CN103681292B - Band extension fixture - Google Patents
Band extension fixture Download PDFInfo
- Publication number
- CN103681292B CN103681292B CN201310435231.0A CN201310435231A CN103681292B CN 103681292 B CN103681292 B CN 103681292B CN 201310435231 A CN201310435231 A CN 201310435231A CN 103681292 B CN103681292 B CN 103681292B
- Authority
- CN
- China
- Prior art keywords
- clamping
- clamping components
- band
- clamping device
- downside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003825 pressing Methods 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 description 18
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- CHPZKNULDCNCBW-UHFFFAOYSA-N gallium nitrate Chemical compound [Ga+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O CHPZKNULDCNCBW-UHFFFAOYSA-N 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229940044658 gallium nitrate Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Basic Packing Technique (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of band extension fixture, and it is used for the band for expanding rectangle, and it possesses：1st clamping components, the 1st side of its clamping band；2nd clamping components, its clamping band with the 1st at the opposed the 2nd；3rd clamping components, its clamping band with the 1st while and vertical the 3rd side when the 2nd；4th clamping components, its clamping band with the 3rd at the opposed the 4th；And expansion, it makes the 1st~the 4th clamping components be moved respectively in the direction vertical with each side of clamping, 1st~the 4th clamping components have downside clamping device and upside clamping device respectively, either one that the top of clamping device and the bottom of upside clamping device are equipped in the multiple rollers rotated in the direction on the side along clamping, downside clamping device and upside clamping device in downside possesses：Rest pad, it supports two rollers to rotate in the way of with predetermined space；And pressing member, it is used for the active position for halving the interval of two rollers for pressing rest pad.
Description
Technical field
The present invention relates to band extension fixture, it is used to expand the splicing tape for being pasted with chip, and external force is assigned to chip.
Background technology
In semiconductor devices manufacturing process, on the surface of the semiconductor wafer for substantially circular plate shape by being arranged as grid
The segmentation preset lines for being referred to as spacing track of shape mark off multiple regions, and IC is formed in the region marked off（Integrated circuit）、
LSI（Large scale integrated circuit）Deng device.Then, semiconductor wafer is cut off along spacing track, thus to being formed with device
Region split producing device one by one.In addition, being laminated with gallium nitrate kind for the surface in sapphire substrate
The optical device wafer of compound semiconductor etc., cuts off also along predetermined segmentation preset lines, be thus partitioned into one by one light two
The optical devices such as pole pipe, laser diode, and electrical equipment is used extensively.
As the method for splitting the machined objects such as the semiconductor wafer or optical device wafer, following methods are practical：
Using the pulse laser light relative to the machined object with radioparent wavelength, focal point is registered to the area for needing to split
The inside in domain is irradiated, and is continuously formed modified layer along spacing track in the inside of machined object, along due to being formed with
The spacing track application external force of the modified layer and intensity decreases, thus splits machined object（For example, referring to patent document 1）.
Also, as along due to being formed with modified layer and the spacing track of intensity decreases applies the technology of external force, following
Patent document 2 records following technology：Expansion is pasted with the splicing tape of chip, then, will in the state of splicing tape has been expanded
Ring-shaped frame surrounds to be divided into pastes splicing tape the chip of device one by one.
Prior art literature
Patent document 1：No. 3408805 publications of Japanese Patent Publication No.
Patent document 2：Japanese Unexamined Patent Publication 2006-229021 publications
However, it is following to be recorded in existing to the technology that the splicing tape for being pasted with chip is expanded for the patent document 2
Problem：Due to being to clamp the method that opposed two side of splicing tape is stretched, so two vertical sides reduce, so that
It is pasted onto splicing tape and is divided into device one by one to sustain damage.And it there is problems：Clamping vertical two
When bar stretching opposed two in the state of, splicing tape is not expanded fully.
The content of the invention
The present invention is that its major technique problem is to provide with extension fixture in view of described true and completes, even if its
Opposed two side of clamping splicing tape is stretched and expands splicing tape, and two vertical sides will not also reduce, and i.e.
Make also can fully expand splicing tape in the state of two vertical sides have been clamped.
In order to solve above-mentioned major technique problem, according to the present invention there is provided a kind of band extension fixture, it is used to expand rectangle
The band of shape, described to be characterised by with extension fixture, it possesses：1st clamping components, it is used for the 1st side of clamping band；2nd
Clamping components, its be used for clamping band with the described 1st at the opposed the 2nd；3rd clamping components, its be used for clamping band with institute
State the 1st while and vertical the 3rd side when the described 2nd；4th clamping components, it is used for opposed with the 3rd side of clamping band
4 sides；And expansion, its be used to making the 1st clamping components, the 2nd clamping components, the 3rd clamping components and
4th clamping components are respectively in the direction movement vertical relative to clamped each side, the 1st clamping components, the described 2nd
Clamping components, the 3rd clamping components and the 4th clamping components have downside clamping device and upside clamping machine respectively
Structure, the multiple rollers rotated in the direction along clamped side is equipped with the top of the downside clamping device, described
The bottom of upside clamping device is equipped with the multiple rollers rotated in the direction along clamped side, the downside clamping device
Possess with either one in the clamping device of upside：Rest pad, it supports two rollers as energy in the way of with predetermined space
Enough rotations；And pressing member, it is used for the active position for halving the interval of two rollers for pressing the rest pad.
The pressing member is made up of following part：Briquetting, two rest pads are supported to by it can be respectively described
Active position rotates；And actuator, the active position by two rest pads that it is used to press the briquetting is second-class
The pressing position divided.
According in the band extension fixture that constitutes of the present invention, the 1st clamping components, the 2nd clamping components, the 3rd clamping components with
And the 4th clamping components respectively have downside clamping device and upside clamping device, in downside, the top of clamping device is equipped
The multiple rollers rotated along the direction on the side of clamping, in upside, the bottom of clamping device is equipped in the side on the side along clamping
To multiple rollers of rotation, therefore, such as clamping splicing tape the 3rd while and when being expanded when the 4th, even with clamping
With the 3rd while and when the 4th the vertical 1st while and the 1st clamping components and the downside clamping machine of the 2nd clamping components when the 2nd
Structure and upside clamping device are clamped, due to being disposed in multiple rollers rotation of downside clamping device and upside clamping device
Turn, so splicing tape can fully be expanded.In addition, clamp the 1st of splicing tape while and when being expanded when the 2nd, even if
Using clamping with the 1st while and when the 2nd the vertical 3rd while and the 3rd clamping components and the 4th clamping components when the 4th under
Side clamping device and upside clamping device are clamped, due to being disposed in many of downside clamping device and upside clamping device
Individual roller rotation, so splicing tape can fully be expanded.
In addition, in the band extension fixture based on the present invention, due to appointing in downside clamping device and upside clamping device
One side possesses：Rest pad, it supports two rollers to rotate in the way of with predetermined space；And pressing member,
It is used for the active position for halving the interval of two rollers for pressing rest pad, therefore, because to two rollers of supporting
Multiple rest pads are pressed in the active position for halving the interval of two rollers respectively, so can be by paired institute
Two rollers having and be disposed in upside clamping device or downside clamping device downside hold assembly multiple rollers, with equal
Deng power clamp each side of splicing tape.
Brief description of the drawings
Fig. 1 is the stereogram with extension fixture constituted according to the present invention.
Fig. 2 is the major part stereogram of the upside clamping device with extension fixture shown in pie graph 1.
Fig. 3 is by the stereogram shown in the major part decomposition of the upside clamping device shown in Fig. 2.
Fig. 4 is downside clamping device and the upside of the clamping components with extension fixture shown in enlarged representation pie graph 1
The front view of the major part of clamping device.
Fig. 5 is the explanation figure that process is clamped using the band implemented shown in Fig. 1 with extension fixture.
Fig. 6 is using the 1st explanation figure with expansion process implemented with extension fixture shown in Fig. 1.
Fig. 7 is using the 2nd explanation figure with expansion process implemented with extension fixture shown in Fig. 1.
Fig. 8 is to represent to be pasted onto to implement the 1st with being divided on expansion process and the 2nd splicing tape with expansion process
The explanation figure of the state of device one by one.
Fig. 9 is the explanation figure using the framework installation procedure implemented shown in Fig. 1 with extension fixture.
Figure 10 is to represent to implement the framework installation procedure shown in Fig. 9, and will be divided into one by one through splicing tape
Interval is formed between device（s）Chip 10 be supported on ring-shaped frame state sectional view.
Figure 11 is the top view for the splicing tape expanded with extension fixture.
Label declaration
1：Splicing tape；
2：Band extension fixture；
20：Fixed pedestal；
3：Circular holding workbench；
4a：1st clamping components；
4b：2nd clamping components；
4c：3rd clamping components；
4d：4th clamping components；
41：Movable base；
42：Downside clamping device；
422：Downside hold assembly；
423：Roller；
43：Upside clamping device；
433：Roller；
434：Rest pad；
435：Pressing member；
436：Briquetting；
437：Actuator；
44：1st travel mechanism；
45：2nd travel mechanism；
5a：1st band expansion；
5b：2nd band expansion；
5c：3rd band expansion；
5d：4th band expansion；
7：Ring-shaped frame；
10：Chip.
Embodiment
Hereinafter, the preferred embodiment with extension fixture constituted according to the present invention is described in detail referring to the drawings.
Figure 11 represents the top view for the splicing tape expanded with extension fixture.The splicing tape 1 of diagram is formed as square（Square
Shape）, and have：1st while 1a, with the 1st while 1a it is opposed the 2nd while 1b, with the 1st while 1a and the 2nd side 1b it is vertical the 3rd
In 1c and 1c is opposed during with the 3rd the 4th side 1d.Adhesive linkage is coated with the surface of the splicing tape 1 formed like this,
The central portion on the surface is pasted with chip 10.In addition, in the illustrated embodiment, chip 10 is by such semiconductor wafer structure
Into：On surface, 10a is formed with multiple spacing tracks 101 in lattice shape, and by the plurality of spacing track 101 mark off it is many
Device 102 is respectively formed with individual region, chip 10 is divided into device 102 one by one along spacing track 101.
Then, the band extension fixture for expanding splicing tape 1 is illustrated referring to figs. 1 to Fig. 3, pasted on the splicing tape 1
There is the described chip 10 for being divided into device 102 one by one.
The stereogram of with extension fixture the embodiment constituted according to the present invention is shown in Fig. 1.
Band extension fixture 2 in embodiment shown in Fig. 1 has：Fixed pedestal 20；Circular holding workbench 3, its
The central portion upper surface of the fixed pedestal 20 is disposed in, for loading the splicing tape 1；1st clamping components 4a, the 2nd clamping structure
Part 4b, the 3rd clamping components 4c and the 4th clamping components 4d, they are used to clamp the splicing tape for being loaded into the holding workbench 3
1；And the 1st band expansion 5a, the 2nd band expansion 5b, the 3rd band expansion 5c and the 4th band expansion 5d, they are used
In making the 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c, the 4th clamping components 4d respectively in circle
Holding workbench 3 move radially.In addition, in the illustrated embodiment, the 1st clamping components 4a clamps the splicing tape 1
The 1st side 1a, the 2nd clamping components 4b clamping with the 1st while 1a it is opposed the 2nd while 1b, the 3rd clamping components 4c clamping and the 1st side 1a
With the 2nd while 1b it is vertical the 3rd while 1c, the 4th clamping components 4d clampings with the 3rd while 1c it is opposed the 4th while 1d.In addition, the 1st band expansion
Component 5a, the 2nd band expansion 5b, the 3rd band expansion 5c and the 4th band expansion 5d make the 1st clamping components 4a, the 2nd folder
Component 4b, the 3rd clamping components 4c and the 4th clamping components 4d are held respectively along the side vertical with each side of clamped splicing tape 1
To movement.
The fixed pedestal 20 is formed as rectangular shape, is formed with its upper surface and is spaced from each other 90 degree of angle ground direction
The 1st guiding groove 201a being centrally formed of the circular holding workbench 3, the 2nd guiding groove 201b, the 3rd guiding groove 201c and
4th guiding groove 201d.In addition, the formation of fixed pedestal 20 has the 1st guiding groove 201a, the 2nd guiding groove 201b, the 3rd guiding
Groove 201c and the 4th guiding groove 201d peripheral part are formed towards foreign side's protrusion.
The circular holding workbench 3 is supported on to the upper surface of fixed pedestal 20 by supporting member 30.In diagram
Embodiment in, the supporting member 30 is configured to, enable holding workbench 3 above-below direction move.
The 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c and the 4th clamping components 4d are matched somebody with somebody respectively
Located at the 1st guiding groove 201a formed in the fixed pedestal 20, the 2nd guiding groove 201b, the guiding of the 3rd guiding groove 201c and the 4th
On groove 201d.That is, 4 clamping components 4a, 4b, 4c, 4d in the circumferential direction arranged with being spaced apart equal angles.In diagram
In embodiment, the 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components on fixed pedestal 20 are disposed in like this
4c and the 4th clamping components 4d is identical structure, and each of which has：Movable base 41, it is formed as L-shaped；Downside is clamped
Mechanism 42 and upside clamping device 43, they in the way of above-below direction is moved can be arranged on the movable base 41；With
1st travel mechanism 44 and the 2nd travel mechanism 45, they make the downside clamping device 42 and upside clamping device 43 exist respectively
Above-below direction is moved.Formed by movable base 41 erects setting as move portion 411 and from the upper surface of the move portion 411
Support 412 is constituted.The lower surface of move portion 411 be respectively arranged with the 1st guiding groove 201a, the 2nd guiding groove 201b,
3rd guiding groove 201c and the 4th guiding groove 201d it is chimeric be directed track 411a, this is directed track 411a respectively with described the
1 guiding groove 201a, the 2nd guiding groove 201b, the 3rd guiding groove 201c and the 4th guiding groove 201d are chimeric, and thus movable base 41 is constituted
For that can exist respectively along the 1st guiding groove 201a, the 2nd guiding groove 201b, the 3rd guiding groove 201c and the 4th guiding groove 201d
Fixed pedestal 20 is moved.In addition, being formed through internal thread 411b in move portion 411.In the inner side of the support 412
Face（The face of mutually opposing side）The guide rail 412a extended in above-below direction is provided with, in the lateral surface of the support 412
It is formed with the elongated slot 412b extended in above-below direction.The elongated slot 412b is reached in addition, being formed with guide rail 412a from medial surface
And the elongated hole 412c extended in above-below direction.
The downside clamping device 42 is made up of following part：Supporting arm 421, it is arranged to can be described along being arranged at
The guide rail 412a movements of the support 412 of movable base 41；And downside hold assembly 422, it is installed on the supporting arm 421.
The cardinal extremity of supporting arm 421 be provided with it is chimeric with the guide rail 412a be directed groove 421a, by making this be directed groove 421a
Chimeric with guide rail 412a, supporting arm 421 is configured to the guide rail 412a along the support 412 of movable base 41 in upper and lower
To movement.In addition, the base portion in supporting arm 421 is provided with the internal thread block 421c with internal thread 421b, the internal thread block
421c is arranged in the way of through the elongated hole 412c.In the illustrated embodiment, the downside hold assembly 422 is formed as
Rectangular-shape, and arrange long side direction towards the direction vertical with being directed track 411a.Under as constituting like this
The upper surface of the clamping surface side of lateral holding portion part 422, is equipped with multiple rollers in the long side direction rotation of downside hold assembly 422
Son 423.
The upside clamping device 43 possesses：Supporting arm 431, it is arranged to can be along being arranged at the movable base 41
Support 412 guide rail 412a movement；And supporting cover 432, it is installed on the supporting arm 431.In the cardinal extremity of supporting arm 431
Be provided with it is chimeric with the guide rail 412a be directed groove 431a, by, the branch chimeric with guide rail 412a that make this be directed groove 431a
Bearing arm 431 is configured to move in above-below direction along guide rail 412a in the support 412 of movable base 41.In addition, in branch
The base portion of bearing arm 431 is provided with the internal thread block 431c with internal thread 431b, and the internal thread block 431c is with through the elongated hole
412c mode is arranged.
Reference picture 2 and Fig. 3 are said to the component parts being disposed in the supporting cover 432 of upside clamping device 43
It is bright.Upside clamping device 43 shown in Fig. 2 and Fig. 3 possesses：Rest pad 434, it is respectively by two rollers 433 with predetermined
The mode at interval supports to rotate；And pressing member 435, it is used for the interval by two rollers for pressing the rest pad
The active position of bisection.Rest pad 434 possesses roller support 434a and pressing service portion 434b, and pressing service portion 434b exists
Roller support 434a is horizontal-extending from upper end.Two support shafts are equipped at a predetermined interval in roller support 434a
433a, roller 433 is supported with the two support shafts 433a in the way of it can rotate respectively.In addition, constituting rest pad 434
Pressing service portion 434b, by two support shaft 433a（Two rollers 433）Interval halve active position be provided with
Axle runs through patchhole 434c.The rest pad 434 so constituted is pressed component 435 for one with two and pressed over the ground.
Pressing member 435 is made up of following part：Briquetting 436, it is respectively by two rest pads 434 can rotate
Mode is supported on active position；And actuator 437, it is used for the effect by two rest pads 434 for pressing the briquetting 436
The pressing position that position is halved.Briquetting 436 is by upper wall 436a, side wall 436b and 436c and end wall 436d and 436e structure
Into being formed as the open box-like in downside.The axle for being arranged at the pressing service portion 434b for constituting rest pad 434 runs through patchhole
434c respectively in the way of it can rotate be installed on the briquetting 436 so formed side wall 436b two support shafts（Not
Diagram）It is chimeric.In the upper wall 436a of the briquetting 436 so constituted, a pair of linking parts for linking actuator 437 are installed
Part 438a, 438b.Patchhole 438c is formed through in a connecting member 438a, is formed with another connecting member 438b
Screwed hole 438d.In the illustrated embodiment, actuator 437 is made up of cylinder mechanism, in its piston rod 437a terminal part
It is formed with connecting hole 437b.The piston rod 437a of the actuator 437 so constituted terminal part is positioned at a pair of connecting members
Between 438a, 438b, binder bolt 439 is run through be inserted into be formed at connecting member 438a through patchhole 438c,
With the connecting hole 437b for the terminal part for being formed at piston rod 437a, and with being formed at another connecting member 438b screwed hole
438d is screwed togather, thus, will constitute the piston rod 437a and the upper wall 436a installed in briquetting 436 of actuator 437 a pair of companies
Knot part 438a, 438b link.The actuator 437 so constituted is installed on the upper wall of the supporting cover 432.
The upside clamping device 43 constituted in this way is opposed with the downside clamping device 42 to be arranged.Also, it is many
Multiple rollers 433 that individual rest pad 434 is supported by twos respectively, which are matched somebody with somebody, is set to and is disposed in the downside clamping device 42
Multiple rollers 423 of downside hold assembly 422 are opposed.
Fig. 1 is returned to go on to say, make the 1st travel mechanism 44 that the downside clamping device 42 is moved in above-below direction by with
Lower part is constituted：External thread rod 441, it is abreast disposed in the shape of support 412 in the movable base 41 with guide rail 412a
Into elongated slot 412b in, and screwed togather with the internal thread block 421c for the base portion for being arranged at the supporting arm 421 internal thread 421b；Axle
Supporting member 442, it is disposed in the support 412 of movable base 41, and is to revolve by the one end supporting of external thread rod 441
Turn；And impulse motor 443, the other end of itself and external thread rod 441 is connected, and for driving external thread rod 441 to rotate.This
The driving pulse motor 443 of the 1st travel mechanism 44 that sample is constituted makes the external thread rod 441 be rotated to a direction or other direction,
Thus downside clamping device 42 is made to be moved along guide rail 412a in above-below direction.
The upside clamping device 43 is set to be and the 1st travel mechanism in the 2nd travel mechanism 45 that above-below direction is moved
44 same structures, it is disposed in the upside of the 1st travel mechanism 44.That is, the 2nd travel mechanism 45 is made up of following part：Outer spiral shell
Rasp bar 451, it is abreast disposed in the elongated slot 412b of the formation of support 412 of the movable base 41 with guide rail 412a,
And screwed togather with the internal thread block 431c for the base portion for being arranged at the supporting arm 431 internal thread 431b；E axle supporting part 452, it is matched somebody with somebody
It is to rotate located at the support 412 of movable base 41, and by the one end supporting of external thread rod 451；And impulse motor
453, the other end of itself and external thread rod 451 is connected, and for driving external thread rod 451 to rotate.The 2nd movement so constituted
The driving pulse motor 453 of mechanism 45 makes external thread rod 451 be rotated to a direction or other direction, thus makes upside clamping machine
Structure 43 is moved along guide rail 412a in above-below direction.
For making the 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c, the 4th clamping components 4d difference
Along the move radially the 1st band expansion 5a of circular holding workbench 3, the 2nd band expansion 5b, the 3rd band expansion structure
Part 5c, the 4th are with expansion 5d respectively along the 1st guiding groove 201a, the 2nd guiding groove for being formed at the fixed pedestal 20
201b, the 3rd guiding groove 201c, the 4th guiding groove 201d are arranged.The 1st band expansion 5a, the 2nd band expansion 5b, the 3rd
Band expansion 5c, the 4th band expansion 5d are made up of following part：External thread rod 51, it matches somebody with somebody respectively is set to and the 1st guiding groove
201a, the 2nd guiding groove 201b, the 3rd guiding groove 201c, the 4th guiding groove 201d are parallel, and with being formed at the movable base 41
The internal thread 411b of move portion 411 is screwed togather；E axle supporting part 52, it is disposed in the fixed pedestal 20, and by external thread rod 51
One end supporting is to rotate；And pulse motor 53, the other end of itself and external thread rod 51 links, for driving outer spiral shell
Rasp bar 51 rotates.External thread rod 51 is set to be rotated to a direction or another direction by driving pulse motor 53 respectively,
The 1st constituted in the above described manner is with expansion 5a, the 2nd band expansion 5b, the 3rd band expansion 5c, the 4th band expansion
5d makes the 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c, the 4th clamping components 4d respectively along circular holding
Workbench 3 is moved radially.
Band extension fixture 2 in embodiment shown in Fig. 1 to Fig. 3 is constituted as described above, and progress is acted on it below
Explanation.
Chip 10 will be pasted with face center portion shown in described Figure 11 by carrying device (not shown)（It is divided into
Device 102 one by one）Splicing tape 1 be loaded into holding workbench 3 on.At this moment splicing tape 1 is assembled into the 1st side 1a and pressed from both sides towards the 1st
Component 4a, the 2nd side 1b is held to clamp towards the 4th towards the 3rd clamping components 4c, the 4th side 1d towards the 2nd clamping components 4b, the 3rd side 1c
Component 4d.In addition, at this moment keep workbench 3 upper surface be positioned at composition the 1st clamping components 4a, the 2nd clamping components 4b,
The downside hold assembly 422 of 3rd clamping components 4c and the 4th clamping components 4d downside clamping device 42 and upside clamping device 43
Multiple rest pads 434 centre position height.
Then, the 1st band expansion 5a, the 2nd band expansion 5b, the 3rd band expansion 5c and the 4th band expansion are made
5d is acted, by the 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c and the 4th clamping components 4d downside
Clamping device 42 and upside clamping device 43, which are navigated to, can clamp the position of splicing tape 1.Then, composition the 1st is made to clamp structure
Part 4a, the 2nd clamping components 4b, the 3rd clamping components 4c and the 4th clamping components 4d the 1st travel mechanism 44 and the 2nd travel mechanism
45 are acted, and the actuator 437 of clamping device 43 on the upside of composition is acted rest pad via briquetting 436
434 press downwards.As a result, as shown in FIG. 4 and 5, by the lower lateral holding portion for being disposed in downside clamping device 42
Multiple rollers 423 of part 422 and block 434 is supported by respectively（Reference picture 3）The roller 433 of two two of supporting, it is viscous to clamp
Each side of tape splicing 1（Band clamping process）, the rest pad 434 pressed respectively by multiple briquettings 436 of upside clamping device 43.
Now, due to supporting two two roller 433 multiple rest pads 434 respectively the interval of two rollers 433 is second-class
Point active position pressed, therefore, it is possible to clamping machine by paired all two roller 433 and on the downside of being disposed in
Multiple rollers 423 of the downside hold assembly 422 of structure 42, each side of splicing tape 1 is clamped with impartial power.
As shown in FIG. 4 and 5, by the multiple rollers for the downside hold assembly 422 for being disposed in downside clamping device 42
Son 423 and it is supported on two two of the rest pad 434 pressed respectively by multiple briquettings 436 of upside clamping device 43 respectively
After each side of the individual roller 433 to have clamped splicing tape 1, for example, make the 3rd band expansion 5c and the 4th band expansion 5d
Acted, as shown in fig. 6, make the clamping components 4c of composition the 3rd and the 4th clamping components 4d downside clamping device 42 and on
Side clamping device 43 is along in figure 6 with the direction shown in arrow A1 and A2（It is left and right directions in Fig. 6）It is mobile.Its result is,
Splicing tape 1 is in the direction shown in arrow A1 and A2（It is left and right directions in Fig. 6）It is stretched and expands（1st band expansion process）.
At this moment, the downside hold assembly 422 of the 1st clamping components 4a and the 2nd clamping components 4b clamping device on the downside of composition 42 is matched somebody with somebody
If multiple rollers 423 and be configured 434 points of the rest pad pressing respectively of multiple briquettings 436 of upside clamping device 43
2 rollers 433 not supported, which are matched somebody with somebody, to be set in long side direction（Along the 1st in 1a and the 2nd 1b direction）Rotation, the described 1st
Clamping components 4a and the 2nd clamping components 4b clamping splicing tape 1 with being configured the 3rd clamping components 4c and the 4th clamping components
The 3rd 1st side 1a vertical 1d in 1c and the 4th of 4d downside clamping device 42 and upside clamping device 43 clamping and the
2 side 1b, therefore when splicing tape 1 is in the direction shown in arrow A1 and A2（It is left and right directions in Fig. 6）When being stretched and expanding,
Constitute multiple rollers 423 and the clamping device on the upside of being configured that the downside hold assembly 422 of downside clamping device 42 is arranged
2 rollers 433 that the rest pad 434 that 43 multiple briquettings 436 are pressed respectively is supported respectively rotate.Therefore, in clamping bonding
When with the 3rd of 1 the, in 1c and the 4th, 1d is expanded, even with clamping and the 3rd the 1st side that 1d is vertical in 1c and the 4th
1a and the 2nd side 1b the 1st clamping components 4a and the 2nd clamping components 4b downside clamping device 42 and upside clamping device
43 are clamped, multiple rollers 423 for being arranged due to the downside hold assembly 422 of the clamping device 42 on the downside of composition and
2 rollers 433 that the rest pad 434 pressed respectively in the multiple briquettings 436 for being configured upside clamping device 43 is supported respectively
Rotation, so splicing tape 1 can fully be expanded.
Then, the 3rd of the clamping splicing tape 1 shown in described Fig. 6 the in 1c and the 4th while the states expanded of 1d
Under, as shown in fig. 7, clamping the clamping components 4a of composition the 1st and the 2nd clamping components 4b downside clamping device 42 and upside
The direction of mechanism 43 in the figure 7 shown in arrow B1 and B2（It is above-below direction in Fig. 7）It is mobile.Its result is that splicing tape 1 is in arrow
Direction shown in head B1 and B2（It is above-below direction in Fig. 7）It is stretched and expands（2nd band expansion process）.At this moment, the 3rd clamping
Multiple rollers 423 of component 4c and the 4th clamping components 4d arranging of downside hold assembly 422 in downside clamping device 42,
Match somebody with somebody with 2 rollers 433 supported respectively in the rest pad 434 pressed respectively by multiple briquettings 436 of upside clamping device 43
It is set in long side direction（Along the 3rd in 1c and the 4th 1d direction）Rotation, the clampings of the 3rd clamping components 4c and the 4th
The downside clamping device 42 with being configured the 1st clamping components 4a and the 2nd clamping components 4b of component 4d clamping splicing tapes 1 and
Upside clamping device 43 clamp the 1st in 1a and the 2nd 1b is vertical the 3rd in 1c and the 4th while 1d, therefore when splicing tape 1 exists
Direction shown in arrow B1 and B2（It is above-below direction in Fig. 7）When being stretched and expanding, the clamping device 42 on the downside of composition
Multiple rollers 423 and be configured 436 points of multiple briquettings of upside clamping device 43 that downside hold assembly 422 is arranged
2 rollers 433 that the rest pad 434 not pressed is supported respectively rotate.Therefore, in the 1st side 1a and the 2nd of clamping splicing tape 1
When side 1b is expanded, even with clamping with the 1st in 1a and the 2nd 1b is vertical the 3rd in 1c and the 4th while 1d the 3rd
Clamping components 4c and the 4th clamping components 4d downside clamping device 42 and upside clamping device 43 is clamped, due to
The downside hold assembly 422 of clamping device 42 is arranged on the downside of composition multiple rollers 423 and be configured upside clamping machine
2 rollers 433 that the rest pad 434 that multiple briquettings 436 of structure 43 are pressed respectively is supported respectively rotate, so can be fully
Expand splicing tape 1.
In addition, in the embodiment shown, showing such example：Clamped the 1st side 1a of splicing tape 1 and
2nd in 1b and the 3rd in the state of 1c and the 4th side 1d, be performed separately expanding the 3rd of splicing tape 1 in 1c and the 4th 1d
1st with expansion process, with the 1st of expansion splicing tape 1 in 1a and the 2nd 1b the 2nd band expansion process, but can also be simultaneously
Implement the 1st band expansion process and the 2nd band expansion process.
By expand splicing tape 1 as described above the 3rd in 1c and the 4th, 1d and the 1st is in 1a and the 2nd while 1b, such as Fig. 8
It is shown, between device 102 obtained from the chip 10 for being pasted on splicing tape 1 is divided into one by one, it is formed with gap S.
In addition, the longitudinal size and lateral dimension even in device are different, the file and horizontal stroke of the device of chip are disposed in
When the quantity of row is different, by the number of devices with arranging accordingly adjust the 1st of splicing tape 1 in 1a and the 2nd 1b expansion
Amount and the 3rd in 1c and the 4th 1d amount of expansion, the gap S being divided between device one by one can be made constant, and
Gap can be made to be formed point-blank.
Then, it is described be pasted on the chip 10 of splicing tape 1 be divided into one by one formed by shape between device 102
Into in the state of there is a gap S, as shown in figure 9, the ring-shaped frame 7 of the opening portion 70 with the size for storing chip 10 is installed to
The surface for being coated with adhesive linkage of splicing tape 1（Framework installation procedure）.Its result is as shown in Figure 10, to be divided into one one
Interval is formed between individual device 102（s）Chip 10 be received to the opening portion 70 of ring-shaped frame 7, and through splicing tape 1 by
Ring-shaped frame 7 is supported.Like this, after ring-shaped frame 7 is installed into the surface of splicing tape 1, cut along the periphery of ring-shaped frame 7
Disconnected splicing tape 1.Then, the chip 10 of ring-shaped frame 7 will be supported on through splicing tape 1（Interval is formed between device 102（s））
Transport to the pickup process of pickup device.
More than, according to embodiment illustrated, the present invention is described, but the present invention is not merely defined in reality
Mode is applied, various modifications can be carried out in the range of the purport of the present invention.In the embodiment shown, following example is shown
Son：Multiple rest pads 434 and multiple pressing members 435 are disposed in upside clamping device 43, multiple rest pads 434 are by two rollers
The supporting of son 433 is can rotate, and multiple pressing members 435 press multiple rest pads 434, but can also be by multiple rest pads
434 and multiple pressing members 435 be disposed in downside clamping device 42.
In addition, in said embodiment, showing the bonding of the chip 10 to being pasted with after splitting along spacing track 101
With 1 example expanded, still, band extension fixture of the invention can also be applied to situations below：To be pasted with along
The splicing tape that the chip of modified layer is internally formed with every road 101 is expanded, so that along the spacing track for being formed with modified layer
Split chip.
Claims (2)
1. a kind of band extension fixture, it is used for the band for expanding rectangular shape,
Described to be characterised by with extension fixture, it possesses：
1st clamping components, it is used for the 1st side of clamping band；
2nd clamping components, its be used for clamping band with the described 1st at the opposed the 2nd；
3rd clamping components, its be used for clamping band with the described 1st while and vertical the 3rd side when the described 2nd；
4th clamping components, its be used for clamping band with the described 3rd at the opposed the 4th；And
Expansion, it is used to making the 1st clamping components, the 2nd clamping components, the 3rd clamping components and described
4th clamping components are moved in the direction vertical relative to clamped each side respectively,
1st clamping components, the 2nd clamping components, the 3rd clamping components and the 4th clamping components have respectively
There is downside clamping device and upside clamping device, be equipped with the top of the downside clamping device along clamped side
Multiple rollers that direction rotates, are equipped with what is rotated in the direction along clamped side in the bottom of the upside clamping device
Multiple rollers,
Either one in the downside clamping device and upside clamping device possesses：Rest pad, it is by two rollers with pre-
Surely the mode being spaced supports to rotate；And pressing member, its be used to pressing the rest pad by between two rollers
Every the active position of bisection.
2. band extension fixture according to claim 1, wherein, the pressing member is made up of following part：Briquetting, its
Two rest pads, which are supported to, to be rotated respectively in active position；And actuator, it is used for the general for pressing the briquetting
The pressing position that the active position of two rest pads is halved.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012209875A JP6009885B2 (en) | 2012-09-24 | 2012-09-24 | Tape expansion unit |
| JP2012-209875 | 2012-09-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103681292A CN103681292A (en) | 2014-03-26 |
| CN103681292B true CN103681292B (en) | 2017-08-11 |
Family
ID=50318491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310435231.0A Active CN103681292B (en) | 2012-09-24 | 2013-09-23 | Band extension fixture |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6009885B2 (en) |
| KR (1) | KR101953395B1 (en) |
| CN (1) | CN103681292B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6087707B2 (en) * | 2013-04-15 | 2017-03-01 | 株式会社ディスコ | Tape expansion unit |
| JP6468789B2 (en) * | 2014-10-20 | 2019-02-13 | リンテック株式会社 | Spacing device |
| JP6408366B2 (en) * | 2014-12-05 | 2018-10-17 | リンテック株式会社 | Separation device and separation method |
| JP6941022B2 (en) * | 2017-10-06 | 2021-09-29 | 株式会社ディスコ | Expansion method and expansion device |
| CN109985829A (en) * | 2019-05-06 | 2019-07-09 | 山东泓瑞光电科技有限公司 | A kind of LED wafer automatic fraction collector dilator body |
| KR102110282B1 (en) * | 2019-12-09 | 2020-05-13 | (주)한길패키지 | Cutoff apparatus for plastic bag manufacture apparatus and plastic bag manufacture apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5769297A (en) * | 1994-07-20 | 1998-06-23 | Loomis; James W. | Apparatus and method for dicing semiconductor wafers |
| CN1681082A (en) * | 2004-03-31 | 2005-10-12 | 株式会社迪斯科 | Band extending device |
| CN102054681A (en) * | 2009-10-02 | 2011-05-11 | 株式会社迪思科 | Band expanding device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5339854A (en) * | 1976-09-24 | 1978-04-12 | Hitachi Ltd | Jig for spacing |
| JPS61100140U (en) * | 1984-12-05 | 1986-06-26 | ||
| CH674327A5 (en) * | 1984-12-19 | 1990-05-31 | Elpatronic Ag | |
| JPH0212944A (en) * | 1988-06-30 | 1990-01-17 | Nec Corp | Sheet enlarging apparatus for manufacture of semiconductor device |
| US5310104A (en) * | 1991-12-16 | 1994-05-10 | General Electric Company | Method and apparatus for cleaving a semiconductor wafer into individual die and providing for low stress die removal |
| JP3408805B2 (en) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | Cutting origin region forming method and workpiece cutting method |
| JP2005116878A (en) | 2003-10-09 | 2005-04-28 | Toshiba Corp | Method and device for supporting substrate |
| JP2006173269A (en) * | 2004-12-14 | 2006-06-29 | Hamamatsu Photonics Kk | Method for machining substrate and device for extending film |
| JP2006229021A (en) * | 2005-02-18 | 2006-08-31 | Disco Abrasive Syst Ltd | Wafer dividing method |
-
2012
- 2012-09-24 JP JP2012209875A patent/JP6009885B2/en active Active
-
2013
- 2013-09-16 KR KR1020130111136A patent/KR101953395B1/en active IP Right Grant
- 2013-09-23 CN CN201310435231.0A patent/CN103681292B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5769297A (en) * | 1994-07-20 | 1998-06-23 | Loomis; James W. | Apparatus and method for dicing semiconductor wafers |
| CN1681082A (en) * | 2004-03-31 | 2005-10-12 | 株式会社迪斯科 | Band extending device |
| CN102054681A (en) * | 2009-10-02 | 2011-05-11 | 株式会社迪思科 | Band expanding device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101953395B1 (en) | 2019-02-28 |
| JP2014067749A (en) | 2014-04-17 |
| KR20140040013A (en) | 2014-04-02 |
| JP6009885B2 (en) | 2016-10-19 |
| CN103681292A (en) | 2014-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103681292B (en) | Band extension fixture | |
| CN103545238B (en) | Band extension fixture | |
| CN104103585B (en) | Band extension fixture | |
| CN106486398B (en) | The manufacturing method of chip attachment machine, attaching method and semiconductor devices | |
| US20090130821A1 (en) | Three dimensional packaging with wafer-level bonding and chip-level repair | |
| US9603294B2 (en) | Apparatus for mounting semiconductor chips | |
| CN108206150A (en) | Chip engagement machine | |
| JP6408366B2 (en) | Separation device and separation method | |
| CN100449718C (en) | Method and apparatus for mounting semiconductor chips | |
| CN105935842B (en) | The manufacturing method of device chip | |
| CN106558524B (en) | The manufacturing method of chip attachment machine and semiconductor devices | |
| CN105023862A (en) | Chip bonder and bonding method | |
| KR101488609B1 (en) | Manufacturing method of semiconductor device | |
| KR20150014395A (en) | Device for holding multiple semiconductor devices during thermocompression bonding and method of bonding | |
| US11037900B2 (en) | Chip bonding device and bonding method thereof | |
| KR101199718B1 (en) | Apparatus for inspecting light-emitting devices | |
| US9250288B2 (en) | Wafer-level testing method for singulated 3D-stacked chip cubes | |
| KR102080865B1 (en) | Die bonding method | |
| JP7344627B2 (en) | Die attachment systems and methods of attaching the die to the substrate | |
| KR102548788B1 (en) | Apparatus for testing semiconductor devices | |
| CN102222632B (en) | Wafer testing method and device | |
| CN110476224A (en) | Method for making semiconductor | |
| KR20160051488A (en) | Apparatus for bonding dies using recipes different from each other | |
| CN107978543B (en) | Bond head assembly including reflective optical element, associated bonding machine, and associated method | |
| CN107442943A (en) | Extend piece |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |