CN103650180B - Substrate for optics - Google Patents
Substrate for optics Download PDFInfo
- Publication number
- CN103650180B CN103650180B CN201280034858.9A CN201280034858A CN103650180B CN 103650180 B CN103650180 B CN 103650180B CN 201280034858 A CN201280034858 A CN 201280034858A CN 103650180 B CN103650180 B CN 103650180B
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- Prior art keywords
- optical element
- substrate
- element substrate
- optics
- base board
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- 239000000758 substrate Substances 0.000 title claims abstract description 127
- 230000003287 optical Effects 0.000 claims abstract description 127
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 description 21
- 238000000576 coating method Methods 0.000 description 21
- 238000000034 method Methods 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 7
- 238000009413 insulation Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 238000001579 optical reflectometry Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000000875 corresponding Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N oxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002194 synthesizing Effects 0.000 description 1
Abstract
The present invention relates to a kind of substrate for optics, it is configured to the mode of assembling and connects optical element substrate and electrode base board, and being configured to form one or more bridge pad on optical element substrate, this bridge pad is insulated with optical element substrate by level of dielectric layer simultaneously.The substrate for optics according to the first aspect of the invention includes: optical element substrate, and it is made up of metallic plate and wherein comprises multiple optical element；Pair of electrodes substrate, its by insulant make with surface thereon at least some of on form conducting shell, be respectively connecting to two side surfaces of optical element substrate, and lead-in wire be bound to the electrode of optical element；And assembling device, it is formed on the side surface of electrode base board and optical element substrate, to assemble optical element substrate and electrode base board.The substrate for optics according to the second aspect of the invention includes: optical element substrate, and it is made up of metallic plate and is provided with multiple optical element；Pair of electrodes substrate, it is made to be respectively connecting to two side surfaces of optical element substrate by metal material, and lead-in wire is bound to the electrode of optical element；Assembling device, it is formed on the side surface of electrode base board and optical element substrate, to assemble optical element substrate and electrode base board；And the vertically insulated layer of assembly type, it is inserted between optical element substrate and electrode base board, in order to be connected to assemble device.
Description
Technical field
The present invention relates to a kind of substrate for optics, and be used for more particularly, to one
The substrate of optics, this optics is configured to the mode of assembling and connects optical element substrate and electrode
Substrate, and be configured on optical element substrate, form one or more bridge pad (bridge simultaneously
Pad), this bridge pad is insulated with optical element substrate by level of dielectric layer.
Background technology
Light emitting diode (LED) usually as light emitting semiconductor device has attracted quite a lot of
Concern, reason is that the light source of beneficially environmental conservation is dirty all without causing environment in every field
Dye.Recently, along with the use of LED expands to every field, such as, indoor and outdoors illumination, car
Headlight, the back light unit (BLU) etc. of display, required that LED has high efficiency and Zhuo
Heat dissipation characteristics more.In order to obtain efficient LED, it is necessary to improve LED raw material or structure, and
Also require that the structure improving LED encapsulation and the raw material used in LED encapsulates.
Because efficient LED produces high heat, when high heat is not effectively dissipated, the temperature of LED becomes
Height, therefore the characteristic of LED is destroyed, thus decreases the life-span of LED.Therefore, have been directed to
Dissipate heat effectively that produce from this LED.
Hereinafter, each light-emitting component (such as, LED etc.) is referred to as " optical element ", and
And each product (each include one or more optical element) is referred to as " optics ".
Figure 1A to 1D is the perspective view of the classical production process explaining optics.First, such as figure
Shown in 1A, in order to form the conventional substrate 10 for installing optical element, will have predetermined thickness
Conductive plate 11(such as, copper coin etc.) and insulation board 12(is such as, glass epoxy board etc.) in plane
Attachment alternating with each other on direction, to form block main body 13(with reference to Figure 1B).Here, conductive plate 11
Attachment with insulation board 12 can be carried out by binding agent, hot pressing etc..
Subsequently, as shown in fig. 1b, when cutting (i.e., along the direction being perpendicular to conductive plate 11 plane
Perpendicular cuts) such as the block main body 13 in Figure 1A, as shown in Figure 1 C, it is thus achieved that include being alternately arranged
The substrate 10 of conductive bars 10a and insulation strip 10b.
Subsequently, as shown in figure ip, substrate 10 conductive bars (10a-1., 10a-2., 10a-3.)
On be respectively arranged with aturegularaintervals arrange LED chip 2, be arranged on conductive bars (10a-1., 10a-
2., 10a-3.) on each LED chip 23 be repeatedly connected to follow-up conductive bars by lead-in wire,
To obtain LED array, and then with the molded LED array of transparent resin, to prepare plate shape
LED array.
Meanwhile, the row of plate shape LED array electrically connects parallel to each other, and its row electricity parallel to each other
Connect.This plate shape LED array can directly make product, or can be by being divided by row and column
Suitable row and column unit or single row and column unit is become to make product.Additionally, plate ought directly be used
During shape LED array, it it is arranged on metal PCB or is arranged on its underpart with heat sink.
But, the above-mentioned substrate being traditionally used for optics has a problem in that its conductive bars and insulation strip
It is attached by binding agent or hot pressing, thus the connection between conductive bars and insulation strip is thick in being easily processed
Slight impact, bending or the crooked damage that the heart causes.
Summary of the invention
Technical problem
Therefore, the present invention specifically addresses the problems referred to above, and it is an object of the invention to provide one
For the substrate of optics, impact, bending or the crooked damage that its middle carelessness that will not be processed causes,
Reason is that it is configured to the mode of assembling and connects optical element substrate and electrode base board, and the most not
Form the level of dielectric layer for optical element substrate being insulated into multiple region.
Another object of the present invention is to provide a kind of substrate for optics, it will not be processed
Impact, bending or the crooked damage that middle carelessness causes, reason is that it is configured to the mode of assembling and connects
Optical element substrate and electrode base board, and on optical element substrate, form one or more bridge simultaneously
Pad, this bridge pad is insulated with optical element substrate by level of dielectric layer.
Technical scheme
To achieve these goals, a first aspect of the present invention provides a kind of base for optics
Plate, including: optical device substrate, it is made up of metallic plate and is provided with multiple optical element；
Pair of electrodes substrate, its by insulant make with surface thereon at least some of on form conduction
Layer, this is respectively connecting to two side surfaces of optical element substrate to electrode base board, and lead-in wire combines
Electrode to optical element；And assembling device, it is formed at electrode base board and optical element substrate
On side surface, to assemble optical element substrate and electrode base board.
In the substrate for optics according to the first aspect of the invention, optical element substrate can
To be provided with chamber, this chamber includes rectangular recess, is provided with multiple optical element in this rectangular recess.This
Outward, optical element substrate can be provided with multiple chamber, and each chamber includes groove, is provided with in this groove
Optical element.
A second aspect of the present invention provides a kind of substrate for optics, including: optical element
Substrate, it is made up of metallic plate and is provided with multiple optical element；Pair of electrodes substrate, its
It is made up of metal material, is respectively connecting to two side surfaces of optical element substrate, and lead-in wire combines
Electrode to optical element；Assembling device, it is formed at the side table of electrode base board and optical element substrate
On face, to assemble optical element substrate and electrode base board；And the vertically insulated layer of assembly type, it inserts
Between optical element substrate and electrode base board, in order to be connected to assemble device.
In the substrate for optics according to the second aspect of the invention, assembly type is vertically insulated
Layer can be by making the side surface anodic oxygen including assembling device of optical element substrate and electrode base board
Change and formed.
Additionally, optical element substrate can be provided with chamber, this chamber includes rectangular recess, this rectangular recess
In multiple optical element is installed.Further, optical element substrate can be provided with multiple chamber, often
Individual chamber includes groove, is provided with optical element in this groove.
In the substrate for optics according to the first or second aspect of the present invention, optical element
Substrate can include the coating being formed thereon on surface.First or second aspect according to the present invention
Substrate for optics can also include: level of dielectric layer, and it is formed at optical element substrate
On the region that at least one coating has been removed, to electrically connect with coating；And bridge pad, it is arranged in water
To allow the electrode of optical element to be electrically connected by lead-in wire on flat insulating barrier.In this case, level
Insulating barrier can be formed in a groove, and this groove is formed at the district that the coating of optical element substrate has been removed
In territory.
Beneficial effect
The advantage of the substrate of the optics according to the present invention is: its middle carelessness that will not be processed causes
Impact, bending or crooked damage, reason is that it is configured to the mode of assembling and connects optical element base
Plate and electrode base board, and on optical element substrate, form one or more bridge pad simultaneously, this bridge pad
Insulated with optical element substrate by level of dielectric layer.
Accompanying drawing explanation
Figure 1A to 1D is the perspective view of the traditional preparation methods explaining optics.
Fig. 2 is according to the embodiment of the present invention by the optics device prepared for the substrate of optics
The sectional view of part.
Fig. 3 is by the light prepared for the substrate of optics according to another embodiment of the present invention
Learn the sectional view of device.
Fig. 4 is the optics prepared by the substrate revised for the local of the optics of Fig. 2
Sectional view, and Fig. 5 is the light prepared by the substrate revised for the local of the optics of Fig. 3
Learn the sectional view of device.
Fig. 6 is the electricity that chip lead is combined in the case of being not inserted into bridge pad optical element by chip
The sectional view of optics prepared by pole.
Fig. 7 A is the plane graph of the optics according to another embodiment of the present invention, and Fig. 7 B
It it is the sectional view of the optics of the line A-A intercepting along Fig. 7 A.
Fig. 8 A is the plane graph of the optics according to another embodiment of the present invention, and Fig. 8 B
It it is the sectional view of the optics of the line A-A intercepting along Fig. 8 A.
Detailed description of the invention
Hereinafter, will be described in detail with reference to the accompanying drawings the preferred embodiment of the present invention.
Fig. 2 is according to the embodiment of the present invention by the optics device prepared for the substrate of optics
The sectional view of part.As shown in Figure 2, optics according to the embodiment of the present invention includes: light
Learning device substrate 110-1, it is positioned at the center of optics and is provided with multiple optical element
160；And pair of electrodes substrate 120-1, it is connected to optical element substrate 110-1 in assembling mode
Both sides and serve as the electrode of optics, i.e. anode and negative electrode.
As it has been described above, optical element substrate 110-1 can be formed by metallic plate, metallic plate is by having height
The metal of heat conductivity is made, such as, aluminum (Al), magnesium (Mg), copper (Cu) or ferrum (Fe) or
Its alloy, the heat produced with the optical element 160 that dissipates rapidly.Additionally, each electrode base board 120-1
Can have the main body being made up of synthetic resin, this synthetic resin has good handlability and Ke Jia
Work, such as, polymer, plastics or its synthetic, reason is electrode base board 120-1 and optics
Device substrate 110-1 compares, it is not necessary to remarkable heat dispersion.Therefore, Fig. 2 show have by
The electrode base board 120-1 of the main body that synthetic resin is made.
Meanwhile, in the present invention, in order to strengthen optical element substrate 110-1 and electrode base board 120-1
Between attachment, two sides of optical element substrate 110-1 are provided with outthrust 112, and often
One side of individual electrode base board 120-1 is provided with groove 122(with reference to the structure in dotted line circle " A "),
Therefore optical element substrate 110-1 by outthrust 112 is assemblied in groove 122 is attached to each
Electrode base board 120-1.In this case, outthrust 112 and groove 122 can distinguish shape across
Become on the side all or in part of optical element substrate 110-1 and electrode base board 120-1.Meanwhile,
As shown in the dotted line circle " B " of Fig. 2, each electrode base board 120-1 can be arranged on one side
It is provided with outthrust 123, and optical element substrate 110-1 can be provided with groove in two side
113.Additionally, optical element substrate 110-1 can be vertically installed with two or more in each of which side
Individual outthrust, and each electrode base board 120-1 can be provided with two or more in one side
Groove.Additionally, optical element substrate 110-1 can be vertically installed with two or more in each of which side
Multiple grooves, and each electrode base board 120-1 can be provided with two or more in one side
Outthrust.Compared with above, optical element substrate 110-1 can be provided with prominent in one side
Thing, and its another side can be provided with groove.Outthrust 112 and groove 122 can lead to
Cross processing technique to be formed.
Meanwhile, as shown in Figure 2, when the main body of electrode base board 120-1 is made up of synthetic resin,
Conducting shell 134 is necessarily formed on the upper surface all or in part of electrode base board main body, so that should
Main body serves as electrode base board 120-1.Meanwhile, optical element 160 can be attached directly to metallic plate
Upper surface, this metallic plate constitutes the optical element substrate that will be arranged on optical element substrate 110-1
110-1, but, in this case, the light being incident on optical element substrate 110-1 upper surface
Reflectance may be lowered due to interference, it is preferred that have the plating of high optical reflectivity
Layer 132 is formed on the upper surface of optical element substrate 110-1.Coating 132 can be by having Gao Guang
The silver (Ag) learning reflectance is made.
In the present invention, in order to prevent optical element substrate 110-1 to be equipped with vertically insulated layer, light
Learn and be provided with and at least one water of this optical element substrate 110-1 electric insulation on device substrate 110-1
Being provided with bridge pad 150 on flat insulating barrier 140, and this level of dielectric layer 140, it is used for electrically connecting
Two adjacent optical elements 160.
Here, level of dielectric layer 140 can be by using binding agent or hot pressing that synthetic resin sheet is attached
It is connected on optical element substrate 110-1, by solidification liquid epoxy or silicon adhesive or by making pottery
The direct thermal spray of porcelain is formed on optical element substrate 110-1.In this case, in order to strengthen
Bonding between level of dielectric layer 140 and optical element substrate 110-1, can make optical element base
After the shaggy pretreatment of plate 110-1, form level of dielectric layer 140.Meanwhile, in order to anti-
Only level of dielectric layer 140 destroys the optical reflection efficiency of optical element substrate 110-1, if it is possible,
The size of level of dielectric layer 140 can be reduced.
Bridge pad 150 can be by having satisfactory electrical conductivity, luminous reflectance and the metal of the cohesive with lead-in wire
Or alloy sheet is formed, it is selected from following: gold (Au), silver (Ag), copper (Cu), aluminum (Al),
Nickel (Ni) and alloy thereof.Preferably, bridge pad 150 can be by using binding agent by silver (Ag) sheet
It is attached on level of dielectric layer 140 formation.Bridge pad 150 can have variously-shaped, such as, circular,
Tetragon etc..
Additionally, bridge pad 150 can be formed by following steps: use splash, plating or electroless plating to use
Metal material processes silicon wafer or uses plating or electroless plating metal material to process plastics or FR4 plate
To form coating, suitably cut coating, and then use binding agent to be attached at by the coating of cutting
On level of dielectric layer 140.Furthermore, it is possible to by using silk screen printing by direct for silver (Ag) pastel
It is printed on level of dielectric layer 140 formation bridge pad 150.Meanwhile, in order to strengthen the reliable of lead-in wire combination
Property, electroless nickel plating (Ni) coating can be additionally formed on the surface of bridge pad 150.Preferably,
The size being smaller in size than level of dielectric layer 140 of bridge pad 150, so that optical element substrate 110-1
Adjacent coating 132 between electric insulation fully carry out.
Meanwhile, after optical element substrate 110-1 is attached to electrode base board 120, shape thereon
Become single coating 130.By mechanical technology (such as, cutting technique) or chemical technology is (such as,
Etch process) this single coating 130 is separated into conducting shell 134 and coating 132 and a region,
Level of dielectric layer 140 will occupy this region, and then can perform subsequent technique.
By above-mentioned technique, complete the substrate for optics.Hereinafter, by optical element 160
It is arranged on coating 132, is provided with by binding agent etc. between coating 132 and optical element 160
Bridge pad 150, then optical element 160 leads to the middle intervention lead-in wire of gap-bridge pad 150 and is electrically connected to each other.
In this case, each electrode of the most left He the rightest optical element 160 is by lead-in wire 165 electricity
It is connected to corresponding electrode base board 120-1.In fig. 2, reference number " 190 " expression is used for protecting
Optical element 160 and lead-in wire 165 comprise the transparent or seal of fluorescent material, and reference number
" 180 " represent the ponding for limiting liquid airproof body 190.
Fig. 3 is by the light prepared for the substrate of optics according to another embodiment of the present invention
Learn the sectional view of device.In figure 3, identical with parts in Fig. 2 parts are with identical reference number
Represent, and it describes in detail and will omit.According to the optics 100-2 shown in Fig. 3, electrode
Substrate 120-2 can be (such as, identical with the metallic plate of optical element substrate 110-1 by metallic plate
Metallic plate) rather than synthetic resin formation.In this case, for explanation electrode base board 120-2
Purpose with optical element substrate 110-1, it is necessary to by the most exhausted for the assembly type with laterally disposed cap-shaped
Edge layer 124 is inserted between these substrates, so that the outthrust 112 of optical element substrate 110-1
Assemble with the groove 122 of electrode base board 120-2.The vertically insulated layer of such assembly type 124 is by synthesizing
Resin is made, and is attached to optical element substrate 110-1 and electrode base board 120-2 by binding agent.
Meanwhile, can have the side of outthrust 112 by making optical element substrate 110-1 or make electrode base
Plate 120-2 has the side anodic oxidation of groove 122, or by making optical element substrate 110-1
There is the side of groove 122 or make electrode base board 120-2 have the side anodic oxidation of outthrust 112,
Make the vertically insulated layer of assembly type integral with optical element substrate 110-1 or electrode base board 120-2.?
Here, assembling structure is identical with the assembling structure shown in Fig. 2.
Fig. 4 is the optics prepared by the substrate revised for the local of the optics of Fig. 2
Sectional view, and Fig. 5 is the light prepared by the substrate revised for the local of the optics of Fig. 3
Learn the sectional view of device.In figures 4 and 5, identical with parts in Fig. 2 and 3 parts are with identical
Reference number represents, and it describes in detail and will omit.At the optics (100-3 shown in Figure 4 and 5
And 100-4) in, in order to the upper surface at bridge pad 150 is high due to the thickness of level of dielectric layer 140
When the upper surface of coating 132, prevent optical reflectivity from reducing, groove will be installed and form optical element
Until the degree of depth corresponding with the thickness of level of dielectric layer 140 in the top of substrate 110-2, and then
This level of dielectric layer 140 is arranged in this installation groove.Therefore, even if being arranged at bridge pad 150
Time on level of dielectric layer 140, the upper surface of bridge pad 150 also with the upper surface flush of coating 132 or
Lower than the upper surface of coating 132, so prevent optical reflectivity from reducing.In Fig. 2 is to 5, in order to
Convenient, it is shown that each optics with two optical elements 160, it is also possible to prepare each tool
There is the optics of two or more optical elements 160.Additionally, ought as shown in FIG. 6 under
As stating in optics, being at a distance sufficiently large so that chip can not be performed to core between optical element
When sheet lead-in wire combines, it may be preferred to the optics shown in ground application drawing 2 to 5.
Fig. 6 is the electricity that chip lead is combined in the case of being not inserted into bridge pad optical element by chip
The sectional view of optics prepared by pole.In figure 6, identical with parts in Fig. 2 to 5 parts are used
Identical reference number represents, and it describes in detail and will omit.At the optics shown in Fig. 6
In 100-5, this optics 100-5 does not include bridge pad, so it need not level of dielectric layer, and
Therefore coating can be formed on the whole region of optical element substrate.Optics according to this embodiment
Device can apply to the optics needing to keep the interval between optical element narrow.In figure 6,
Reference number " 195 " represent for will the light that send from optical element focus on lens (convex lens) (
In the case of diverging light: concavees lens).Such lens may be directly applied to shown in Fig. 7 and 8
Following optics and Fig. 2 are to the above-mentioned optics shown in 5.
Fig. 7 A is the plane graph of the optics according to another embodiment of the present invention, and Fig. 7 B
It it is the sectional view of the optics of the line A-A intercepting along Fig. 7 A.In Fig. 7 A and 7B, with figure
The parts that in 2 to 5, parts are identical are denoted with the same reference numerals, and it describes in detail and will omit.
As shown in Fig. 7 A to 7B, in optics 100-6 according to the embodiment of the present invention, tool
The single chamber having rectangular recess is formed in the upper part of optical element substrate 110-3, and in this chamber
Multiple optical element 160 is installed.In this case, when forming chamber with tilted shape, so that
The width of upper part of wall in chamber more than the width of lower part of its wall time, optical reflection can be improved
Rate.
Meanwhile, in this configuration, preferably seal 190 is filled with in this chamber until this chamber
The horizontal plane of upper surface.In such a case, it is possible to include the vertically insulated layer of assembly type 124 betwixt
Optical element substrate 110-3 and electrode base board 120-3 part on step is set, so that even
The lead-in wire 165 being connected to electrode base board 120-3 is embedded in seal 190.Can be at optical element base
Plate 110-3 and electrode base board 120-3 by assembling and be attached in the case of, by pressing, cutting or
Etch process forms chamber.Unlike this, optical element substrate 110-3 and electrode base board 120-3 that
This forms chamber and step in the case of separating, and then makes optical element substrate 110-3 and electricity by assembling
Electrode substrate 120-3 is attached.
Fig. 8 A is the plane graph of the optics according to another embodiment of the present invention, and Fig. 8 B
It it is the sectional view of the optics of the line A-A intercepting along Fig. 8 A.In Fig. 8 A and 8B, with figure
The parts that in 2 to 5, parts are identical are denoted with the same reference numerals, and it describes in detail and will omit.
As shown in Figure 8A and 8B, in optics 100-7 according to the embodiment of the present invention, for
Further increase optical reflectivity, is arranged on optical element in corresponding chamber, and each chamber is by having
The groove on inclined-plane is formed, and the upper part width on this inclined-plane and its underpart are narrow.Therefore, optical element base
Plate is provided with multiple chamber.Meanwhile, in this embodiment, between chamber, channel-style groove is formed
(channel groove), each channel-style groove has the width less than chamber, recessed at each channel-style
In groove formed level of dielectric layer, and on level of dielectric layer arrange bridge pad, thus the upper plane in chamber with
The upper surface flush of bridge pad, thus increase optical reflectivity.
In Fig. 2 is to 8, unless explained especially, the most identical material with functional part with identical
Hatching represents.
Under the technological thought of the present invention, the substrate for optics according to the present invention can be entered
The various amendments of row, and it is not limited to above-mentioned embodiment.Optics device can also will be used for according to the present invention
The substrate of part is for the light source of back light unit, and plurality of optical element is continuous in the way of being connected in series
Aligning.
<the reference number explanation in accompanying drawing>
100-1～100-7: optics
110-1～110-4: optical element substrate
112: outthrust
120-1～120-4: electrode base board
122: groove
124: the vertically insulated layer of assembly type
130: coating
132: coating
134: conducting shell
140: level of dielectric layer
150: bridge pad
160: optical element
165: lead-in wire
180: seal ponding
190: seal
195: lens
Claims (3)
1. for a substrate for optics, comprising:
Optical element substrate, it is made up and is provided with multiple optical element of metallic plate, wherein,
Level of dielectric layer is formed on a metal plate, between the multiple optical elements installed, and bridge pulvilliform
Become on each level of dielectric layer to electrically connect the electrode of adjacent optical elements；
Pair of electrodes substrate, it is made up of insulant and is formed with at least some of upper of surface thereon
Conducting shell, this is respectively connecting to two side surfaces of optical element substrate, and optics to electrode base board
The contact conductor of element is bound to conducting shell；And
Assembling device, it is formed on the side surface of electrode base board and optical element substrate, to assemble light
Learn device substrate and electrode base board.
Substrate for optics the most according to claim 1, wherein optical element substrate
Being provided with chamber, this chamber includes rectangular recess, is provided with multiple optical element in this rectangular recess.
Substrate for optics the most according to claim 1, wherein optical element substrate
Being provided with multiple chamber, each chamber includes groove, is provided with optical element in this groove.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0070095 | 2011-07-14 | ||
| KR1020110070095A KR101253247B1 (en) | 2011-07-14 | 2011-07-14 | substrate for light emitting device |
| PCT/KR2012/005479 WO2013009082A2 (en) | 2011-07-14 | 2012-07-11 | Substrate for optical device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103650180A CN103650180A (en) | 2014-03-19 |
| CN103650180B true CN103650180B (en) | 2016-11-30 |
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|---|---|---|---|---|
| JP2000058924A (en) * | 1998-08-06 | 2000-02-25 | Shichizun Denshi:Kk | Surface mounting-type light emitting diode and its manufacture |
| JP2002335019A (en) * | 2001-03-05 | 2002-11-22 | Nichia Chem Ind Ltd | Light emitting device |
| CN101252164A (en) * | 2007-02-22 | 2008-08-27 | 夏普株式会社 | Surface mounting type light emitting diode and method for manufacturing the same |
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000058924A (en) * | 1998-08-06 | 2000-02-25 | Shichizun Denshi:Kk | Surface mounting-type light emitting diode and its manufacture |
| JP2002335019A (en) * | 2001-03-05 | 2002-11-22 | Nichia Chem Ind Ltd | Light emitting device |
| CN101252164A (en) * | 2007-02-22 | 2008-08-27 | 夏普株式会社 | Surface mounting type light emitting diode and method for manufacturing the same |
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