CN103676474B - The manufacture method that a kind of micro-embossing mould is split type - Google Patents
The manufacture method that a kind of micro-embossing mould is split type Download PDFInfo
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Abstract
The invention discloses the manufacture method that a kind of micro-embossing mould is split type.Described method is the module of the processing of the target pattern design according to impressing mould；Being smaller than 1mm between the single pattern of target pattern of described impressing mould and single pattern dimension is the most one-dimensional less than 1mm, module includes A, B module, and quantity is more than or equal to 1；Then machining A, B module and the module rack corresponding to module；The module rack of fixing A, B module group of finally combination and correspondence forms micro-embossing mould；Described A, B module array mode for being staggered, seamless and A, B module height between A, B module.
Description
Technical field
The present invention relates to the manufacture method of a kind of micro-embossing mould, be specifically related to the manufacture that a kind of micro-embossing mould is split type
Method.
Background technology
Micro-embossing technology is one of microreplicated conventional technology.Micro-embossing technology only need to prepare one piece of template (mould), just
Much copy can be processed quickly, inexpensively, easily, also there is processing three dimensional structure pattern, processing different materials etc. excellent
Point.
In micro-embossing, the duplication of information is difficult point, and the manufacture of mould is the approach that information replicates.It is usually used in minute-pressure at present
The method of die tool has: all-in-one-piece fine precision machining, LIGA technology, LIGA-like technology.Fine precision machining
Technology requires expensive precision optical machinery oil (gas) filling device, and LIGA technology need expensive synchrotron radiation X radiant and X-ray mask and
Light source is rare, greatly limit the application of LIGA technology.LIGA-like technology needs also exist for the equipment of costliness.LIGA-like technology includes
UV-LIGA, Laser-LIGA, SI-LIGA and the DEM technology of use silicon deep etching process.The SU8 used in UV-LIGA technology bears
Property photoresist very sensitive to lithography process parameters, and repeatability poor, particularly SU photoresist is through overexposure and electroforming process
After generate cross-linked polymer, be very difficult to remove, limit application.And it is difficult directly to carry out micro-electroforming in silicon deep etching process from silicon
Spend bigger.
It addition, all-in-one-piece fine precision machining, LIGA technology, LIGA-like technology are each due to the mould processed
Between relief pattern, spacing is the least, it is impossible to process to improve fineness to the sidewall of pattern.Rough sidewall is easy to
Cause demoulding difficulty after impressing, in knockout course, even destroy pattern after mould or impressing.
Summary of the invention
It is an object of the invention to provide a kind of method obtaining high accuracy micro-embossing mould by common process equipment, tool
Body relates to the manufacture method that a kind of micro-embossing mould is split type.
The technical solution realizing the object of the invention is:
The manufacture method that a kind of micro-embossing mould is split type, described method includes:
(1) according to the module of the processing of the target pattern design of impressing mould；The target pattern of described impressing mould
Being smaller than 1mm between single pattern and single pattern dimension is the most one-dimensional less than 1mm, module includes A, B module, quantity
More than or equal to 1；
(2) machining A, B module and the module rack corresponding to module；
(3) module rack of fixing A, B module group of combination and correspondence forms micro-embossing mould；Described A, B module array mode
For being staggered, seamless and A, B module height between A, B module.
Wherein, the target pattern of step (1) impressing mould is the pattern formed at body surface after needs imprint, this figure
Case includes the single pattern that quantity is more than 1, and as being respectively 0.1mm square by length, width and height, each square horizontal direction is separated by
0.2mm, vertical direction is concordant, and it is exactly a kind of target pattern that 200 row 150 arrange the pattern of such square arrangement, wherein
Length, width and height are respectively the single patterns in target pattern for the square of 0.1mm.
The single pattern dimension of target pattern of described impressing mould the most one-dimensional upper less than 1mm refer to single pattern length,
Wide, high at least one less than 1mm.If single pattern is cylinder, billiard table, circular cone, refer to its diameter, the most at least
One is less than 1mm.
Described module includes A, B module and more multimode, and the kind of module and quantity are according to the mesh of required impressing mould
The requirement of case of marking on a map determines.
Step (2) machining refers to that all energy machinery means manufacture the process of product, includes but not limited to: laser is cut
Cut, heavy processing, metal bonding, metal drawing, plasma cutting, precision welding, rolling and forming, sheet metal brake forming,
Die forging, water injection cutting, precision welding.
Step (3) combination stuck-module and corresponding module rack, mode can be to utilize fastenings (screw, alignment pin
Deng) by method fixing to module and module rack, it is also possible to fixed by the plunging of interference fit, or other modes fixed,
Method, method for brazing that the physical characteristic expanded with heat and contract with cold such as riveting, applied metal material is fixed, utilize low-melting alloy cold
Low-melting alloy method that time solidifying, the characteristic of volumetric expansion fastens, by the phosphoric acid solution of epoxy adhesive or aluminium hydroxide
It is mixed into binding agent with cupric oxide powder and pours into method fixing after solidification in the gap of retaining element.
A kind of micro-embossing mould, uses the manufacture method that above-mentioned micro-embossing mould is split type, and described method includes following step
Rapid:
(11) according to the module of the processing of the target pattern design of impressing mould: the target pattern of described impressing mould
Being smaller than 1mm between single pattern and single pattern dimension is the most one-dimensional less than 1mm, described processing module is by A plate B plate
Composition, wherein A plate and B plate are rectangular structure, and length is respectively 5-300mm, 0.01-1mm, 1-200mm；
(12) machining module and the module rack corresponding to module: carry out according to the A plate B plate shape described in step (11)
Processing, the module rack of A plate B plate is placed in processing simultaneously；
(13) combination stuck-module group and corresponding module rack form micro-embossing mould: arrange according to the mode of ABABABABA
Row A, B plate makes A plate B plate fit tightly together in being positioned over module rack, seamless between A, B plate, module rack surrounding bolt
Fixing A, B plate group forms micro-embossing mould.
A kind of micro-embossing mould, uses the manufacture method that above-mentioned micro-embossing mould is split type, and described method includes following step
Rapid:
(21) according to the module of the processing of the target pattern design of impressing mould: the target pattern of described impressing mould
Being smaller than 1mm between single pattern and single pattern dimension is the most one-dimensional less than 1mm, described processing module is by A plate B plate
Composition, wherein A plate and B plate are made up of upper and lower two parts respectively, and top and the bottom are wide different long, high rectangular structure and are
Integrated design, described A plate and B plate lower part rectangular structure have identical length, and upper part rectangular structure has
Identical length and width；
(22) machining module and the module rack corresponding to module: carry out according to the A plate B plate shape described in step (21)
Processing, processing simultaneously places the module rack of A plate B plate, has cavity inside module rack, the profile phase of cavity shape and A plate B plate
Join；
(23) combination stuck-module group shape and corresponding module put up micro-embossing mould: arrange according to the mode of ABABABABA
Row A, B plate makes A plate B plate fit tightly together in being positioned over module rack, seamless between A, B plate, module rack surrounding bolt
Fixing A, B plate group forms micro-embossing mould.
Wherein, in step (21), the length of A plate and B plate lower part rectangular structure is respectively 5-300mm, 0.01-
1mm, 1-200mm, the length of A plate upper part rectangular structure is respectively 5-300mm, 0.01-1mm, 1-10mm, on B plate
The length and width of part rectangular structure is respectively 5-300mm, 0.01-1mm, short transverse 0.01-1mm lower than A plate.
A kind of micro-embossing mould, uses the manufacture method that above-mentioned micro-embossing mould is split type, and described method includes following step
Rapid:
(31) according to the module of the processing of the target pattern design of impressing mould: the target pattern of described impressing mould
Being smaller than 1mm between single pattern and single pattern dimension is the most one-dimensional less than 1mm, described processing module is by A plate B plate
Composition, wherein A plate and B plate are made up of upper, middle, and lower part respectively, and top and the bottom are wide different long, high cuboid knot
Structure, middle part is trapezium structure, and the trapezoidal upper end is equal with plate upper part rectangular structure length, goes to the bottom and plate lower part rectangular structure
Long equal, and upper, middle, and lower part is the integrated design, in described A plate and B plate, lower part trapezium structure and rectangular structure
Having identical length, waist, upper part rectangular structure has identical length and width；
(32) machining module and the module rack corresponding to module: carry out according to the A plate B plate shape described in step (31)
Processing, processing simultaneously places the module rack of A plate B plate, has cavity inside module rack, the profile phase of cavity shape and A plate B plate
Join；
(33) combination stuck-module and corresponding module rack group form micro-embossing mould: arrange according to the mode of ABABABABA
Row A, B plate makes A plate B plate fit tightly together in being positioned over module rack, seamless between A, B plate, smears high-strength between each plate
Degree multi-use mucilage fixes A, B plate group and module rack forms micro-embossing mould.
Wherein, in step (31), the length of A plate and B plate lower part rectangular structure is respectively 5-300mm, 0.01-
In 1mm, 1-200mm, A plate and B plate, part trapezium structure length, waist are 5-300mm, 0.01-1mm, 1-200mm, 1-
The length of 200mm, A plate upper part rectangular structure is respectively 5-300mm, 0.01-1mm, 1-10mm, and B plate upper part is long
The length and width of cube structure is respectively 5-300mm, 0.01-1mm, short transverse 0.01-1mm lower than A plate.
A kind of micro-embossing mould, uses the manufacture method that above-mentioned micro-embossing mould is split type, and described method includes following step
Rapid:
(41) according to the module of the processing of the target pattern design of impressing mould: the target pattern of described impressing mould
Being smaller than 1mm between single pattern and single pattern dimension is the most one-dimensional less than 1mm, described processing module is by A rod B rod C
Rod composition, wherein A rod B rod C rod is rectangular structure, described A rod and B rod rectangular structure length and width is equal but height, institute
State the rectangular structure length of B rod C rod, high equal but width；
(42) machining module and the module rack corresponding to module: according to the A rod B rod C rod shape described in step (41)
Being processed, the module rack of A rod B rod C rod is placed in processing simultaneously, has cavity, cavity shape and A rod B rod C rod inside module rack
Profile match；
(43) combination stuck-module group and corresponding module rack form micro-embossing mould: according toMode arrange
Row A, B rod is positioned over center in module rack, and center surrounding is covered with C rod, makes A rod B rod C rod fit tightly together, A, B, C rod
Between seamless, module rack surrounding bolt fix A, B rod group formed micro-embossing mould.
Wherein, in step (41), the length of A rod rectangular structure is respectively 0.001-1mm, 0.001-1mm, 1-
The length and width of 200mm, B rod rectangular structure is respectively 0.01-1mm, 0.01-1mm, and short transverse is than the A low 0.01-1mm of rod.
A kind of micro-embossing mould, uses the manufacture method that above-mentioned micro-embossing mould is split type, and described method includes following step
Rapid:
(51) according to the module of the processing of the target pattern design of impressing mould: the target pattern of described impressing mould
Being smaller than 1mm between single pattern and single pattern dimension is the most one-dimensional less than 1mm, described processing module is by A rod B rod
Composition, wherein A rod is cylindrical structural, and B rod is column structure, and described column structure is to be foursquare rectangular scapus in bottom surface
Four long limits on slot, the cross section of described groove shape is 1/4 circular arc, the radius phase that its radius and A rod cylindrical cross-section are justified
Deng, described A rod and B rod height；
(52) machining module and the module rack corresponding to module: carry out according to the A rod B rod shape described in step (51)
Processing, the module rack of A rod B rod is placed in processing simultaneously, has cavity inside module rack, the profile phase that cavity shape is excellent with A rod B
Join；
(53) combination stuck-module group and corresponding module rack form micro-embossing mould: according toMode arrange A, B
Rod makes A rod B rod fit tightly together in being positioned over module rack, seamless between A, B rod, module rack surrounding bolt fix A,
B rod group forms micro-embossing mould.
Wherein, in step (51), the bottom surface radius of circle of A rod cylindrical structural is 0.001-0.5mm, a height of 1-200mm, B rod
1/4 arc radius of structure is 0.001-0.5mm, and short transverse is than the A low 0.01-1mm of rod.
Compared with prior art, its remarkable advantage is the present invention: the present invention proposes one and just utilizes common process equipment
The split type processing method of micro-embossing mould can be manufactured.Use this method, it is possible to use common process apparatus processing goes out high-precision
Degree micro-embossing mould, it is to avoid fine precision machining, LIGA technology, LIGA-like technology need the demand of expensive device, with
Time solve the problem that impressing mould 0.5mm spacing below pattern sidewalls cannot polish.
Below in conjunction with the accompanying drawings the present invention is described in further detail.
Accompanying drawing explanation
Fig. 1 is top view and the cross-sectional view of the very low power of 1 one kinds of micro-embossing die marks of embodiment.
Fig. 2 is the structural representation of 1 one kinds of micro-embossing mould A plates of embodiment.
Fig. 3 is the structural representation of 1 one kinds of micro-embossing mould B plates of embodiment.
Fig. 4 is top view and the cross-sectional view of 1 one kinds of micro-embossing die module framves of embodiment.
Fig. 5 is top view and the cross-sectional view of the very low power of 2 one kinds of micro-embossing die marks of embodiment.
Fig. 6 is the structural representation of 2 one kinds of micro-embossing mould A plates of embodiment.
Fig. 7 is the structural representation of 2 one kinds of micro-embossing mould B plates of embodiment.
Fig. 8 is top view and the cross-sectional view of 2 one kinds of micro-embossing die module framves of embodiment.
Fig. 9 is the top view of micro-rectangle of 3 one kinds of micro-embossing die marks of embodiment.
Figure 10 is the structural representation of 3 one kinds of micro-embossing mould A rods of embodiment.
Figure 11 is the structural representation of 3 one kinds of micro-embossing mould B rods of embodiment.
Figure 12 is the structural representation of 3 one kinds of micro-embossing mould C rods of embodiment.
Figure 13 be 3 one kinds of micro-embossing mould A, B, C rods of embodiment put in order (except indicate A, C external position be B).
Figure 14 is top view and the cross-sectional view of 3 one kinds of micro-embossing die module framves of embodiment.
Figure 15 is the top view of micro-rectangle of 4 one kinds of micro-embossing die marks of embodiment.
Figure 16 is the structural representation of 4 one kinds of micro-embossing mould A rods of embodiment.
Figure 17 is the structural representation of 4 one kinds of micro-embossing mould B rods of embodiment.
Figure 18 be 4 one kinds of micro-embossing mould A, B rods of embodiment put in order (except indicate A external position be B).
Figure 19 is top view and the cross-sectional view of 4 one kinds of micro-embossing die module framves of embodiment.
Detailed description of the invention
The following examples can make those skilled in the art that the present invention is more fully understood.
Embodiment 1
(1) according to impressing very low power pattern as shown in Figure 1, groove width W be 0.01mm, highly H be 0.5mm, length L
For 190mm, it is spaced W1 position 0.01mm.Design manufactures the processing module of mould.Described processing module by A plate (such as Fig. 2 institute
Show) B plate (as shown in Figure 3) composition, A plate quantity is 250, and B plate quantity is that 250, wherein A plate and B plate are respectively by upper and lower two parts
Composition, top and the bottom are wide different long, high rectangular structure and are the integrated design, and described A plate and B plate lower part are rectangular
Body structure has identical length, and upper part rectangular structure has identical length and width；A plate lower part Ha1, La1 and Wa are respectively
For 290mm, 200mm and 0.01mm, B plate lower part Hb1, Lb1 and Wb are respectively 290mm, 200mm and 0.01mm；A plate upper part
Ha2 be 10mm, La2 be 190mm, Wa be 0.01mm, B plate upper part Hb2 be 9.5mm, Lb2 be 190mm, Wb be 0.01mm.
(2) machining module and the module rack corresponding to module: carry out according to the A plate B plate shape described in step (11)
Processing, processing simultaneously is placed the module rack (as shown in Figure 4) of A plate B plate, is had cavity, cavity shape and A inside shown module rack
The profile of plate B plate matches, and cavity is divided into upper and lower two cuboids, top rectangular structure Lab1, Hab1, Wab be 200mm,
290mm, 5mm, bottom rectangular structure Lab2, Hab2, Wab are 190mm, 9.9mm, 5mm.
(3) combination stuck-module group forms micro-embossing mould: arranges A, B plate according to the mode of ABABABABA and is positioned over and puts
Enter in shape module rack as shown in Figure 4, the AA face of A plate, together with the BB face of B plate all fits tightly with the CC face of module rack, and
It is bolted A, B plate group by module rack side (DD direction shown in Fig. 4) and forms micro-embossing mould, i.e. shape on EE direction
Become the impressing face that height is staggered.
Embodiment 2
The manufacture method that a kind of micro-embossing mould is split type, said method comprising the steps of:
(1) according to impressing very low power pattern as shown in Figure 5, groove width 0.3mm, degree of depth 0.5mm, it is spaced 0.3mm.Ditch
Slot length 100mm, design manufactures the processing module of mould.Described processing module by A plate (as shown in Figure 6) B plate (such as Fig. 7
Shown in) composition, A plate quantity is 6, and B plate quantity is that 7, wherein A plate and B plate are made up of upper, middle, and lower part respectively, top and the bottom
For wide different long, high rectangular structure, middle part is trapezium structure, the trapezoidal upper end and plate upper part rectangular structure appearance
Deng, go to the bottom equal with plate lower part rectangular structure length, and upper, middle, and lower part is the integrated design, described A plate and B plate
In, lower part trapezium structure and rectangular structure there is identical length, waist, upper part rectangular structure have identical length,
Wide；The length of A plate and B plate lower part rectangular structure is respectively 300,0.3mm, 200mm, and in A plate and B plate, part is trapezoidal
The end in structure, go to the bottom, wide, high, be 100,300,0.3mm, 150mm, the length of A plate upper part rectangular structure is respectively
100mm, 0.3mm, 2.6mm, the length of B plate upper part rectangular structure is respectively 100mm, 0.3mm, 2.1mm.
(2) machining module and the module rack corresponding to module: add according to the A plate B plate shape described in step (1)
Work, processing simultaneously is placed the module rack (as shown in Figure 8) of A plate B plate, is had cavity, cavity shape and A plate inside shown module rack
The profile of B plate matches, and cavity is made up of upper, middle, and lower part, and top and the bottom are wide different long, high rectangular structure,
Middle part is trapezium structure, and the trapezoidal upper end is equal with plate upper part rectangular structure length, goes to the bottom long with plate lower part rectangular structure
Equal, top rectangular structure length is 100mm, 3.9mm, 2.1mm, bottom rectangular structure length be 300mm,
3.9mm, 200mm, the end on middle part trapezium structure, go to the bottom, wide, a height of 100,300,3.9mm, 150mm；
(3) combination stuck-module group forms micro-embossing mould: arranges A, B plate according to the mode of ABABABABA and is positioned over and puts
Enter in shape module rack as shown in Figure 4, the AA face of A plate, together with the BB face of B plate all fits tightly with the CC face of module rack, and
Fix A, B plate group formation micro-embossing mould by smearing high intensity multi-use mucilage between each plate, be i.e. upwardly formed height in EE side
Staggered impressing face.
Embodiment 3
The manufacture method that a kind of micro-embossing mould is split type, said method comprising the steps of:
(1) according to the micro-rectangular patterns of impressing as shown in Figure 9, rectangle highlights high 0.3mm, and wide length is 0.5mm.Between rectangle
Every 0.5mm, design manufactures the processing module of mould.Described processing module is excellent (such as Figure 11 institute by A rod (as shown in Figure 10) B
Show) C rod (as shown in figure 12) composition, wherein A rod and B rod be bottom surface be foursquare rectangular structure, C rod be cuboid knot
Structure, described A rod B rod C rod the rectangular structure bottom surface length of side is equal but height；The length of A rod rectangular structure is respectively
For 0.5mm, 0.5mm, 10.3mm, the length of B rod rectangular structure is respectively 0.5mm, 0.5mm, 10mm, C rod cuboid
The length of structure is respectively 0.5mm, 0.25mm, 10mm.
(2) machining module and the module rack corresponding to module: enter according to the A rod B rod C rod shape described in step (1)
Row processing, processing simultaneously is placed the module rack of A rod B rod C rod, is had cavity, cavity shape and A rod B rod C rod inside module rack
Profile matches；
(3) combination stuck-module group and corresponding module rack form micro-embossing mould: according toMode arrange
A, B rod is positioned over center in module rack, and center surrounding is covered with C rod, makes A rod B rod C rod fit tightly together, between A, B, C rod
Seamless, A rod AA face, B rod BB face, C rod CC face all fit tightly with the DD face of module rack together with, and pass through A,
The phosphoric acid solution smearing aluminium hydroxide between B, C rod is mixed into binding agent, cured rear fixing A, B, C rod group shape with cupric oxide powder
Become micro-embossing mould, be i.e. upwardly formed the impressing face that height is staggered in GG side.
Embodiment 4
The manufacture method that a kind of micro-embossing mould is split type, said method comprising the steps of:
(1) according to the micro-rectangular patterns of impressing as shown in figure 15, the module of the processing of design: described processing module by
A rod (as shown in figure 16) B rod (as shown in figure 17) composition, wherein A rod is cylindrical structural, and B rod is column structure, described cylinder
Structure is to slot on four long limits that bottom surface is foursquare rectangular scapus, and the cross section of described groove shape is 1/4 circular arc, its
Radius is equal with the radius of A rod cylindrical cross-section circle, described A rod and B rod height, the bottom surface radius of circle of A rod cylindrical structural
For 0.25mm, 1/4 arc radius of a height of 10.3mm, B bar structure is 0.25mm, a height of 10mm；
(2) machining module and the module rack corresponding to module: add according to the A rod B rod shape described in step (1)
Work, processing simultaneously is placed the module rack (as shown in figure 19) of A rod B rod, is had cavity, cavity shape and A rod B rod inside module rack
Profile match；
(3) combination stuck-module group and corresponding module rack form micro-embossing mould: according toMode arrange A, B
Rod makes A rod B rod fit tightly together in being positioned over module rack, seamless between A, B rod, the AA face of A rod, and the BB face of B rod is equal
Together with fitting tightly with the CC face of module rack, and fixed by soldering by module rack side (DD/EE direction shown in Figure 19)
A, B rod group forms micro-embossing mould, is i.e. upwardly formed the impressing face that height is staggered in FF side.
Embodiment 5
(1) according to impressing very low power pattern as shown in Figure 1, groove width W be 1mm, highly H be 1mm, length L is
1mm, is spaced W1 position 0.5mm.Design manufactures the processing module of mould.Described processing module is by A plate (as shown in Figure 2) B plate
(as shown in Figure 3) composition, A plate quantity is 5, and B plate quantity is that 4, wherein A plate and B plate are made up of upper and lower two parts respectively, top and the bottom
Being divided into wide different long, high rectangular structure and be the integrated design, described A plate and B plate lower part rectangular structure have
Identical length, height, upper part rectangular structure has identical length and width；A plate lower part Ha1, La1 and Wa be respectively 3mm, 10mm and
1mm, B plate lower part Hb1, Lb1 and Wb are respectively 3mm, 10mm and 0.5mm；A plate upper part Ha2, La2, Wa be respectively 2mm,
1mm, 1mm, B plate upper part Hb2 be 1mm, Lb2 be 1mm, Wb be 0.5mm.
(2) machining module and the module rack corresponding to module: carry out according to the A plate B plate shape described in step (11)
Processing, processing simultaneously is placed the module rack (as shown in Figure 4) of A plate B plate, is had cavity, cavity shape and A inside shown module rack
The profile of plate B plate matches, and cavity is divided into upper and lower two cuboids, top rectangular structure Lab1, Hab1, Wab be 10mm,
3mm, 7.5mm, bottom rectangular structure Lab2, Hab2, Wab are 1mm, 1mm, 7.5mm.
(3) combination stuck-module group forms micro-embossing mould: arranges A, B plate according to the mode of ABABABABA and is positioned over and puts
Enter in shape module rack as shown in Figure 4, the AA face of A plate, together with the BB face of B plate all fits tightly with the CC face of module rack, and
Fix mould bases by low-melting alloy method, A, B plate group group forms micro-embossing mould, is i.e. upwardly formed the pressure that height is staggered in EE side
Print face.
Embodiment 6
(1) according to impressing very low power pattern as shown in Figure 1, groove width W be 1mm, highly H be 0.01mm, length L is
1mm, is spaced W1 position 0.5mm.Design manufactures the processing module of mould.Described processing module is by A plate (as shown in Figure 2) B plate
(as shown in Figure 3) composition, A plate quantity is 5, and B plate quantity is that 4, wherein A plate and B plate are made up of upper and lower two parts respectively, top and the bottom
Being divided into wide different long, high rectangular structure and be the integrated design, described A plate and B plate lower part rectangular structure have
Identical length, height, upper part rectangular structure has identical length and width；A plate lower part Ha1, La1 and Wa be respectively 3mm, 10mm and
1mm, B plate lower part Hb1, Lb1 and Wb are respectively 3mm, 10mm and 0.5mm；A plate upper part Ha2, La2, Wa are respectively
1.01mm, 1mm, 1mm, B plate upper part Hb2 be 1mm, Lb2 be 1mm, Wb be 0.5mm.
(2) machining module and the module rack corresponding to module: carry out according to the A plate B plate shape described in step (11)
Processing, processing simultaneously is placed the module rack (as shown in Figure 4) of A plate B plate, is had cavity, cavity shape and A inside shown module rack
The profile of plate B plate matches, and cavity is divided into upper and lower two cuboids, top rectangular structure Lab1, Hab1, Wab be 10mm,
3mm, 7.5mm, bottom rectangular structure Lab2, Hab2, Wab are 1mm, 1mm, 7.5mm.
(3) combination stuck-module group forms micro-embossing mould: arranges A, B plate according to the mode of ABABABABA and is positioned over and puts
Enter in shape module rack as shown in Figure 4, the AA face of A plate, together with the BB face of B plate all fits tightly with the CC face of module rack, and
Form micro-embossing mould by the fixing mould bases of riveting, A, B plate group, be i.e. upwardly formed the impressing face that height is staggered in EE side.
Claims (10)
1. the manufacture method that a micro-embossing mould is split type, it is characterised in that described method includes:
The module of the processing of the target pattern design according to impressing mould；The single pattern of target pattern of described impressing mould
Between be smaller than 1mm and single pattern dimension is the most one-dimensional less than 1mm, module includes A module, B module, A module number
More than or equal to 1, B module number is more than or equal to 1；
Machining A module, B module and the module rack corresponding to module；
The module rack of the fixing A module of combination, B module group and correspondence forms micro-embossing mould；Described A module, B module array mode
For being staggered, between A module, B module seamless and place after A module, B module height.
2. a micro-embossing mould, it is characterised in that according to method manufacture described in claim 1, described method includes following step
Rapid:
(11) according to the module of the processing of the target pattern design of impressing mould: described processing module is made up of A plate, B plate,
Wherein A plate and B plate are rectangular structure, and length is respectively 5-300mm, 0.01-1mm, 1-200mm；
(12) machining module and the module rack corresponding to module: add according to the A plate described in step (11), B plate shape
Work, A plate, the module rack of B plate are placed in processing simultaneously；
(13) combination stuck-module group and corresponding module rack form micro-embossing mould: arrange A according to the mode of ABABABABA
Plate, B plate make A plate, B plate fit tightly together in being positioned over module rack, seamless between A plate, B plate, module rack surrounding spiral shell
Bolt fixes A plate, B plate group forms micro-embossing mould.
3. a micro-embossing mould, it is characterised in that according to method manufacture described in claim 1, described method includes following step
Rapid:
(21) according to the module of the processing of the target pattern design of impressing mould: described processing module is made up of A plate, B plate,
Wherein A plate and B plate are made up of upper and lower two parts respectively, and top and the bottom are wide different long, high rectangular structure and are integrated
Changing design, described A plate and B plate lower part rectangular structure have identical length, and upper part rectangular structure has identical
Length and width；
(22) machining module and the module rack corresponding to module: add according to the A plate described in step (21), B plate shape
Work, processing simultaneously is placed A plate, the module rack of B plate, is had cavity, cavity shape and A plate, the profile phase of B plate inside module rack
Join；
(23) combination stuck-module group shape and corresponding module put up micro-embossing mould: arrange A according to the mode of ABABABABA
Plate, B plate make A plate, B plate fit tightly together in being positioned over module rack, seamless between A plate, B plate, by riveting by module
Frame, A plate, B plate group are fixing forms micro-embossing mould.
Micro-embossing mould the most according to claim 3, it is characterised in that: A plate and B plate lower part cuboid knot in step (21)
The length of structure is respectively 5-300mm, 0.01-1mm, 1-200mm, and the length of A plate upper part rectangular structure is respectively
For 5-300mm, 0.01-1mm, 1-10mm, the length and width of B plate upper part rectangular structure is respectively 5-300mm, 0.01-1mm, high
The degree low 0.01-1mm of direction ratio A plate.
5. a micro-embossing mould, it is characterised in that according to method manufacture described in claim 1, described method includes following step
Rapid:
(31) according to the module of the processing of the target pattern design of impressing mould: described processing module is made up of A plate, B plate,
Wherein A plate and B plate are made up of upper, middle, and lower part respectively, and top and the bottom are wide different long, high rectangular structure, middle part
For trapezium structure, the trapezoidal upper end, is equal with plate upper part rectangular structure length, goes to the bottom equal with plate lower part rectangular structure length,
And upper, middle, and lower part is the integrated design, in described A plate and B plate, lower part trapezium structure and rectangular structure there is phase
Same length, waist, upper part rectangular structure has identical length and width；
(32) machining module and the module rack corresponding to module: add according to the A plate described in step (31), B plate shape
Work, processing simultaneously is placed A plate, the module rack of B plate, is had cavity, cavity shape and A plate, the profile phase of B plate inside module rack
Join；
(33) combination stuck-module and corresponding module rack group form micro-embossing mould: arrange A according to the mode of ABABABABA
Plate, B plate make A plate, B plate fit tightly together in being positioned over module rack, seamless between A plate, B plate, smear height between each plate
Intensity multi-use mucilage is fixed A plate, B plate group and module rack and is formed micro-embossing mould.
Micro-embossing mould the most according to claim 5, it is characterised in that: A plate and B plate lower part cuboid knot in step (31)
The length of structure is respectively part trapezium structure length, waist in 5-300mm, 0.01-1mm, 1-200mm, A plate and B plate
Being respectively 5-300mm, 0.01-1mm, 1-200mm, the length of 1-200mm, A plate upper part rectangular structure is respectively 5-
300mm, 0.01-1mm, 1-10mm, the length and width of B plate upper part rectangular structure is respectively 5-300mm, 0.01-1mm, the most just
To lower 0.01-1mm than A plate.
7. a micro-embossing mould, it is characterised in that according to method manufacture described in claim 1, described method includes following step
Rapid:
(41) according to the module of the processing of the target pattern design of impressing mould: described processing module is by A rod, B rod, C rod
Composition, wherein A rod, B rod, C rod are rectangular structure, described A rod and B rod rectangular structure length and width is equal but height, institute
State B rod, the rectangular structure length of C rod, high equal but width；
(42) machining module and the module rack corresponding to module: enter according to the A rod described in step (41), B rod, C rod shape
Row processing, processing simultaneously is placed A rod, B rod, the module rack of C rod, is had cavity, cavity shape and A rod, B rod, C inside module rack
The profile of rod matches；
(43) combination stuck-module group and corresponding module rack form micro-embossing mould: according toMode arrange A
Excellent, B rod is positioned over center in module rack, and center surrounding is covered with C rod, makes A rod, B rod, C rod fit tightly together, A is excellent, B is excellent,
Between C rod seamless, by cast low-temperature alloy stuck-module frame, A rod, B rod, C rod group formed micro-embossing mould.
Micro-embossing mould the most according to claim 7, it is characterised in that: A rod rectangular structure in step (41)
Length is respectively 0.001-1mm, 0.001-1mm, 1-200mm, and the length and width of B rod rectangular structure is respectively 0.01-
1mm, 0.01-1mm, short transverse is than the A low 0.01-1mm of rod.
9. a micro-embossing mould, it is characterised in that according to method manufacture described in claim 1, described method includes following step
Rapid:
(51) according to the module of the processing of the target pattern design of impressing mould: described processing module is made up of A rod, B rod,
Wherein A rod is cylindrical structural, and B rod is column structure, and described column structure is to be the four of foursquare rectangular scapus in bottom surface
Slotting on individual long limit, the cross section of described groove shape is 1/4 circular arc, and its radius is equal with the radius of A rod cylindrical cross-section circle, institute
State A rod and B rod height；
(52) machining module and the module rack corresponding to module: add according to the A rod described in step (51), B rod shape
Work, the A rod of processing placement simultaneously, the module rack of B rod, have cavity, cavity shape and A rod, the profile phase of B rod inside module rack
Join；
(53) combination stuck-module group and corresponding module rack form micro-embossing mould: according to Mode arrange A rod, B
Rod makes A rod, B rod fit tightly together in being positioned over module rack, seamless between A rod, B rod, module rack surrounding is solid with bolt
Determine A rod, B rod group forms micro-embossing mould.
Micro-embossing mould the most according to claim 9, it is characterised in that: the bottom surface circle of A rod cylindrical structural in step (51)
Radius is 0.001-0.5mm, and 1/4 arc radius of a height of 1-200mm, B bar structure is 0.001-0.5mm, and short transverse is than A rod
Low 0.01-1mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310690969.1A CN103676474B (en) | 2013-12-17 | 2013-12-17 | The manufacture method that a kind of micro-embossing mould is split type |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310690969.1A CN103676474B (en) | 2013-12-17 | 2013-12-17 | The manufacture method that a kind of micro-embossing mould is split type |
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| CN103676474B true CN103676474B (en) | 2016-09-21 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1474960A (en) * | 2001-05-18 | 2004-02-11 | �ʼҷ����ֵ�������˾ | Lithographic method of manufacturing device |
| CN1581434A (en) * | 2003-08-07 | 2005-02-16 | 株式会社东芝 | Design of pivture, optical mask and photoetching colloid figure, and method for making smiconductor device |
| CN1631290A (en) * | 2003-12-25 | 2005-06-29 | 中国印钞造币总公司 | Interrupted tooth on edge of coin and souvenir badge and its printing method |
| CN101135843A (en) * | 2006-08-31 | 2008-03-05 | 三星电机株式会社 | Method of manufacturing a stamper |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100843392B1 (en) * | 2005-03-31 | 2008-07-03 | 삼성전기주식회사 | Mold used in imprinting printed circuit board with excellent durability and preparing method for printed circuit board using the same |
| TWI342862B (en) * | 2008-01-31 | 2011-06-01 | Univ Nat Taiwan | Method of micro/nano imprinting |
-
2013
- 2013-12-17 CN CN201310690969.1A patent/CN103676474B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1474960A (en) * | 2001-05-18 | 2004-02-11 | �ʼҷ����ֵ�������˾ | Lithographic method of manufacturing device |
| CN1581434A (en) * | 2003-08-07 | 2005-02-16 | 株式会社东芝 | Design of pivture, optical mask and photoetching colloid figure, and method for making smiconductor device |
| CN1631290A (en) * | 2003-12-25 | 2005-06-29 | 中国印钞造币总公司 | Interrupted tooth on edge of coin and souvenir badge and its printing method |
| CN101135843A (en) * | 2006-08-31 | 2008-03-05 | 三星电机株式会社 | Method of manufacturing a stamper |
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