CN103687327B - Printed circuit board (PCB) and the method that element is set on a printed circuit - Google Patents
Printed circuit board (PCB) and the method that element is set on a printed circuit Download PDFInfo
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- CN103687327B CN103687327B CN201210357087.9A CN201210357087A CN103687327B CN 103687327 B CN103687327 B CN 103687327B CN 201210357087 A CN201210357087 A CN 201210357087A CN 103687327 B CN103687327 B CN 103687327B
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- printed circuit
- circuit board
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Abstract
Method and the printed circuit board (PCB) of element are set on a printed circuit, described method is applied to printed circuit board (PCB), described printed circuit board (PCB) includes by having the first area of the first thickness and having the substrate that the second area of the second thickness forms, wherein said first thickness is more than described second thickness, described method includes: before at least one element is welded on described printed circuit board (PCB), and the first printing zone on described first area arranges tin cream；And it is not provided with tin cream on the second printing zone of described second area.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB) and the method that element is set on a printed circuit.
Background technology
Currently, along with the lightening Developing Tendency of terminal unit of such as smart mobile phone or panel computer etc
Gesture, the requirement to the thickness of the printed circuit board (PCB) (PCB) in terminal unit becomes more and more higher.In order to
Meet the requirement of the integral thickness of terminal unit, generally require and the thickness of impression of the hand printed circuit board is reduced.Cause
This, the thinning technique of regional area that some printed circuit board (PCB) uses, say, that at such printed circuit
On plate, the thickness of specific region is less than the thickness in other region.In the prior art, by such as core
Before the element of sheet, diode or electric capacity etc is welded to such printed circuit board (PCB), need to print at such
The printing zone (that is, paster region or pad) of circuit board one layer of tin cream of upper attachment comes with will when welding
Element is welded to printed circuit board (PCB).But, owing to tin cream is by a scraper shape on a printed circuit
Becoming tin cream, therefore, the thickness that the printing zone at such printed circuit board (PCB) is positioned at printed circuit board (PCB) is less
In the case of region, owing to the reason of difference in height causes this printing zone may will not be attached upper tin cream,
Or tin cream is uneven on this printing zone, thus when element being welded to this printing zone, may
Rosin joint or the even weldering of element can be caused, thus affect the yield of finished product.
Summary of the invention
In order to solve above-mentioned technical problem of the prior art, according to an aspect of the present invention, it is provided that a kind of
The method arranging element on a printed circuit, is applied to printed circuit board (PCB), and described printed circuit board (PCB) includes
By there is the first area of the first thickness and there is the substrate that the second area of the second thickness forms, wherein
Described first thickness is more than described second thickness, and described method includes: be welded on by least one element
Before described printed circuit board (PCB), the first printing zone on described first area arranges tin cream；And
Second printing zone of described second area is not provided with tin cream.
Additionally, according to one embodiment of present invention, wherein said first printing zone and described second
Printing zone is pad.
Additionally, according to one embodiment of present invention, wherein said method farther includes: described
On second printing zone in two regions gold-plated to increase the soldering reliability of the second printing zone.
Additionally, according to one embodiment of present invention, described method farther includes: in described secondth district
Scaling powder is adhered on second printing zone in territory.
Additionally, according to one embodiment of present invention, wherein said method farther includes: by multiple
Before element is welded on described printed circuit board (PCB), at least one soldered ball is set at the plurality of component base,
The size of the soldered ball of wherein corresponding with described second printing zone component base is printed more than with described first
The size of the soldered ball of the component base that region is corresponding.
Additionally, according to one embodiment of present invention, wherein said method farther includes: by multiple
Before element is welded on described printed circuit board (PCB), at least one soldered ball is set at the plurality of component base；
And bottom at least one soldered ball described, adhere to the tin cream of predetermined thickness.
Additionally, according to a further aspect in the invention, it is provided that a kind of printed circuit board (PCB), including:
Substrate, described substrate is by having the first area of the first thickness and having the secondth district of the second thickness
Territory forms, and described first thickness is more than described second thickness, is wherein being welded by least one element
Before described printed circuit board (PCB), the first printing zone on described first area arranges tin cream, and
And it is not provided with tin cream on the second printing zone of described second area.
Additionally, according to one embodiment of present invention, wherein said first printing zone and described second
Printing zone is pad.
Additionally, according to one embodiment of present invention, wherein, in the second Printing Zone of described second area
On territory gold-plated to increase the soldering reliability of the second printing zone.
Additionally, according to one embodiment of present invention, wherein at the second printing zone of described second area
On be attached with scaling powder.
Additionally, according to one embodiment of present invention, wherein multiple elements are being welded on described printing electricity
Before the plate of road, the plurality of component base is provided with at least one soldered ball, wherein with described second printing
The size of the soldered ball of the component base that region is corresponding is more than the component base corresponding with described first printing zone
The size of soldered ball.
Additionally, according to one embodiment of present invention, wherein multiple elements are being welded on described printing electricity
Before the plate of road, the plurality of component base is provided with at least one soldered ball；And described at least one
The tin cream of predetermined thickness it is attached with bottom soldered ball.
By above-mentioned configuration, when to printed circuit board (PCB) print solder paste, not at the low thickness of printed circuit board (PCB)
Region print solder paste, thus can avoid owing to difference in height causes tin cream in the low caliper zones of printed circuit board (PCB)
Territory skewness or fail to be attached to the situation of the low thickness area of printed circuit board (PCB), such that it is able to avoid
It is welded to element be likely to result in the rosin joint of element during this printing zone or connect the generation of situation about welding.
Accompanying drawing explanation
Fig. 1 is to illustrate the method arranging element on a printed circuit according to embodiments of the present invention；
Fig. 2 is to illustrate the schematic diagram arranging tin cream on a printed circuit according to embodiments of the present invention；
Fig. 3 is to illustrate printed circuit board (PCB) according to embodiments of the present invention and the schematic diagram of element to be welded；
And
Fig. 4 is that another that illustrate printed circuit board (PCB) and element to be welded according to embodiments of the present invention shows
It is intended to.
Detailed description of the invention
Will be described in detail with reference to the accompanying drawings each embodiment according to the present invention.Here it is to be noted that it
In the accompanying drawings, identical reference imparting is substantially had the composition of same or like 26S Proteasome Structure and Function
Part, and the repeated description about them will be omitted.
Below with reference to Fig. 1, the side arranging element on a printed circuit according to embodiments of the present invention is described
Method.Here, the method arranging element on a printed circuit according to embodiments of the present invention can apply to
Certain types of printed circuit board (PCB).Here, certain types of printed circuit board (PCB) (PCB) can have office
The substrate that portion is thinning.It is to say, the printed circuit board (PCB) of the type includes by having the first of the first thickness
Region and there is the substrate of second area composition of the second thickness, and the first thickness is more than the second thickness.
As it is shown in figure 1, in step S101, before at least one element is welded on printed circuit board (PCB),
On the first printing zone on the first area of printed circuit board (PCB), tin cream is set.
Additionally, in step S102, the second printing zone of second area is not provided with tin cream.
Here, the first printing zone and the second printing zone are pad.It is to say, the first Printing Zone
Territory and the second printing zone are and each class component (e.g., chip, electric capacity etc.) are welded to printing electricity
The printing zone (paster region) of road plate, wherein to be positioned at thickness on printed circuit board (PCB) higher for the first printing zone
Region (on first area), and the second printing zone is positioned at the relatively low region of thickness on printed circuit board (PCB) (
On two regions).
Here it is possible to according on the first area of printed circuit board (PCB) and second area (low thickness area)
Layout determine attachment tin cream scope.Specifically, can be the of the first area of printed circuit board (PCB)
Tin cream is adhered on one printing zone, and not to other region on the first area of printed circuit board (PCB) and the
Any region in two regions carries out adhering to the process of tin cream.Further, it is also possible to by printed circuit board (PCB)
First area and second area all adhere to tin cream, are then only remained in the tin cream on the first printing zone (e.g.,
Scrape off the tin cream on other region) mode realize on the first printing zone, arranging tin cream and not second
The situation of tin cream it is not provided with on second printing zone in region.Fig. 2 illustrates according to embodiments of the present invention
The situation of tin cream is set on a printed circuit, wherein tin cream is being set on the first printing zone and is not existing
It is not provided with tin cream on second printing zone of second area.
Here, owing to similarly to the prior art, the first printing zone being attached to tin cream, therefore inciting somebody to action
It is similar with the process of prior art that element is welded on the process of the first printing zone, the most only enters it
Row is briefly described.Before element is welded on the first printing zone, generally in element and the first Printing Zone
The part (bottom) of territory contact arranges stannum ball.In this case, element is being welded on the first printing
During region, element can be made to weld by the tin cream on the stannum ball of thawing component base and printed circuit board (PCB)
On printed circuit board (PCB).
According to embodiments of the invention, owing to not arranging tin cream on the second printing zone, therefore by unit
When part is welded to the second printing zone, the method for Fig. 1 can further include at the second of second area
On printing zone gold-plated to increase the soldering reliability of the second printing zone.Here, it is to have due to gold
The conductor of the highest conductivity, therefore element is welded on have on the second printing zone of Gold plated Layer permissible
Effectively ensure that element can connect with other element on printed circuit board (PCB).Additionally, due to the leading of gold
Hot the highest, therefore it is easy to when welding produce uniform temperature at the second printing zone, is thus beneficial to
The welding of element.
Additionally, according to another embodiment of the invention, the method for Fig. 1 can further include
Scaling powder is adhered on second printing zone in two regions.Here, scaling powder can contribute to welding effect
Any type of scaling powder.Furthermore, it is possible to directly adhere to scaling powder on the second printing zone, or
Can also gold-plated on the second printing zone after adhere to scaling powder again.
Then, according to embodiments of the invention, the method shown in Fig. 1 can further include: is inciting somebody to action
Before multiple elements are welded on printed circuit board (PCB), at multiple component base, at least one soldered ball is set (e.g.,
Stannum ball).Here, the size of the soldered ball (stannum ball) of corresponding with the second printing zone component base more than with
The size of the soldered ball (stannum ball) of the component base that the first printing zone is corresponding.Here, as previously described
Like that, when element is welded on the first printing zone, can be by melting stannum ball and the print of component base
Tin cream on printed circuit board makes element be welded on printed circuit board (PCB).Additionally, as it is shown on figure 3, due to
Second printing zone does not have tin cream, therefore, is being welded on by the element corresponding with this second printing zone
Before on second printing zone, at component base, at least one stannum ball is set so that element to be welded to printing electricity
On the plate of road, and in order to ensure the quality of welding, the size of the stannum ball that the bottom of this element is arranged needs big
Size in the soldered ball (stannum ball) of the component base corresponding with the first printing zone.Here, due to
The bottom of the element that this second printing zone is corresponding arranges the stannum ball containing more stannum, therefore by this yuan
When part is welded on the second printing zone, the bigger stannum ball arranged in the bottom of element can produce more
Melt stannum this element is fixed on the second printing zone and ensures setting on this element and the second printing zone
Line electricity connects.Such as, the bottom at the element corresponding with this second printing zone is arranged contained by stannum ball
Stannum amount can and the bottom of the element corresponding with the first printing zone arrange the stannum amount contained by stannum ball and with
The stannum amount of the tin cream on position that stannum ball is corresponding is identical so that by the unit corresponding with this second printing zone
When part is welded to the second printing zone, can there is enough stannum to complete welding procedure.
Additionally, according to another embodiment of the invention, the method shown in Fig. 1 can further include
Before multiple elements are welded on printed circuit board (PCB), at least one soldered ball is set at multiple component base,
And bottom at least one soldered ball, adhere to the tin cream of predetermined thickness.Here, as shown in Figure 4, due to
Two printing zones do not have tin cream, therefore to ensure the quality of welding, will be with the second printing zone pair
Before answering element to be welded on printed circuit board (PCB), except arranging at least one soldered ball (stannum at multiple component base
Ball) outside, also at the tin cream of at least one soldered ball (stannum ball) bottom attachment predetermined thickness.Here, in advance
The effect of the tin cream determining thickness is identical with the effect of the tin cream being attached on the first printing zone.Such as, if
The thickness putting the tin cream bottom at least one stannum ball can be with the tin cream being attached on the first printing zone
Thickness is identical.In this case, printed circuit board (PCB) will be welded on the second printing zone counter element
The second printing zone on time, tin cream bottom at least one stannum ball of this component base melts to be attached to
On second printing zone, stannum ball also melts to merge with tin cream simultaneously, thus can be solid by element
It is scheduled on the second printing zone, ensures the line electricity connection on element and the second printing zone simultaneously.
By the way, when to printed circuit board (PCB) print solder paste, not at the low thickness of printed circuit board (PCB)
The upper print solder paste in region (the second printing zone), thus can avoid owing to difference in height causes tin cream in print
The low thickness area skewness of printed circuit board or fail to be attached to the feelings of the low thickness area of printed circuit board (PCB)
Condition, such that it is able to avoid being likely to result in rosin joint or the company of element when element is welded to this printing zone
The generation of the situation of weldering.
It follows that printed circuit board (PCB) according to embodiments of the present invention will be described.Fig. 2 is that diagram is according to this
The schematic diagram of the printed circuit board (PCB) of bright embodiment.
As in figure 2 it is shown, printed circuit board (PCB) according to embodiments of the present invention includes substrate.Substrate can be by appointing
The semi-conducting material of meaning realizes (e.g., silicon substrate).According to embodiments of the invention, substrate is by having first
The first area of thickness and there is the second area composition of the second thickness, and first area is first thick
Degree is more than the second thickness of second area.It is to say, printed circuit board (PCB) according to embodiments of the present invention is
There is the printed circuit board (PCB) in the region of local reduction.As in figure 2 it is shown, at least one element is being welded on
The first print before printed circuit board (PCB) according to embodiments of the present invention, on the first area of printed circuit board (PCB)
Brush arranges tin cream on region, and is not provided with tin cream on the second printing zone of second area.
Specifically, the first printing zone and the second printing zone are the pad on printed circuit board (PCB).The most just
Being to say, the first printing zone and the second printing zone are each class component (e.g., chip, electric capacity etc.
Deng) it is welded to the printing zone (paster region) of printed circuit board (PCB), wherein the first printing zone is positioned at printing
The region (on first area) that on circuit board, thickness is higher, and the second printing zone is positioned on printed circuit board (PCB)
The region (on second area) that thickness is relatively low.For example, it is possible to according on the first area of printed circuit board (PCB) with
And the layout of second area (low thickness area) determines the scope of attachment tin cream.Specifically, Ke Yi
Adhere to tin cream on first printing zone of the first area of printed circuit board (PCB), and not to printed circuit board (PCB) the
Other region and any region of second area on one region carry out adhering to the process of tin cream.Additionally,
Then can also be only remained in by all adhering to tin cream in the first area of printed circuit board (PCB) and second area
The mode of the tin cream (e.g., scraping off the tin cream on other region) on the first printing zone realizes in the first print
Brush arranges tin cream and is not provided with the situation of tin cream on the second printing zone of second area on region.This
In, similarly to the prior art, owing to being attached to tin cream on the first printing zone, therefore element is being welded
When being connected on the first printing zone, can be by the stannum ball arranged at component base and the first printing zone
The tin cream arranged makes element be welded on printed circuit board (PCB).
Additionally, due to do not arrange tin cream on the second printing zone, therefore, according to embodiments of the invention,
When the second printing zone that element is welded on printed circuit board (PCB), in addition it is also necessary to the second printing zone is entered
Row is specific to be processed.
For example, it is possible to it is gold-plated to increase by the second printing zone on the second printing zone of second area in advance
Soldering reliability.Here, owing to gold is the conductor with the highest conductivity, therefore element is welded
Be connected on have on the second printing zone of Gold plated Layer can effectively ensure element can with on printed circuit board (PCB)
Other element connection.Additionally, due to the heat conductivity of gold is the highest, therefore it is easy to the when welding
Two printing zones produce the welding of uniform temperature, the most beneficially element.
Furthermore it is also possible to adhere to scaling powder in advance on the second printing zone of second area.Here, help
Solder flux can contribute to any type of scaling powder of welding effect.Here it is possible to directly in the second print
Brush region on adhere to scaling powder, or can also gold-plated on the second printing zone after adhere to scaling powder again.
Further, it is also possible to the element of the second printing zone that will be arranged on printed circuit board (PCB) is made a reservation for
Process.
Such as, before multiple elements are welded on printed circuit board (PCB), arrange at least at multiple component base
One soldered ball (e.g., stannum ball) is to arrange element on a printed circuit.Here, with the second Printing Zone
The size of the soldered ball (stannum ball) of the component base that territory is corresponding is at the bottom of more than the element corresponding with the first printing zone
The size of the soldered ball (stannum ball) in portion.Here, as it is shown on figure 3, owing to the second printing zone does not have stannum
Cream, therefore, before the element corresponding with this second printing zone is welded on the second printing zone,
At component base, at least one stannum ball is set to be welded on printed circuit board (PCB) by element, and in order to ensure
The quality of welding, the size of the stannum ball that the bottom of this element is arranged needs more than corresponding with the first printing zone
The size of soldered ball (stannum ball) of component base.Here, due to corresponding with this second printing zone
The bottom of element arranges the stannum ball containing more stannum, therefore this element is being welded on the second printing zone
Time, the bigger stannum ball arranged in the bottom of element can produce and more melt stannum to be fixed on by this element
Second printing zone also ensures the line electricity connection arranged on this element and the second printing zone.Such as, exist
The bottom of the element corresponding with this second printing zone arranges the stannum amount contained by stannum ball and can and print with first
The bottom of the element that region is corresponding arranges the stannum amount contained by stannum ball and the stannum on the position corresponding with stannum ball
The stannum amount of cream is identical so that the element corresponding with this second printing zone is being welded to the second printing zone
Time, can there is enough stannum to complete welding procedure.
Additionally, according to another embodiment of the invention, multiple elements are welded on printed circuit board (PCB) it
Before, at least one soldered ball can be set at multiple component base, and also can be at the bottom of at least one soldered ball
The tin cream of portion's attachment predetermined thickness.Here, as shown in Figure 4, owing to the second printing zone does not have tin cream,
Therefore to ensure the quality of welding, printed circuit board (PCB) will be welded on the second printing zone counter element
Before, in addition to arranging at least one soldered ball (stannum ball) at multiple component base, also at least one
The tin cream of soldered ball (stannum ball) bottom attachment predetermined thickness.Here, the effect of the tin cream of predetermined thickness is with attached
The effect tin cream on the first printing zone is identical.Such as, it is arranged on bottom at least one stannum ball
The thickness of tin cream can be identical with the thickness of the tin cream being attached on the first printing zone.In this case,
By when being welded on the second printing zone of printed circuit board (PCB) with the second printing zone counter element, this yuan
Tin cream bottom at least one stannum ball bottom part melts to be attached on the second printing zone, stannum ball simultaneously
Also melt to merge with tin cream, thus element can be fixed on the second printing zone, simultaneously
Ensure the line electricity connection on element and the second printing zone.
By the way, when to printed circuit board (PCB) print solder paste, not at the low thickness of printed circuit board (PCB)
The upper print solder paste in region (the second printing zone), thus can avoid owing to difference in height causes tin cream in print
The low thickness area skewness of printed circuit board or fail to be attached to the feelings of the low thickness area of printed circuit board (PCB)
Condition, such that it is able to avoid being likely to result in rosin joint or the company of element when element is welded to this printing zone
The generation of the situation of weldering.
Each embodiment of the present invention described in detail above.But, those skilled in the art should manage
Solve, without departing from the principles and spirit of the present invention, these embodiments can be carried out various amendment,
Combine or sub-portfolio, and such amendment should fall within the scope of the present invention.
Claims (12)
1. the method arranging element on a printed circuit, is applied to printed circuit board (PCB), described printing
Circuit board includes by having the first area of the first thickness and having what the second area of the second thickness formed
Substrate, wherein said first thickness is more than described second thickness, and described method includes:
Before at least one element is welded on described printed circuit board (PCB), on described first area
On one printing zone, tin cream is set；And
Second printing zone of described second area is not provided with tin cream.
2. the method for claim 1, wherein
Described first printing zone and described second printing zone are pad.
3. the method for claim 1, farther includes:
On the second printing zone of described second area, the gold-plated welding to increase by the second printing zone is reliable
Property.
4. the method for claim 1, farther includes:
Second printing zone of described second area adheres to scaling powder.
5. the method for claim 1, farther includes:
Before multiple elements are welded on described printed circuit board (PCB), arrange extremely at the plurality of component base
A few soldered ball,
The size of the soldered ball of wherein corresponding with described second printing zone component base is more than with described first
The size of the soldered ball of the component base that printing zone is corresponding.
6. the method for claim 1, farther includes:
Before multiple elements are welded on described printed circuit board (PCB), arrange extremely at the plurality of component base
A few soldered ball；And
The tin cream of predetermined thickness is adhered to bottom at least one soldered ball described.
7. a printed circuit board (PCB), including:
Substrate, described substrate is by having the first area of the first thickness and having the secondth district of the second thickness
Territory forms, and described first thickness is more than described second thickness,
Wherein
Before at least one element is welded on described printed circuit board (PCB), on described first area
Tin cream is set on one printing zone, and is not provided with tin cream on the second printing zone of described second area.
8. printed circuit board (PCB) as claimed in claim 7, wherein,
Described first printing zone and described second printing zone are pad.
9. printed circuit board (PCB) as claimed in claim 7, wherein,
On the second printing zone of described second area, the gold-plated welding to increase by the second printing zone is reliable
Property.
10. printed circuit board (PCB) as claimed in claim 7, wherein,
Second printing zone of described second area is attached with scaling powder.
11. printed circuit board (PCB)s as claimed in claim 7, wherein,
Before multiple elements are welded on described printed circuit board (PCB), it is provided with at the plurality of component base
At least one soldered ball,
The size of the soldered ball of wherein corresponding with described second printing zone component base is more than with described first
The size of the soldered ball of the component base that printing zone is corresponding.
12. printed circuit board (PCB)s as claimed in claim 7, wherein,
Before multiple elements are welded on described printed circuit board (PCB), it is provided with at the plurality of component base
At least one soldered ball；And
The tin cream of predetermined thickness it is attached with bottom at least one soldered ball described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210357087.9A CN103687327B (en) | 2012-09-21 | 2012-09-21 | Printed circuit board (PCB) and the method that element is set on a printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210357087.9A CN103687327B (en) | 2012-09-21 | 2012-09-21 | Printed circuit board (PCB) and the method that element is set on a printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103687327A CN103687327A (en) | 2014-03-26 |
| CN103687327B true CN103687327B (en) | 2016-10-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210357087.9A Active CN103687327B (en) | 2012-09-21 | 2012-09-21 | Printed circuit board (PCB) and the method that element is set on a printed circuit |
Country Status (1)
| Country | Link |
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| CN (1) | CN103687327B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390805A (en) * | 2022-01-26 | 2022-04-22 | 深圳市潜力创新科技有限公司 | Double-layer circuit board welding method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07183433A (en) * | 1993-12-24 | 1995-07-21 | Murata Mfg Co Ltd | Semiconductor device |
| CN101189717A (en) * | 2006-01-13 | 2008-05-28 | 日本Cmk株式会社 | Printed wiring board with built-in semiconductor element and method for manufacturing same |
| CN102300405A (en) * | 2011-08-16 | 2011-12-28 | 深南电路有限公司 | Embedded-type circuit board and production method thereof |
-
2012
- 2012-09-21 CN CN201210357087.9A patent/CN103687327B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07183433A (en) * | 1993-12-24 | 1995-07-21 | Murata Mfg Co Ltd | Semiconductor device |
| CN101189717A (en) * | 2006-01-13 | 2008-05-28 | 日本Cmk株式会社 | Printed wiring board with built-in semiconductor element and method for manufacturing same |
| CN102300405A (en) * | 2011-08-16 | 2011-12-28 | 深南电路有限公司 | Embedded-type circuit board and production method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103687327A (en) | 2014-03-26 |
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