CN103635264B - 超声换能组件及其制造方法 - Google Patents

超声换能组件及其制造方法 Download PDF

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Publication number
CN103635264B
CN103635264B CN201280031923.2A CN201280031923A CN103635264B CN 103635264 B CN103635264 B CN 103635264B CN 201280031923 A CN201280031923 A CN 201280031923A CN 103635264 B CN103635264 B CN 103635264B
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CN
China
Prior art keywords
layer
ultrasound transducer
electrode layer
transducer element
piezoelectric
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Active
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CN201280031923.2A
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English (en)
Chinese (zh)
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CN103635264A (zh
Inventor
W·苏多尔
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Koninklijke Philips NV
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Koninklijke Philips NV
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Publication of CN103635264A publication Critical patent/CN103635264A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Gynecology & Obstetrics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Physics & Mathematics (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Manufacturing & Machinery (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
CN201280031923.2A 2011-06-27 2012-06-26 超声换能组件及其制造方法 Active CN103635264B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161501307P 2011-06-27 2011-06-27
US61/501,307 2011-06-27
PCT/IB2012/053216 WO2013001448A1 (en) 2011-06-27 2012-06-26 Ultrasound transducer assembly and method of manufacturing the same

Publications (2)

Publication Number Publication Date
CN103635264A CN103635264A (zh) 2014-03-12
CN103635264B true CN103635264B (zh) 2016-06-01

Family

ID=46704971

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280031923.2A Active CN103635264B (zh) 2011-06-27 2012-06-26 超声换能组件及其制造方法

Country Status (5)

Country Link
US (1) US9293690B2 (OSRAM)
EP (1) EP2723506B1 (OSRAM)
JP (1) JP6388536B2 (OSRAM)
CN (1) CN103635264B (OSRAM)
WO (1) WO2013001448A1 (OSRAM)

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DE102012206875B4 (de) * 2012-04-25 2021-01-28 Robert Bosch Gmbh Verfahren zum Herstellen eines hybrid integrierten Bauteils und entsprechendes hybrid integriertes Bauteil
US9738650B2 (en) 2013-01-29 2017-08-22 Aptinyx Inc. Spiro-lactam NMDA receptor modulators and uses thereof
SI2951183T1 (sl) 2013-01-29 2019-07-31 Aptinyx Inc. Spiro-laktam NMDA receptorski modulatorji in njihove uporabe
CN105308049A (zh) 2013-01-29 2016-02-03 阿普廷伊克斯股份有限公司 螺-内酰胺nmda受体调节剂及其用途
WO2014120784A1 (en) 2013-01-29 2014-08-07 Naurex, Inc. Spiro-lactam nmda receptor modulators and uses thereof
WO2014120786A1 (en) 2013-01-29 2014-08-07 Naurex, Inc. Spiro-lactam nmda receptor modulators and uses thereof
CN105705255B (zh) 2013-11-04 2019-02-15 皇家飞利浦有限公司 单元件超声波换能器的大批量制造
JP6266106B2 (ja) * 2013-11-11 2018-01-24 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 保護された集積回路相互接続を有するロバストな超音波トランスデューサプローブ
CN104916773B (zh) * 2014-03-14 2017-10-20 中国科学院苏州纳米技术与纳米仿生研究所 电致变形薄膜阵列、其制备方法及应用
EP3028772B1 (en) 2014-12-02 2022-12-28 Samsung Medison Co., Ltd. Ultrasonic probe and method of manufacturing the same
KR102406927B1 (ko) * 2014-12-02 2022-06-10 삼성메디슨 주식회사 초음파 프로브 및 그 제조방법
JP6510290B2 (ja) * 2015-03-30 2019-05-08 キヤノンメディカルシステムズ株式会社 超音波プローブ及び超音波診断装置
EP3316791B1 (en) 2015-07-02 2020-08-05 Koninklijke Philips N.V. Multi-mode capacitive micromachined ultrasound transducer and associated devices and systems
WO2017201285A1 (en) 2016-05-19 2017-11-23 Aptinyx Inc. Spiro-lactam nmda receptor modulators and uses thereof
WO2017201283A1 (en) 2016-05-19 2017-11-23 Aptinyx Inc. Spiro-lactam nmda receptor modulators and uses thereof
US10497856B2 (en) * 2016-06-20 2019-12-03 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
JP6712917B2 (ja) * 2016-07-14 2020-06-24 株式会社日立製作所 半導体センサチップアレイ、および超音波診断装置
AU2017306158B2 (en) 2016-08-01 2021-10-14 Aptinyx Inc. Spiro-lactam and bis-spiro-lactam NMDA receptor modulators and uses thereof
JP7032378B2 (ja) 2016-08-01 2022-03-08 アプティニックス インコーポレイテッド スピロ－ラクタムｎｍｄａ受容体修飾因子及びその使用
SG11201900554YA (en) 2016-08-01 2019-02-27 Aptinyx Inc Spiro-lactam nmda modulators and methods of using same
MX383650B (es) 2016-08-01 2025-03-14 Aptinyx Inc Moduladores del receptor nmda espiro-lactam y uso de los mismos.
WO2018026763A1 (en) 2016-08-01 2018-02-08 Aptinyx Inc. Spiro-lactam nmda receptor modulators and uses thereof
EP3472430A4 (en) 2016-09-27 2020-01-08 Halliburton Energy Services, Inc. MULTIDIRECTIONAL ULTRASONIC TRANSDUCER FOR DOWNHOLE MEASUREMENTS
WO2018065405A1 (en) * 2016-10-03 2018-04-12 Koninklijke Philips N.V. Transducer arrays with air kerfs for intraluminal imaging
GB2555835B (en) * 2016-11-11 2018-11-28 Novosound Ltd Ultrasound transducer
CN112204031B (zh) 2018-01-31 2024-05-24 元羿生物科技(香港)有限公司 螺-内酰胺nmda受体调节剂及其用途
US11806191B2 (en) 2018-05-21 2023-11-07 General Electric Company Phased array transducers and wafer scale manufacturing for making the same
KR20190143179A (ko) * 2018-06-20 2019-12-30 삼성메디슨 주식회사 초음파프로브 및 그 제조방법
US12012413B2 (en) 2019-11-11 2024-06-18 Tenacia Biotechnology (Hong Kong) Co., Limited Methods of treating painful diabetic peripheral neuropathy
US12156766B2 (en) 2019-11-22 2024-12-03 Novioscan B.V. Robust, simple, and efficiently manufacturable transducer array
CN117917957A (zh) * 2021-09-09 2024-04-23 皇家飞利浦有限公司 具有用于多排换能器阵列的电连接的腔内超声成像组件

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US5774960A (en) * 1993-03-05 1998-07-07 Thomson-Csf Process for manufacturing a multi-element acoustic probe, especially an echograph probe
US5793149A (en) * 1995-07-26 1998-08-11 Francotyp-Postalia Ag & Co. Arrangement for plate-shaped piezoactuators and method for the manufacture thereof
EP0785826B1 (en) * 1994-10-14 1999-02-03 Parallel Design, Inc. Ultrasonic transducer array with apodized elevation focus
CN101069295A (zh) * 2004-10-15 2007-11-07 富士胶卷迪马蒂克斯股份有限公司 具有腔体和压电岛的微机电装置及形成具有压电换能器的装置的方法
CN100398224C (zh) * 2001-09-17 2008-07-02 Ge帕拉莱尔设计公司 换能器的频率和振幅旁瓣缩减
CN101662989A (zh) * 2006-11-03 2010-03-03 研究三角协会 使用挠曲模式压电换能器的增强的超声成像探头

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JP3697200B2 (ja) * 2001-11-07 2005-09-21 アロカ株式会社 超音波探触子
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JP2007158467A (ja) * 2005-11-30 2007-06-21 Toshiba Corp 超音波プローブ及びその製造方法
US7892176B2 (en) 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080315331A1 (en) 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5774960A (en) * 1993-03-05 1998-07-07 Thomson-Csf Process for manufacturing a multi-element acoustic probe, especially an echograph probe
EP0785826B1 (en) * 1994-10-14 1999-02-03 Parallel Design, Inc. Ultrasonic transducer array with apodized elevation focus
US5793149A (en) * 1995-07-26 1998-08-11 Francotyp-Postalia Ag & Co. Arrangement for plate-shaped piezoactuators and method for the manufacture thereof
CN100398224C (zh) * 2001-09-17 2008-07-02 Ge帕拉莱尔设计公司 换能器的频率和振幅旁瓣缩减
CN101069295A (zh) * 2004-10-15 2007-11-07 富士胶卷迪马蒂克斯股份有限公司 具有腔体和压电岛的微机电装置及形成具有压电换能器的装置的方法
CN101662989A (zh) * 2006-11-03 2010-03-03 研究三角协会 使用挠曲模式压电换能器的增强的超声成像探头

Also Published As

Publication number Publication date
CN103635264A (zh) 2014-03-12
WO2013001448A1 (en) 2013-01-03
EP2723506B1 (en) 2017-02-15
JP2014523689A (ja) 2014-09-11
US20140139072A1 (en) 2014-05-22
JP6388536B2 (ja) 2018-09-12
US9293690B2 (en) 2016-03-22
EP2723506A1 (en) 2014-04-30

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