CN103644875A - Dynamic spindle rotation precision detection device - Google Patents
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Abstract
The invention discloses a dynamic spindle rotation precision detection device, and relates to the precision measurement field. A plurality of eddy current sensors are arranged, with axes orthogonal to each other, in a radial direction of a spindle detection mandrel, to obtain a run-out displacement signal in a corresponding radial direction of the detection mandrel. A fixing sleeve is passed through by several fastening screws and locked and fixed along an axial direction of a spindle outer cover. The fixing sleeve covers the spindle outer cover and is locked and fixed for supporting and fixing the eddy current sensors and a reflection type photoelectric sensor. The eddy current sensors and the reflection type photoelectric sensor are connected to an embedded system device which conducts analysis on collected radial run-out data, wherein the eddy current sensors and the reflection type photoelectric sensor present a non-contact state with a detection point of the spindle detection mandrel. The problems that a conventional contact detection device can neither measure the radial run-out of the spindle at a high speed rotating state nor detect the rotation precision of the spindle at an absolute position are solved, and structural design data are provided for improving the spindle dynamic precision.
Description
Technical field
The invention relates to precision measurement field, relates in particular to a kind of dynamic spindle rotation accuracy pick-up unit.
Background technology
The diameter run-out of traditional detection main shaft generally adopts contact type measurement, and if clock gauge or the mini-inductance measurement crown are on smooth smooth rotary annular reference field, main shaft is done to carry out radial pulsation measurement under utmost point slow-speed of revolution rotation status.Main shaft, when certain rotation speed operation, generally surpasses when per minute tens turns and just can not correctly read detection data.When main shaft is when more speed is rotated, table gauge head vibration frequency is accelerated, and adds the additional dither impact that friction of motion brings, and its instrument apparent value is without reading meaning.So existing traditional detection technology can only be carried out main shaft diameter to glitch detection under quasi-static situation.
Main shaft is when running up work, particularly rotating speed reaches 2000r/min to 10000r/min or when higher, due to factors such as transient equilibrium error, bearing accuracy and processing assembling, influence of thermal deformations, data and actual condition state that its quasistatic is measured have larger difference, and rotating speed enters resonant frequency region situation more very.Cause high dynamic motion accuracy error directly to affect part processing precision.
Existing contactless high dynamic displacement pick-up unit is to adopt separate type functional module or parts to add computing machine to pile up and build formation substantially, generally also to just can complete detection analysis task by special software, and whole detection system to construct cost high, connect comparatively loaded down with trivial detailsly, detect operating process complicated.So generally, owing to lacking accurate, comprehensive, the meticulous rotating accuracy data of main shaft under the dynamic work condition state of height, be unfavorable for dynamic technique analysis and the research and development manufacture of high-precision high-speed main shaft.
Summary of the invention
The present invention is intended at least solve the technical matters existing in prior art, has proposed to special innovation a kind of dynamic spindle rotation accuracy pick-up unit.
A kind of dynamic spindle rotation accuracy pick-up unit, comprise: at least two current vortex sensors 1, reflective photoelectric sensor 2 and embedded systems are processed device, described current vortex sensor 1 with reflective photoelectric sensor 2 respectively through signal amplifier and FPGA(field programmable logic device) logical circuit processes device with described embedded system and is connected
Described reflective photoelectric sensor 2 is arranged on described main shaft detecting core shaft 8 fixed cover 5 in the radial direction, described reflective photoelectric sensor 2 is relative with the position of calibrating reference point on described main shaft detecting core shaft 8, for obtaining the absolute position one of calibrating reference point on described main shaft detecting core shaft 8, turn pulse signal and described position one is turned to pulse signal and after FPGA processing of circuit, be transferred to described embedded system and process device, described embedded system is processed device according to the reference point pulse signal of described absolute position, described main shaft detecting core shaft 8 is calibrated and is arranged the diameter run-out data acquisition location point of described main shaft detecting core shaft 8, the collection starting impulse signal of its circumference equidistant position data collection point turns recurrence interval time domain distribution by FPGA circuit according to one calculating generation is set, the collection starting impulse signal enabling 2 passage high-speed a/d circuit of the data acquisition location point that FPGA circuit distributes complete analog to digital conversion.FPGA Circnit Layout has periodic refresh speed discrimination function, only the image data in confirmation velocity range is extracted, and guarantees the multiplicity of each collection position point, makes testing result more accurate.
The present invention adopts described reflective photoelectric sensor mode to obtain data acquisition location point on circumference, than the rotary encoder mode comparison of common employing, to have the advantages that harvester simple installation and processing safety are high.
For meeting high dynamically high density data, gather the system responses requirement of environment, the present invention uses the high real time effect of FPGA circuit to carry out real-time collaborative processing, guarantee the high multiplicity of each position, collection point, to obtain higher detection precision under the high current intelligence of main shaft.
The present invention has adopted the equidistant segment data acquisition technique of circumference, use described current vortex sensor 1 axis to be arranged on main shaft detecting core shaft 8 fixed cover 5 in the radial direction, the displacement signal be transferred to described embedded system and process device of beating for the described collection position point that obtains described main shaft detecting core shaft 8 in respective radial direction, described embedded system is processed device to described diameter run-out data analysis, wherein, described current vortex sensor 1 and reflective photoelectric sensor 2 are contactless state with the check point of main shaft detecting core shaft.
Solve the problem that radial beat eccentricity that traditional contact-type detection cannot be under the high dynamical state of main shaft and rotating accuracy detect, for improving main shaft dynamic accuracy, provide structural design data.
To achieve these goals, the invention provides a kind of dynamic spindle rotation accuracy pick-up unit.
A kind of dynamic spindle rotation accuracy pick-up unit, comprise: telescopic mounting frame for sensor 5, at least two current vortex sensors 1, reflective photoelectric sensor 2 and embedded systems are processed device, described current vortex sensor 1 and reflective photoelectric sensor 2 are processed device through signal amplifier and FPGA circuit and described embedded system respectively and are connected;
Described reflective photoelectric sensor 2 is arranged on described main shaft detecting core shaft 8 telescopic mounting frame for sensor 5 in the radial direction, described reflective photoelectric sensor 2 is relative with the position of calibrating reference point on described main shaft detecting core shaft 8, for obtaining, on described main shaft detecting core shaft 8, calibrate one of absolute position reference point and turn pulse signal, this signal absolute position pulse signal as a reference point after shaping pulse, after FPGA circuit carries out calculation process, be transferred to described embedded system and process device, described embedded system is processed device, according to described position signalling, described main shaft detecting core shaft 8 is carried out to the circle distribution diameter run-out data acquisition location point that speed is differentiated verification and described main shaft detecting core shaft 8 is set, the collection starting impulse signal of its data acquisition location point turns recurrence interval time domain by FPGA circuit according to one and distributes setting value to calculate generation, after time domain distributes acquisition pulse to start, carry out the collection of N continuous secondary data, N collection finishes rear wait and gathers starting impulse next distribution.Segment data continuous acquisition technology is beneficial to and realizes data filtering preferred process, guarantees to extract the precision of data.
The P-pulse feature of its reference point detects one and turns pulse signal function, so this signal is again as rotary speed detecting signal.
Described current vortex sensor 1 axis is arranged on main shaft detecting core shaft 8 fixed cover 5 in the radial direction, the displacement signal be transferred to described embedded system and process device of beating for the described collection position point that obtains described main shaft detecting core shaft 8 in respective radial direction, described embedded system is processed device to described diameter run-out data analysis, wherein, described current vortex sensor 1 and reflective photoelectric sensor 2 are contactless state with the check point of main shaft detecting core shaft.
Solve the problem that radial beat eccentricity that traditional contact-type detection cannot be under the high dynamical state of main shaft and rotating accuracy detect, for improving main shaft dynamic accuracy, provide structural design data.
Adopted current vortex sensor, be contactless state with test point, realized the accurate main shaft under high-speed motion state is carried out to diameter run-out detection.
Described dynamic spindle rotation accuracy pick-up unit, preferably, described current vortex sensor comprises: described current vortex sensor 1 is two, described two current vortex sensor 1 quadrature arrangement, on main shaft detecting core shaft 8 telescopic mounting frame for sensor 5 in the radial direction, are respectively used to obtain the directions X of main shaft 7 and the Y-direction displacement signal of beating.
Solve the problem that radial beat eccentricity that traditional contact-type detection cannot be under the high dynamical state of main shaft and rotating accuracy detect, for improving main shaft dynamic accuracy, provide structural design data.
Described dynamic spindle rotation accuracy pick-up unit, preferred, comprising: current vortex sensor 1 coil overall diameter φ=6mm, the detection faces 0.5mm of current vortex sensor 1 tip-to-face distance main shaft detecting core shaft 8, and in range, carry out multiple point distance measurement calibration.
By the current vortex sensor mounting distance of definite 0.5mm, and in range, carry out multiple point distance measurement calibration, can collect and detect accurately data.
Described dynamic spindle rotation accuracy pick-up unit, preferably, also comprises the current vortex sensor sinusoidal excitation signal source of precise and stable characteristic frequency.
Described dynamic spindle rotation accuracy pick-up unit, preferably, on described main shaft detecting core shaft 8, calibrating reference point is reflective pad pasting 3, described reflective photoelectric sensor is according to the detection periphery absolute position reference point of the position acquisition main shaft detecting core shaft of the reflective pad pasting 3 of main shaft, each using position reference point as detection rotating speed turns the initial reference point of pulse signal, according to initial reference point, determine the absolute collection position that detects uniform 72 collection points on periphery, the system of being convenient to is sent the collection starting impulse of corresponding collection point.Reference point its feature in absolute position detects one and turns pulse signal function, so this signal is again as rotary speed detecting signal.
Described dynamic spindle rotation accuracy pick-up unit, preferably, described embedded system is processed device and is comprised: on described main shaft detecting core shaft 8, calibrating reference point is reflective pad pasting 3, described reflective photoelectric sensor is according to the detection periphery absolute position reference point of the position acquisition main shaft detecting core shaft of the reflective pad pasting 3 of main shaft, each using position reference point as detection rotating speed turns the initial reference point of pulse signal, according to initial reference point, determine the absolute collection position that detects uniform 72 collection points on periphery, limited by A/D slewing rate, collection point closeness can and detect resolving accuracy according to the speed of mainshaft and require to set adjustment in test parameter.
Described dynamic spindle rotation accuracy pick-up unit, preferably, described embedded system is processed device and is comprised: FPGA circuit, two high-speed a/d converters, storer, flush bonding processor, touch liquid crystal screen and data Peripheral Interface, wherein X-direction current vortex sensor is connected respectively two high-speed a/d converters with Y-direction current vortex sensor signal, the sinusoidal excitation detection signal variable that X-direction current vortex sensor and Y-direction current vortex sensor are produced amplifies through binary channels respectively, detection, after after programme-controlled gain advance signal amplification conditioning, input respectively two high-speed a/d converters, two high-speed a/d converters are connected with flush bonding processor, reflective photoelectric sensor connects Schmidt's shaping buffer circuit, described Schmidt's shaping buffer circuit connects flush bonding processor interface through FPGA circuit, flush bonding processor arranges memory stores detection signal data, flush bonding processor arranges data Peripheral Interface connection external unit data is transmitted, and the data connection touch liquid crystal screen of flush bonding processor institute record analysis is shown, by touch liquid crystal, shield and systematic parameter is set and control system is moved.
By the resulting data of above-mentioned instrument and waveform, by touch liquid crystal, shield and be shown to user, make collection situation and the waveform character of the understanding data that user can be more visual and clear, and dynamic main shaft diameter is jumped to pick-up unit and adjust calibration.
Described dynamic spindle rotation accuracy pick-up unit, preferably, described touch liquid crystal screen comprises: described touch liquid crystal screen connects flush bonding processor, by dynamic tracing display major axis X, Y-direction diameter run-out waveform and amplitude and rotating speed, and by flush bonding processor matching main shaft absolute position rotating accuracy graph of errors.
In sum, owing to having adopted technique scheme, the invention has the beneficial effects as follows: solved the problem that radial beat eccentricity that traditional contact-type detection cannot be under the high dynamical state of main shaft and main shaft absolute position rotating accuracy detect, for improving main shaft dynamic accuracy, provide structural design data.Dynamically spindle rotation accuracy pick-up unit has adopted the equidistant segment data acquisition technique of circumference, with Duan Weidian judgement displacement.After time domain distributes acquisition pulse to start, carry out N continuous time and gather, N collection finishes rear wait and gathers starting impulse next distribution.Segment data continuous acquisition technology is beneficial to and realizes data filtering preferred process, guarantees to extract the precision of data.
Be particularly suitable for grinding machine tool, the checking of dynamic accuracy of the precision high speed chief axis of the plant equipment such as high-speed main spindle machining center and basis research and development test, for the detection record exact instrument that a kind of easy operating is provided is manufactured in the research and development of high precision (precision) machine tool.The technology of the present invention purposes is comparatively extensive, and has harvester simple installation and the high feature of processing safety, and use, easy to carry, has its promotional value.Adopt reflective photoelectric sensor mode to obtain data acquisition POS INT point on circumference, have the advantages that harvester simple installation and processing safety are high.The technology has adopted circumference two dimension absolute position pointwise acquisition technique, can matching rotating accuracy graph of errors, contribute to analyze main shaft dynamically frequency domain distribution of amplitudes and turn error characteristic at a high speed, optimizing structure design.
Accompanying drawing explanation
Fig. 1 is the dynamic spindle rotation accuracy pick-up unit of the present invention sensor fixing structure schematic diagram;
Fig. 2 is the dynamic spindle rotation accuracy pick-up unit of the present invention installation of sensors A-A direction schematic diagram;
Fig. 3 is the dynamic spindle rotation accuracy structure of the detecting device of the present invention theory diagram.
Embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, only for explaining the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention, it will be appreciated that, term " longitudinally ", " laterally ", " on ", orientation or the position relationship of the indication such as D score, 'fornt', 'back', " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward " be based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, rather than indicate or imply that the device of indication or element must have specific orientation, with specific orientation, construct and operation, therefore can not be interpreted as limitation of the present invention.
In description of the invention, unless otherwise prescribed and limit, it should be noted that, term " installation ", " being connected ", " connection ", " connection " should be interpreted broadly, for example, can be mechanical connection or electrical connection, also can be the connection of two element internals, can be to be directly connected, and also can indirectly be connected by intermediary, for the ordinary skill in the art, can understand as the case may be the concrete meaning of above-mentioned term.
The present invention has adopted current vortex sensor as microspur variation sensing device, completes contactless displacement signals collecting; Because current vortex sensor and test point are contactless state, and meet and detect the requirement of target velocity characteristic response, avoided the added influence that under motion state, contact friction brings, so measurement data true and accurate solves conventional instrument measuring technique Detection task in the cards hardly.The technology is integrated into Embedded micro-system by signal amplification, data acquisition, data processing etc.The equidistant two-dimentional collection signal of circumference is fitted to rotating accuracy graph of errors, print and provide examining report, realize the data acquisition and the data analysis technique that detect high dynamically main shaft diameter run-out and rotating accuracy.
As shown in Figure 1, a kind of dynamic main shaft absolute position rotating accuracy detecting device, comprise: at least two current vortex sensors 1, reflective photoelectric sensor 2 and embedded systems are processed device, described current vortex sensor 1 is processed device through signal amplification circuit with FPGA circuit and described embedded system respectively with reflective photoelectric sensor 2 and is connected
Described reflective photoelectric sensor 2 is arranged on described main shaft detecting core shaft 8 fixed cover 5 in the radial direction, described reflective photoelectric sensor 2 is relative with the position of calibrating reference point on described main shaft detecting core shaft 8, for obtaining the absolute position one of calibrating reference point on described main shaft detecting core shaft 8, turn pulse signal and described position one is turned to pulse signal and after FPGA processing of circuit, be transferred to described embedded system and process device, described embedded system is processed device and according to described position signalling, described main shaft detecting core shaft 8 is calibrated and arranged the diameter run-out data acquisition location point of described main shaft detecting core shaft 8, the collection starting impulse signal of its data acquisition location point turns recurrence interval calculating by FPGA circuit according to one and produces, the collection starting impulse signal enabling 2 passage high-speed a/d circuit of the data acquisition location point that FPGA circuit distributes complete analog to digital conversion, main shaft 7 is wider than main shaft detecting core shaft 8, main shaft 7 outsides are coated spindle jacket 6, spindle jacket 6 is locked along spindle jacket 6 axial directions through fixed cover 5 by some trip bolts 4, detection faces Y-direction (or X-direction) current vortex sensor of the coated spindle jacket 6 of fixed cover 5 and fixing some current vortex sensors 1 and reflective photoelectric sensor 2 main shaft detecting core shafts faces direction reflective photoelectric sensor 2 is installed, the reflective pad pasting 3 of a main shaft is pasted in the corresponding reflective photoelectric sensor of detection faces 2 positions at main shaft detecting core shaft, obtain the detection faces absolute position reference point signal of main shaft detecting core shaft.
The geometric accuracy of main shaft detecting core shaft 8 must meet accuracy of detection class requirement.
Adopt FPGA circuit to work in coordination with in real time and process, can further improve system response time, to obtain higher detection degree of accuracy under the high current intelligence of main shaft.
The present invention has adopted the equidistant segment data acquisition technique of circumference, after time domain distributes acquisition pulse to start, carries out N continuous time and gathers, and N collection finishes rear wait and gather starting impulse next distribution.Segmentation image data is put into buffer area, then concentrate and carry out software filtering processing, in conjunction with median method and the method for average, extract segment data, obtain higher detection degree of accuracy.
Described current vortex sensor 1 axis is arranged on main shaft detecting core shaft 8 fixed cover 5 in the radial direction, the displacement signal be transferred to described embedded system and process device of beating for the described collection position point that obtains described main shaft detecting core shaft 8 in respective radial direction, described embedded system is processed device to described diameter run-out data analysis, wherein, described current vortex sensor 1 and reflective photoelectric sensor 2 are contactless state with the check point of main shaft detecting core shaft.
Solve the problem that radial beat eccentricity that traditional contact-type detection cannot be under the high dynamical state of main shaft and rotating accuracy detect, for improving main shaft dynamic accuracy, provide structural design data.
Adopted current vortex sensor, be contactless state with test point, realized the accurate main shaft under high-speed motion state is carried out to diameter run-out detection.
Fig. 2 is the cut-open view of A-A direction in Fig. 1, can show more clearly the position relationship of each parts.
Described dynamic main shaft diameter is to jitter detection apparatus, preferably, described current vortex sensor comprises: with two current vortex sensor 1 axis, make quadrature arrangement in main shaft detecting core shaft 8 radial direction, obtain respectively the directions X of main shaft 7 and the Y-direction displacement signal of beating, the directions X of the main shaft detecting core shaft 8 that current vortex sensor detects and the Y-direction directions X of displacement signal and main shaft 7 and the Y-direction displacement signal of beating of beating is identical.
Solve traditional contact-type detection and cannot measure the problem of the radial beat eccentricity of main shaft under height is dynamic, for improving main shaft dynamic accuracy, provide structural design data.
Described dynamic spindle rotation accuracy pick-up unit, preferred, comprising: the detection faces 0.5mm of current vortex sensor 1 coil overall diameter φ=6mm current vortex sensor 1 tip-to-face distance main shaft detecting core shaft 8.
Resolution: 0.0001mm;
Amplitude range: peak-to-peak value=0.2mm;
Response speed: rotating speed of target Max:15000r/min;
By the mounting distance of definite 0.5mm, and in range, carry out multiple point distance measurement calibration, can collect and detect accurately data.
Described dynamic spindle rotation accuracy pick-up unit, preferably, detection faces Y-direction (or X-direction) current vortex sensor of main shaft detecting core shaft faces direction reflective photoelectric sensor 2 is installed, the reflective pad pasting 3 of a main shaft is pasted in the corresponding reflective photoelectric sensor of detection faces 2 positions at main shaft detecting core shaft, obtain the detection faces absolute position reference point signal of main shaft detecting core shaft, reflective pad pasting 3 positions are reference point locations.This signal is as determining that (collection point closeness can and detect resolving accuracy according to the speed of mainshaft and require to arrange adjustment in uniform 72 collection points on detection periphery.) absolute collection position, the system of being convenient to is sent the collection starting impulse of corresponding collection point.Its feature of this signal detects one and turns pulse signal function, so this signal detects pulse counting signal as rotating speed again.When the speed of mainshaft is higher, can consider pasting a no-reflection counterweight pad pasting that acts on balance with reflective pad pasting 3 relative directions.
As shown in Figure 3, described dynamic spindle rotation accuracy pick-up unit, preferably, described embedded system device comprises: FPGA circuit, high-speed a/d converter, storer, 32 flush bonding processors, touch liquid crystal screen and data Peripheral Interface, wherein X-direction current vortex sensor is connected high-speed a/d converter with Y-direction current vortex sensor, the sinusoidal excitation detection variable signal (main shaft dynamic displacement) that X-direction current vortex sensor and Y-direction current vortex sensor are inducted amplifies through 2 passages, detection, programme-controlled gain advance signal is sent into respectively 2 high-speed a/d converters after amplifying conditioning, adopt gain-programmed amplifier to be convenient to adopt adjustment System parameter to change amplifier gain according to signal amplitude size (displacement) and reach the object that changes range multiplying power, make operation more easy.
Adopt 2 A/D converters to work alone and can further improve system processing speed than carrying out acquisition time with 1 A/D converter, the technical requirement detecting to meet high-speed main spindle high precision.
High-speed a/d converter will obtain data and hand over flush bonding processor computing; Reflective photoelectric sensor connects schmidt shaping circuit and carries out signal processing, with this, obtain the extremely steep pulse of good noiseproof feature and forward position, with absolute reference position accurately on repeated obtain periphery, guarantee the absolute collection position accuracy of 72 collection points uniform on circumference collection face; For guaranteeing 72 even being distributed on main shaft detecting core shaft circumference anchor ring of data collection position point, the collection starting impulse signal of its 72 data collection position points turns recurrence interval time domain Distribution Calculation by FPGA circuit according to 1 and produces.Each cycle is carried out refresh process, avoids cumulative effect.Adopt FPGA circuit to carry out associated treatment, can further improve system response time, the detection degree of accuracy running up under state to obtain main shaft.Collection point closeness also can and detect the actual conditions such as resolving accuracy requirement according to the speed of mainshaft adjustment is set.
While carrying out polar coordinates matching computing under high speed conditions, should consider the bias effect of comprehensive retardation time to absolute position.
Described Schmidt's shaping buffer circuit connects FPGA circuit, connects embedded system again.Flush bonding processor arranges memory stores detection signal data, flush bonding processor arranges data Peripheral Interface connection external unit data is transmitted, and the data connection touch liquid crystal screen of flush bonding processor institute record analysis is shown, and touch liquid crystal shields that systematic parameter is set and control system is moved by operating.
By the resulting data of above-mentioned instrument, by touch liquid crystal, shield and be shown to user, make collection situation and the main shaft dynamic waveform of the understanding data that user can be more visual and clear, and dynamic main shaft diameter is adjusted to calibration to jitter detection apparatus.
Described dynamic spindle rotation accuracy pick-up unit, preferred, described storer comprises: SDRAM and FLASH.Reflective photoelectric sensor connects schmidt shaping circuit and carries out signal processing, with this, obtain the extremely steep pulse of good noiseproof feature and forward position, with absolute reference position accurately on repeated obtain periphery, guarantee the absolute collection position accuracy of 72 collection points uniform on circumference collection face; Described Schmidt's shaping buffer circuit connects FPGA circuit.FPGA circuit connects flush bonding processor.Flush bonding processor is sent to corresponding SDRAM and FLASH by detection data, by SDRAM and FLASH, carries out calling of data.
Use the detection data of described memory stores to carry out safely and effectively follow-up analyzing and processing, make described device stable operation.
Described dynamic spindle rotation accuracy pick-up unit, preferred, described data Peripheral Interface comprises: jtag interface, USB interface, RS232 interface and SD card interface.Diameter run-out data after detection are imported into after flush bonding processor, by USB interface, RS232 interface and SD card interface, be connected with external unit, each interface described above is according to transmission conditions, and the model of external unit medium is different, by user, is selected to install.Jtag interface is for system debug.
Use described data Peripheral Interface transmission data, play effect and the extension storage capacity to peripheral hardware transmission data of safety and stability.
Described dynamic spindle rotation accuracy pick-up unit, preferably, described touch liquid crystal screen comprises: described touch liquid crystal screen connects embedded system, by dynamic tracing display major axis X, Y-direction radial beat eccentricity waveform and amplitude and rotating speed, and by flush bonding processor matching main shaft absolute position rotating accuracy graph of errors.
Described dynamic spindle rotation accuracy pick-up unit, preferred, described analogue amplifier, photoelectrical coupler, digital circuit, A/D change-over circuit are all high-speed type device, to meet the requirement of detection system response speed.
In sum, owing to having adopted technique scheme, the beneficial effect of the technology is: solved the problem that radial beat eccentricity that traditional contact-type detection cannot be under the high dynamical state of main shaft and absolute position rotating accuracy detect, for improving main shaft dynamic accuracy, provide structural design data.Dynamically spindle rotation accuracy pick-up unit has adopted the equidistant segment data acquisition technique of circumference, with Duan Weidian judgement displacement.After time domain distributes acquisition pulse to start, carry out N continuous time and gather, N collection finishes rear wait and gathers starting impulse next distribution.Segment data continuous acquisition technology is beneficial to and realizes data filtering preferred process, guarantees to extract the precision of data.
Be particularly suitable for grinding machine tool, the checking of dynamic accuracy of the precision high speed chief axis of the plant equipment such as high-speed main spindle machining center and basis research and development test, for the research and development of high precision (precision) machine tool, manufacture a kind of detection record exact instrument of easy operating is provided, and there is harvester simple installation and the high feature of processing safety.The technology purposes is comparatively extensive, and use, easy to carry, has its promotional value.
In the description of this instructions, the description of reference term " a kind of preferred implementation ", " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present invention or example in conjunction with specific features, structure, material or the feature of this embodiment or example description.In this manual, the schematic statement of above-mentioned term is not necessarily referred to identical embodiment or example.And the specific features of description, structure, material or feature can be with suitable mode combinations in any one or more embodiment or example.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: in the situation that not departing from principle of the present invention and aim, can carry out multiple variation, modification, replacement and modification to these embodiment, scope of the present invention is limited by claim and equivalent thereof.
Claims (6)
1. a dynamic spindle rotation accuracy pick-up unit, it is characterized in that, comprise: telescopic mounting frame for sensor (5), at least two current vortex sensors (1), reflective photoelectric sensor (2) and embedded system are processed device, described current vortex sensor (1) is processed device through signal amplifier with fpga logic circuit and described embedded system respectively with reflective photoelectric sensor (2) and is connected;
Described reflective photoelectric sensor (2) is arranged on described main shaft detecting core shaft (8) telescopic mounting frame for sensor (5) in the radial direction, described reflective photoelectric sensor (2) is relative with the position of the upper calibration of described main shaft detecting core shaft (8) reference point, be used for obtaining the upper absolute position one of calibrating reference point of described main shaft detecting core shaft (8) and turn pulse signal, this signal after shaping pulse as the reference point pulse signal of absolute position, after FPGA circuit carries out calculation process, be transferred to described embedded system and process device, described embedded system is processed device, according to described position signalling, described main shaft detecting core shaft (8) is carried out to the circle distribution diameter run-out data acquisition location point that speed is differentiated verification and described main shaft detecting core shaft (8) is set, the collection starting impulse signal of its data acquisition location point turns recurrence interval time domain by FPGA circuit according to one and distributes setting value to calculate generation, and the P-pulse feature of its reference point detects one and turns pulse signal function, so this signal is again as rotary speed detecting signal,
Described current vortex sensor (1) axis is arranged on main shaft detecting core shaft (8) fixed cover (5) in the radial direction, the beat displacement signal be transferred to described embedded system process device of the described collection position point that is used for obtaining described main shaft detecting core shaft (8) in respective radial direction, described embedded system is processed device to described diameter run-out data analysis, wherein, described current vortex sensor (1) and reflective photoelectric sensor (2) are contactless state with the check point of main shaft detecting core shaft.
2. dynamic spindle rotation accuracy pick-up unit according to claim 1, it is characterized in that, described current vortex sensor (1) is two, described two current vortex sensors (1) quadrature arrangement is upper in main shaft detecting core shaft (8) telescopic mounting frame for sensor (5) in the radial direction, is respectively used to obtain the directions X of main shaft (7) and the Y-direction displacement signal of beating.
3. dynamic spindle rotation accuracy pick-up unit according to claim 1, it is characterized in that, comprise: current vortex sensor (1) coil overall diameter φ=6mm, the detection faces 0.5mm of current vortex sensor (1) tip-to-face distance main shaft detecting core shaft (8), and in range, carry out multiple point distance measurement calibration calibrating.
4. dynamic spindle rotation accuracy pick-up unit according to claim 1, it is characterized in that, the upper calibration of described main shaft detecting core shaft (8) reference point is reflective pad pasting (3), described reflective photoelectric sensor is according to the detection periphery absolute position reference point of the position acquisition main shaft detecting core shaft of the reflective pad pasting of main shaft (3), each using position reference point as detection rotating speed turns the initial reference point of pulse signal, determines the absolute collection position that detects uniform 72 collection points on periphery according to initial reference point; Limited by A/D slewing rate, collection point closeness can and detect resolving accuracy according to the speed of mainshaft and require to set adjustment in test parameter.
5. dynamic spindle rotation accuracy pick-up unit according to claim 1, it is characterized in that, described embedded system is processed device and is comprised: FPGA circuit, two high-speed a/d converters, storer, flush bonding processor, touch liquid crystal screen and data Peripheral Interface, wherein X-direction current vortex sensor is connected respectively two high-speed a/d converters with Y-direction current vortex sensor signal, the sinusoidal excitation detection signal variable that X-direction current vortex sensor and Y-direction current vortex sensor are produced amplifies through binary channels respectively, detection, programme-controlled gain advance signal is inputted respectively two high-speed a/d converters after amplifying conditioning, two high-speed a/d converters are connected with flush bonding processor, reflective photoelectric sensor connects Schmidt's shaping buffer circuit, described Schmidt's shaping buffer circuit connects flush bonding processor interface through FPGA circuit, flush bonding processor arranges memory stores detection signal data, flush bonding processor arranges data Peripheral Interface connection external unit data is transmitted, and the data connection touch liquid crystal screen of flush bonding processor institute record analysis is shown, by touch liquid crystal, shield and systematic parameter is set and control system is moved.
6. dynamic spindle rotation accuracy pick-up unit according to claim 5, it is characterized in that, described touch liquid crystal screen comprises: described touch liquid crystal screen connects flush bonding processor, by dynamic tracing display major axis X, Y-direction diameter run-out waveform and amplitude and rotating speed, and process matching demonstration main shaft absolute position rotating accuracy graph of errors by embedded system device.
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Cited By (16)
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| CN104942655A (en) * | 2015-07-20 | 2015-09-30 | 徐文欢 | Main shaft rotary error accuracy testing device |
| CN105115729A (en) * | 2015-09-29 | 2015-12-02 | 爱佩仪中测（成都）精密仪器有限公司 | Spindle deformation analysis device |
| CN105108582A (en) * | 2015-09-29 | 2015-12-02 | 爱佩仪中测（成都）精密仪器有限公司 | Device beneficial to shortening thermal deformation analyzing cycle of machine tool spindle |
| CN105108581A (en) * | 2015-09-29 | 2015-12-02 | 爱佩仪中测（成都）精密仪器有限公司 | Numerically-controlled machine tool spindle rotation precision verifying unit |
| CN105181319A (en) * | 2015-09-29 | 2015-12-23 | 爱佩仪中测（成都）精密仪器有限公司 | Spindle dynamic error and thermal deformation analyzer |
| CN105222694A (en) * | 2015-11-04 | 2016-01-06 | 上海电气电站设备有限公司 | The device and method that the rotating shaft of a kind of non-contact measurement large deflection is beated |
| CN106168464A (en) * | 2016-07-10 | 2016-11-30 | 哈尔滨理工大学 | A kind of main shaft dynamic rotation method for testing precision based on machine vision |
| CN106826394A (en) * | 2017-02-26 | 2017-06-13 | 邵阳学院 | Lathe main shaft diameter is to glitch detection method and device under machining state |
| CN108873804A (en) * | 2017-05-16 | 2018-11-23 | 发那科株式会社 | For swinging the display device and system of processing of cutting |
| CN109781042A (en) * | 2018-12-21 | 2019-05-21 | 西安交通大学 | A kind of spindle rotation error measuring device |
| CN111457841A (en) * | 2020-06-05 | 2020-07-28 | 上海电气电站设备有限公司 | Continuous measuring method for runout of rotating body and centering measuring method for rotating body |
| CN112846938A (en) * | 2021-01-05 | 2021-05-28 | 北京信息科技大学 | Main shaft rotation precision degradation traceability system under cutting working condition |
| CN113250976A (en) * | 2021-05-24 | 2021-08-13 | 合肥工业大学 | Device and method for detecting and controlling radial runout of main shaft of canned motor pump and canned motor pump |
| CN114070000A (en) * | 2021-11-30 | 2022-02-18 | 浙江水泵总厂有限公司 | Brushless synchronous generator structure and generator with same |
| CN114152237A (en) * | 2021-11-26 | 2022-03-08 | 珠海格力电器股份有限公司 | Monitoring device based on radial error of main shaft |
| CN115541225A (en) * | 2022-10-29 | 2022-12-30 | 通用技术集团机床工程研究院有限公司 | Online precision analysis method and system for main shaft of ultra-precision machine tool |
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| CN104942655A (en) * | 2015-07-20 | 2015-09-30 | 徐文欢 | Main shaft rotary error accuracy testing device |
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| CN105115729A (en) * | 2015-09-29 | 2015-12-02 | 爱佩仪中测（成都）精密仪器有限公司 | Spindle deformation analysis device |
| CN105108582A (en) * | 2015-09-29 | 2015-12-02 | 爱佩仪中测（成都）精密仪器有限公司 | Device beneficial to shortening thermal deformation analyzing cycle of machine tool spindle |
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| CN106826394B (en) * | 2017-02-26 | 2018-12-28 | 邵阳学院 | Lathe main shaft diameter is to glitch detection method and device under machining state |
| CN106826394A (en) * | 2017-02-26 | 2017-06-13 | 邵阳学院 | Lathe main shaft diameter is to glitch detection method and device under machining state |
| CN108873804B (en) * | 2017-05-16 | 2020-07-07 | 发那科株式会社 | Display device for swing cutting and machining system |
| CN108873804A (en) * | 2017-05-16 | 2018-11-23 | 发那科株式会社 | For swinging the display device and system of processing of cutting |
| CN109781042A (en) * | 2018-12-21 | 2019-05-21 | 西安交通大学 | A kind of spindle rotation error measuring device |
| CN111457841A (en) * | 2020-06-05 | 2020-07-28 | 上海电气电站设备有限公司 | Continuous measuring method for runout of rotating body and centering measuring method for rotating body |
| CN112846938B (en) * | 2021-01-05 | 2022-09-16 | 北京信息科技大学 | Main shaft rotation precision degradation traceability system under cutting working condition |
| CN112846938A (en) * | 2021-01-05 | 2021-05-28 | 北京信息科技大学 | Main shaft rotation precision degradation traceability system under cutting working condition |
| CN113250976A (en) * | 2021-05-24 | 2021-08-13 | 合肥工业大学 | Device and method for detecting and controlling radial runout of main shaft of canned motor pump and canned motor pump |
| CN113250976B (en) * | 2021-05-24 | 2022-08-30 | 合肥工业大学 | Device and method for detecting and controlling radial runout of main shaft of canned motor pump and canned motor pump |
| CN114152237A (en) * | 2021-11-26 | 2022-03-08 | 珠海格力电器股份有限公司 | Monitoring device based on radial error of main shaft |
| CN114070000A (en) * | 2021-11-30 | 2022-02-18 | 浙江水泵总厂有限公司 | Brushless synchronous generator structure and generator with same |
| CN115541225A (en) * | 2022-10-29 | 2022-12-30 | 通用技术集团机床工程研究院有限公司 | Online precision analysis method and system for main shaft of ultra-precision machine tool |
| CN115541225B (en) * | 2022-10-29 | 2023-09-05 | 通用技术集团机床工程研究院有限公司 | Method and system for analyzing online precision of spindle of ultra-precise machine tool |
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