CN103635009A - Yellow polyamidoimide protection film for printed circuit board and manufacturing method thereof - Google Patents
Yellow polyamidoimide protection film for printed circuit board and manufacturing method thereof Download PDFInfo
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- CN103635009A CN103635009A CN201210308257.4A CN201210308257A CN103635009A CN 103635009 A CN103635009 A CN 103635009A CN 201210308257 A CN201210308257 A CN 201210308257A CN 103635009 A CN103635009 A CN 103635009A
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- yellow
- polyamidoimide
- circuit board
- printed circuit
- diaphragm
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Abstract
The invention discloses a yellow polyamidoimide protection film for a printed circuit board and a manufacturing method thereof. According to the invention, a liquid baking yellow polyamidoimide film is sprayed on the portion of the surface of a printed circuit board by an ink jet way, wherein the portion needs to be covered; low-temperature baking is carried out; and then the protection film is directly formed on the surface of the printed circuit board. The provide yellow polyamidoimide protection film can be matched with a reel-to-reel platform type ink-jet device for continuous production; and the protection film having characteristics of ultra-thin property, shielding circuit, good flexibility and pliability, release paper-free property meeting environment protection work requirement, processing chipless generation, and high TG and the like is suitable for a flip phone, a slide phone, a digital camera, a digital shooting machine, a tablet computer and an intelligent mobile phone and the like.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB) that is covered in to play diaphragm and the manufacture method thereof of protection and anti-welding effect, be specifically related to a kind of diaphragm without adhesion agent layer and manufacture method thereof.
Background technology
Small-sized electronic product not only will be to more small-sized, lightweight development, and the design that has more the degree of freedom is also a large key element.The wiring material of small-sized electronic product adopts the flexible printed wiring board that design freedom is high, bendability is good (Flexible Printed Circuit mostly, hereinafter to be referred as FPC), in FPC field, be not only the intelligent mobile phone for main flow, the new demand that contact panel is designed is also in continuous expansion.Flexible printed wiring board (FPC) generally consists of substrate and polyimides (PI) diaphragm two parts of forming circuit, and FPC is constantly to the countermeasure of having formulated various thickness, workability in high-speedization, high rich bent, development.
The traditional protection membrane material of FPC; mainly to take the double-layer structure diaphragm of polyimides (PI) film and solid (Adhesive) as main; in addition; also have non-sensing optical activity pi diaphragm and self photosensitive type pi diaphragm, different diaphragms is applied to FPC by different operating types:
(1) diaphragm of the double-layer structure that traditional PI film and solid (Adhesive) form: this protection pleurodiaphragmatic in terspace material is with three layers of combination of PI film+solid+strippable paper;
PI film: general flexible printed wiring board regular size is 1/2mil ~ 1mil thickness;
Solid is generally divided into:
1) acryl system: do not need stored refrigeratedly, deposit under room temperature;
2) modified Epoxy: need stored refrigerated below 10 degree C;
During operation, need, first for opening reserved on circuit, on diaphragm, with physical method, with die punching moulding or with NC board, hole in advance.Fit in again on the substrate that has become circuit, generally to press soon after 160 ℃ ~ 190 ℃ high-temperature laminatings of mode, the 160 ℃ of temperature baking hardenings of arranging in pairs or groups complete, separately have in pressure transmission mode and make, generally with 160 ℃ ~ 175 ℃ long-time pressings, solidify, this pressure transmission is made advantage for amount is large, does not need baking time separately, but presses soon mode production elasticity relatively poor.
As from the foregoing, the structure of the diaphragm of traditional PI film+solid and operating type easily produce following defect: owing to there being glue-line, so diaphragm thickness is thicker; Epoxy glue causes diaphragm storage condition harsh; Rich song is not good; Need release liners, and the easy exfoliation of strippable paper produces foreign matter; The easy plate bursting of high temperature process; The glue amount of overflowing is wayward.
(2) non-sensing optical activity pi diaphragm: cover the non-sensing optical activity pi of one deck diaphragm in the substrate surface that becomes circuit during operation; again in its diaphragm surface coverage one deck UV sensitization photoresistance film; use UV exposure principle; with liquid, remove after the light group and diaphragm of reserved opening part again; with roasting mode, hardened again; the shortcoming of this diaphragm and operating type is to cause flexible printed wiring board processing procedure more loaded down with trivial details, and cost is high, and flexibility is not good.
(3) self photosensitive type pi diaphragm: cover one deck self sensing optical activity pi diaphragm in the substrate surface that becomes circuit during operation; because itself has possessed photoresistance characteristic; directly with UV exposure operation; with liquid, remove after reserved opening part diaphragm, later roasting mode has hardened again.The shortcoming of this diaphragm and operating type is that high, the rich song of cost is not good and diaphragm storage condition is harsh.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides the yellow polyamidoimide diaphragm of a kind of use in printed circuit board and manufacture method thereof, diaphragm of the present invention is that the mode by low-temperature bake after ink-jet is directly formed at printed circuit board surface, there is ultrathin type, yellow is covered, flexibility is good, pliability is good, no-off paper meets environmental protection operation, the characteristics such as the generation of processability chipless and high TG (glass transition temperature), be used for replacing general diaphragm material, be better than traditional polyimides diaphragm (the thin PI of thin glue), photosensitive type PI (or acryl system) diaphragm and non-photosensitive type PI diaphragm (photoresistance on need), be applicable to clamshell phone, slide phone, digital camera, digital camera, flat computer and intelligent mobile phone etc.
The present invention for the technical scheme that solves its technical problem and adopt is:
The yellow polyamidoimide diaphragm of a kind of use in printed circuit board; the yellow polyamidoimide film of liquid baking-type that there is direct spraying in molded circuit base plate surface and form through baking; the yellow polyamidoimide film of described liquid baking-type is formed at molded circuit base plate surface and needs capped position, and the position that does not cover the yellow polyamidoimide film of described liquid baking-type on described molded circuit base plate surface forms the portion of windowing.
The thickness of the yellow polyamidoimide film of described liquid baking-type is 5～15 μ m, preferably 5～12 μ m.
The manufacture method of the yellow polyamidoimide diaphragm of above-mentioned use in printed circuit board is as follows: adopting ink-jetting style to be sprayed at the precursor composition solution that adds the polyamidoimide that has yellow substance needs the position of covering and form the yellow polyamidoimide film of described liquid baking-type through overbaking on molded circuit base plate surface; baking temperature is 170～200 ℃, and baking time is 1～1.5 hour.
Can adopt the platform-type ink jet printer of volume to volume (ROLL TO ROLL) that the described precursor composition solution spraying of the polyamidoimide that has yellow substance that adds is needed to capped position in molded circuit base plate surface.
The invention has the beneficial effects as follows: the yellow polyamidoimide diaphragm of use in printed circuit board of the present invention has the yellow polyamidoimide film of liquid baking-type that is directly formed at molded circuit base plate surface, therefore without glue-line, simple without photoresistance and processing procedure, and there is ultrathin type, yellow is covered, flexibility is good, pliability is good, no-off paper meets environmental protection operation, the characteristics such as the generation of processability chipless and high TG (glass transition temperature), be used for replacing general diaphragm material, be better than traditional polyimides diaphragm (the thin PI of thin glue), photosensitive type PI (or acryl system) diaphragm and non-photosensitive type PI diaphragm (photoresistance on need), the platform-type ink jet printer continuity of the volume to volume of can arranging in pairs or groups (ROLL TOROLL) is produced in a large number, be applicable to clamshell phone, slide phone, digital camera, digital camera, flat computer and intelligent mobile phone etc.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Below, by specific instantiation explanation the specific embodiment of the present invention, those of ordinary skills can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can other different mode be implemented, and, under not departing from disclosed category, can give different modifications and change that is.
Embodiment: the yellow polyamidoimide diaphragm of a kind of use in printed circuit board; there is direct spraying in molded circuit base plate 2 surfaces and the yellow polyamidoimide film 1 of liquid baking-type forming through baking; the yellow polyamidoimide film 1 of described liquid baking-type is directly formed at molded circuit base plate 2 surfaces and needs capped position, and the position that does not cover the yellow polyamidoimide film 1 of described liquid baking-type on described molded circuit base plate surface forms the portion 3 of windowing.
The thickness of the yellow polyamidoimide film 1 of described liquid baking-type is 5～15 μ m, preferably 5～12 μ m.
The manufacture method of the yellow polyamidoimide diaphragm of above-mentioned use in printed circuit board is as follows: adopting ink-jetting style to be sprayed at the precursor composition solution that adds the polyamidoimide that has yellow substance needs the position of covering and form the yellow polyamidoimide film 1 of described liquid baking-type through overbaking on molded circuit base plate surface; baking temperature is 170～200 ℃, and baking time is 1～1.5 hour.
Can adopt the platform-type ink jet printer of volume to volume that the described precursor composition solution spraying of the polyamidoimide that has yellow substance that adds is needed to capped position in molded circuit base plate surface.
Wherein, the concrete steps of spraying are: molded circuit base plate is put to the fixed position in the platform-type ink jet printer of volume to volume, in ink jet printer, imageing sensor is confirmed the location conductor on circuit and carries out contraposition and finely tune the mobile accurate contraposition of circuit that makes, then ink jet printer carries out adding according to the designed image that set the ink jet type spraying that the precursor composition solution of the polyamidoimide that has yellow substance is raw material, ink-jet thickness is 5 μ m～12 μ m, after spraying, make to add the precursor composition solution of the polyamidoimide that has yellow substance to form and need to cover the covering part of position and the portion of windowing of uncovering position on molded circuit base plate surface.
Polyamidoimide described in the present invention (PAI) refers to the polymer that has monamide group and imide group structure on main chain, and its chemical molecular is as follows:
The yellow polyamidoimide diaphragm of use in printed circuit board of the present invention and traditional protection film are compared as follows:
Diaphragm of the present invention and traditional PI film fundamental characteristics are compared:
Yellow polyamidoimide (PAI) film of liquid baking-type of the present invention is used compares with traditional protection film on FPC, the high flexibility characteristic of demonstration:
One, flexibility test:
Use flexibility tester to carry out.
Test condition is as follows:
Voltage: AC220V
Measuring range: 410 grams
Readable: 0.001 gram
Test R angle: 2.35mm
Testing procedure:
1, two feets adjusting tester, make spirit bubble be positioned at leveling device center.
2, connect instrument power source, by instrument zero clearing.
3, open glass door, test piece (size 10mm * 30mm) one end is fixed on the holder of pallet top, the other end is stuck on the deck at pallet center, makes test piece become one " U " font, after shut glass door.
4, rotary apparatus right-hand member knob slowly counterclockwise, makes deck slow decreasing, until it contacts with lower square washer, now test piece R angle is 2.35mm.
5, lamp to be instructed bright after, can read contravariant power reading.
6, after being completed, knob dextrorotation, to original position, is opened to glass door, take off test piece.
7, repeat steps 3-6 suddenly, test other test pieces.
Two, flexibility test:
Use slide unit tester to carry out.
Test condition:
Use voltage: AC220V
Test R angle: 1.0mm
Testing procedure:
1, two feets adjusting tester, are fixed on test piece on tester table;
2, connect instrument power source, by instrument zero clearing;
Set: test condition:
Spacing H:2.0mm, place, R angle: 1.0mm
Frequency: 30 beats/min
Shift motion: 32mm
3, lamp to be instructed bright after, can record experimental test data;
4,, after being completed, knob dextrorotation, to original position, is taken off to test piece;
5, repeat above-mentioned steps, test other test pieces.
Three groups of data of every group of sample test, test result is averaged and is embedded in following table again:
Above-described embodiment is only the illustrative principle of the invention and effect thereof, but not for limiting the present invention.The scope of the present invention, should be as listed in claims.
Claims (5)
1. the yellow polyamidoimide diaphragm of a use in printed circuit board; it is characterized in that: the yellow polyamidoimide film (1) of liquid baking-type that there is direct spraying in molded circuit base plate (2) surface and form through baking; the described yellow polyamidoimide film of liquid baking-type (1) is directly formed at molded circuit base plate (2) surface and needs capped position, and the position that does not cover the described yellow polyamidoimide film of liquid baking-type (1) on described molded circuit base plate surface forms the portion (3) of windowing.
2. the yellow polyamidoimide diaphragm of use in printed circuit board as claimed in claim 1, is characterized in that: the thickness of the described yellow polyamidoimide film of liquid baking-type (1) is 5～15 μ m.
3. the yellow polyamidoimide diaphragm of use in printed circuit board as claimed in claim 2, is characterized in that: the thickness of the described yellow polyamidoimide film of liquid baking-type (1) is 5～12 μ m.
4. the manufacture method of the yellow polyamidoimide diaphragm of use in printed circuit board as described in claim 1,2 or 3; it is characterized in that: adopting ink-jetting style to be sprayed at the precursor composition solution that adds the polyamidoimide that has yellow substance needs the position of covering and form the yellow polyamidoimide film (1) of described liquid baking-type through overbaking on molded circuit base plate surface; baking temperature is 170～200 ℃, and baking time is 1～1.5 hour.
5. the manufacture method of the yellow polyamidoimide diaphragm of use in printed circuit board as claimed in claim 4, is characterized in that: adopt the platform-type ink jet printer of volume to volume that the described precursor composition solution spraying of the polyamidoimide that has yellow substance that adds is needed to capped position in molded circuit base plate surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210308257.4A CN103635009A (en) | 2012-08-28 | 2012-08-28 | Yellow polyamidoimide protection film for printed circuit board and manufacturing method thereof |
| TW101225455U TWM451783U (en) | 2012-08-28 | 2012-12-28 | Flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210308257.4A CN103635009A (en) | 2012-08-28 | 2012-08-28 | Yellow polyamidoimide protection film for printed circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103635009A true CN103635009A (en) | 2014-03-12 |
Family
ID=48802069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210308257.4A Pending CN103635009A (en) | 2012-08-28 | 2012-08-28 | Yellow polyamidoimide protection film for printed circuit board and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103635009A (en) |
| TW (1) | TWM451783U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100116528A1 (en) * | 2008-11-13 | 2010-05-13 | Samsung Techwin Co., Ltd. | Printed circuit board with multiple metallic layers and method of manufacturing the same |
| CN202319177U (en) * | 2011-11-11 | 2012-07-11 | 松扬电子材料(昆山)有限公司 | Color covering film |
| CN202374559U (en) * | 2011-12-05 | 2012-08-08 | 昆山雅森电子材料科技有限公司 | Flexible printed circuit board structure |
| CN202773171U (en) * | 2012-08-28 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Yellow polyamide-imide protection film used for printed circuit board |
-
2012
- 2012-08-28 CN CN201210308257.4A patent/CN103635009A/en active Pending
- 2012-12-28 TW TW101225455U patent/TWM451783U/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100116528A1 (en) * | 2008-11-13 | 2010-05-13 | Samsung Techwin Co., Ltd. | Printed circuit board with multiple metallic layers and method of manufacturing the same |
| CN202319177U (en) * | 2011-11-11 | 2012-07-11 | 松扬电子材料(昆山)有限公司 | Color covering film |
| CN202374559U (en) * | 2011-12-05 | 2012-08-08 | 昆山雅森电子材料科技有限公司 | Flexible printed circuit board structure |
| CN202773171U (en) * | 2012-08-28 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Yellow polyamide-imide protection film used for printed circuit board |
Non-Patent Citations (2)
| Title |
|---|
| 廖贵红: "聚酰胺酰亚胺的合成与性能研究", 《中国优秀硕士学位论文全文数据库工程科技I辑》 * |
| 郑玢: "新型聚酰胺酰亚胺的合成及其应用性能评价", 《中国优秀硕士学位论文全文数据库工程科技I辑》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM451783U (en) | 2013-04-21 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140312 |
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| RJ01 | Rejection of invention patent application after publication |