CN209514145U - A kind of chip coupled apparatus - Google Patents
A kind of chip coupled apparatus Download PDFInfo
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- CN209514145U CN209514145U CN201920104502.7U CN201920104502U CN209514145U CN 209514145 U CN209514145 U CN 209514145U CN 201920104502 U CN201920104502 U CN 201920104502U CN 209514145 U CN209514145 U CN 209514145U
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Abstract
The utility model relates to a kind of chip coupled apparatus, chip coupled apparatus includes substrate and fits in the chip on substrate；Chip includes silicon waveguide and the spot-size converter that connect with waveguide front-ends；The front end of spot-size converter is provided with V-groove；V-groove includes the identical first gap end face of area and Second gap end face；First gap end face is corresponding with the end face of spot-size converter, and has between first gap end face and the end face of spot-size converter and couple gap；It couples gap and meets preset value in the width of V-groove extending direction, the area for coupling gap is greater than the face area of spot-size converter；Second gap end face is aligned with the corresponding end surface of chip；Coupled apparatus further includes optical fiber, and after placing the fiber in V-groove, and the end face center of optical fiber and the end face center of spot-size converter are coincide in the extending direction of V-groove.Coupling efficiency can be improved in the utility model.
Description
Technical field
The utility model relates to optical fields, more particularly to a kind of chip coupled apparatus.
Background technique
The light engine encapsulation technology of silicon optical module is all a difficult point and emphasis for silicon photon technology application all the time.Mesh
There are two types of preceding more mature packaged types: the first is to utilize " 90 ° of bending optical fiber based on the vertical coupled of grating coupler
Array " is coupled with grating coupler.The shortcomings that this mode, is that coupling loss is larger, and " 90 ° of bending fiber arrays " at
This is higher；Second is the end coupling based on spot-size converter, is coupled using horizontal fiber array with spot-size converter.
The advantages of this mode is that coupling loss is smaller, and cost is relatively low for horizontal fiber array, but coupling accuracy is more demanding, active coupling
It is complex.Therefore, it is complicated that the inefficiency of active coupling, coupling technique are carried out in generally existing silicon light traditional scheme at present
Problem.
Utility model content
Based on this, it is necessary to aiming at the problem that current active coupling efficiency is low and complex process, provide a kind of chip coupling
Clutch part.
A kind of chip coupled apparatus including substrate and fits in the chip on the substrate；
The chip includes silicon waveguide and the spot-size converter that connect with the waveguide front-ends；
The front end of the spot-size converter is provided with V-groove；
The V-groove includes the identical first gap end face of area and Second gap end face；
The first gap end face is corresponding with the end face of the spot-size converter, and the first gap end face with it is described
There is coupling gap between the end face of spot-size converter；
The coupling gap meets preset value, the area in the coupling gap in the width of the V-groove extending direction
Greater than the face area of the spot-size converter；
The Second gap end face is aligned with the corresponding end surface of the chip；
The coupled apparatus further includes optical fiber, and after the optical fiber is put into the V-groove, in the end face of the optical fiber
The end face center of the heart and the spot-size converter is coincide in the extending direction of the V-groove.
Preferably, the preset value is 0 between 50um.Preferably, the chip includes receiving chip and transmitting chip,
The optical fiber includes launching fiber and reception optical fiber, and the launching fiber is coupled by the V-groove with the transmitting chip,
The reception optical fiber is coupled by V-groove with the reception chip.
Preferably, the launching fiber and reception optical fiber all have 4 optical fiber, and 4 optical fiber passes through correspondence respectively
V-groove and coupling gap coupled with the corresponding end surface of spot-size converter in the reception chip and transmitting chip.
Preferably, two angles between groove face and chip upper surface of the V-groove are between 40 degree and 60 degree.It is excellent
Choosing, the chip coupled apparatus further includes the first cover board and the second cover board；
It is fitted on the substrate on the downside of first cover board, is provided on the upside of first cover board and places the light
The fine V-groove；
Second cover board be used for fit in first cover board upside with the fixation optical fiber.
In the utility model, the chip includes silicon waveguide and the spot-size converter that connect with the waveguide front-ends；It is described
The front end of spot-size converter is provided with V-groove；The V-groove includes the identical first gap end face of area and Second gap
End face；The first gap end face is corresponding with the end face of the spot-size converter, and the first gap end face and the mould
There is coupling gap between the end face of spot-size converter；The coupling gap meets pre- in the width of the V-groove extending direction
If value, the area in the coupling gap is greater than the face area of the spot-size converter；The Second gap end face and the core
The corresponding end surface of piece is aligned；The coupled apparatus further includes optical fiber, and after the optical fiber is put into the V-groove, the light
The end face center of fine end face center and the spot-size converter is coincide in the extending direction of the V-groove；This is practical as a result,
It is novel that directly optical fiber can be fixed in the V-groove in chip when coupling optical fiber with chip, to make the fibre of optical fiber
Core end face is directly aligned with the end face of spot-size converter, then directly can be filled optical cement in coupling gap and V-groove, be made
The end face of fiber end face and spot-size converter is communicatively coupled completely, and the utility model can promote optical fiber by V-groove as a result,
With the coupling efficiency of chip, filling optical cement can be convenient by coupling gap, chip and optical fiber is quickly made to complete to be communicatively coupled.
Detailed description of the invention
Fig. 1 is the structure chart of chip coupled apparatus；
Fig. 2 is the structure chart of V-groove in Fig. 1；
Fig. 3 is the side view of chip coupled apparatus；
Fig. 4 is the coupling schematic diagram of core end surface and spot-size converter end face；
Fig. 5 is transmitting and receives integrated chip on a silicon optical chip；
Fig. 6 is the enlarged diagram after the end face of an optical fiber is aligned with spot-size converter end face.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
Fig. 1 is the structure chart of chip coupled apparatus.As shown in Figure 1, the chip coupled apparatus includes substrate 1 and fits in base
Chip 3 on plate 1；
Chip 3 includes silicon waveguide and the spot-size converter connecting with waveguide front-ends；
The front end of spot-size converter is provided with V-groove 7；
V-groove 7 includes the identical first gap end face of area and Second gap end face；
First gap end face is corresponding with the end face of spot-size converter, and the end face of first gap end face and spot-size converter
Between have coupling gap；
It couples gap and meets preset value in the width of V-groove extending direction, the area for coupling gap is converted greater than mould spot
The face area of device；
Second gap end face is aligned with the corresponding end surface of chip；
Coupled apparatus further includes optical fiber, and after placing the fiber in V-groove, the end face center of optical fiber and spot-size converter
End face center is coincide in the extending direction of V-groove.
In the utility model, the chip includes silicon waveguide and the spot-size converter that connect with the waveguide front-ends；It is described
The front end of spot-size converter is provided with V-groove；The V-groove includes the identical first gap end face of area and Second gap
End face；The first gap end face is corresponding with the end face of the spot-size converter, and the first gap end face and the mould
There is coupling gap between the end face of spot-size converter；The coupling gap meets pre- in the width of the V-groove extending direction
If value, the area in the coupling gap is greater than the face area of the spot-size converter；The Second gap end face and the core
The corresponding end surface of piece is aligned；The coupled apparatus further includes optical fiber, and after the optical fiber is put into the V-groove, the light
The end face center of fine end face center and the spot-size converter is coincide in the extending direction of the V-groove；This is practical as a result,
It is novel that directly optical fiber can be fixed in the V-groove in chip when coupling optical fiber with chip, to make the fibre of optical fiber
Core end face is directly aligned with the end face of spot-size converter, then directly can be filled optical cement in coupling gap and V-groove, be made
The end face of fiber end face and spot-size converter is communicatively coupled completely, and the utility model can promote optical fiber by V-groove as a result,
With the coupling efficiency of chip, filling optical cement can be convenient by coupling gap, chip and optical fiber is quickly made to complete to be communicatively coupled.
Chip can be silicon optical chip, and silicon waveguide front-ends are spot-size converter, the corresponding etching V in the front end of spot-size converter
Type groove, outer dimension, width of V-groove etc. calculate and Precision Machining, guarantee optical fiber be placed in V-groove and with
After cell wall is tangent, the end face coordinate of core end surface and spot-size converter is aligned always.
In the present embodiment, chip coupled apparatus can also include laser, modulator, TIA and other components, this implementation
Example is no longer described in detail, it will be understood that these elements can be used to implement the utility model, but be not used to limit the present embodiment
Concrete scheme.In practical applications, silicon optical chip can be transmitting chip and separate with chip is received, and is also possible to emit, connect
Integrated chip is received on a silicon optical chip.Fiber array can be to be made of two beams, 4 fibre ribbon, is also possible to by a branch of 8 light
Fibre ribbons composition, is also possible to other combinations (in general, the MT connector of a fiber array can accommodate 12 optical fiber.It can
Being applied in combination for fibre ribbon is carried out according to the product design scheme of light engine).Emphasis is the combination energy and core of fiber array
The corresponding channel of piece is matched.
Wherein, preset value is 0 between 50um.The width in coupling gap can satisfy in fiber end face and spot-size converter
End face between directly fill optical cement, optical cement is transparent, so that optical fiber be made to couple completely with chip.
As shown in Figure 1, chip 1 may include receiving chip 3 and transmitting chip 4, corresponding optical fiber may include transmitting light
Fibre 6 and reception optical fiber 5, launching fiber are coupled by V-groove with transmitting chip, and reception optical fiber is by V-groove and receives core
Piece coupling.
Further as shown in Figure 1, receiving chip is to receive silicon which show the schematic diagram that one 4 hair 4 receives silicon photon engine
Optical chip, transmitting chip are transmitting silicon optical chip.Launching fiber and reception optical fiber can have 4 optical fiber, and 4 optical fiber point
Do not pass through the corresponding end surface coupling of spot-size converter in corresponding V-groove and coupling gap and reception chip and transmitting chip
It closes.
Fig. 5 is transmitting and receives integrated chip on a silicon optical chip, as shown in figure 5, receiving chip and transmitting chip
For a silicon optical chip.
Fig. 2 is the structure chart of V-groove in Fig. 1.As shown in Fig. 2, two of V-groove between groove face and chip upper surface
Angle between 40 degree and 60 degree, using V-groove and cooperate upper cover plate push optical fiber, can guarantee optical fiber in V-groove
It is tangent with two groove faces and upper cover plate, it can guarantee that optical fiber has very high alignment precision, can guarantee the fastness of optical fiber fixed bonding
And reliability.
As shown in Figure 1, chip coupled apparatus further includes the first cover board 8 and the second cover board 2；Wherein:
It is fitted on substrate on the downside of first cover board, the V-groove for placing optical fiber is provided on the upside of the first cover board；
Second cover board be used for fit in the first cover board upside to fix optical fiber.
First substrate and the second substrate all can be glass cover-plates.
In the present embodiment, V-groove can also be set in the downside of the second cover board, and the first cover board and the second cover board are pasted
It closes.
In the present embodiment, fiber array completes passive accurate positioning by being placed in the V-groove of silicon optical chip, after
The continuous relieved package for applying a glass cover-plate through dispensing and above optical fiber and completing optical fiber.First cover board and the second cover board
It is fixed by dispensing and substrate, so that the power for avoiding optical patchcord from plugging impacts optical fiber.
Fig. 3 is the side view of chip coupled apparatus；As shown in figure 3, chip can be formed after chip and optical fiber complete coupling
Coupled apparatus.From side view as can be seen that V-groove height in the horizontal direction on V-groove and chip on the first cover board
Spend it is completely the same, to guarantee that optical fiber is horizontal, it is ensured that optical fiber and chip perfect can couple.
Fig. 6 is the schematic diagram that the end face of an optical fiber is aligned with spot-size converter end face, as shown in fig. 6, at this point, for light
An optical fiber 5 in fibre array, the first gap end in the V-groove corresponding with chip of the end face of the fibre core of the optical fiber
After neat, between the end face and 10 end face of spot-size converter of fibre core there is one to couple gap 9, coupling can fill out in gap 9
Optical cement is filled, which is " transparent " optical cement that can transmit communication wavelengths, so that optical fiber be made to couple with chip perfection.Such as figure
Shown in 6, the area for coupling gap can be greater than or equal to the area of spot-size converter end face, so that optical cement can be sufficient filling with
Between spot-size converter end face and chip end face, guarantee the success rate of coupling.It should be pointed out that the width ratio in coupling gap
Smaller, avoiding filling more optical cement causes to communicate after coupling to go wrong, typically, couple the width in gap 0 to
Between 50um herein, the width for coupling gap refers to: the end face of the fibre core of an optical fiber V-groove corresponding with chip
In the alignment of first gap end face after, the distance between the end face of fibre core and corresponding spot-size converter end face.
The present embodiment additionally provides a kind of coupling process of chip, this method comprises:
The size of end face based on the optical fiber coupled with chip etches V-groove, V in the spot-size converter front end of chip
Type groove includes the identical first gap end face of area and Second gap end face, the end face of first gap end face and spot-size converter
It is corresponding, and have between first gap end face and the end face of spot-size converter and couple gap, coupling gap extends in V-groove
The width in direction meets preset value, and the area for coupling gap is greater than the face area of spot-size converter, Second gap end face and core
The corresponding end surface of piece is aligned；
Chip is fitted in the first predeterminated position on substrate；
First cover board and the second cover board are provided, and the first cover board is fitted in into base after etching V-groove on the first cover board
The second predeterminated position on plate, the second predeterminated position are opposite with the first predeterminated position；
Optical fiber front removal coat is left into the V-groove being put into after fibre core on the first cover board, and the second cover board is put
It sets and fixes optical fiber on the first cover board；
The optical fiber that would extend out the V-groove on the first cover board is put into V-groove in chip, makes the end face of fibre core and the
The alignment of one gap end face；
Optical cement is filled in coupling gap, and spot-size converter front end and the end face of optical fiber is made to be communicatively coupled.
In the utility model, the chip includes silicon waveguide and the spot-size converter that connect with the waveguide front-ends；It is described
The front end of spot-size converter is provided with V-groove；The V-groove includes the identical first gap end face of area and Second gap
End face；The first gap end face is corresponding with the end face of the spot-size converter, and the first gap end face and the mould
There is coupling gap between the end face of spot-size converter；The coupling gap meets pre- in the width of the V-groove extending direction
If value, the area in the coupling gap is greater than the face area of the spot-size converter；The Second gap end face and the core
The corresponding end surface of piece is aligned；The coupled apparatus further includes optical fiber, and after the optical fiber is put into the V-groove, the light
The end face center of fine end face center and the spot-size converter is coincide in the extending direction of the V-groove；This is practical as a result,
It is novel that directly optical fiber can be fixed in the V-groove in chip when coupling optical fiber with chip, to make the fibre of optical fiber
Core end face is directly aligned with the end face of spot-size converter, then directly can be filled optical cement in coupling gap and V-groove, be made
The end face of fiber end face and spot-size converter is communicatively coupled completely, and the utility model can promote optical fiber by V-groove as a result,
With the coupling efficiency of chip, filling optical cement can be convenient by coupling gap, chip and optical fiber is quickly made to complete to be communicatively coupled.
In the present embodiment, the first cover board front has the optical fiber of certain length exposed, can be used for matching the V-type of silicon optical chip
Trench inactive encapsulation.
Fig. 4 be core end surface and spot-size converter end face coupling schematic diagram, as shown in figure 4, spot-size converter front end and
After the end face of optical fiber is communicatively coupled, the center of both end faces of the end face of spot-size converter and optical fiber is mutually right in the same direction
Together.
In the present embodiment, when optical fiber is coupled with chip, optical fiber can remove coat in advance and leave covering and fibre core simultaneously
It is fixed by glass upper and lower cover plates.One of cover board is V-groove structure, can guarantee parallel, equidistant, the stable arrangement of optical fiber
It is fixed in V-groove, and through glue and another cover board.The processing modes such as optical fiber leading portion end face grinding, guarantee same
Fiber end face in a array is in the same plane.
Core segment is moved into before the V-groove of chip, it can be exposed by fiber array leading portion by coupling cramp
Angular adjustment between optical fiber and the V-groove of chip is parallel, then optical fiber is moved into corresponding silicon optical chip V-groove, adjusts
The distance between fiber end face and spot-size converter end face are saved, is aligned fiber end face with the first gap end face.
Later, optical cement can be clicked and entered into coupling gap.Glass cover-plate is placed on optical fiber upper surface to be adhesively fixed,
And the first cover board of dispensing is adhesively fixed with the second cover board.
In the present embodiment, the optical fiber that would extend out the V-groove on the first cover board is put into after the V-groove in chip,
The above method further include:
The end face center of optical fiber and the end face center of spot-size converter are coincide in the extending direction of V-groove.
In the present embodiment, the first cover board and the second cover board can guarantee the stability of optical fiber front, be conducive to coupling operation；It holds
The contact engaging and separating force in optical module test use process has been carried on a shoulder pole, optical fiber front end, spot-size converter and the V-groove of sensitive fragility can be protected.
In the present embodiment, chip attachment generally uses heat-conducting glue (heat-conducting glue of such as elargol or other forms)；V-type in chip
Using fixed optical cement between groove and optical fiber；And the filling in the coupling gap between core end surface and spot-size converter end face
" transparent " optical cement that can transmit communication wavelengths can be used；First cover board can be used transparent, nontransparent with the second cover board
Optical cement or structure glue are bonded or are fixed.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (6)
1. a kind of chip coupled apparatus, which is characterized in that including substrate and fit in the chip on the substrate；
The chip includes silicon waveguide and the spot-size converter that connect with the waveguide front-ends；
The front end of the spot-size converter is provided with V-groove；
The V-groove includes the identical first gap end face of area and Second gap end face；
The first gap end face is corresponding with the end face of the spot-size converter, and the first gap end face and the mould spot
There is coupling gap between the end face of converter；
The coupling gap meets preset value in the width of the V-groove extending direction, and the area in the coupling gap is greater than
The face area of the spot-size converter；
The Second gap end face is aligned with the corresponding end surface of the chip；
The coupled apparatus further includes optical fiber, and after the optical fiber is put into the V-groove, the end face center of the optical fiber with
The end face center of the spot-size converter is coincide in the extending direction of the V-groove.
2. chip coupled apparatus according to claim 1, which is characterized in that the preset value is 0 between 50um.
3. chip coupled apparatus according to claim 1, which is characterized in that the chip includes receiving chip and transmitting core
Piece, the optical fiber include launching fiber and reception optical fiber, and the launching fiber passes through the V-groove and the transmitting chip coupling
It closes, the reception optical fiber is coupled by V-groove with the reception chip.
4. chip coupled apparatus according to claim 3, which is characterized in that the launching fiber and reception optical fiber all have
4 optical fiber, and 4 optical fiber passes through corresponding V-groove and coupling gap and the reception chip and transmitting core respectively
The corresponding end surface coupling of spot-size converter in piece.
5. chip coupled apparatus according to claim 1, which is characterized in that two groove faces of the V-groove with it is described
Angle between chip upper surface is between 40 degree and 60 degree.
6. chip coupled apparatus according to claim 1, which is characterized in that the chip coupled apparatus further includes the first lid
Plate and the second cover board；
It is fitted on the substrate on the downside of first cover board, is provided on the upside of first cover board and places the optical fiber
The V-groove；
Second cover board be used for fit in first cover board upside with the fixation optical fiber.
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| CN201920104502.7U CN209514145U (en) | 2019-01-22 | 2019-01-22 | A kind of chip coupled apparatus |
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| CN201920104502.7U CN209514145U (en) | 2019-01-22 | 2019-01-22 | A kind of chip coupled apparatus |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109613667A (en) * | 2019-01-22 | 2019-04-12 | 江苏亨通光网科技有限公司 | A kind of chip coupled apparatus and chip coupling process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109613667A (en) * | 2019-01-22 | 2019-04-12 | 江苏亨通光网科技有限公司 | A kind of chip coupled apparatus and chip coupling process |
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Address after: 215200 Hengdao 88, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee after: JIANGSU HENGTONG OPTICAL NETWORK TECHNOLOGY Co.,Ltd. Patentee after: Suzhou Zhuoyu Photon Technology Co.,Ltd. Address before: 215200 Hengdao 88, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: JIANGSU HENGTONG OPTICAL NETWORK TECHNOLOGY Co.,Ltd. Patentee before: HENGTONG ROCKLEY TECHNOLOGY Co.,Ltd. |
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Address after: No. 168 Jiaotong North Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhuoyu Photon Technology Co.,Ltd. Patentee after: JIANGSU HENGTONG OPTICAL NETWORK TECHNOLOGY Co.,Ltd. Address before: 215200 Hengdao 88, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: JIANGSU HENGTONG OPTICAL NETWORK TECHNOLOGY Co.,Ltd. Patentee before: Suzhou Zhuoyu Photon Technology Co.,Ltd. |