eccentric for rotation step connecting axle and taper shank eccentric disc are closely fixed together with hold-down ring, utilize the bull nose of emery wheel to cut the surface for the treatment of the crystal of flour milling, length of cut exceedes the radius of the crystal treating flour milling;
8th step, repeat the step of above-mentioned 3rd step to the 8th step, until the surface angle completing the crystal treating flour milling compensates.
Structure of the present invention is simple, easy to operate, only utilizes cylindrical grinder just can complete SiC single crystal round as a ball with angle compensation work, can effectively improve processed finished products rate and working (machining) efficiency.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of taper shank eccentric disc 1 of the present invention;
Fig. 3 is that taper shank eccentric disc 1 of the present invention overlooks the structural representation on direction;
Fig. 4 is the structural representation of hold-down ring 3 of the present invention;
Fig. 5 is the structural representation of the eccentric connecting axle 4 of rotation step of the present invention;
Fig. 6 is the structural representation of T-shaped pedestal 5 of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is described in detail:
A kind of SiC single crystal crystal orientation angle compensation processing unit (plant), comprise cylindrical grinder, the headstock of cylindrical grinder is connected with taper shank eccentric disc 1, on the tail end fixed clamp of the taper shank 6 of taper shank eccentric disc 1 chuck on the headstock of cylindrical grinder, the eccentric card 7 of taper shank eccentric disc 1 is inclination card, angle between the vertical plane of the axis of eccentric card 7 and taper shank 6 is 1.5 degree, the left pin-and-hole 12 of connection rotating shaft is provided with in the center of eccentric card 7, the cylindrical of eccentric card 7 is evenly equipped with four eccentric connecting axle fixing holes 8, the left surface 15 rotating the eccentric connecting axle 4 of step is inclination disc, the angle rotated between the eccentric left surface 15 of connecting axle 4 of step and the vertical plane of the axis of taper shank 6 is 1.5 degree, the right pin-and-hole 20 of connection rotating shaft is provided with in the center of left surface 15, connection rotating shaft 2 is provided with between the right pin-and-hole of connection rotating shaft 20 and the left pin-and-hole 12 of connection rotating shaft, hold-down ring 3 is evenly equipped with four eccentric connecting axle hold-down apertures 13, hold-down ring 3 is socketed on the step 23 of the eccentric connecting axle 4 of rotation step, connecting bolt is provided with between eccentric connecting axle hold-down apertures 13 and eccentric connecting axle fixing hole 8, the right-hand member cylinder 19 rotating the eccentric connecting axle 4 of step is provided with the pin joint hole 21 of T-shaped pedestal 5, the base cylindrical body 24 of T-shaped pedestal 5 is connected with in the pin joint hole 21 of T-shaped pedestal 5, the bonding crystal needing flour milling on the right-hand member end face 25 of T-shaped pedestal 5.
The card of eccentric card 7 is provided with 360 degree of dials 9, corresponding 1 degree of every part of graduation mark.
The present invention mainly contains 5 parts compositions: taper shank eccentric disc 1, connection rotating shaft 2, hold-down ring 3, rotation step eccentric connecting axle 4, T-shaped pedestal 5, the taper shank 6 of taper shank eccentric disc 1, according to the length of the requirement setting taper shank of headstock for cylindrical grinding machine and tapering, ensures to coordinate with headstock for cylindrical grinding machine moieties into close.The eccentric card 7 of taper shank eccentric disc 1 is 1.5 ° of inclined planes, there are 4 eccentric connecting axle fixing holes 8, and have 360 parts of graduation marks 9, corresponding 1 degree of every part of graduation mark, eccentric card 7 cylindrical indicates the highest and minimum point, peak 10 is 0 ° of corresponding points, and minimum point 11 is 180 ° of corresponding points, and there is the left pin-and-hole 12 of connection rotating shaft eccentric card 7 center.Rotate the eccentric connecting axle 4 of step to be connected with taper shank eccentric disc 1 by connection rotating shaft 2, connection rotating shaft 2 is placed in and rotates the eccentric right pin-and-hole of connection rotating shaft 20 of connecting axle 4 of step and connection rotating shaft left pin-and-hole 12 place of taper shank eccentric disc 1.The card 15 rotating the eccentric connecting axle 4 of step is similarly 1.5 ° of inclined-planes, and the cylindrical of this card indicates the highest 16 and minimum point 17, when eccentric connecting axle card 15 is connected with taper shank eccentric disc card 7, the peak 16 of left surface 15 is corresponding with the minimum point 11 of the eccentric card 7 of taper shank eccentric disc 1, the same minimum point 17 of eccentric connecting axle card 15 is corresponding with the peak 10 of the eccentric card 7 of taper shank eccentric disc, and now angle compensation device is designated as zero point.The right flank 18 rotating the eccentric connecting axle 4 of step is a standard flat, the emery wheel axes normal of this plane and cylindrical grinder.Hold-down ring 3 is uniformly distributed 4 eccentric connecting axle hold-down apertures 13, when the eccentric connecting axle 4 of rotation step is connected with taper shank eccentric disc 1, hold-down ring centre bore 14 is through the cylinder 19 of eccentric connecting axle, and push down the step surface 23 of eccentric connecting axle, 4 screws are fixedly connected with 4 eccentric connecting axle fixing holes 8 of taper shank eccentric disc card 7 through 4 holes 13 of hold-down ring, ensureing that the eccentric connecting axle 4 of rotation step and taper shank eccentric disc 1 closely cooperate, not relatively rotating both when utilizing cylindrical grinder flat surface grinding.Base cylindrical body 24 inserts the pin joint hole 21 that rotates the eccentric connecting axle 4 of step and closely cooperates, and is fixed by jackscrew 22, the base cylindrical body 25 of T-shaped pedestal 5 with treat that the crystal of flour milling is interfixed by bonding agent.
A kind of SiC single crystal crystal orientation angle compensation processing method, comprises the following steps:
The first step, by on the chuck of the tail end fixed clamp of the taper shank 6 of taper shank eccentric disc 1 on the headstock of cylindrical grinder, the card of eccentric card 7 arranges 360 degree of dials 9, corresponding 1 degree of every part of graduation mark, the eccentric card 7 of taper shank eccentric disc 1 is inclination card, angle between the vertical plane of the axis of eccentric card 7 and taper shank 6 is 1.5 degree, the left pin-and-hole 12 of connection rotating shaft is set in the center of eccentric card 7, the cylindrical of eccentric card 7 is evenly equipped with four eccentric connecting axle fixing holes 8, the left surface 15 rotating the eccentric connecting axle 4 of step is inclination disc, the angle rotated between the eccentric left surface 15 of connecting axle 4 of step and the vertical plane of the axis of taper shank 6 is 1.5 degree, the right pin-and-hole 20 of connection rotating shaft is set in the center of left surface 15, between the right pin-and-hole of connection rotating shaft 20 and the left pin-and-hole 12 of connection rotating shaft, connection rotating shaft 2 is set, hold-down ring 3 is evenly equipped with four eccentric connecting axle hold-down apertures 13, hold-down ring 3 is socketed on the step of the eccentric connecting axle 4 of rotation step, the right side rotating the eccentric connecting axle 4 of step arranges the pin joint hole 21 of T-shaped pedestal 5, the peak 16 of left surface 15 is corresponding with the minimum point 11 of the eccentric card 7 of taper shank eccentric disc, and the same minimum point 17 of eccentric connecting axle card 15 is corresponding with the peak 10 of the eccentric card 7 of taper shank eccentric disc, and now angle compensation device is designated as zero point,
Second step, until the crystal of flour milling and pedestal 5 fixing by AB glue after, insert rotate the eccentric connecting axle 4 of step pin joint hole 21 in and fix with jackscrew 22; With connecting bolt, hold-down ring 3 and eccentric card 7 are linked together;
3rd step, utilize the bull nose of emery wheel to cut the surface for the treatment of the crystal of flour milling, length of cut exceedes the radius of the crystal treating flour milling;
4th step, unload T-shaped pedestal 5 and the crystal treating flour milling, utilize X-ray to the surface orientation treating the crystal of flour milling cut, determine the <0001> direction of crystal and surperficial maximum deviation angle size and offset direction, and at plane of crystal mark highs and lows;
5th step, then by T-shaped pedestal 5 with treat that the crystal of flour milling is arranged on compensation arrangement, note now treating that the peak of the crystal of flour milling is corresponding with the peak of the left surface 15 rotating the eccentric connecting axle 4 of step, and by using jackscrew 22 fixing;
6th step, according to the size and Orientation of deflecting angle of crystal treating flour milling, the eccentric connecting axle 4 of step, makes the deflecting angle of the crystal treating flour milling be compensated;
7th step, after adjusting the anglec of rotation rotating the eccentric connecting axle 4 of step, with hold-down ring 3, eccentric for rotation step connecting axle 4 is closely fixed together with taper shank eccentric disc 1, utilize the bull nose of emery wheel to cut the surface for the treatment of the crystal of flour milling, length of cut exceedes the radius of the crystal treating flour milling;
8th step, repeat the step of above-mentioned 3rd step to the 8th step, until the surface angle completing the crystal treating flour milling compensates.
Claims (2)
1. a SiC single crystal crystal orientation angle compensation processing unit (plant), comprise cylindrical grinder, the headstock of cylindrical grinder is connected with taper shank eccentric disc (1), on the tail end fixed clamp of the taper shank (6) of taper shank eccentric disc (1) chuck on the headstock of cylindrical grinder, it is characterized in that, the eccentric card (7) of taper shank eccentric disc (1) is inclination card, angle between the vertical plane of the axis of eccentric card (7) and taper shank (6) is 1.5 degree, the center of eccentric card (7) is provided with the left pin-and-hole of connection rotating shaft (12), the cylindrical of eccentric card (7) is evenly equipped with four eccentric connecting axle fixing holes (8), the left surface (15) rotating the eccentric connecting axle (4) of step is inclination disc, the angle rotated between the eccentric left surface (15) of connecting axle (4) of step and the vertical plane of the axis of taper shank (6) is 1.5 degree, the center of left surface (15) is provided with the right pin-and-hole of connection rotating shaft (20), connection rotating shaft (2) is provided with between the right pin-and-hole of connection rotating shaft (20) and the left pin-and-hole of connection rotating shaft (12), hold-down ring (3) is evenly equipped with four eccentric connecting axle hold-down apertures (13), hold-down ring (3) is socketed on the step of the eccentric connecting axle (4) of rotation step, connecting bolt is provided with between eccentric connecting axle hold-down apertures (13) and eccentric connecting axle fixing hole (8), the right side rotating the eccentric connecting axle (4) of step is provided with the pin joint hole (21) of T-shaped pedestal (5), the base cylindrical body (24) of T-shaped pedestal (5) is connected with in the pin joint hole (21) of T-shaped pedestal (5), at the upper bonding crystal needing flour milling of the right-hand member end face (25) of T-shaped pedestal (5).
2. a kind of SiC single crystal crystal orientation according to claim 1 angle compensation processing unit (plant), is characterized in that, the card of eccentric card (7) is provided with 360 degree of dials (9), corresponding 1 degree of every part of graduation mark.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310671401.5A CN103692301B (en) | 2013-12-12 | 2013-12-12 | A kind of SiC single crystal crystal orientation angle compensation processing unit (plant) |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310671401.5A CN103692301B (en) | 2013-12-12 | 2013-12-12 | A kind of SiC single crystal crystal orientation angle compensation processing unit (plant) |
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| CN103692301A CN103692301A (en) | 2014-04-02 |
| CN103692301B true CN103692301B (en) | 2016-01-20 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108068012B (en) * | 2016-11-18 | 2020-03-31 | 北京七星华创电子股份有限公司 | Clamping device and crystal processing equipment |
| CN109834584B (en) * | 2019-03-18 | 2021-01-29 | 内蒙古中环光伏材料有限公司 | Processing method of multistage reducing seed crystal and multistage reducing seed crystal |
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| CN1047998A (en) * | 1990-08-03 | 1990-12-26 | 航空航天工业部第二研究院二○三所 | Angle, wafer school and the incorporate method and apparatus of grinding |
| CN200981169Y (en) * | 2006-06-09 | 2007-11-28 | 李汶军 | Oriented processing flat grinder |
| CN101530982A (en) * | 2009-04-13 | 2009-09-16 | 西安理工大学 | Grinding clamp for changing wafer orientation |
| CN201960677U (en) * | 2010-12-24 | 2011-09-07 | 北京有色金属研究总院 | Fixture for directionally processing sapphire crystal |
| CN102430951A (en) * | 2011-10-31 | 2012-05-02 | 江苏竹箦阀业有限公司 | Gate valve sealing surface rotating lathe clamping tool |
| CN202727138U (en) * | 2012-06-18 | 2013-02-13 | 元亮科技有限公司 | Sapphire ingot orientating and machining clamp |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1044143A (en) * | 1996-08-08 | 1998-02-17 | Mimasu Handotai Kogyo Kk | Workpiece mounting jig, device and method |
| JPH10112493A (en) * | 1996-08-13 | 1998-04-28 | Sony Corp | Surface-reformed thin plate holder, face adjusting means, and direction adjusting means |
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2013
- 2013-12-12 CN CN201310671401.5A patent/CN103692301B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1047998A (en) * | 1990-08-03 | 1990-12-26 | 航空航天工业部第二研究院二○三所 | Angle, wafer school and the incorporate method and apparatus of grinding |
| CN200981169Y (en) * | 2006-06-09 | 2007-11-28 | 李汶军 | Oriented processing flat grinder |
| CN101530982A (en) * | 2009-04-13 | 2009-09-16 | 西安理工大学 | Grinding clamp for changing wafer orientation |
| CN201960677U (en) * | 2010-12-24 | 2011-09-07 | 北京有色金属研究总院 | Fixture for directionally processing sapphire crystal |
| CN102430951A (en) * | 2011-10-31 | 2012-05-02 | 江苏竹箦阀业有限公司 | Gate valve sealing surface rotating lathe clamping tool |
| CN202727138U (en) * | 2012-06-18 | 2013-02-13 | 元亮科技有限公司 | Sapphire ingot orientating and machining clamp |
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| CN103692301A (en) | 2014-04-02 |
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