CN103676035A - Packaging method for planar optical waveguide chip - Google Patents
Packaging method for planar optical waveguide chip Download PDFInfo
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- CN103676035A CN103676035A CN201310693441.XA CN201310693441A CN103676035A CN 103676035 A CN103676035 A CN 103676035A CN 201310693441 A CN201310693441 A CN 201310693441A CN 103676035 A CN103676035 A CN 103676035A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title abstract 6
- 230000008878 coupling Effects 0.000 claims abstract description 20
- 238000010168 coupling process Methods 0.000 claims abstract description 20
- 238000005859 coupling reaction Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000013307 optical fiber Substances 0.000 claims description 18
- 238000012856 packing Methods 0.000 claims description 18
- 239000007767 bonding agent Substances 0.000 claims description 5
- 230000001788 irregular Effects 0.000 abstract description 12
- 239000000835 fiber Substances 0.000 abstract 4
- 238000007711 solidification Methods 0.000 abstract 2
- 230000008023 solidification Effects 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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Abstract
The invention relates to the field of chip packaging and provides a packaging method for a planar optical waveguide chip. The packaging part of the planar optical waveguide chip comprises a substrate, a PLC chip, a lens array and a tail fiber. The PLC chip further comprises a waveguide device. The packaging method for the planar optical waveguide chip comprises the following steps that firstly, the PLC chip is fixed, wherein the PLC chip is fixed to the substrate through an adhesive, and then the substrate provided with the PLC chip in a bonding mode is placed in an oven to be baked; secondly, the position of the lens array is fixed and adjusted so that the coupling efficiency can be the highest when the tail fiber, the lens array and the waveguide device arrive at specific positions, and then UV light rays are used for solidification; thirdly, the position of the tail fiber is fixed, wherein the tail fiber is in bridge connection with the lens array, and then UV light rays are used for solidification; lastly, the planar optical waveguide chip is baked. The packaging method for the planar optical waveguide chip solves the problem that the traditional coupling mode of regular PLC chips is unsuitable for the coupling mode of irregular PLC chips.
Description
Technical field
The invention belongs to chip package field, particularly the method for packing of irregular planar optical waveguide chip.
Background technology
Along with the southerly breeze development of optical communication technology, planar optical waveguide (Planar Lightwave Circuit is called for short PLC) device is used widely.Planar optical waveguide device, because of its compact conformation, the high and low loss of integrated level, high reliability, has become the most crucial device in optical communication technology field.
One of mode that the height of planar optical waveguide device is integrated is: integrated PD, MUX, DEMUX, Switch etc. function on single plane chip of light waveguide.The company that has in the world at present PLC technology is more, and the technique of every company is slightly different.Traditional PLC chip is a regular rectangular parallelepiped or square, as shown in Figure 1a.But the PLC chip of some company's design is irregular chip, as shown in Figure 2, in this case, waveguide section P and chip planar S be not in same plane.Therefore, the coupling scheme of conventional P LC chip be not suitable for the coupling scheme of irregular PLC chip.
Summary of the invention
The coupling scheme that the invention solves the PLC chip of traditional rule are not suitable for the problem of the coupling scheme of irregular PLC chip, and a kind of method for packing of new planar optical waveguide chip is provided.
The invention provides a kind of method for packing of planar optical waveguide chip, wherein, the packed part of planar optical waveguide chip comprises substrate, PLC chip, lens arra and tail optical fiber, and PLC chip further comprises a waveguide; It is characterized in that: the method for packing of planar optical waveguide chip comprises the following steps:
First, fixedly PLC chip, is fixed on PLC chip on substrate with bonding agent, then the substrate of bonding PLC chip is put into baking box and toasts;
Secondly, the position of fixed lens array, the position of adjustment lens arra, reaches behind specific position tail optical fiber, lens arra, waveguide, and coupling efficiency is best, re-uses UV light and is cured;
Then, the fixing position of tail optical fiber, tail optical fiber bridge joint lens arra, re-uses UV light and is cured;
Finally, planar optical waveguide chip is toasted.
Wherein, preferred implementation is: when the substrate of bonding PLC chip is put into baking box and toasted, the temperature setting of baking box is set to 85 °, and set of time is 2H.
Wherein, preferred implementation is: the set of time that lens arra is used UV light to be cured is 300S.
Wherein, preferred implementation is: the set of time that tail optical fiber is used UV light to be cured is 300S.
Wherein, preferred implementation is: planar optical waveguide chip toasts, and temperature setting is set to 85 °, and set of time is 2H.
Compared with prior art, advantage and the good effect of the method for packing of planar optical waveguide chip of the present invention are: first, suitable adjustment can be carried out according to coupling efficiency in the position of lens arra 300, so that coupling efficiency reaches is the highest; Secondly, after the position of lens arra 300 is fixing, according to coupling efficiency, therefore tail optical fiber 400 is also fixed; Finally, the coupling scheme that the method for packing of above-mentioned planar optical waveguide chip has solved the PLC chip of traditional rule are not suitable for the problem of the coupling scheme of irregular PLC chip.
Accompanying drawing explanation
Fig. 1 a is the schematic diagram of existing traditional PLC chip.
Fig. 1 b is the schematic diagram of irregular PLC chip.
Fig. 2 a to Fig. 2 c is the schematic diagram of the method for packing of planar optical waveguide chip of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is done further and described in detail.
Fig. 2 a to Fig. 2 c is the schematic diagram of the method for packing of planar optical waveguide chip of the present invention.The part of the encapsulation of planar optical waveguide chip comprises substrate 100, PLC chip 200, lens arra (Lens Array) 300 and tail optical fiber 400.Wherein, PLC chip 200 comprises cushion block 210, irregular PLC chip 220 and waveguide 230, cushion block 210 be set to the to bond lower surface of irregular PLC chip 220, waveguide 230 is arranged on the upper surface of irregular PLC chip 220, and formation PLC chip 200 adhered to one another between cushion block 210, irregular PLC chip 220 and waveguide 230.Wherein, all there is the sphere of the paraxial curvature of sharing the same light on 220 lens arras (Lens Array), 300 two sides, and for example, curvature is set to 0.2mm; And its size is set to slightly larger than traditional lens arra size, for example, high 2mm, 1mm, the 1mm of being of a size of of the length and width of traditional lens arra, the size that this lens arra 300 length and width are high is set to 5mm, 3mm, 2mm.
Referring to Fig. 2 a to Fig. 2 c, the method for packing step of planar optical waveguide chip is:
First, fixedly PLC chip 200.PLC chip 200 use bonding agents are fixed on substrate 100, then the substrate 100 that fixes PLC chip 200 are put into baking box together and toast, oven temperature is set to 85 °, and the time is set as 2 hours.As shown in Figure 2 a.
Secondly, the position of fixed lens array 300.The position of adjusting lens arra 300, makes lens arra 300 and PLC chip 200 coupling efficiencies reach the highest, and now, tail optical fiber 400, lens arra 300, waveguide 230 reach ad-hoc location.By the position of bonding agent fixed lens array 300 on substrate 100, use UV light to be cured cemented lens array 300 and the bonding agent of substrate 100, be set to 300S set time.As shown in Figure 2 b.
Then, the fixing position of tail optical fiber 400.Tail optical fiber 400 carries out bridge joint by glass tube and lens arra 300.By Fig. 2 b and above-mentioned steps, known, after lens arra 300 is fixing, the position that is bonded in the glass tube on lens arra 300 is fixed, so the position of tail optical fiber 400 is fixed.Use UV light to be cured tail optical fiber 400, be set to 300S set time.As shown in Figure 2 c.
Finally, the above-mentioned planar optical waveguide chip that fixes device position is toasted.Whole planar optical waveguide chip is put into baking box and toast, temperature setting is set to 85 °, and set of time is 2H.
Compared with prior art, advantage and the good effect of the method for packing of planar optical waveguide chip of the present invention are: first, suitable adjustment can be carried out according to coupling efficiency in the position of lens arra 300, so that coupling efficiency reaches is the highest; Secondly, after the position of lens arra 300 is fixing, according to coupling efficiency, therefore tail optical fiber 400 is also fixed; Finally, the coupling scheme that the method for packing of above-mentioned planar optical waveguide chip has solved the PLC chip of traditional rule are not suitable for the problem of the coupling scheme of irregular PLC chip.
The above, be only most preferred embodiment of the present invention, and not for limiting the scope of the invention, all equivalences of doing according to the present patent application the scope of the claims change or modify, and are all the present invention and contain.
Claims (5)
1. the method for packing of planar optical waveguide chip, wherein, the packed part of planar optical waveguide chip comprises substrate, PLC chip, lens arra and tail optical fiber, PLC chip further comprises a waveguide; It is characterized in that: the method for packing of planar optical waveguide chip comprises the following steps:
First, fixedly PLC chip, is fixed on PLC chip on substrate with bonding agent, then the substrate of bonding PLC chip is put into baking box and toasts;
Secondly, the position of fixed lens array, the position of adjustment lens arra, reaches behind specific position tail optical fiber, lens arra, waveguide, and coupling efficiency is best, re-uses UV light and is cured;
Then, the fixing position of tail optical fiber, tail optical fiber bridge joint lens arra, re-uses UV light and is cured;
Finally, planar optical waveguide chip is toasted.
2. the method for packing of planar optical waveguide chip as claimed in claim 1, is characterized in that: when the substrate of bonding PLC chip is put into baking box and toasted, the temperature setting of baking box is set to 85 °, and set of time is 2H.
3. the method for packing of planar optical waveguide chip as claimed in claim 1, is characterized in that: the set of time that lens arra is used UV light to be cured is 300S.
4. the method for packing of planar optical waveguide chip as claimed in claim 1, is characterized in that: the set of time that tail optical fiber is used UV light to be cured is 300S.
5. the method for packing of planar optical waveguide chip as claimed in claim 1, is characterized in that: planar optical waveguide chip toasts, and temperature setting is set to 85 °, and set of time is 2H.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310693441.XA CN103676035A (en) | 2013-12-17 | 2013-12-17 | Packaging method for planar optical waveguide chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310693441.XA CN103676035A (en) | 2013-12-17 | 2013-12-17 | Packaging method for planar optical waveguide chip |
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| CN103676035A true CN103676035A (en) | 2014-03-26 |
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| CN201310693441.XA Pending CN103676035A (en) | 2013-12-17 | 2013-12-17 | Packaging method for planar optical waveguide chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107219591A (en) * | 2017-06-17 | 2017-09-29 | 西安盛佳光电有限公司 | Optical fiber lens coupler and preparation method thereof |
| CN115421247A (en) * | 2022-11-07 | 2022-12-02 | 北京浦丹光电股份有限公司 | Optical coupling structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102308239A (en) * | 2009-01-30 | 2012-01-04 | 凯亚光电 | Micromechanically aligned optical assembly |
| JP2013007797A (en) * | 2011-06-22 | 2013-01-10 | Nippon Telegr & Teleph Corp <Ntt> | Plane type optical wave circuit |
| WO2013035227A1 (en) * | 2011-09-09 | 2013-03-14 | 日本電気株式会社 | Light receiving module |
| WO2013101112A1 (en) * | 2011-12-29 | 2013-07-04 | Intel Corporation | Two-dimensional, high-density optical connector |
-
2013
- 2013-12-17 CN CN201310693441.XA patent/CN103676035A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102308239A (en) * | 2009-01-30 | 2012-01-04 | 凯亚光电 | Micromechanically aligned optical assembly |
| JP2013007797A (en) * | 2011-06-22 | 2013-01-10 | Nippon Telegr & Teleph Corp <Ntt> | Plane type optical wave circuit |
| WO2013035227A1 (en) * | 2011-09-09 | 2013-03-14 | 日本電気株式会社 | Light receiving module |
| WO2013101112A1 (en) * | 2011-12-29 | 2013-07-04 | Intel Corporation | Two-dimensional, high-density optical connector |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107219591A (en) * | 2017-06-17 | 2017-09-29 | 西安盛佳光电有限公司 | Optical fiber lens coupler and preparation method thereof |
| CN115421247A (en) * | 2022-11-07 | 2022-12-02 | 北京浦丹光电股份有限公司 | Optical coupling structure |
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Application publication date: 20140326 |