CN103636295A - 与电路中断器或其它装置一起使用的总线设备 - Google Patents
与电路中断器或其它装置一起使用的总线设备 Download PDFInfo
- Publication number
- CN103636295A CN103636295A CN201280030096.5A CN201280030096A CN103636295A CN 103636295 A CN103636295 A CN 103636295A CN 201280030096 A CN201280030096 A CN 201280030096A CN 103636295 A CN103636295 A CN 103636295A
- Authority
- CN
- China
- Prior art keywords
- connection element
- bus
- layer
- substrate
- additional connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 239000004020 conductor Substances 0.000 claims abstract description 65
- 239000000463 material Substances 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims description 21
- 230000007613 environmental effect Effects 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 238000002955 isolation Methods 0.000 description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/015—Boards, panels, desks; Parts thereof or accessories therefor
- H02B1/04—Mounting thereon of switches or of other devices in general, the switch or device having, or being without, casing
- H02B1/056—Mounting on plugboards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Connection Or Junction Boxes (AREA)
- Combinations Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Gas-Insulated Switchgears (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161499404P | 2011-06-21 | 2011-06-21 | |
US61/499,404 | 2011-06-21 | ||
PCT/US2012/043463 WO2012177826A1 (en) | 2011-06-21 | 2012-06-21 | Bus apparatus for use with circuit interrupters or other devices |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103636295A true CN103636295A (zh) | 2014-03-12 |
CN103636295B CN103636295B (zh) | 2017-08-29 |
Family
ID=47422934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280030096.5A Active CN103636295B (zh) | 2011-06-21 | 2012-06-21 | 与电路中断器或其它装置一起使用的总线设备 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9408292B2 (zh) |
EP (1) | EP2724596B1 (zh) |
CN (1) | CN103636295B (zh) |
BR (1) | BR112013031749B1 (zh) |
CA (1) | CA2837212C (zh) |
WO (1) | WO2012177826A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106294905A (zh) * | 2015-06-01 | 2017-01-04 | 鸿富锦精密电子(郑州)有限公司 | 印刷电路板布线系统及方法 |
CN110062986A (zh) * | 2016-12-19 | 2019-07-26 | Abb瑞士股份有限公司 | 制造多相汇流排的方法和用于执行该方法的布置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014011243A1 (en) * | 2012-07-12 | 2014-01-16 | Eaton Corporation | Load buss assembly and method of manufacturing the same |
JP6644730B2 (ja) * | 2017-04-12 | 2020-02-12 | 矢崎総業株式会社 | 積層配索体の導体接続構造 |
US10356926B1 (en) * | 2017-12-28 | 2019-07-16 | Deere & Company | Electronic assembly with enhanced high power density |
JP7528364B2 (ja) | 2021-06-11 | 2024-08-05 | デュップリッコ ディー. オー. オー. | 積層電気回路の自動化された組立て又は分解のために使用されるキット |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6002580A (en) * | 1996-12-09 | 1999-12-14 | Power Distribution Products International | Circuit breaker power distribution panel |
US20020168882A1 (en) * | 2001-04-27 | 2002-11-14 | Akihiko Chiriku | Junction box for vehicle |
US20050243527A1 (en) * | 2004-04-29 | 2005-11-03 | Harris Corporation | Printed wiring board with enhanced structural integrity |
CN101237102A (zh) * | 2007-12-13 | 2008-08-06 | 西南交通大学 | 用于磁悬浮列车悬浮斩波器的层叠功率母线排 |
US20090040691A1 (en) * | 2007-08-06 | 2009-02-12 | Abb Inc. | Panelboard |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4689718A (en) * | 1986-04-04 | 1987-08-25 | United Technologies Automotive, Inc. | Programmable junction box |
EP0701514B1 (en) * | 1993-06-09 | 1997-08-06 | UNITED TECHNOLOGIES AUTOMOTIVE, Inc. | Hybrid junction box |
US5715135A (en) * | 1996-08-12 | 1998-02-03 | General Motors Corporation | Electrical distribution center with two-piece insulation assembly |
WO1998018180A1 (en) * | 1996-10-24 | 1998-04-30 | Thomas & Betts International, Inc. | Power distribution center |
US6008982A (en) * | 1998-05-20 | 1999-12-28 | General Motors Corporation | Low profile electrical distribution center and method of making a bus subassembly therefor |
EP1142079B1 (en) * | 1998-12-17 | 2003-03-19 | Spd Technologies Inc. | Power node control center |
JP2000299911A (ja) | 1999-04-13 | 2000-10-24 | Yazaki Corp | 電気接続箱 |
US20110096470A1 (en) | 2006-06-01 | 2011-04-28 | Joseph Scott Dixon | Systems, devices, and methods for distributing electrical energy |
US8319372B2 (en) | 2006-09-22 | 2012-11-27 | Siemens Industry, Inc. | EIB protocol in an integrated power distribution system |
US7955133B2 (en) * | 2008-04-23 | 2011-06-07 | Littelfuse, Inc. | Flexible power distribution module |
KR101708927B1 (ko) * | 2009-10-09 | 2017-02-21 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 내열성이 향상된 전방향족 액정 폴리에스테르 수지 컴파운드 및 그의 제조방법 |
US8094436B2 (en) | 2010-03-29 | 2012-01-10 | Eaton Corporation | Plug-in circuit breaker assembly |
-
2012
- 2012-06-21 BR BR112013031749-3A patent/BR112013031749B1/pt active IP Right Grant
- 2012-06-21 CN CN201280030096.5A patent/CN103636295B/zh active Active
- 2012-06-21 CA CA2837212A patent/CA2837212C/en active Active
- 2012-06-21 EP EP12802656.4A patent/EP2724596B1/en active Active
- 2012-06-21 US US14/123,857 patent/US9408292B2/en active Active
- 2012-06-21 WO PCT/US2012/043463 patent/WO2012177826A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6002580A (en) * | 1996-12-09 | 1999-12-14 | Power Distribution Products International | Circuit breaker power distribution panel |
US20020168882A1 (en) * | 2001-04-27 | 2002-11-14 | Akihiko Chiriku | Junction box for vehicle |
US20050243527A1 (en) * | 2004-04-29 | 2005-11-03 | Harris Corporation | Printed wiring board with enhanced structural integrity |
US20090040691A1 (en) * | 2007-08-06 | 2009-02-12 | Abb Inc. | Panelboard |
CN101796700A (zh) * | 2007-08-06 | 2010-08-04 | Abb公司 | 配电板 |
CN101237102A (zh) * | 2007-12-13 | 2008-08-06 | 西南交通大学 | 用于磁悬浮列车悬浮斩波器的层叠功率母线排 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106294905A (zh) * | 2015-06-01 | 2017-01-04 | 鸿富锦精密电子(郑州)有限公司 | 印刷电路板布线系统及方法 |
CN110062986A (zh) * | 2016-12-19 | 2019-07-26 | Abb瑞士股份有限公司 | 制造多相汇流排的方法和用于执行该方法的布置 |
Also Published As
Publication number | Publication date |
---|---|
CN103636295B (zh) | 2017-08-29 |
CA2837212C (en) | 2019-10-01 |
US20140110154A1 (en) | 2014-04-24 |
US9408292B2 (en) | 2016-08-02 |
CA2837212A1 (en) | 2012-12-27 |
BR112013031749A2 (pt) | 2017-08-15 |
WO2012177826A1 (en) | 2012-12-27 |
BR112013031749B1 (pt) | 2021-10-26 |
EP2724596A1 (en) | 2014-04-30 |
EP2724596A4 (en) | 2014-11-19 |
EP2724596B1 (en) | 2019-10-16 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20151014 Address after: Texas, USA Applicant after: Rebino LLC Address before: Ohio, USA Applicant before: Eaton Corp. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: American Texas Patentee after: Safran Electric&Power USA LLC Country or region after: U.S.A. Address before: American Texas Patentee before: Rebino LLC Country or region before: U.S.A. |
|
CP03 | Change of name, title or address |