JP2014067749A - Tape expanding device - Google Patents

Tape expanding device Download PDF

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JP2014067749A
JP2014067749A JP2012209875A JP2012209875A JP2014067749A JP 2014067749 A JP2014067749 A JP 2014067749A JP 2012209875 A JP2012209875 A JP 2012209875A JP 2012209875 A JP2012209875 A JP 2012209875A JP 2014067749 A JP2014067749 A JP 2014067749A
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tape
clamping
clamping means
rollers
adhesive tape
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JP6009885B2 (en
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Toru Takazawa
徹 高澤
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to KR1020130111136A priority patent/KR101953395B1/en
Priority to CN201310435231.0A priority patent/CN103681292B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Basic Packing Technique (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a tape expanding device with which two orthogonal sides of an adhesive tape do not reduce even if two facing sides are sandwiched, pulled and expanded and which can sufficiently expand the adhesive tape in a state where the two orthogonal sides are sandwiched.SOLUTION: A tape expanding device includes: first sandwiching means 4a for sandwiching a first side of a tape; second sandwiching means 4b for sandwiching a second side of the tape, which faces the first side; third sandwiching means 4c for sandwiching a third side of the tape, which is orthogonal with the first side and the second side; fourth sandwiching means 4d for sandwiching a fourth side of the tape, which faces the third side; and expanding means. The sandwiching means 4a, 4b, 4c and 4d individually include lower sandwiching mechanisms 42 and upper sandwiching mechanisms 43. A plurality of rollers 423 are arranged at an upper part of the lower sandwiching mechanism 42, and a plurality of rollers 433 are arranged at a lower part of the upper sandwiching mechanism 43. One of the mechanisms includes a block for supporting the two rollers at a prescribed interval and pressing means for pressing an action position which divides the interval between the two rollers into two halves.

Description

本発明は、ウエーハが貼着された粘着テープを拡張してウエーハに外力を付与するためのテープ拡張装置に関する。   The present invention relates to a tape expansion device for expanding an adhesive tape to which a wafer is attached and applying an external force to the wafer.

半導体デバイス製造工程においては、略円板形状である半導体ウエーハの表面に格子状に配列されたストリートと呼ばれる分割予定ラインによって複数の領域が区画され、この区画された領域にＩＣ、ＬＳＩ等のデバイスを形成する。そして、半導体ウエーハをストリートに沿って切断することによりデバイスが形成された領域を分割して個々のデバイスを製造している。また、サファイヤ基板の表面に窒化ガリウム系化合物半導体等が積層された光デバイスウエーハも所定の分割予定ラインに沿って切断することにより個々の発光ダイオード、レーザーダイオード等の光デバイスに分割され、電気機器に広く利用されている。   In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual devices. In addition, an optical device wafer in which a gallium nitride compound semiconductor or the like is laminated on the surface of a sapphire substrate is also divided into optical devices such as individual light-emitting diodes and laser diodes by cutting along a predetermined division line. Widely used.

上述した半導体ウエーハや光デバイスウエーハ等の被加工物を分割する方法として、その被加工物に対して透過性を有する波長のパルスレーザー光線を用い、分割すべき領域の内部に集光点を合わせて照射し、被加工物の内部にストリートに沿って変質層を連続的に形成し、この変質層が形成されることによって強度が低下したストリートに沿って外力を加えることにより、被加工物を分割する方法が実用化されている。（例えば、特許文献１参照。）   As a method of dividing a workpiece such as the semiconductor wafer or the optical device wafer described above, a pulse laser beam having a wavelength that is transparent to the workpiece is used, and a focusing point is set inside the region to be divided. Irradiate and continuously form a deteriorated layer along the street inside the workpiece, and split the workpiece by applying external force along the street whose strength has decreased due to the formation of this deteriorated layer. The method to do is put into practical use. (For example, refer to Patent Document 1.)

そして、変質層が形成されることによって強度が低下したストリートに沿って外力を付与する技術として、ウエーハが貼着された粘着テープを拡張し、その後、粘着テープを拡張した状態で環状のフレームを個々のデバイスに分割されたウエーハを囲繞して粘着テープに貼着する技術が下記特許文献２に記載されている。   Then, as a technique for applying external force along the street where the strength has decreased due to the formation of the altered layer, the adhesive tape with the wafer attached is expanded, and then the annular frame is expanded with the adhesive tape expanded. A technique for surrounding a wafer divided into individual devices and sticking it to an adhesive tape is described in Patent Document 2 below.

特許第３４０８８０５号公報Japanese Patent No. 3408805 特開２００６−２２９０２１号公報JP 2006-229021 A

而して、上記特許文献２に記載されているウエーハが貼着された粘着テープを拡張する技術は、粘着テープの対向する２辺を挟持して引っ張る方法であるため、直交する２辺が縮小して粘着テープに貼着され個々の分割されたデバイスが損傷するという問題がある。また、直交する２辺を挟持した状態で対向する２辺を引っ張ると粘着テープが十分拡張しないという問題がある。   Therefore, since the technique for expanding the adhesive tape to which the wafer is attached described in Patent Document 2 is a method of sandwiching and pulling two opposite sides of the adhesive tape, the two orthogonal sides are reduced. Then, there is a problem that the individual divided devices that are stuck to the adhesive tape are damaged. Moreover, there is a problem that the adhesive tape does not expand sufficiently if the two opposite sides are pulled with the two orthogonal sides sandwiched.

本発明は上記事実に鑑みてなされたものであり、その主たる技術的課題は、粘着テープの対向する２辺を挟持して引っ張り粘着テープを拡張しても直交する２辺が縮小しないとともに、直交する２辺を挟持した状態でも粘着テープを十分拡張することができるテープ拡張装置を提供することにある。   The present invention has been made in view of the above-mentioned facts, and the main technical problem thereof is that even if the two opposing sides of the adhesive tape are sandwiched and the tensile adhesive tape is expanded, the two orthogonal sides are not reduced and orthogonal An object of the present invention is to provide a tape expansion device capable of sufficiently expanding an adhesive tape even in a state where two sides are sandwiched.

上記主たる技術課題を解決するため、本発明によれば、矩形状のテープを拡張するテープ拡張装置において、
テープの第１辺を挟持する第１の挟持手段と、該第１辺と対向するテープの第２辺を挟持する第２の挟持手段と、該第１辺および該第２辺と直交するテープの第３辺を挟持する第３の挟持手段と、該第３辺と対向するテープの第４辺を挟持する第４の挟持手段と、該第１の挟持手段と該第２の挟持手段と該第３の挟持手段と該第４の挟持手段をそれぞれ挟持する各辺に対して直交する方向に移動せしめる拡張手段と、を具備し、
該第１の挟持手段と該第２の挟持手段と該第３の挟持手段と該第４の挟持手段は、それぞれ下側挟持機構と上側挟持機構とを備え、該下側挟持機構の上部には挟持した辺に沿った方向に回転する複数のコロが配設され、該上側挟持機構の下部には挟持した辺に沿った方向に回転する複数のコロが配設されており、
該下側挟持機構と上側挟持機構のいずれか一方は、２個のコロを所定の間隔を持って回転可能に支持する支持ブロックと、該支持ブロックにおける２個のコロの間隔を２等分する作用位置を押圧する押圧手段と、を具備している、
ことを特徴とするテープ拡張装置が提供される。 In order to solve the main technical problem, according to the present invention, in a tape expansion device for expanding a rectangular tape,
A first clamping means for clamping the first side of the tape, a second clamping means for clamping the second side of the tape facing the first side, and a tape orthogonal to the first side and the second side A third clamping means for clamping the third side of the tape, a fourth clamping means for clamping the fourth side of the tape facing the third side, the first clamping means, and the second clamping means, Extending means for moving the third clamping means and the fourth clamping means in directions orthogonal to the respective sides for clamping the fourth clamping means,
The first clamping means, the second clamping means, the third clamping means, and the fourth clamping means are each provided with a lower clamping mechanism and an upper clamping mechanism, and are provided above the lower clamping mechanism. Is provided with a plurality of rollers rotating in the direction along the sandwiched side, and a plurality of rollers rotating in the direction along the sandwiched side are disposed at the lower portion of the upper clamping mechanism,
One of the lower clamping mechanism and the upper clamping mechanism bisects a support block that rotatably supports two rollers at a predetermined interval, and an interval between the two rollers in the support block. Pressing means for pressing the working position,
A tape expansion device is provided.

上記押圧手段は、２個の支持ブロックをそれぞれが該作用位置において回転可能に支持する押圧ブロックと、該押圧ブロックにおける２個の支持ブロックの該作用位置を２等分する押圧位置を押圧するアクチュエータとによって構成されている。   The pressing means includes a pressing block that rotatably supports two support blocks at the operating position, and an actuator that presses a pressing position that bisects the operating position of the two supporting blocks in the pressing block. And is composed of.

本発明に従って構成されたテープ拡張装置おいては、第１の挟持手段と第２の挟持手段と第３の挟持手段と第４の挟持手段は、それぞれ下側挟持機構と上側挟持機構とを備え、下側挟持機構の上部には挟持した辺に沿った方向に回転する複数のコロが配設されており、上側挟持機構の下部には挟持した辺に沿った方向に回転する複数のコロが配設されているので、例えば粘着テープの第３辺および第４辺を挟持して拡張する際に、第３辺および第４辺と直交する第１辺および第２辺を挟持する第１の挟持手段および第２の挟持手段の下側挟持機構および上側挟持機構によって挟持していても、下側挟持機構および上側挟持機構に配設された複数のコロが回転するので、粘着テープは十分に拡張される。また、粘着テープの第１辺および第２辺を挟持して拡張する際に、第１辺および第２辺と直交する第３辺および第４辺を挟持する第３の挟持手段および第４の挟持手段の下側挟持機構および上側挟持機構によって挟持していても、下側挟持機構および上側挟持機構に配設された複数のコロが回転するので、粘着テープは十分に拡張される。
また、本発明によるテープ拡張装置おいては、下側挟持機構と上側挟持機構のいずれか一方は、２個のコロを所定の間隔を持って回転可能に支持する支持ブロックと、支持ブロックにおける２個のコロの間隔を２等分する作用位置を押圧する押圧手段とを具備しているので、２個のコロを支持する複数の支持ブロックはそれぞれ２個のコロの間隔を２等分する作用位置で押圧されるため、一対をなす全ての２個のコロは上側挟持機構または下側挟持機構の下側挟持部材に配設された複数のコロとによって粘着テープの各辺を均一な力で挟持することができる。 In the tape expansion apparatus constructed according to the present invention, the first clamping means, the second clamping means, the third clamping means, and the fourth clamping means each include a lower clamping mechanism and an upper clamping mechanism. A plurality of rollers that rotate in the direction along the sandwiched side are disposed at the upper part of the lower clamping mechanism, and a plurality of rollers that rotate in the direction along the sandwiched side are disposed at the lower part of the upper clamping mechanism. Since it is disposed, for example, when the third side and the fourth side of the adhesive tape are sandwiched and expanded, the first side and the second side perpendicular to the third side and the fourth side are sandwiched. Even if the holding means and the second holding means are held by the lower holding mechanism and the upper holding mechanism, the plurality of rollers arranged in the lower holding mechanism and the upper holding mechanism rotate, so that the adhesive tape is sufficiently Expanded. Further, when the first side and the second side of the adhesive tape are sandwiched and expanded, a third clamping unit and a fourth clamping unit that clamp the third side and the fourth side orthogonal to the first side and the second side. Even if the holding means is clamped by the lower clamping mechanism and the upper clamping mechanism, the plurality of rollers disposed in the lower clamping mechanism and the upper clamping mechanism rotate, so that the adhesive tape is sufficiently expanded.
In the tape expansion device according to the present invention, one of the lower clamping mechanism and the upper clamping mechanism includes a support block that rotatably supports two rollers at a predetermined interval, and 2 in the support block. A plurality of support blocks for supporting the two rollers, each of which bisects the interval between the two rollers. Since each of the two rollers forming a pair is pressed at a position, each side of the adhesive tape is applied to each side of the adhesive tape with a uniform force by a plurality of rollers arranged on the lower holding member of the upper holding mechanism or the lower holding mechanism. Can be pinched.

本発明に従って構成されたテープ拡張装置の斜視図。1 is a perspective view of a tape expansion device constructed in accordance with the present invention. 図１に示すテープ拡張装置を構成する上側挟持機構の要部斜視図。The principal part perspective view of the upper side clamping mechanism which comprises the tape expansion apparatus shown in FIG. 図２に示す上側挟持機構の要部を分解して示す斜視図。The perspective view which decomposes | disassembles and shows the principal part of the upper side clamping mechanism shown in FIG. 図１に示すテープ拡張装置の挟持手段を構成する下側挟持機構および上側挟持機構の要部を拡大して示す正面図。The front view which expands and shows the principal part of the lower side clamping mechanism and upper side clamping mechanism which comprise the clamping means of the tape expansion apparatus shown in FIG. 図１に示すテープ拡張装置を用いて実施するテープ挟持工程の説明図。Explanatory drawing of the tape clamping process implemented using the tape expansion apparatus shown in FIG. 図１に示すテープ拡張装置を用いて実施する第１のテープ拡張工程の説明図。Explanatory drawing of the 1st tape expansion process implemented using the tape expansion apparatus shown in FIG. 図１に示すテープ拡張装置を用いて実施する第２のテープ拡張工程の説明図。Explanatory drawing of the 2nd tape expansion process implemented using the tape expansion apparatus shown in FIG. 第１のテープ拡張工程および第２のテープ拡張工程が実施された粘着テープに貼着された個々に分割されたデバイスの状態を示す説明図。Explanatory drawing which shows the state of the device divided | segmented separately stuck on the adhesive tape in which the 1st tape expansion process and the 2nd tape expansion process were implemented. 図１に示すテープ拡張装置を用いて実施するフレーム装着工程の説明図。Explanatory drawing of the flame | frame mounting process implemented using the tape expansion apparatus shown in FIG. 図９に示すフレーム装着工程が実施され個々に分割されたデバイス間に間隔(s)が形成されたウエーハ１０が粘着テープを介して環状のフレームに支持された状態を示す断面図。FIG. 10 is a cross-sectional view showing a state in which the wafer 10 in which the frame mounting step shown in FIG. 9 is performed and a space (s) is formed between individually divided devices is supported by an annular frame via an adhesive tape. テープ拡張装置によって拡張される粘着テープの平面図。The top view of the adhesive tape expanded by a tape expansion apparatus.

以下、本発明によって構成されたテープ拡張装置の好適な実施形態について、添付図面を参照して詳細に説明する。   Hereinafter, a preferred embodiment of a tape expansion device constructed according to the present invention will be described in detail with reference to the accompanying drawings.

図１１には、テープ拡張装置によって拡張される粘着テープの平面図が示されている。図示の粘着テープ１は、正方形（矩形）に形成されており、第１辺１aと、該第１辺１aと対向する第２辺１bと、該第１辺１aおよび該第２辺１bと直交する第３辺１cと、該第３辺１cと対向する第４辺１dを備えている。このように形成された粘着テープ１の表面には粘着層が塗布されており、この表面の中央部にウエーハ１０が貼着されている。なお、ウエーハ１０は、図示の実施形態においては表面１０aに複数のストリート１０１が格子状に形成されているとともに、該複数のストリート１０１によって区画された複数の領域にそれぞれデバイス１０２が形成された半導体ウエーハからなっており、ストリート１０１に沿って個々のデバイス１０２に分割されているものとする。   FIG. 11 shows a plan view of an adhesive tape that is expanded by the tape expansion device. The illustrated adhesive tape 1 is formed in a square (rectangular shape), and is orthogonal to the first side 1a, the second side 1b facing the first side 1a, the first side 1a and the second side 1b. And a fourth side 1d opposite to the third side 1c. A pressure-sensitive adhesive layer is applied to the surface of the pressure-sensitive adhesive tape 1 formed as described above, and a wafer 10 is attached to the center of the surface. In the illustrated embodiment, the wafer 10 is a semiconductor in which a plurality of streets 101 are formed in a lattice shape on the surface 10a, and devices 102 are formed in a plurality of regions partitioned by the plurality of streets 101, respectively. It is assumed that it consists of a wafer and is divided into individual devices 102 along the street 101.

次に、上述した個々のデバイス１０２に分割されたウエーハ１０が貼着されている粘着テープ１を拡張するテープ拡張装置について、図１乃至図３を参照して説明する。
図１には、本発明に従って構成されたテープ拡張装置の一実施形態の斜視図が示されている。
図１に示す実施形態におけるテープ拡張装置２は、固定基台２０と、該固定基台２０の中央部上面に配設され上記粘着テープ１を載置する円形状の保持テーブル３と、該保持テーブル３に載置された上記粘着テープ１を挟持する第１の挟持手段４aと第２の挟持手段４bと第３の挟持手段４cと第４の挟持手段４dと、該第１の挟持手段４aと該第２の挟持手段４bと該第３の挟持手段４cと該第４の挟持手段４dをそれぞれ円形状の保持テーブル３の径方向に移動せしめる第１のテープ拡張手段５aと第２のテープ拡張手段５bと第３のテープ拡張手段５cと第４のテープ拡張手段５dを具備している。なお、図示の実施形態においては、第１の挟持手段４aは上記粘着テープ１の第１辺１aを挟持し、第２の挟持手段４bは第１辺１aと対向する第２辺１bを挟持し、第３の挟持手段４cは第１辺１aおよび第２辺１bと直交する第３辺１cを挟持し、第４の挟持手段４dは第３辺１cと対向する第４辺１dを挟持する。また、第１のテープ拡張手段５aと第２のテープ拡張手段５bと第３のテープ拡張手段５cと第４のテープ拡張手段５dは、第１の挟持手段４aと第２の挟持手段４bと第３の挟持手段４cと第４の挟持手段４dをそれぞれ挟持する粘着テープ１の各辺に対して直交する方向に移動せしめる。 Next, a tape expansion device that expands the adhesive tape 1 to which the wafer 10 divided into the individual devices 102 is attached will be described with reference to FIGS. 1 to 3.
FIG. 1 shows a perspective view of one embodiment of a tape expansion device constructed in accordance with the present invention.
The tape expansion device 2 in the embodiment shown in FIG. 1 includes a fixed base 20, a circular holding table 3 disposed on the upper surface of the central portion of the fixed base 20, and on which the adhesive tape 1 is placed, and the holding The first clamping means 4a, the second clamping means 4b, the third clamping means 4c, the fourth clamping means 4d, and the first clamping means 4a for clamping the adhesive tape 1 placed on the table 3. The first and second tape-carrying means 5a and the second tape for moving the second clamping means 4b, the third clamping means 4c and the fourth clamping means 4d in the radial direction of the circular holding table 3, respectively. An expansion means 5b, a third tape expansion means 5c, and a fourth tape expansion means 5d are provided. In the illustrated embodiment, the first clamping means 4a clamps the first side 1a of the adhesive tape 1, and the second clamping means 4b clamps the second side 1b facing the first side 1a. The third clamping means 4c clamps the third side 1c orthogonal to the first side 1a and the second side 1b, and the fourth clamping means 4d clamps the fourth side 1d facing the third side 1c. The first tape expanding means 5a, the second tape expanding means 5b, the third tape expanding means 5c, and the fourth tape expanding means 5d are the first clamping means 4a, the second clamping means 4b, and the second clamping means. The third clamping means 4c and the fourth clamping means 4d are moved in a direction orthogonal to the respective sides of the adhesive tape 1 that clamps the third clamping means 4c and the fourth clamping means 4d.

上記固定基台２０は矩形状に形成され、その上面には互いに９０度の角度を持って上記円形状の保持テーブル３の中心に向かって形成された第１の案内溝２０１aと第２の案内溝２０１bと第３の案内溝２０１cと第４の案内溝２０１dが形成されている。また、固定基台２０の上記第１の案内溝２０１aと第２の案内溝２０１bと第３の案内溝２０１cと第４の案内溝２０１dが形成された外周部は、外方に突出して形成されている。   The fixed base 20 is formed in a rectangular shape, and a first guide groove 201a and a second guide are formed on the upper surface of the fixed base 20 with an angle of 90 degrees to the center of the circular holding table 3. A groove 201b, a third guide groove 201c, and a fourth guide groove 201d are formed. Further, the outer peripheral portion of the fixed base 20 on which the first guide groove 201a, the second guide groove 201b, the third guide groove 201c, and the fourth guide groove 201d are formed is formed to protrude outward. ing.

上記円形状の保持テーブル３は、固定基台２０の上面に支持手段３０によって支持されている。この支持手段３０は、図示の実施形態においては保持テーブル３を上下方向に移動可能に構成されている。   The circular holding table 3 is supported by the support means 30 on the upper surface of the fixed base 20. In the illustrated embodiment, the support means 30 is configured to be able to move the holding table 3 in the vertical direction.

上記第１の挟持手段４aと第２の挟持手段４bと第３の挟持手段４cと第４の挟持手段４dは、上記固定基台２０に形成された第１の案内溝２０１aと第２の案内溝２０１bと第３の案内溝２０１cと第４の案内溝２０１d上にそれぞれ配設されている。即ち、４個の挟持手段４a、４b、４c、４d、は、周方向に互いに等角度をもって配設されている。このように固定基台２０上に配設された第１の挟持手段４aと第２の挟持手段４bと第３の挟持手段４cと第４の挟持手段４dは、図示の実施形態においては同一の構成であり、それぞれＬ字状に形成された可動基台４１と、該可動基台４１に上下方向に移動可能に装着された下側挟持機構４２および上側挟持機構４３と、該下側挟持機構４２および上側挟持機構４３をそれぞれ上下方向に移動せしめる第１の移動機構４４および第２の移動機構４５とを具備している。可動基台４１は、移動部４１１と、該移動部４１１の上面から立設して形成された支持部４１２とからなっている。移動部４１１の下面にはそれぞれ上記第１の案内溝２０１a、第２の案内溝２０１b、第３の案内溝２０１c、第４の案内溝２０１dに嵌合する被案内レール４１１aが設けられており、この被案内レール４１１aをそれぞれ上記第１の案内溝２０１a、第２の案内溝２０１b、第３の案内溝２０１c、第４の案内溝２０１dに嵌合することにより、可動基台４１は固定基盤２０にそれぞれ上記第１の案内溝２０１a、第２の案内溝２０１b、第３の案内溝２０１c、第４の案内溝２０１dに沿って移動可能に構成される。また、移動部４１１には、雌ネジ４１１bが貫通して形成されている。上記支持部４１２の内側の面（互いに対向する側の面）には上下方向に延びる案内レール４１２aが設けられており、外側の面には上下方向に延びる長溝４１２bが形成されている。また、案内レール４１２aには、内側の面から上記長溝４１２bに達し上下方向に延びる長穴４１２cが形成されている。   The first clamping means 4a, the second clamping means 4b, the third clamping means 4c, and the fourth clamping means 4d are composed of a first guide groove 201a and a second guide formed in the fixed base 20, respectively. The groove 201b, the third guide groove 201c, and the fourth guide groove 201d are disposed on the groove 201b, the third guide groove 201c, and the fourth guide groove 201d, respectively. That is, the four clamping means 4a, 4b, 4c, and 4d are disposed at equal angles with each other in the circumferential direction. Thus, the first clamping means 4a, the second clamping means 4b, the third clamping means 4c, and the fourth clamping means 4d arranged on the fixed base 20 are the same in the illustrated embodiment. A movable base 41 having an L-shape, a lower clamping mechanism 42 and an upper clamping mechanism 43 mounted on the movable base 41 so as to be movable in the vertical direction, and the lower clamping mechanism. The first moving mechanism 44 and the second moving mechanism 45 that move the upper and lower clamping mechanisms 43 in the vertical direction are provided. The movable base 41 includes a moving part 411 and a support part 412 formed upright from the upper surface of the moving part 411. Guided rails 411a that fit into the first guide groove 201a, the second guide groove 201b, the third guide groove 201c, and the fourth guide groove 201d are provided on the lower surface of the moving part 411, By fitting the guided rail 411a into the first guide groove 201a, the second guide groove 201b, the third guide groove 201c, and the fourth guide groove 201d, the movable base 41 is fixed to the fixed base 20. Are configured to be movable along the first guide groove 201a, the second guide groove 201b, the third guide groove 201c, and the fourth guide groove 201d, respectively. The moving part 411 is formed with a female screw 411b penetrating therethrough. A guide rail 412a extending in the vertical direction is provided on the inner surface (surfaces facing each other) of the support portion 412, and a long groove 412b extending in the vertical direction is formed on the outer surface. The guide rail 412a has a long hole 412c extending from the inner surface to the long groove 412b and extending in the vertical direction.

上記下側挟持機構４２は、上記可動基台４１の支持部４１２に設けられた案内レール４１２aに沿って移動可能に配設された支持アーム４２１と、該支持アーム４２１に取り付けられた下側挟持部材４２２とからなっている。支持アーム４２１の基端には上記案内レール４１２aと嵌合する被案内溝４２１aが設けられており、この被案内溝４２１aを案内レール４１２aに嵌合することにより、支持アーム４２１は可動基台４１の支持部４１２の案内レール４１２aに沿って上下方向に移動可能に構成される。また、支持アーム４２１の基部には雌ネジ４２１bを備えた雌ネジブロック４２１cが設けられており、この雌ネジブロック４２１cが上記長穴４１２cを挿通して配設される。上記下側挟持部材４２２は、図示の実施形態においては直方体状に形成されており、長手方向が被案内レール４１１aと直交する方向に向けて配設されている。このように構成された下側挟持部材４２２の挟持面側である上面には、下側挟持部材４２２の長手方向に回転する複数のコロ４２３が配設されている。   The lower clamping mechanism 42 includes a support arm 421 movably disposed along a guide rail 412 a provided on the support portion 412 of the movable base 41, and a lower clamping mechanism attached to the support arm 421. It consists of the member 422. A guided groove 421a that fits with the guide rail 412a is provided at the base end of the support arm 421. By fitting the guided groove 421a into the guide rail 412a, the support arm 421 is moved to the movable base 41. The support portion 412 is configured to be movable in the vertical direction along the guide rail 412a. Further, a female screw block 421c having a female screw 421b is provided at the base portion of the support arm 421, and this female screw block 421c is disposed through the elongated hole 412c. In the illustrated embodiment, the lower clamping member 422 is formed in a rectangular parallelepiped shape, and is disposed such that its longitudinal direction is perpendicular to the guided rail 411a. A plurality of rollers 423 that rotate in the longitudinal direction of the lower clamping member 422 are disposed on the upper surface that is the clamping surface side of the lower clamping member 422 configured as described above.

上記上側挟持機構４３は、上記可動基台４１の支持部４１２に設けられた案内レール４１２aに沿って移動可能に配設された支持アーム４３１と、該支持アーム４３１に取り付けられた支持カバー４３２を具備している。支持アーム４３１の基端には上記案内レール４１２aと嵌合する被案内溝４３１aが設けられており、この被案内溝４３１aを案内レール４１２aに嵌合することにより、支持アーム４３１は可動基台４１の支持部４１２に案内レール４１２aに沿って上下方向に移動可能に構成される。また、支持アーム４３１の基部には雌ネジ４３１bを備えた雌ネジブロック４３１cが設けられており、この雌ネジブロック４３１cが上記長穴４１２cを挿通して配設される。   The upper clamping mechanism 43 includes a support arm 431 movably disposed along a guide rail 412 a provided on the support portion 412 of the movable base 41, and a support cover 432 attached to the support arm 431. It has. A guided groove 431a that fits with the guide rail 412a is provided at the base end of the support arm 431. By fitting the guided groove 431a to the guide rail 412a, the support arm 431 is moved to the movable base 41. The support portion 412 is configured to be movable in the vertical direction along the guide rail 412a. Further, a female screw block 431c having a female screw 431b is provided at the base portion of the support arm 431, and this female screw block 431c is disposed through the elongated hole 412c.

上記支持カバー４３２内に配設される上側挟持機構４３の構成部材について、図２および図３を参照して説明する。図２および図３に示す上側挟持機構４３は、それぞれ２個のコロ４３３を所定の間隔を持って回転可能に支持する支持ブロック４３４と、該支持ブロックにおける２個のコロの間隔を２等分する作用位置を押圧する押圧手段４３５を具備している。支持ブロック４３４は、コロ支持部４３４aと該コロ支持部４３４aに上端から水平に延びる押圧作用部４３４bを備えている。コロ支持部４３４aには２個の支持軸４３３aが所定の間隔をおいて配設され、この２個の支持軸４３３aにそれぞれコロ４３３が回転可能に支持されている。なお、支持ブロック４３４を構成する押圧作用部４３４bには、２個の支持軸４３３a（２個のコロ４３３）の間隔を２等分する作用位置に軸挿通穴４３４cが設けられている。このように構成された支持ブロック４３４は、２個を一対として押圧手段４３５によって押圧されるようになっている。   Constituent members of the upper clamping mechanism 43 disposed in the support cover 432 will be described with reference to FIGS. The upper clamping mechanism 43 shown in FIG. 2 and FIG. 3 has a support block 434 that rotatably supports two rollers 433 with a predetermined interval, and divides the interval between the two rollers in the support block into two equal parts. A pressing means 435 for pressing the operating position is provided. The support block 434 includes a roller support portion 434a and a pressing action portion 434b extending horizontally from the upper end of the roller support portion 434a. Two support shafts 433a are disposed on the roller support portion 434a at a predetermined interval, and the rollers 433 are rotatably supported by the two support shafts 433a. In addition, a shaft insertion hole 434c is provided in the pressing action portion 434b constituting the support block 434 at an action position that bisects the interval between the two support shafts 433a (two rollers 433). The support block 434 configured as described above is pressed by the pressing unit 435 as a pair.

押圧手段４３５は、２個の支持ブロック４３４をそれぞれ作用位置において回転可能に支持する押圧ブロック４３６と、該押圧ブロック４３６における２個の支持ブロック４３４の作用位置を２等分する押圧位置を押圧するアクチュエータ４３７とによって構成されている。押圧ブロック４３６は、上壁４３６aと側壁４３６bおよび４３６cと端壁４３６dおよび４３６eとからなり、下側が開放された箱状に形成されている。このように形成された押圧ブロック４３６の側壁４３６bに装着された２本の支持軸（図示せず）に上記、支持ブロック４３４を構成する押圧作用部４３４bに設けられた軸挿通穴４３４cがそれぞれ回転可能に嵌合される。このように構成された押圧ブロック４３６の上壁４３６aには、アクチュエータ４３７を連結するための一対の連結部材４３８a，４３８bが装着されている。一方の連結部材４３８aには挿通穴４３８cが形成され、他方の連結部材４３８bにはネジ穴４３８dが形成されている。アクチュエータ４３７は、図示の実施形態においてはエアシリンダ機構からなり、そのピストンロッド４３７aの先端部に連結穴４３７bが形成されている。このように構成されたアクチュエータ４３７のピストンロッド４３７aの先端部を一対の連結部材４３８a，４３８b間に位置付け、連結ボルト４３９を一方の連結部材４３８aに形成された挿通穴４３８cおよびピストンロッド４３７aの先端部に形成された連結穴４３７bを挿通し、他方の連結部材４３８bに形成されたネジ穴４３８dに螺合することにより、アクチュエータ４３７を構成するピストンロッド４３７aを押圧ブロック４３６の上壁４３６aに装着された一対の連結部材４３８a，４３８bに連結する。このように構成されたアクチュエータ４３７は、上記支持カバー４３２の上壁に取り付けられる。   The pressing means 435 presses the pressing block 436 that rotatably supports the two support blocks 434 at the operating position, and the pressing position that bisects the operating position of the two supporting blocks 434 in the pressing block 436. And an actuator 437. The pressing block 436 includes an upper wall 436a, side walls 436b and 436c, and end walls 436d and 436e, and is formed in a box shape having an open lower side. The shaft insertion holes 434c provided in the pressing portion 434b constituting the support block 434 rotate on the two support shafts (not shown) mounted on the side wall 436b of the press block 436 formed as described above. Can be fitted. A pair of connecting members 438a and 438b for connecting the actuator 437 are mounted on the upper wall 436a of the pressing block 436 configured as described above. One connecting member 438a has an insertion hole 438c, and the other connecting member 438b has a screw hole 438d. The actuator 437 is formed of an air cylinder mechanism in the illustrated embodiment, and a connecting hole 437b is formed at the tip of the piston rod 437a. The tip of the piston rod 437a of the actuator 437 configured in this way is positioned between the pair of connecting members 438a and 438b, and the connecting bolt 439 is inserted into the through hole 438c formed in one connecting member 438a and the tip of the piston rod 437a. The piston rod 437a that constitutes the actuator 437 is mounted on the upper wall 436a of the pressing block 436 by inserting the connecting hole 437b formed in the second connecting member 438b and screwing into the screw hole 438d formed in the other connecting member 438b. It connects with a pair of connecting member 438a, 438b. The actuator 437 configured in this manner is attached to the upper wall of the support cover 432.

以上のように構成された上側挟持機構４３は、上記下側挟持機構４２と対向して配設される。そして、複数の支持ブロック４３４にそれぞれ２個ずつ支持された複数のコロ４３３は、上記下側挟持機構４２の下側挟持部材４２２に配設された複数のコロ４２３と対向するように配設される。   The upper clamping mechanism 43 configured as described above is disposed to face the lower clamping mechanism 42. The plurality of rollers 433 that are each supported by the plurality of support blocks 434 are disposed so as to face the plurality of rollers 423 disposed on the lower holding member 422 of the lower holding mechanism 42. The

図１に戻って説明を続けると、上記下側挟持機構４２を上下方向に移動せしめる第１の移動機構４４は、上記可動基台４１の支持部４１２に形成された長溝４１２b内に案内レール４１２aと平行に配設され上記支持アーム４２１の基部に設けられた雌ネジブロック４２１cの雌ネジ４２１bと螺合する雄ネジロッド４４１と、可動基台４１の支持部４１２に配設され雄ネジロッド４４１の一端部を回転可能に支持する軸受４４２と、雄ネジロッド４４１の他端に連結され雄ネジロッド４４１を回転駆動するためのパルスモータ４４３とからなっている。このように構成された第１の移動機構４４は、パルスモータ４４３を駆動して雄ネジロッド４４１を一方向または他方向に回動することにより、下側挟持機構４２を案内レール４１２aに沿って上下方向に移動せしめる。   Returning to FIG. 1 and continuing the description, the first moving mechanism 44 for moving the lower clamping mechanism 42 in the vertical direction is guided rail 412a in the long groove 412b formed in the support portion 412 of the movable base 41. And a male screw rod 441 that engages with the female screw 421b of the female screw block 421c provided at the base of the support arm 421, and one end of the male screw rod 441 provided on the support 412 of the movable base 41. And a pulse motor 443 connected to the other end of the male screw rod 441 for driving the male screw rod 441 to rotate. The first moving mechanism 44 configured as described above drives the pulse motor 443 to rotate the male screw rod 441 in one direction or the other direction, thereby moving the lower clamping mechanism 42 up and down along the guide rail 412a. Move in the direction.

上記上側挟持機構４３を上下方向に移動せしめる第２の移動機構４５は、上記第１の移動機構４４と同様の構成で第１の移動機構４４の上側に配設されている。即ち、第２の移動機構４５は、上記可動基台４１の支持部４１２に形成された長溝４１２b内に案内レール４１２aと平行に配設され上記支持アーム４３１の基部に設けられた雌ネジブロック４３１cの雌ネジ４３１bと螺合する雄ネジロッド４５１と、可動基台４１の支持部４１２に配設され雄ネジロッド４５１の一端部を回転可能に支持する軸受４５２と、雄ネジロッド４５１の他端に連結され雄ネジロッド４５１を回転駆動するためのパルスモータ４５３とからなっている。このように構成された第２の移動機構４５は、パルスモータ４５３を駆動して雄ネジロッド４５１を一方向または他方向に回動することにより、上側挟持機構４３を案内レール４１２aに沿って上下方向に移動せしめる。   The second moving mechanism 45 that moves the upper clamping mechanism 43 in the vertical direction is arranged on the upper side of the first moving mechanism 44 with the same configuration as the first moving mechanism 44. That is, the second moving mechanism 45 is arranged in a long groove 412b formed in the support portion 412 of the movable base 41 in parallel with the guide rail 412a and is provided with a female screw block 431c provided at the base portion of the support arm 431. A male screw rod 451 screwed into the female screw 431b, a bearing 452 disposed on the support portion 412 of the movable base 41 and rotatably supporting one end portion of the male screw rod 451, and the other end of the male screw rod 451. It comprises a pulse motor 453 for rotationally driving the male screw rod 451. The second moving mechanism 45 configured in this manner drives the pulse motor 453 to rotate the male screw rod 451 in one direction or the other direction, thereby moving the upper clamping mechanism 43 in the vertical direction along the guide rail 412a. Move to.

上記第１の挟持手段４a、第２の挟持手段４b、第３の挟持手段４c、第４の挟持手段４dをそれぞれ円形状の保持テーブル３の径方向に移動せしめる第１のテープ拡張手段５a、第２のテープ拡張手段５b、第３のテープ拡張手段５c、第４のテープ拡張手段５dは、それぞれ上記固定基台２０に形成された上記第１の案内溝２０１a、第２の案内溝２０１b、第３の案内溝２０１c、第４の案内溝２０１dに沿って配設されている。この第１のテープ拡張手段５a、第２のテープ拡張手段５b、第３のテープ拡張手段５c、第４のテープ拡張手段５dは、それぞれ第１の案内溝２０１a、第２の案内溝２０１b、第３の案内溝２０１c、第４の案内溝２０１dと平行に配設され上記可動基台４１の移動部４１１に形成された雌ネジ４１１bと螺合する雄ネジロッド５１と、上記固定基台２０に配設され雄ネジロッド５１の一端部を回転可能に支持する軸受５２と、雄ネジロッド５１の他端と連結され雄ネジロッド５１を回転駆動するためのパルスモータ５３とからなっている。このように構成された第１のテープ拡張手段５a、第２のテープ拡張手段５b、第３のテープ拡張手段５c、第４のテープ拡張手段５dは、それぞれパルスモータ５３を駆動して雄ネジロッド５１を一方向または他方向に回動することにより、第１の挟持手段４a、第２の挟持手段４b、第３の挟持手段４c、第４の挟持手段４dをそれぞれ円形状の保持テーブル３の径方向に移動せしめる。   A first tape expansion means 5a for moving the first clamping means 4a, the second clamping means 4b, the third clamping means 4c, and the fourth clamping means 4d in the radial direction of the circular holding table 3, respectively; The second tape expanding means 5b, the third tape expanding means 5c, and the fourth tape expanding means 5d are respectively composed of the first guide groove 201a, the second guide groove 201b formed on the fixed base 20, respectively. It is disposed along the third guide groove 201c and the fourth guide groove 201d. The first tape expanding means 5a, the second tape expanding means 5b, the third tape expanding means 5c, and the fourth tape expanding means 5d are respectively composed of a first guide groove 201a, a second guide groove 201b, and a second guide groove 201b. A male screw rod 51 which is arranged in parallel with the third guide groove 201c and the fourth guide groove 201d and which engages with a female screw 411b formed in the moving part 411 of the movable base 41, and the fixed base 20. The bearing 52 is provided to rotatably support one end portion of the male screw rod 51, and a pulse motor 53 is connected to the other end of the male screw rod 51 and rotationally drives the male screw rod 51. The first tape expansion means 5a, the second tape expansion means 5b, the third tape expansion means 5c, and the fourth tape expansion means 5d configured in this way each drive the pulse motor 53 to drive the male screw rod 51. By rotating the first holding means 4a, the second holding means 4b, the third holding means 4c, and the fourth holding means 4d to the diameter of the circular holding table 3, respectively. Move in the direction.

図１乃至図３に示す実施形態におけるテープ拡張装置２は以上のように構成されており、以下その作用について説明する。
上記図１１に示す表面中央部にウエーハ１０（個々のデバイス１０２に分割されている）が貼着されている粘着テープ１は、図示しない搬送装置によって保持テーブル３上に載置される。このとき粘着テープ１は、第１辺１aを第１の挟持手段４aに向け、第２辺１bを第２の挟持手段４bに向け、第３辺１cを第３の挟持手段４cに向け、第４辺１dを第４の挟持手段４dに向けて載置される。なお、このとき保持テーブル３は、上面が上記第１の挟持手段４a、第２の挟持手段４b、第３の挟持手段４c、第４の挟持手段４dを構成する下側挟持機構４２の下側挟持部材４２２と上側挟持機構４３の複数の支持ブロック４３４との中間位置の高さに位置付けられている。 The tape expansion device 2 in the embodiment shown in FIGS. 1 to 3 is configured as described above, and the operation thereof will be described below.
The adhesive tape 1 having the wafer 10 (divided into individual devices 102) attached to the center of the surface shown in FIG. 11 is placed on the holding table 3 by a transport device (not shown). At this time, the adhesive tape 1 has the first side 1a facing the first clamping means 4a, the second side 1b facing the second clamping means 4b, the third side 1c facing the third clamping means 4c, The four sides 1d are placed toward the fourth clamping means 4d. At this time, the holding table 3 has an upper surface below the lower clamping mechanism 42 that constitutes the first clamping means 4a, the second clamping means 4b, the third clamping means 4c, and the fourth clamping means 4d. It is positioned at the height of an intermediate position between the holding member 422 and the plurality of support blocks 434 of the upper holding mechanism 43.

次に、第１のテープ拡張手段５a、第２のテープ拡張手段５b、第３のテープ拡張手段５c、第４のテープ拡張手段５dを作動して第１の挟持手段４a、第２の挟持手段４b、第３の挟持手段４c、第４の挟持手段４dの下側挟持機構４２および上側挟持機構４３を粘着テープ１を挟持できる位置に位置付ける。そして、第１の挟持手段４a、第２の挟持手段４b、第３の挟持手段４c、第４の挟持手段４dを構成する第１の移動機構４４および第２の移動機構４５を作動するとともに、上側挟持機構４３を構成するアクチュエータ４３７を作動して押圧ブロック４３６を介して支持ブロック４３４を下方に押圧する。この結果、図４および図５に示すように下側挟持機構４２の下側挟持部材４２２に配設された複数のコロ４２３と上側挟持機構４３の複数の押圧ブロック４３６によってそれぞれ押圧される支持ブロック４３４（図３参照）にそれぞれ支持された２個ずつのコロ４３３とによって粘着テープ１の各辺を挟持する（テープ挟持工程）。このとき、２個ずつのコロ４３３を支持する複数の支持ブロック４３４はそれぞれ２個のコロ４３３の間隔を２等分する作用位置で押圧されるので、一対をなす全ての２個のコロ４３３は下側挟持機構４２の下側挟持部材４２２に配設された複数のコロ４２３とによって粘着テープ１の各辺を均一な力で挟持することができる。   Next, the first and second clamping means 5a, 5b, 5b, 5c and 4d are operated to operate the first clamping means 4a and the second clamping means. 4b, the third clamping means 4c, the lower clamping mechanism 42 and the upper clamping mechanism 43 of the fourth clamping means 4d are positioned at positions where the adhesive tape 1 can be clamped. And while operating the 1st moving means 44 and the 2nd moving mechanism 45 which comprise the 1st clamping means 4a, the 2nd clamping means 4b, the 3rd clamping means 4c, and the 4th clamping means 4d, The actuator 437 constituting the upper clamping mechanism 43 is operated to press the support block 434 downward via the pressing block 436. As a result, as shown in FIGS. 4 and 5, the support blocks pressed by the plurality of rollers 423 disposed on the lower clamping member 422 of the lower clamping mechanism 42 and the plurality of pressing blocks 436 of the upper clamping mechanism 43, respectively. Each side of the adhesive tape 1 is clamped by two rollers 433 respectively supported by 434 (see FIG. 3) (tape clamping process). At this time, each of the plurality of support blocks 434 supporting the two rollers 433 is pressed at the working position that bisects the interval between the two rollers 433, so that all the two rollers 433 forming a pair are Each side of the adhesive tape 1 can be clamped with a uniform force by the plurality of rollers 423 disposed on the lower clamping member 422 of the lower clamping mechanism 42.

図４および図５に示すように下側挟持機構４２の下側挟持部材４２２に配設された複数のコロ４２３と上側挟持機構４３の複数の押圧ブロック４３６によってそれぞれ押圧される支持ブロック４３４にそれぞれ支持された２個ずつのコロ４３３とによって粘着テープ１の各辺を挟持したならば、例えば第３のテープ拡張手段５cおよび第４のテープ拡張手段５dを作動し、図６に示すように第３の挟持手段４cおよび第４の挟持手段４dを構成する下側挟持機構４２および上側挟持機構４３を図６において矢印A1およびA2で示す方向（図６において左右方向）に移動せしめる。この結果、粘着テープ１は、矢印A1およびA2で示す方向（図６において左右方向）に引っ張られて拡張する（第１のテープ拡張工程）。このとき、第３の挟持手段４cおよび第４の挟持手段４dを構成する下側挟持機構４２および上側挟持機構４３に挟持された粘着テープ１の第３辺１cおよび第４辺１dと直交する第１辺１aおよび第２辺１bを挟持する第１の挟持手段４aおよび第２の挟持手段４bの下側挟持機構４２を構成する下側挟持部材４２２に配設された複数のコロ４２３および上側挟持機構４３を構成する複数の押圧ブロック４３６によってそれぞれ押圧される支持ブロック４３４にそれぞれ支持された２個のコロ４３３は長手方向（第１辺１aおよび第２辺１bに沿った方向）に回転するように配設されているので、粘着テープ１が矢印A1およびA2で示す方向（図６において左右方向）に引っ張られて拡張すると、下側挟持機構４２を構成する下側挟持部材４２２に配設された複数のコロ４２３および上側挟持機構４３を構成する複数の押圧ブロック４３６によってそれぞれ押圧される支持ブロック４３４にそれぞれ支持された２個のコロ４３３が回転する。従って、粘着テープ１の第３辺１cおよび第４辺１dを挟持して拡張する際に、第３辺１cおよび第４辺１dと直交する第１辺１aおよび第２辺１bを挟持する第１の挟持手段４aおよび第２の挟持手段４bの下側挟持機構４２および上側挟持機構４３によって挟持していても、下側挟持機構４２を構成する下側挟持部材４２２に配設された複数のコロ４２３および上側挟持機構４３を構成する複数の複数の押圧ブロック４３６によってそれぞれ押圧される支持ブロック４３４にそれぞれ支持された２個のコロ４３３が回転するので、粘着テープ１は十分に拡張される。   As shown in FIGS. 4 and 5, the plurality of rollers 423 provided on the lower holding member 422 of the lower holding mechanism 42 and the support blocks 434 respectively pressed by the plurality of pressing blocks 436 of the upper holding mechanism 43 are respectively provided. If each side of the adhesive tape 1 is sandwiched between the two rollers 433 that are supported, for example, the third tape expansion means 5c and the fourth tape expansion means 5d are operated, and as shown in FIG. The lower clamping mechanism 42 and the upper clamping mechanism 43 constituting the third clamping means 4c and the fourth clamping means 4d are moved in the directions indicated by arrows A1 and A2 in FIG. 6 (left and right directions in FIG. 6). As a result, the adhesive tape 1 expands by being pulled in the direction indicated by the arrows A1 and A2 (the left-right direction in FIG. 6) (first tape expansion step). At this time, the third side 1c and the fourth side 1d of the adhesive tape 1 clamped by the lower clamping mechanism 42 and the upper clamping mechanism 43 constituting the third clamping means 4c and the fourth clamping means 4d are orthogonal to each other. A plurality of rollers 423 and an upper holding member disposed on a lower holding member 422 constituting the lower holding mechanism 42 of the first holding unit 4a and the second holding unit 4b that hold the first side 1a and the second side 1b. The two rollers 433 supported by the support blocks 434 respectively pressed by the plurality of pressing blocks 436 constituting the mechanism 43 are rotated in the longitudinal direction (the direction along the first side 1a and the second side 1b). Therefore, when the adhesive tape 1 is extended by being pulled in the direction indicated by the arrows A1 and A2 (left and right direction in FIG. 6), it is disposed on the lower clamping member 422 constituting the lower clamping mechanism 42. Two rollers 433 which are supported respectively on support blocks 434 are pressed, respectively, by a plurality of pressing blocks 436 which constitute the plurality of rollers 423 and the upper clamping mechanism 43 is rotated. Therefore, when sandwiching and expanding the third side 1c and the fourth side 1d of the adhesive tape 1, the first side 1a and the second side 1b perpendicular to the third side 1c and the fourth side 1d are sandwiched. A plurality of rollers disposed on the lower clamping member 422 constituting the lower clamping mechanism 42 even when the lower clamping mechanism 42 and the upper clamping mechanism 43 are clamped by the lower clamping mechanism 42 and the second clamping means 4b. Since the two rollers 433 respectively supported by the support blocks 434 pressed by the plurality of pressing blocks 436 constituting the 423 and the upper clamping mechanism 43 rotate, the adhesive tape 1 is sufficiently expanded.

次に、上記第６図に示す粘着テープ１の第３辺１cおよび第４辺１dを挟持して拡張した状態で、図７に示すように第１の挟持手段４aおよび第２の挟持手段４bを構成する下側挟持機構４２および上側挟持機構４３を図７において矢印B1およびB2で示す方向（図７において上下方向）に移動せしめる。この結果、粘着テープ１は、矢印B1およびB2で示す方向（図７において上下方向）に引っ張られて拡張する（第２のテープ拡張工程）。このとき、第１の挟持手段４aおよび第２の挟持手段４bを構成する下側挟持機構４２および上側挟持機構４３に挟持された粘着テープ１の第１辺１aおよび第２辺１dと直交する第３辺１cおよび第４辺１dを挟持する第３の挟持手段４cおよび第４の挟持手段４dの下側挟持機構４２の下側挟持部材４２２に配設された複数のコロ４２３と上側挟持機構４３の複数の押圧ブロック４３６によってそれぞれ押圧される支持ブロック４３４にそれぞれ支持された２個のコロ４３３は長手方向（第３辺１cおよび第４辺１dに沿った方向）に回転するように配設されているので、粘着テープ１が矢印B1およびB2で示す方向（図７において上下方向）に引っ張られて拡張すると、下側挟持機構４２を構成する下側挟持部材４２２に配設された複数のコロ４２３および上側挟持機構４３を構成する複数の押圧ブロック４３６によってそれぞれ押圧される支持ブロック４３４にそれぞれ支持された２個のコロ４３３が回転する。従って、粘着テープ１の第１辺１aおよび第２辺１bを挟持して拡張する際に、第１辺１aおよび第２辺１bと直交する第３辺１cおよび第４辺１dを挟持する第３の挟持手段４cおよび第４の挟持手段４dの下側挟持機構４２および上側挟持機構４３によって挟持していても、下側挟持機構４２を構成する下側挟持部材４２２に配設された複数のコロ４２３および上側挟持機構４３を構成する複数の押圧ブロック４３６によってそれぞれ押圧される支持ブロック４３４にそれぞれ支持された２個のコロ４３３が回転するので、粘着テープ１は十分に拡張される。
なお、上述した実施形態においては、粘着テープ１の第１辺１aおよび第２辺１bと第３辺１cおよび第４辺１dを挟持した状態で、粘着テープ１の第３辺１cおよび第４辺１dを拡張する第１のテープ拡張工程と粘着テープ１の第１辺１aおよび第２辺１bを拡張する第２のテープ拡張工程を分けて実施する例を示したが、第１のテープ拡張工程と第２のテープ拡張工程を同時に実施してもよい。 Next, in a state where the third side 1c and the fourth side 1d of the adhesive tape 1 shown in FIG. 6 are held and expanded, as shown in FIG. 7, the first holding means 4a and the second holding means 4b. Are moved in directions indicated by arrows B1 and B2 in FIG. 7 (vertical direction in FIG. 7). As a result, the adhesive tape 1 is extended by being pulled in the direction indicated by arrows B1 and B2 (vertical direction in FIG. 7) (second tape expansion step). At this time, the first side 1a and the second side 1d of the adhesive tape 1 held between the lower holding mechanism 42 and the upper holding mechanism 43 constituting the first holding means 4a and the second holding means 4b are orthogonal to each other. A plurality of rollers 423 and an upper clamping mechanism 43 disposed on the lower clamping member 422 of the lower clamping mechanism 42 of the third clamping means 4c and the fourth clamping means 4d that clamp the three sides 1c and the fourth side 1d. The two rollers 433 respectively supported by the support blocks 434 pressed by the plurality of pressing blocks 436 are arranged to rotate in the longitudinal direction (the direction along the third side 1c and the fourth side 1d). Therefore, when the adhesive tape 1 is pulled and expanded in the directions indicated by the arrows B1 and B2 (vertical direction in FIG. 7), a plurality of rollers disposed on the lower clamping member 422 constituting the lower clamping mechanism 42 is provided. 423 Two rollers 433 which are supported respectively on support blocks 434 are pressed, respectively, by a plurality of pressing blocks 436 which constitute the fine upper clamping mechanism 43 is rotated. Accordingly, when the first side 1a and the second side 1b of the adhesive tape 1 are sandwiched and expanded, the third side 1c and the fourth side 1d perpendicular to the first side 1a and the second side 1b are sandwiched. A plurality of rollers disposed on the lower clamping member 422 constituting the lower clamping mechanism 42 even when the lower clamping mechanism 42 and the upper clamping mechanism 43 clamp the lower clamping mechanism 42 and the fourth clamping means 4d. Since the two rollers 433 respectively supported by the support blocks 434 pressed by the plurality of pressing blocks 436 constituting the 423 and the upper clamping mechanism 43 rotate, the adhesive tape 1 is sufficiently expanded.
In the above-described embodiment, the third side 1c and the fourth side of the pressure-sensitive adhesive tape 1 are sandwiched between the first side 1a and the second side 1b, the third side 1c and the fourth side 1d of the pressure-sensitive adhesive tape 1. Although the 1st tape expansion process which expands 1d and the 2nd tape expansion process which expands the 1st edge | side 1a and the 2nd edge | side 1b of the adhesive tape 1 were shown separately, the 1st tape expansion process was shown. And the second tape expansion step may be performed simultaneously.

以上のように粘着テープ１の第３辺１cおよび第４辺１dと第１辺１aおよび第２辺１bを拡張することにより、図８に示すように粘着テープ１に貼着されたウエーハ１０が個々に分割されているデバイス１０２間には、隙間Sが形成される。
なお、デバイスの縦および横の寸法が異なり、ウエーハに配設されたデバイスの縦列と横列の数が異なる場合でも、配設されたデバイスの数に対応して粘着テープ１の第１辺１aおよび第２辺１bの拡張量と第３辺１cおよび第４辺１dの拡張量を調整することにより、個々に分割されているデバイス間の隙間Sを一定にできるとともに、隙間を一直線上に形成することができる。 As described above, by expanding the third side 1c and the fourth side 1d and the first side 1a and the second side 1b of the adhesive tape 1, the wafer 10 attached to the adhesive tape 1 as shown in FIG. A gap S is formed between the devices 102 that are individually divided.
Even when the vertical and horizontal dimensions of the devices are different and the numbers of columns and rows of devices arranged on the wafer are different, the first side 1a of the adhesive tape 1 corresponding to the number of devices arranged and By adjusting the extension amount of the second side 1b and the extension amounts of the third side 1c and the fourth side 1d, the gap S between the devices divided individually can be made constant, and the gap is formed on a straight line. be able to.

次に、上述した粘着テープ１に貼着されたウエーハ１０が個々に分割されているデバイス１０２間に隙間Sを形成した状態で、図９に示すようにウエーハ１０が収容される大きさの開口部７０を有する環状のフレーム７を粘着テープ１の粘着層が塗布された表面に装着する（フレーム装着工程）。この結果、図１０に示すように個々に分割されたデバイス１０２間に間隔(s)が形成されたウエーハ１０は、環状のフレーム７の開口部７０に収容され、粘着テープ１を介して環状のフレーム７によって支持されることになる。このようにして、粘着テープ１の表面に環状のフレーム７を装着したならば、粘着テープ１を環状のフレーム７の外周に沿って切断する。そして、環状のフレーム７に粘着テープ１を介して支持されたウエーハ１０（デバイス１０２間に間隔(s)が形成されている）は、デバイスをピックアップするピックアップ工程に搬送される。   Next, in the state where gaps S are formed between the devices 102 in which the wafers 10 adhered to the above-described adhesive tape 1 are individually divided, as shown in FIG. An annular frame 7 having a portion 70 is attached to the surface of the adhesive tape 1 to which the adhesive layer has been applied (frame attachment step). As a result, as shown in FIG. 10, the wafer 10 in which the space (s) is formed between the individually divided devices 102 is accommodated in the opening 70 of the annular frame 7, and the annular shape is interposed via the adhesive tape 1. It will be supported by the frame 7. In this manner, when the annular frame 7 is mounted on the surface of the adhesive tape 1, the adhesive tape 1 is cut along the outer periphery of the annular frame 7. Then, the wafer 10 supported by the annular frame 7 via the adhesive tape 1 (the interval (s) is formed between the devices 102) is conveyed to a pickup process for picking up the device.

以上、本発明を図示の実施形態に基づいて説明したが、本発明は実施形態のみに限定されるものではなく、本発明の趣旨の範囲で種々の変形は可能である。上述した実施形態においては、２個のコロ４３３を回転可能に支持する複数の支持ブロック４３４および複数の支持ブロック４３４を押圧する複数の押圧手段４３５を上側挟持機構４３に配設した例を示したが、複数の支持ブロック４３４および複数の押圧手段４３５は下側挟持機構４２に配設してもよい。
また、上述した実施形態においては、ストリート１０１に沿って分割されたウエーハ１０が貼着された粘着テープ１を拡張する例を示したが、本発明によるテープ拡張装置はストリート１０１に沿って内部に改質層が形成されたウエーハが貼着された粘着テープを拡張して、ウエーハを改質層が形成されたストリートに沿って分割する場合に用いてもよい。 Although the present invention has been described based on the illustrated embodiment, the present invention is not limited to the embodiment, and various modifications are possible within the scope of the gist of the present invention. In the above-described embodiment, the example in which the plurality of support blocks 434 that rotatably support the two rollers 433 and the plurality of pressing units 435 that press the plurality of support blocks 434 are arranged in the upper clamping mechanism 43 is shown. However, the plurality of support blocks 434 and the plurality of pressing means 435 may be disposed in the lower clamping mechanism 42.
Further, in the above-described embodiment, an example in which the adhesive tape 1 to which the wafer 10 divided along the street 101 is attached is shown. However, the tape expansion device according to the present invention is arranged along the street 101 inside. It may be used when the adhesive tape to which the wafer with the modified layer is attached is expanded to divide the wafer along the street with the modified layer formed.

１：粘着テープ
２：テープ拡張装置
２０：固定基台
３：円形状の保持テーブル
４ａ：第１の挟持手段
４ｂ：第２の挟持手段
４ｃ：第３の挟持手段
４ｄ：第４の挟持手段
４１：可動基台
４２：下側挟持機構
４２２：下側挟持部材
４２３：コロ
４３：上側挟持機構
４３３：コロ
４３４：支持ブロック
４３５：押圧手段
４３６：押圧ブロック
４３７：アクチュエータ
４４：第１の移動機構
４５：第２の移動機構
５ａ：第１のテープ拡張手段
５ｂ：第２のテープ拡張手段
５ｃ：第３のテープ拡張手段
５ｄ：第４のテープ拡張手段
７：環状のフレーム
１０：ウエーハ 1: Adhesive tape 2: Tape expanding device 20: Fixed base 3: Circular holding table 4a: First clamping means 4b: Second clamping means 4c: Third clamping means 4d: Fourth clamping means 41 : Moving base 42: Lower clamping mechanism 422: Lower clamping member 423: Roller 43: Upper clamping mechanism 433: Roller 434: Support block 435: Pressing means 436: Pressing block 437: Actuator 44: First moving mechanism 45 : Second moving mechanism 5a: first tape expansion means 5b: second tape expansion means 5c: third tape expansion means 5d: fourth tape expansion means 7: annular frame 10: wafer

Claims (2)

矩形状のテープを拡張するテープ拡張装置において、
テープの第１辺を挟持する第１の挟持手段と、該第１辺と対向するテープの第２辺を挟持する第２の挟持手段と、該第１辺および該第２辺と直交するテープの第３辺を挟持する第３の挟持手段と、該第３辺と対向するテープの第４辺を挟持する第４の挟持手段と、該第１の挟持手段と該第２の挟持手段と該第３の挟持手段と該第４の挟持手段をそれぞれ挟持する各辺に対して直交する方向に移動せしめる拡張手段と、を具備し、
該第１の挟持手段と該第２の挟持手段と該第３の挟持手段と該第４の挟持手段は、それぞれ下側挟持機構と上側挟持機構とを備え、該下側挟持機構の上部には挟持した辺に沿った方向に回転する複数のコロが配設され、該上側挟持機構の下部には挟持した辺に沿った方向に回転する複数のコロが配設されており、
該下側挟持機構と上側挟持機構のいずれか一方は、２個のコロを所定の間隔を持って回転可能に支持する支持ブロックと、該支持ブロックにおける２個のコロの間隔を２等分する作用位置を押圧する押圧手段と、を具備している、
ことを特徴とするテープ拡張装置。 In a tape expansion device that expands a rectangular tape,
A first clamping means for clamping the first side of the tape, a second clamping means for clamping the second side of the tape facing the first side, and a tape orthogonal to the first side and the second side A third clamping means for clamping the third side of the tape, a fourth clamping means for clamping the fourth side of the tape facing the third side, the first clamping means, and the second clamping means, Extending means for moving the third clamping means and the fourth clamping means in directions orthogonal to the respective sides for clamping the fourth clamping means,
The first clamping means, the second clamping means, the third clamping means, and the fourth clamping means are each provided with a lower clamping mechanism and an upper clamping mechanism, and are provided above the lower clamping mechanism. Is provided with a plurality of rollers rotating in the direction along the sandwiched side, and a plurality of rollers rotating in the direction along the sandwiched side are disposed at the lower portion of the upper clamping mechanism,
One of the lower clamping mechanism and the upper clamping mechanism bisects a support block that rotatably supports two rollers at a predetermined interval, and an interval between the two rollers in the support block. Pressing means for pressing the working position,
A tape expansion device characterized by that. 上記押圧手段は、２個の支持ブロックをそれぞれが作用位置において回転可能に支持する押圧ブロックと、該押圧ブロックにおける２個の支持ブロックの作用位置を２等分する押圧位置を押圧するアクチュエータとによって構成されている、請求項１記載のテープ拡張装置。   The pressing means includes a pressing block that supports the two support blocks so as to be rotatable at the operating position, and an actuator that presses the pressing position that bisects the operating position of the two supporting blocks in the pressing block. The tape expansion device according to claim 1, which is configured.
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