CN103668096B - Bar magnet, magnetic target and magnetron sputtering equipment - Google Patents

Abstract

The invention relates to the technical field of magnetron sputtering, in particular to a bar magnet, a magnetic target and magnetron sputtering equipment. The bar magnet is provided with a raised structure in the middle area. The strip magnet, the target material and the magnetron sputtering equipment provided by the present invention provide the magnetron sputtering area with a strong magnetic induction intensity during the process of depositing a film by magnetron sputtering through the raised structure provided by the strip magnet. Weak and evenly distributed magnetic field ensures uniform thickness of the deposited film.

Description

Bar magnets, magnetic targets and magnetron sputtering equipment

technical field

The invention relates to the technical field of magnetron sputtering, in particular to a bar magnet, a magnetic target and magnetron sputtering equipment.

Background technique

In the process of magnetron sputtering, in order to obtain a higher target atom deposition rate, a higher degree of ionization of the starting gas is required, and to obtain a higher degree of ionization of the starting gas, it is necessary to ensure that the electrons and the molecules of the starting gas are sufficiently large. Therefore, the attached magnetic target is used in the magnetron sputtering equipment to control the trajectory of electrons, so that the trajectory is spiral, as shown in Figure 1.

When electrons move in a magnetic field, because there is a certain angle between the moving speed of electrons and the direction of the magnetic field, the electrons are under the action of the Loren magnetic force and move in a circle; and because of the action of the electric field, the electrons have acceleration in the opposite direction of the electric field lines, so , Under the combined action of the magnetic field and the electric field, the electrons spiral forward, prolonging the movement path, and at the same time increasing the collision probability between the electrons and the glowing gas molecules.

At present, most magnetic targets use fixed bar-shaped permanent magnets to provide magnetic fields for sputtering. A plurality of bar-shaped permanent magnets in the magnetic target are fixed side by side on the fixed plate. The magnetron sputtering equipment includes a stage, a target arranged above the stage, a back plate located on the upper side of the target, and a bar-shaped permanent magnet arranged on the upper side of the back plate. When the substrate placed on the stage is deposited by the magnetron sputtering equipment, since the magnetic induction intensity of the magnetic field provided by the bar-shaped permanent magnet is unevenly distributed on the substrate, the magnetic induction intensity of the edge area of the bar-shaped magnet is stronger than that of the magnet. The magnetic induction intensity in the middle area causes the thickness of the deposited film to be uneven. According to sheet resistance measurement and deposition film thickness measurement, it is found that the deposited film has the defect that the middle part is thin, and the film near the end of the bar-shaped permanent magnet is thicker.

In order to solve the above problems, the present invention makes beneficial improvements.

Contents of the invention

(1) Technical problems to be solved

The object of the present invention is to provide a bar magnet, a magnetic target and a magnetron sputtering device that can make the magnetic induction intensity distribution of the magnetic field in the magnetron sputtering area more uniform.

(2) Technical solutions

The present invention is achieved through the following technical solutions: a bar magnet, the bar magnet is provided with a protruding structure in the middle area.

Wherein, the protruding structure is a bent structure arranged on the bar magnet along the length direction of the bar magnet.

Preferably, the bending angle of the bending structure ranges from 165° to 178°.

Specifically, the bar magnet includes:

The outer S pole and the inner N pole;

Or, the outer N pole and the inner S pole.

The present invention also provides a magnetic target, comprising a fixed plate and the above-mentioned bar magnet disposed on the fixed plate; the protruding structure of the bar magnet is protrudingly arranged toward the fixed plate.

Specifically, the magnetic target includes a plurality of bar magnets, and the plurality of bar magnets include bar magnets with internal N poles and peripheral S poles and bar magnets with internal S poles and peripheral N poles. .

Preferably, the bar magnet is a permanent magnet or an electromagnet.

Further, a slide rail is provided on the fixed plate, and the bar magnet is connected to the slide rail in a manner capable of moving on the slide rail.

The present invention also provides a magnetron sputtering device, including a target material, a back plate and the above-mentioned magnetic target, the target material is arranged on one side of the back plate, and the magnetic target is arranged on the back plate The other side.

Further, a driving device is also included, and the driving device is used to drive the bar magnet to move along a preset driving track.

(3) Beneficial effects

Compared with prior art and product, the present invention has following advantage:

The bar magnet, target material and magnetron sputtering equipment provided by the present invention provide the magnetron sputtering area with a strong magnetic induction intensity during the process of depositing a film by magnetron sputtering through the raised structure provided by the bar magnet. Weak and evenly distributed magnetic field ensures uniform thickness of the deposited film.

Description of drawings

Fig. 1 is a schematic diagram of electron motion trajectory in magnetron sputtering equipment in the prior art;

Fig. 2 is the top view of a kind of bar magnet of the present invention;

Fig. 3 is the top view of another kind of bar magnet of the present invention;

Fig. 4 is the side view of bar magnet of the present invention;

Fig. 5 is the top structural view of the magnetic target of the present invention;

Fig. 6 is a side view structure diagram of the magnetic target of the present invention;

Fig. 7 is a structural diagram of the magnetron sputtering device of the present invention.

In the accompanying drawings, the list of components represented by each component is as follows:

1-bar magnet; 11-bar magnet with inner N pole and outer S pole; 12-bar magnet with inner S pole and outer N pole; 3-fixing plate; 4-magnetic target; 5-back plate; 6 - target; 7 - substrate; 8 - stage.

Detailed ways

The specific implementation manner of the present invention will be described in detail below in conjunction with the accompanying drawings.

This embodiment provides a bar magnet installed on a magnetron sputtering device. As shown in FIG. 2 , FIG. 3 and FIG. 4 , the middle area of the bar magnet 1 is provided with a raised structure. When the film is deposited on the substrate by magnetron sputtering, the convex structure on the bar magnet 1 is protruded toward the substrate, so that the two ends of the bar magnet are farther away from the substrate than the middle area of the bar magnet. Thereby, the magnetic field intensity provided by the two ends of the bar magnet becomes weaker, overcomes the defect that the magnetic field intensity of the edge positions near the two ends of the existing linear bar magnet is stronger, and the magnetic field intensity in the middle area is weaker, and the magnetic field in the magnetron sputtering area A magnetic field with relatively uniform magnetic induction intensity is formed.

The protruding structure can adopt various structures, such as curved structures such as arcs, all of which can solve the technical problem of the present invention. This embodiment preferably adopts a protruding structure, which is a bent structure arranged on the bar magnet along the length direction of the bar magnet. The bent structure is simple and easy to manufacture. Moreover, the angle of the bending structure on the bar magnet can be adjusted according to the measured parameters such as the sheet resistance of the deposited film and the thickness of the film to ensure uniform magnetic induction for the magnetron sputtering area. Magnetic field, and can sputter deposition on the substrate to form a uniform thickness of the film.

Preferably, the bending angle of the bending structure ranges from 165° to 178°. When the bending angle of the bending structure is less than 165°, the bending angle of the bar magnet will be too large, which will reduce the edge magnetic field at both ends of our bar magnet too much, resulting in new film formation inhomogeneity; when the bending structure The bending angle is greater than 178°, which is similar to the effect of a linear bar magnet, and cannot adjust the magnetic field strength of the edge parts at both ends of the bar magnet. In summary, an angle range of 165°-178° is preferred as the bending angle range of the bending structure of the present invention.

Specifically, the bar magnet 1 is divided into two types, one is a bar magnet 11 with an inner N pole and an outer S pole;

Bar magnet 12 with inner S pole and outer N pole;

Preferably, the bar magnet 1 is a permanent magnet or an electromagnet.

The present embodiment provides a magnetic target, as shown in Figure 5 and Figure 6, comprising a fixed plate 3 and the above-mentioned bar magnet 1 arranged on the fixed plate 3; the protrusion of the bar magnet 1 The structure protrudes towards said fixing plate 3 . There are one or more bar magnets 1 . When the magnetic target includes a plurality of bar magnets 1, the plurality of bar magnets 1 include bar magnets 11 with inner N poles and outer S poles and bar magnets 12 with inner S poles and outer N poles. .

Further, a slide rail (not shown in the figure) is provided on the fixing plate 3 , and the bar magnet is connected to the slide rail in a manner capable of sliding on the slide rail.

This embodiment also provides a magnetron sputtering device, as shown in FIG. 7 , including a target 6, a back plate 5 and the above-mentioned magnetic target 4, and the target 6 is arranged under the back plate 5. The magnetic target 4 is arranged on the upper side of the back plate 5 . The stage 8 is arranged under the target 6 , and the substrate 7 for depositing a thin film is placed on the upper side of the stage 8 . The bar magnet 1 can reciprocate on the slide rail along the direction parallel to the plane of the target 6, so as to provide a magnetic field for the magnetron sputtering area.

Further, the magnetron sputtering equipment further includes a driving device, which is used to drive the bar magnet to move along a preset driving track.

The above embodiments are only used to illustrate the present invention, but not to limit the present invention. Those of ordinary skill in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, all Equivalent technical solutions also belong to the category of the present invention, and the scope of patent protection of the present invention should be defined by the claims.

Claims (10)

1. A bar magnet, characterized in that, the bar magnet is provided with a raised structure in the middle region, and provides a magnetic field with uniform distribution of magnetic induction intensity for the magnetron sputtering region by the raised structure. 2. The bar magnet according to claim 1, wherein the protruding structure is a bent structure arranged on the bar magnet along the length direction of the bar magnet. 3 . The bar magnet according to claim 2 , wherein the bending angle of the bending structure ranges from 165° to 178°. 4. The bar magnet according to claim 1, wherein the bar magnet comprises: The outer S pole and the inner N pole; Or, the outer N pole and the inner S pole. 5. A magnetic target, characterized in that it comprises a fixed plate and the bar magnet according to any one of claims 1 to 4 arranged on the fixed plate; the protruding structure of the bar magnet faces the The protrusions of the fixed plate are set. 6. The magnetic target according to claim 5, characterized in that, the magnetic target comprises a plurality of bar-shaped magnets, and the plurality of bar-shaped magnets include a bar-shaped arrangement of internal N poles and peripheral S poles. Magnets and bar magnets with inner S poles and outer N poles. 7. The magnetic target according to claim 5, wherein the bar magnet is a permanent magnet or an electromagnet. 8 . The magnetic target according to claim 5 , wherein a slide rail is provided on the fixed plate, and the bar magnet is connected to the slide rail in a manner capable of moving on the slide rail. 9. A magnetron sputtering device, characterized in that it comprises a target, a back plate and the magnetic target according to any one of claims 5 to 8, the target is arranged on one side of the back plate, The magnetic target is arranged on the other side of the back plate. 10 . The magnetron sputtering device according to claim 9 , further comprising a driving device for driving the bar magnet to move along a preset driving track. 11 .