CN103140019B - The black covering film of flexible circuit board, flexible printed circuit board structure and method for making thereof - Google Patents
The black covering film of flexible circuit board, flexible printed circuit board structure and method for making thereof Download PDFInfo
- Publication number
- CN103140019B CN103140019B CN201110397730.6A CN201110397730A CN103140019B CN 103140019 B CN103140019 B CN 103140019B CN 201110397730 A CN201110397730 A CN 201110397730A CN 103140019 B CN103140019 B CN 103140019B
- Authority
- CN
- China
- Prior art keywords
- polyamidoimide
- base plate
- film
- atrament
- baking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The present invention discloses the black covering film of a kind of flexible circuit board, a kind of flexible printed circuit board structure and method for making with this mulch film, there is the liquid baking-type black polyamidoimide film being directly formed at molded circuit base plate surface, flexible printed wiring board is formed by molded circuit base plate and liquid baking-type black polyamidoimide film, volume to volume of can arranging in pairs or groups flatbed inkjet machine consecutive production, and the protective membrane that liquid baking-type black polyamidoimide film collocation light sensitive polyimide protective membrane can be adopted to form promotes flexible printed wiring board pad or the reserved Aperture precision of circuit, mulch film of the present invention has ultra-thin type, cover circuit, flexibility is good, good flexibility, no-off paper meets environmental protection operation, processibility is without characteristics such as bits generation and high TG, the flexible printed wiring board with this mulch film is applicable to clamshell phone, slip lid mobile phone, digital camera, digital camera, tablet PC and intelligent mobile phone etc.
Description
Technical field
The invention belongs to flexible printed wiring board field, it is specifically related to the black covering film of a kind of flexible circuit board, and there is flexible printed circuit board structure and the manufacture method thereof of this protective membrane.
Background technology
Small-sized electronic product not only will to more small-sized, lightweight development, and the designability having more degree of freedom is also a big key element. Flexible printed wiring board (the FlexiblePrintedCircuit that the distribution material of small-sized electronic product adopts design freedom height, bendability good mostly, hereinafter referred to as FPC), in FPC field, being not only the intelligent mobile phone for main flow, the new demand designed by contact panel is also in continuous expansion. Flexible printed wiring board (FPC) is generally made up of the substrate and polyimide (PI) protective membrane two portions that form circuit, and FPC is constantly to the countermeasure having formulated various thickness, workability while high speed, high rich bent, development.
The traditional protection mould material of FPC; mainly based on the double-layer structure protective membrane of polyimide (PI) film and solid (Adhesive); in addition; also having non-sensing optical activity pi protective membrane and self photosensitive type pi protective membrane, different protective membranes is applied to FPC by different mode of operation:
(1) protective membrane of the double-layer structure that traditional PI film and solid (Adhesive) are formed: the former material of this protective membrane is with PI film+solid+separating shaped paper three layers combination;
PI film: general flexible printed wiring board regular size is 1/2mil��1mil thickness;
Solid is generally divided into:
1) acryl system: do not need stored refrigerated, deposits under room temperature;
2) modified Epoxy: need stored refrigerated in 10 degree of below C;
During operation, need first for opening reserved on circuit, shaping with die punching in advance or with NC machine bench drill hole with physical method on protective membrane.Fit in again and become on the substrate of circuit, generally with after pressing mode 160 DEG C��190 DEG C high-temperature laminatings soon, 160 DEG C of temperature baking hardenings of arranging in pairs or groups complete, separately have and make in pressure transmission mode, generally with 160 DEG C��175 DEG C long-time pressing solidifications, it is big for amount that this pressure transmission makes advantage, does not need baking time separately, but fast pressure mode production elasticity is relatively poor.
As from the foregoing, structure and the mode of operation of the protective membrane of traditional PI film+solid easily produce following defect: owing to there being glue-line, therefore protective membrane thickness is thicker; Epoxy glue causes protective membrane storage condition harsh; Rich song is not good; Need to by separate-type paper, and the separating shaped paper bits that easily fall produce foreign matter; The easy plate bursting of high temperature process; Glue amount of overflowing is wayward.
(2) non-sensing optical activity pi protective membrane: in becoming the substrate surface of circuit to cover the non-sensing optical activity pi protective membrane of lid layer during operation; again in its protective membrane surface coverage one layer of photosensitive photoresistance film of UV; UV is used to expose principle; after removing the light group reserving opening place and protective membrane with liquid again; harden with roasting mode again; the shortcoming of this protective membrane and mode of operation causes flexible printed wiring board processing procedure more loaded down with trivial details, cost height, and flexibility is not good.
(3) self photosensitive type pi protective membrane: in becoming the substrate surface of circuit to cover lid layer self sensing optical activity pi protective membrane during operation; owing to itself having possessed light resistance characteristic; directly with UV exposure operation; after removing reserved opening place protective membrane with liquid again, later roasting mode has hardened. The shortcoming of this protective membrane and mode of operation is cost height, rich song is not good and protective membrane storage condition is harsh.
Summary of the invention
In order to overcome above-mentioned defect, the present invention provides the black covering film of a kind of flexible circuit board, this protective membrane has ultra-thin type, cover circuit, flexibility is good, good flexibility, no-off paper meets environmental protection operation, processibility is without characteristics such as bits generation and high TG (glass transition temperature), it is used for replacing general Protective coatings, it is better than tradition polyimide protective membrane (the thin PI of thin glue), photosensitive type PI (or acryl system) protective membrane and non-photo-sensing type PI protective membrane (light resistance need to be gone up), present invention also offers a kind of flexible printed circuit board structure with this protective membrane, and it is formed on substrate by this protective membrane to make the method for making of flexible printed wiring board, the flexible printed wiring board with this protective membrane is applicable to clamshell phone, slip lid mobile phone, digital camera, digital camera, tablet PC and intelligent mobile phone etc.
The technical scheme that the present invention adopts to solve its technical problem is:
The black covering film of a kind of flexible circuit board, there is the liquid baking-type black polyamidoimide film being directly sprayed at molded circuit base plate surface and become through baking, described liquid baking-type black polyamidoimide film is formed at the position that molded circuit base plate surface need to be capped, and the position that described molded circuit base plate does not cover described liquid baking-type black polyamidoimide film on the surface forms portion of windowing.
Goodly, described liquid baking-type black polyamidoimide film is the precursor composition solution of the polyamidoimide by being added with atrament adopt ink-jetting style to be sprayed at position that molded circuit base plate needs to cover on the surface and becomes through baking. Wherein, described in be added with atrament polyamidoimide precursor composition solution in containing monomer, solvent and atrament, described monomer is trimellitic acid 1,2-anhydride (TMA, C9H4O5), 1,2-ethylene [1,3-bis-hydrogen-1,3-dioxo isobenzofuran-5-carboxylicesters] (TMEG, C20H10O10) and diphenylmethanediisocyanate (MDI, C15H10N2O2), described solvent is dimethylbenzene (Xylene;1,4-Dimethylbenzene; C8H10) and DMAC N,N' dimethyl acetamide (DMAC, CH3C(O)N(CH3)2It is called for short N,N-DIMETHYLACETAMIDE), described atrament be selected from carbon material and black pigment (pigment of the present invention contains pigment, toner and dyestuff etc.) one of at least, described storing temperature is 160 DEG C��200 DEG C, and baking time is 1��1.5 hour.
When the pad of flexible printed wiring board or the reserved opening demand high precision of circuit; also it is provided with light sensitive polyimide protective membrane; described light sensitive polyimide protective membrane covers described liquid baking-type black polyamidoimide film; described liquid baking-type black polyamidoimide film is between described molded circuit base plate and described light sensitive polyimide protective membrane, and described light sensitive polyimide protective membrane has opening corresponding to some and described portion of windowing. The structure of this kind of liquid baking-type black polyamidoimide film and the collocation of light sensitive polyimide protective membrane; the pad of client's flexible printed wiring board or the precision of the reserved opening of circuit can be made greatly to promote, and the shortcoming of the not resistance to bending of light sensitive polyimide protective membrane can be overcome.
Goodly, the position that the precursor composition solution spraying of the described polyamidoimide being added with atrament need to be capped by a kind of ink jet unit in sheet production platform formula ink jet unit and volume to volume (ROLLTOROLL) flatbed inkjet machine (consecutive production) in molded circuit base plate surface is adopted.
Goodly, the thickness of described liquid baking-type black polyamidoimide film is 5 ��m��25 ��m.
Goodly, the thickness of described light sensitive polyimide protective membrane is 17 ��m��25 ��m.
A kind of flexible printed circuit board structure, is made up of molded circuit base plate and mulch film of the present invention.
The method for making of a kind of flexible printed circuit board structure, by liquid baking-type black polyamidoimide film being formed at the position that molded circuit base plate surface need to be capped through baking operation after spraying process, make the flexible printed wiring board being made up of molded circuit base plate and liquid baking-type black polyamidoimide film, and the position that described molded circuit base plate does not cover described liquid baking-type black polyamidoimide film on the surface forms portion of windowing.
Described spraying process adopts the ink-jetting style position that needs to be capped on the surface by the precursor composition solution spraying being added with the polyamidoimide of atrament in molded circuit base plate, and the position of the molded circuit base plate precursor composition solution that do not cover the polyamidoimide being added with atrament on the surface forms portion of windowing. Wherein, described in be added with atrament polyamidoimide precursor composition solution in containing monomer, solvent and atrament, described monomer is:
Trimellitic acid 1,2-anhydride (), 1,2-ethylene [1,3-bis-hydrogen-1,3-dioxo isobenzofuran-5-carboxylicesters] () and diphenylmethanediisocyanateDescribed solvent is dimethylbenzeneAnd N, N-methylacetamideAt least one that described atrament is selected from carbon material and black pigment.
In the method for making of above-mentioned flexible printed circuit board structure, adopt the position that the precursor composition solution spraying of the described polyamidoimide being added with atrament need to be capped by a kind of ink jet unit in sheet production platform formula ink jet unit and volume to volume (ROLLTOROLL) flatbed inkjet machine (consecutive production) in molded circuit base plate surface, coating thickness is 5 ��m��25 ��m, and the position of the precursor composition solution that molded circuit base plate surface does not cover the polyamidoimide being added with atrament forms portion of windowing.Preferably, molded circuit base plate is put the fixed position in a kind of ink jet unit in sheet production platform formula ink jet unit and volume to volume flatbed inkjet machine, location conductor on image sensor confirmation circuit in ink jet unit also carries out contraposition fine setting movement and makes the accurate contraposition of circuit, then the precursor composition solution that ink jet unit carries out the polyamidoimide to be added with atrament according to the designed image set sprays as the ink jet type of raw material, ink-jet thickness is 5 ��m��25 ��m, make the precursor composition solution being added with the polyamidoimide of atrament be formed on molded circuit base plate surface after spraying and need the covering part of covering position and the portion of windowing of uncovering position. then carry out baking operation, described storing temperature is 160 DEG C��200 DEG C, and baking time is 1��1.5 hour, in bake process, described in be added with atrament polyamidoimide precursor composition solution in monomer polymerization become polyamidoimide.
Polyamidoimide described in the present invention (PAI) refers to the polymkeric substance having monoamide group and imide group structure on main chain, and its chemical molecular is as follows:
When the pad of flexible printed wiring board or the reserved opening demand high precision of circuit; also need to form one layer of light sensitive polyimide protective membrane on described liquid baking-type black polyamidoimide film surface; make described liquid baking-type black polyamidoimide film between described molded circuit base plate and described light sensitive polyimide protective membrane; then described light sensitive polyimide protective membrane exposed and develops, making described light sensitive polyimide protective membrane form opening corresponding to some and described portion of windowing. Goodly, described light sensitive polyimide protective membrane can be formed at described liquid baking-type black polyamidoimide film surface by printing or pressing mode.
The invention has the beneficial effects as follows: the black covering film of the flexible circuit board of the present invention has the liquid baking-type black polyamidoimide film being directly formed at molded circuit base plate surface, therefore without the need to glue-line, hinder without the need to light, and processing procedure is simple, and there is ultra-thin type, cover circuit, flexibility is good, good flexibility, no-off paper meets environmental protection operation, processibility produces without bits and the characteristic such as high TG (glass transition temperature), is used for replacing general Protective coatings, is better than tradition polyimide protective membrane (the thin PI of thin glue), photosensitive type PI (or acryl system) protective membrane and non-photo-sensing type PI protective membrane (light resistance need to be gone up), volume to volume of can arranging in pairs or groups (ROLLTOROLL) flatbed inkjet machine continuity is produced in a large number, and the mulch film that liquid baking-type black polyamidoimide film collocation light sensitive polyimide protective membrane can be adopted to form significantly promotes the precision of flexible printed wiring board pad or the reserved opening of circuit and promotes the flexibility of light sensitive polyimide protective membrane, the flexible printed wiring board with mulch film of the present invention is applicable to clamshell phone, slip lid mobile phone, digital camera, digital camera, tablet PC and intelligent mobile phone etc.
Accompanying drawing explanation
Fig. 1 is the flexible printed circuit board structure schematic diagram of the embodiment of the present invention 1;
Fig. 2 is the flexible printed circuit board structure schematic diagram of the embodiment of the present invention 2.
Embodiment
Below by way of specific specific examples, the specific embodiment of the present invention being described, the personage being familiar with this skill can be understood advantage and effect of the present invention easily by content disclosed in the present specification.The present invention can also other different mode be implemented, that is, not departing from, under disclosed category, giving different modifications and change.
Embodiment 1: present embodiment discloses the black covering film of a kind of flexible circuit board, a kind of mode of operation that there is the flexible printed circuit board structure of this mulch film and be formed on substrate by this mulch film the flexible printed wiring board making the present embodiment.
The flexible printed circuit board structure of the present embodiment, as shown in Figure 1, it is made up of the mulch film 1 of molded circuit base plate 2 and the present embodiment, the mulch film of the present embodiment is liquid baking-type black polyamidoimide film 1, the position that this liquid state baking-type black polyamidoimide film 1 need to be capped in molded circuit base plate 2 surface by the precursor composition solution spraying of the polyamidoimide being added with atrament also becomes through baking, originally be embodiment the thickness of mulch film (liquid baking-type black polyamidoimide film 1) be 5 ��m��25 ��m, the position that described molded circuit base plate does not cover described liquid baking-type black polyamidoimide film 1 on the surface forms portion 3 of windowing.
The flexible printed circuit board structure of the present embodiment and the mulch film of the present embodiment are obtained by following mode of operation:
By the position that the precursor composition solution spraying being added with the polyamidoimide of atrament need to be capped in molded circuit base plate surface, then carry out toasting the precursor composition solution polymerization curing molding of the polyamidoimide being added with atrament making molded circuit base plate surface for liquid baking-type black polyamidoimide film, make the flexible printed wiring board being made up of molded circuit base plate and liquid baking-type black polyamidoimide film, and the position that described molded circuit base plate does not cover described liquid baking-type black polyamidoimide film on the surface forms portion of windowing.
Wherein, the concrete steps of spraying are: molded circuit base plate is put the fixed position in a kind of ink jet unit in sheet production platform formula ink jet unit and volume to volume flatbed inkjet machine, location conductor on image sensor confirmation circuit in ink jet unit also carries out contraposition fine setting movement and makes the accurate contraposition of circuit, then the precursor composition solution that ink jet unit carries out the polyamidoimide to be added with atrament according to the designed image set sprays as the ink jet type of raw material, ink-jet thickness is 5 ��m��25 ��m, make the precursor composition solution being added with the polyamidoimide of atrament be formed on molded circuit base plate surface after spraying and need the covering part of covering position and the portion of windowing of uncovering position.
Wherein, described in be added with atrament polyamidoimide precursor composition solution in containing monomer, solvent and atrament, described monomer is:
Trimellitic acid 1,2-anhydride (), 1,2-ethylene [1,3-bis-hydrogen-1,3-dioxo isobenzofuran-5-carboxylicesters] () and diphenylmethanediisocyanateDescribed solvent is dimethylbenzeneAnd DMAC N,N' dimethyl acetamideAt least one that described atrament is selected from carbon material and pigment.
Wherein, described storing temperature is 160 DEG C��200 DEG C, and baking time is 1��1.5 hour, in bake process, described in be added with atrament polyamidoimide precursor composition solution in monomer polymerization become polyamidoimide.
Embodiment 2: present embodiment discloses the black covering film of a kind of flexible circuit board, a kind of mode of operation that there is the flexible printed circuit board structure of this mulch film and be formed on substrate by this mulch film the flexible printed wiring board making the present embodiment.
The flexible printed circuit board structure of the present embodiment, as shown in Figure 2, it is made up of the mulch film 1 of molded circuit base plate 2 and the present embodiment, the mulch film of the present embodiment is made up of liquid baking-type black polyamidoimide film 1 and light sensitive polyimide protective membrane 4, the position that this liquid state baking-type black polyamidoimide film 1 need to be capped in molded circuit base plate 2 surface by the precursor composition solution spraying of the polyamidoimide being added with atrament also becomes through baking, the thickness of this liquid state baking-type black polyamidoimide film 1 is 5 ��m��25 ��m, the position that described molded circuit base plate does not cover described liquid baking-type black polyamidoimide film 1 on the surface forms portion 3 of windowing, described light sensitive polyimide protective membrane 4 covers described liquid baking-type black polyamidoimide film 1, described liquid baking-type black polyamidoimide film 1 is between described molded circuit base plate 2 and described light sensitive polyimide protective membrane 4, described light sensitive polyimide protective membrane 4 has opening corresponding to some and described portion 3 of windowing, the thickness of described light sensitive polyimide protective membrane 4 is 17 ��m��25 ��m.
The flexible printed circuit board structure of the present embodiment and the protective membrane of the present embodiment are obtained by following mode of operation:
By the position that the precursor composition solution spraying being added with the polyamidoimide of atrament need to be capped in molded circuit base plate surface, then carry out toasting the precursor composition solution polymerization curing molding of the polyamidoimide being added with atrament making molded circuit base plate surface for liquid baking-type black polyamidoimide film, make the flexible printed wiring board being made up of molded circuit base plate and liquid baking-type black polyamidoimide film, and the position that described molded circuit base plate does not cover described liquid baking-type black polyamidoimide film on the surface forms portion of windowing.
Wherein, the concrete steps of spraying are: molded circuit base plate is put the fixed position in a kind of ink jet unit in sheet production platform formula ink jet unit and volume to volume flatbed inkjet machine, location conductor on image sensor confirmation circuit in ink jet unit also carries out contraposition fine setting movement and makes the accurate contraposition of circuit, then the precursor composition solution that ink jet unit carries out the polyamidoimide to be added with atrament according to the designed image set sprays as the ink jet type of raw material, ink-jet thickness is 5 ��m��25 ��m, make the precursor composition solution being added with the polyamidoimide of atrament be formed on molded circuit base plate surface after spraying and need the covering part of covering position and the portion of windowing of uncovering position.
Wherein, described in be added with atrament polyamidoimide precursor composition solution in containing monomer, solvent and atrament, described monomer is:
Trimellitic acid 1,2-anhydride (), 1,2-ethylene [1,3-bis-hydrogen-1,3-dioxo isobenzofuran-5-carboxylicesters] () and diphenylmethanediisocyanateDescribed solvent is dimethylbenzeneAnd DMAC N,N' dimethyl acetamideAt least one that described atrament is selected from carbon material and pigment.
Wherein, described storing temperature is 160 DEG C��200 DEG C, and baking time is 1��1.5 hour, in bake process, described in be added with atrament polyamidoimide precursor composition solution in monomer polymerization become polyamidoimide.
Pad or circuit in order to improve flexible printed wiring board reserves the precision of opening; the mode by printing or pressing is also needed to form one layer of light sensitive polyimide protective membrane on described liquid baking-type black polyamidoimide film surface; make described liquid baking-type black polyamidoimide film between described molded circuit base plate and described light sensitive polyimide protective membrane; then described light sensitive polyimide protective membrane exposed and develops, making described light sensitive polyimide protective membrane form opening corresponding to some and described portion of windowing.
Wherein, the concrete steps adopting mode of printing formation light sensitive polyimide protective membrane and carry out exposing and developing are as follows: carry out screen painting with printing machine platform, do comprehensive light sensitive polyimide printing on liquid baking-type black polyamidoimide film surface to cover, print thickness is 17um��25um, then within 30��45 minutes, make light sensitive polyimide dry with low temperature (50 DEG C��85 DEG C) baking, after using the exposure film of exposure machine to expose again, after carrying out the shaping of light sensitive polyimide protective membrane opening with sodium carbonate liquid, make wiring board presents light sensitive polyimide protective membrane opening, complete with baking hardening again.
Wherein, the concrete steps adopting pressing mode formation light sensitive polyimide protective membrane and carry out exposing and developing are as follows: with dry film (resistance of MASK light) pressing machine by light sensitive polyimide protective membrane with pressing mode pressing (temperature: 100+/-10 DEG C;Pressing speed: 1.0��1.6M/min; Pressure: 3.1+/-0.5kg/cm2) in described liquid baking-type black polyamidoimide film surface; after using the exposure film of exposure machine to expose; after carrying out the shaping of light sensitive polyimide protective membrane opening with sodium carbonate liquid; make wiring board presents light sensitive polyimide protective membrane opening; complete to make with baking hardening again; this production method is applicable to the high flexible printed wiring board of general demand precision, and strengthens the shortcoming of the not resistance to bending of general light sensitive polyimide protective membrane.
The mulch film of the present invention and tradition mulch film comparison:
Mulch film of the present invention and the basic characteristic comparison of traditional PI film:
Liquid baking-type black polyamidoimide (PAI) film of the present invention is used on FPC compared with tradition mulch film, the high flexibility characteristic of display.
One, flexibility test:
Flexibility tester is used to carry out.
Test condition
Voltage: AC220V
Useful range: 410 grams
Readable: 0.001 gram
Test R angle: 2.35mm
Test procedure
1, adjust two feets of tester, make level bubble be positioned at horizontal centre.
2, connect instrument power source, instrument is reset.
3, opening glass door, be fixed on the folder seat above pallet test piece (size 10mm �� 30mm) one end, the other end is stuck on the card seat of tray center, makes test piece become one " U " font, after shut glass door.
4, counter clockwise direction slowly rotary apparatus right-hand member knob, makes card seat slowly decline, until it contacts with inferior shim, now test piece R angle is 2.35mm.
5, lamp to be instructed bright after, namely can read contravariant power reading.
6, after being completed, knob is threaded to clockwise original position, opens glass door, take off test piece.
7, repeat steps 3-6 suddenly, test other test pieces.
Two, flexibility test:
Slide unit tester is used to carry out.
Test condition
Use voltage: AC220V
Test R angle: 1.0mm
Test procedure
1, adjust two feets of tester, test piece is fixed on tester table;
2, connect instrument power source, instrument is reset;
Setting: test condition:
Spacing H:2.0mm, R angle place: 1.0mm
Frequency: 30 beats/min
Mobile stroke: 32mm
3, lamp to be instructed bright after, experimental test data can be recorded;
4, after being completed, knob is threaded to clockwise original position, takes off test piece;
5, repeat above-mentioned steps, test other test pieces.
Often organizing sample test three groups of data, test result is averaged and is embedded in following table again:
Above-described embodiment is only the illustrative principle of the invention and effect thereof, but not for limiting the present invention. The scope of the present invention, should as listed by claim book.
Claims (4)
1. the black covering film of a flexible circuit board, it is characterized in that: there is liquid baking-type black polyamidoimide film (1) being directly sprayed at molded circuit base plate (2) surface and become through baking, described liquid baking-type black polyamidoimide film (1) is formed at the position that molded circuit base plate (2) surface need to be capped, and the position that described molded circuit base plate does not cover described liquid baking-type black polyamidoimide film (1) on the surface forms portion (3) of windowing;
Described liquid baking-type black polyamidoimide film (1) is the precursor composition solution of the polyamidoimide by being added with atrament adopt ink-jetting style to be sprayed at position that molded circuit base plate needs to cover on the surface and becomes through baking;
Containing monomer, solvent and atrament in the precursor composition solution of the described polyamidoimide being added with atrament, described monomer is trimellitic acid 1,2-anhydride, 1,2-ethylene [1,3-bis-hydrogen-1,3-dioxo isobenzofuran-5-carboxylicesters] and diphenylmethanediisocyanate, described solvent is dimethylbenzene and N, N-N,N-DIMETHYLACETAMIDE, described atrament is selected from carbon material and black pigment one of at least, described storing temperature is 160 DEG C��200 DEG C, and baking time is 1��1.5 hour;
Also it is provided with light sensitive polyimide protective membrane (4), described light sensitive polyimide protective membrane (4) covers described liquid baking-type black polyamidoimide film (1), described liquid baking-type black polyamidoimide film (1) is positioned between described molded circuit base plate (2) and described light sensitive polyimide protective membrane (4), and described light sensitive polyimide protective membrane (4) has opening corresponding to some and described portion of windowing (3);
The thickness of described liquid baking-type black polyamidoimide film (1) is 5 ��m��25 ��m;
The thickness of described light sensitive polyimide protective membrane (4) is 17 ��m��25 ��m.
2. the black covering film of flexible circuit board as claimed in claim 1, it is characterised in that: adopt the position that the precursor composition solution spraying of the described polyamidoimide being added with atrament need to be capped by a kind of ink jet unit in sheet production platform formula ink jet unit and volume to volume flatbed inkjet machine in molded circuit base plate surface.
3. a flexible printed circuit board structure, it is characterised in that: it is made up of molded circuit base plate (2) and mulch film as claimed in claim 1 or 2.
4. the method for making of a flexible printed circuit board structure, it is characterized in that: by liquid baking-type black polyamidoimide film (1) being formed at the position that molded circuit base plate (2) surface need to be capped through baking operation after spraying process, make the flexible printed wiring board being made up of molded circuit base plate (2) and liquid baking-type black polyamidoimide film (1), and the position that described molded circuit base plate (2) does not cover described liquid baking-type black polyamidoimide film (1) on the surface forms portion (3) of windowing;
Described spraying process adopts the ink-jetting style position that needs to be capped on the surface by the precursor composition solution spraying being added with the polyamidoimide of atrament in molded circuit base plate, and the position of the molded circuit base plate precursor composition solution that do not cover the polyamidoimide being added with atrament on the surface forms portion (3) of windowing;
Containing monomer, solvent and atrament in the precursor composition solution of the described polyamidoimide being added with atrament, described monomer is trimellitic acid 1,2-anhydride, 1,2-ethylene [1,3-bis-hydrogen-1,3-dioxo isobenzofuran-5-carboxylicesters] and diphenylmethanediisocyanate, described solvent is dimethylbenzene and N, N-N,N-DIMETHYLACETAMIDE, described atrament is selected from carbon material and black pigment one of at least, described storing temperature is 160 DEG C��200 DEG C, and baking time is 1��1.5 hour;
Adopting the position that the precursor composition solution spraying of the described polyamidoimide being added with atrament need to be capped by a kind of ink jet unit in sheet production platform formula ink jet unit and volume to volume flatbed inkjet machine in molded circuit base plate surface, coating thickness is 5 ��m��25 ��m;
Molded circuit base plate is put the fixed position in a kind of ink jet unit in sheet production platform formula ink jet unit and volume to volume flatbed inkjet machine, location conductor on image sensor confirmation circuit in ink jet unit also carries out contraposition fine setting movement and makes the accurate contraposition of circuit, then the precursor composition solution that ink jet unit carries out the polyamidoimide to be added with atrament according to the designed image set sprays as the ink jet type of raw material, ink-jet thickness is 5 ��m��25 ��m, make the precursor composition solution being added with the polyamidoimide of atrament be formed on molded circuit base plate surface after spraying and need the covering part of covering position and the portion of windowing of uncovering position,
One layer of light sensitive polyimide protective membrane (4) is formed on described liquid baking-type black polyamidoimide film (1) surface; described liquid baking-type black polyamidoimide film (1) is made to be positioned between described molded circuit base plate (2) and described light sensitive polyimide protective membrane (4); then described light sensitive polyimide protective membrane (4) exposed and develops, making described light sensitive polyimide protective membrane (4) form opening corresponding to some and described portion of windowing (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110397730.6A CN103140019B (en) | 2011-12-05 | 2011-12-05 | The black covering film of flexible circuit board, flexible printed circuit board structure and method for making thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110397730.6A CN103140019B (en) | 2011-12-05 | 2011-12-05 | The black covering film of flexible circuit board, flexible printed circuit board structure and method for making thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103140019A CN103140019A (en) | 2013-06-05 |
| CN103140019B true CN103140019B (en) | 2016-06-08 |
Family
ID=48499161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110397730.6A Active CN103140019B (en) | 2011-12-05 | 2011-12-05 | The black covering film of flexible circuit board, flexible printed circuit board structure and method for making thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103140019B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103338587A (en) * | 2013-07-10 | 2013-10-02 | 苏州联易昌工业材料有限公司 | Circuit board and fabrication technology thereof |
| CN104883808B (en) * | 2015-05-05 | 2017-12-01 | 华为技术有限公司 | A kind of manufacture method of printed circuit board (PCB) and printed circuit board (PCB) |
| CN107177325A (en) * | 2017-06-05 | 2017-09-19 | 苏州金禾新材料股份有限公司 | A kind of Sun-shading type electricity conductive cloth tape |
| CN108521710B (en) * | 2018-05-15 | 2021-03-02 | 景旺电子科技(龙川)有限公司 | Flexible printed circuit board for wireless charger and manufacturing method thereof |
| CN110827683A (en) * | 2019-10-22 | 2020-02-21 | 武汉华星光电半导体显示技术有限公司 | Integrated flexible display module and manufacturing method thereof |
| CN110769614A (en) * | 2019-10-28 | 2020-02-07 | 厦门弘信电子科技股份有限公司 | FPC full-process tracing method with black cover film |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11246759A (en) * | 1998-03-04 | 1999-09-14 | Hitachi Chem Co Ltd | Polyamideimide resin paste and film-forming material containing same |
| JP4843214B2 (en) * | 2004-11-16 | 2011-12-21 | 株式会社東芝 | Module board and disk device |
| JP2006229127A (en) * | 2005-02-21 | 2006-08-31 | Showa Denko Kk | Thermosetting composition for solder resist and its curing object |
| WO2007105713A1 (en) * | 2006-03-16 | 2007-09-20 | Showa Denko K.K. | Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film |
| KR101229722B1 (en) * | 2006-12-12 | 2013-02-04 | 도요보 가부시키가이샤 | Polyamide-imide resin, colorless transparent flexible metal laminate made of the same, and wiring board |
| CN102083271B (en) * | 2009-11-26 | 2015-06-03 | 昆山雅森电子材料科技有限公司 | Cover membrane for printed circuit board |
-
2011
- 2011-12-05 CN CN201110397730.6A patent/CN103140019B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103140019A (en) | 2013-06-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103140019B (en) | The black covering film of flexible circuit board, flexible printed circuit board structure and method for making thereof | |
| CN103140020B (en) | The mulch film of flexible print wiring board, flexible print wiring board structure and method for making thereof | |
| CN102395634A (en) | Electrically conductive ink, and laminate having electrically conductive pattern attached thereto and process for production thereof | |
| WO2007106699A1 (en) | Roll-to-roll manufacturing of electronic and optical materials | |
| WO2008078620A1 (en) | Novel polyimide precursor composition, use thereof and production method thereof | |
| WO2010036049A3 (en) | Polyimide film | |
| CN106853704A (en) | Interior rupture pressure disc for many curved surface touch-control display modules and preparation method thereof | |
| KR102207604B1 (en) | flexible photo imageable coverlay film and manufacturing method thereof | |
| CN202374558U (en) | Cover film for FPC (Flexible Printed Circuit) and FPC structure | |
| CN102083271B (en) | Cover membrane for printed circuit board | |
| CN202773171U (en) | Yellow polyamide-imide protection film used for printed circuit board | |
| CN103140018B (en) | Diaphragm, flexible printed circuit board structure and the method for making thereof of flexible printed wiring board | |
| CN202374559U (en) | Flexible printed circuit board structure | |
| CN202374557U (en) | Black covering film and structure of flexible printed circuit board | |
| CN101577185B (en) | Key panel structure | |
| CN201601890U (en) | Cover film | |
| US20120067625A1 (en) | Suspension board with a circuit for use in a hard disk drive | |
| US7556525B2 (en) | Flexible printed circuit | |
| CN203104944U (en) | Ultra thin ink protection film | |
| CN103019486B (en) | Touch-screen assemble method | |
| CN202435714U (en) | Glue-free single-sided copper foil coated substrate with bonding function | |
| CN202979454U (en) | Combined type stack-up covering film and circuit board with the covering film | |
| CN202679792U (en) | Flexible printed circuit board | |
| CN103635009A (en) | Yellow polyamidoimide protection film for printed circuit board and manufacturing method thereof | |
| CN101488408A (en) | Press-key panel construction of electronic apparatus and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |