CN202979454U - Combined type stack-up covering film and circuit board with the covering film - Google Patents
Combined type stack-up covering film and circuit board with the covering film Download PDFInfo
- Publication number
- CN202979454U CN202979454U CN 201220593859 CN201220593859U CN202979454U CN 202979454 U CN202979454 U CN 202979454U CN 201220593859 CN201220593859 CN 201220593859 CN 201220593859 U CN201220593859 U CN 201220593859U CN 202979454 U CN202979454 U CN 202979454U
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- Prior art keywords
- polyamidoimide
- film
- combined type
- coverlay
- covering film
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Abstract
A combined type stack-up covering film is formed by primary color polyamidoimide film directly formed on the surface of a molded line substrate, and a black polyamidoimide film directly formed on the surface of the primary color polyamidoimide film. The primary color polyamidoimide protection film has good electrical characteristics of good wire space impedance value and high destroying voltage, and has good mechanical characteristics of strong tensile performance, high elongation and high elastic modulus; and the black polyamidoimide protection film has good light-sheltering effect and shielding performance. During the producing process of the combined type stack-up covering film, no release paper is adopted, the non-paper environment-friendly superiority is realized, glass transition temperature characteristic is realized and the flexible performance is good. The flexible printed circuit board with the covering film is suitable for mobile phones, digital cameras, digital video cameras, flat computers, etc.
Description
Technical field
The utility model relates to a kind of yellow PAI diaphragm of low-temperature bake of liquid state and a kind of black PAI diaphragm of liquid state, particularly the PAI diaphragm of the folded structure of combined type of two kinds of ultra-thin printed circuit board (PCB)s that are used for high flexible that are painted on the FPC surface.
Background technology
Printed circuit board (PCB) is material indispensable in electronic product, and along with the consumption electronic products demand growth, also grows with each passing day for the demand of printed circuit board (PCB).Due to flexible printed wiring board (FPC, Flexible Printed Circuit) but have the characteristics such as flexibility and three-dimensional space distribution, emphasize that at the technicalization electronic product development compact, flexibility drives under gesture, computer and ancillary equipment thereof, communication product and consumption electronic products etc. at present are widely used.
Generally speaking, flexible print wiring board is mainly by copper clad laminate (FCCL, Flexible Copper Clad Laminate) and coverlay (CL, Coverlay) consist of, the general plastic film that uses perhaps utilizes screen printing technology to form one deck thin insulating printing ink as coverlay as coverlay.These known coverlays exist that thickness is thicker, fillibility is inhomogeneous, coverlay self short defective in useful life.In addition; most coverlay is the light polyimide film in the market; and the function of covering circuit layout for the polyimides diaphragm is had; there is the secondary coating carried out on FPC as shown in Figure 1 to form and to satisfy opering characteristic of electric apparatus requirement; both possessed the requirement of covering circuit, satisfied again the cloudy surface requirement of dumb light.
The utility model content
in order to overcome defects, the utility model provides a kind of combined type to fold the structure coverlay, it is strong that this coverlay has the property of covering, ultrathin, flexibility is good, pliability is good, no-off paper meets the environmental protection operation, the processability chipless produces and high TG(glass transition temperature) etc. characteristic, be used for replacing general diaphragm material, be better than traditional polyimides diaphragm (the thin PI of thin glue), photosensitive type PI(or acryl are) diaphragm and non-photosensitive type PI diaphragm (photoresistance on need), the utility model also provides the circuit board with this coverlay, flexible print wiring board with this coverlay is applicable to clamshell phone, slide phone, digital camera, digital camera, flat computer and intelligent mobile phone etc.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of combined type is folded the structure coverlay, is made of the primary colors polyamidoimide film that directly is formed at molded circuit base plate surface and the black polyamidoimide film that directly is formed at described primary colors polyamidoimide film surface.
The utility model for the further technical scheme that solves its technical problem and adopt is:
Described primary colors polyamidoimide film is the liquid baking-type primary colors polyamidoimide film that the liquid precursor composition by polyamidoimide is sprayed at molded circuit base plate surface and forms through baking.
Described black polyamidoimide film is the liquid baking-type black polyamidoimide film that the liquid precursor composition by the polyamidoimide that is mixed with atrament is sprayed at described primary colors polyamidoimide film surface and forms through baking.
Better, the thickness of described primary colors polyamidoimide film is the 10-15 micron.
Better, the thickness of described black polyamidoimide film is the 5-10 micron.
A kind of flexible printed wiring board is made of molded circuit base plate and the folded structure coverlay of combined type described in the utility model.
The position that does not cover the folded structure coverlay of described combined type on described molded circuit base plate surface forms the section of windowing.
The beneficial effects of the utility model are: the folded structure coverlay of combined type of the present utility model is formed by primary colors polyamidoimide diaphragm and the folded structure of black polyamidoimide diaphragm, described primary colors polyamidoimide diaphragm has splendid electrical characteristic, comprise that between line, resistance value is good, disintegration voltage is high, have higher mechanical property, comprise that anti-degree is strong, percentage elongation, modulus of elasticity be high; Described black polyamidoimide diaphragm has splendid light-shading effect and covering property.The folded structure coverlay of combined type of the present utility model does not need to use strippable paper in process of production, has the superiority of with no paper environmental protection; Have advantages of that also glass transition temperature characteristic and flexing are good.Flexible print wiring board with the utility model coverlay is applicable to clamshell phone, slide phone, digital camera, digital camera, flat computer and intelligent mobile phone etc.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Below by specific instantiation explanation embodiment of the present utility model, the personage who is familiar with this skill can understand advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can other different mode be implemented, and, under the category that does not disclose departing from the utility model, can give different modifications and change that is.
Embodiment: a kind of combined type is as shown in Figure 1 folded the structure coverlay, is made of the primary colors polyamidoimide film 2 that directly is formed at molded circuit base plate 1 surface and the black polyamidoimide film 3 that directly is formed at described primary colors polyamidoimide film surface.
Described primary colors polyamidoimide film 2 is liquid baking-type primary colors polyamidoimide films that the liquid precursor composition by polyamidoimide is sprayed at molded circuit base plate 1 surface and forms through baking.
Described black polyamidoimide film 3 is liquid baking-type black polyamidoimide films that the liquid precursor composition by the polyamidoimide that is mixed with atrament is sprayed at described primary colors polyamidoimide film 2 surfaces and forms through baking.
Better, the thickness of described primary colors polyamidoimide film is the 10-15 micron.
Better, the thickness of described black polyamidoimide film is the 5-10 micron.
A kind of flexible printed wiring board is made of molded circuit base plate and the folded structure coverlay of combined type described in the utility model.
The position that does not cover the folded structure coverlay of described combined type on described molded circuit base plate 1 surface forms the section 4 of windowing.
The method for making of described flexible printed wiring board is as follows, adopts the mode of secondary coated and molded:
Step 1: with polyamidoimide precursor composition solution direct spraying on molded circuit base plate;
Step 2: the molded circuit base plate that is coated with amide imide precursor composition solution that step 1 is obtained toasts, make the polymerisation in solution of described amide imide precursor composition be cured as primary colors polyamidoimide film, wherein, described baking temperature is 160 ℃～200 ℃, and stoving time is 1～1.5 hour;
Step 3: described black amide imide precursor composition solution direct spraying is surperficial in type liquid baking-type primary colors polyamidoimide film;
Step 4: adopt the low-temperature setting technology that described black amide imide precursor composition solution baking is formed liquid baking-type black polyamidoimide film, described baking temperature is 160 ℃～200 ℃, and stoving time is 1～1.5 hour.
wherein, described step 1 is specific as follows: molded circuit base plate is put fixed position in ink jet printer, in ink jet printer, imageing sensor is confirmed the location conductor on circuit and carries out contraposition and finely tune the mobile accurate contraposition of circuit that makes, then ink jet printer carries out ink jet type spraying take the precursor composition solution of polyamidoimide as raw material according to the designed image that set, ink-jet thickness is 10 microns～15 microns, make the precursor composition solution of polyamidoimide need to cover the covering section of position and the section of windowing of uncovering position in the surface formation of molded circuit base plate after spraying.
wherein, described step 3 is specific as follows: the molded circuit base plate that will have a primary colors polyamidoimide film is put the fixed position in a kind of ink jet printer in sheet production platform formula ink jet printer and the platform-type ink jet printer of volume to volume, in ink jet printer, imageing sensor is confirmed the location conductor on circuit and carries out contraposition and finely tune the mobile accurate contraposition of circuit that makes, then ink jet printer carries out ink jet type spraying take the precursor composition solution of black polyamidoimide as raw material according to the designed image that set, ink-jet thickness is 5 microns～10 microns, make the precursor composition solution of black polyamidoimide cover the surface of in type primary colors polyamidoimide coverlay after spraying.
The comparison of the folded structure coverlay of the combined type of the present embodiment and traditional coverlay sees the following form one and table two:
Table one: the contrast of the folded structure coverlay of the combined type of the present embodiment and traditional coverlay
Table two: the fundamental characteristics of the folded structure coverlay of combined type and traditional coverlay is compared:
The flexibility test
Test condition
Voltage: AC220V
Measuring range: 410 grams
Readable: 0.001 gram
Test R angle: 2.35 mm
Testing procedure is as follows:
1, adjust two feets of tester, make air level be positioned at the leveling instrument center.
2, connect instrument power source, with the instrument zero clearing.
3, open glass door, test piece (size 10 mm * 30 a mm) end is fixed on the holder of pallet top, the other end is stuck on the deck at pallet center, makes test piece become one " U " font, shuts glass door after complete.
4, rotary apparatus right-hand member knob slowly counterclockwise makes the deck slow decreasing, until it contacts with lower square washer, test piece R angle is 2.35 mm at this moment.
5, lamp to be instructed bright after, both can read contravariant power reading.
6, be completed after, the knob dextrorotation to original position, is opened glass door, take off test piece.
7, repeat steps 3-6 suddenly, test other test piece.
The flexibility test
Test condition
Use voltage: AC220V
Test R angle: 1.0 mm
Testing procedure is as follows:
1, adjust two feets of tester, test piece is fixed on tester table;
2, connect instrument power source, with the instrument zero clearing;
Set: test condition:
H:2.0 mm, place, R angle: 1.0 mm
30 beats/mins
32?mm
3, lamp to be instructed bright after, can record the experimental test data;
4, be completed after, the knob dextrorotation to original position, is taken off test piece;
5, repeat above-mentioned steps, test other test piece.
Test result is as shown in following table three:
Table three: the flexibility of the folded structure coverlay of combined type and traditional coverlay and line of deflection contrast:
Claims (6)
1. the folded structure coverlay of combined type, is characterized in that: consist of by directly being formed at the surperficial primary colors polyamidoimide film (2) of molded circuit base plate (1) and directly being formed at the surperficial black polyamidoimide film (3) of described primary colors polyamidoimide film (2).
2. the folded structure coverlay of a kind of combined type as claimed in claim 1 is characterized in that: described primary colors polyamidoimide film (2) is the liquid baking-type primary colors polyamidoimide film that the liquid precursor composition by polyamidoimide is sprayed at molded circuit base plate (1) surface and forms through baking.
3. combined type as claimed in claim 1 is folded the structure coverlay, and it is characterized in that: the thickness of described primary colors polyamidoimide film is the 10-15 micron.
4. combined type as claimed in claim 1 is folded the structure coverlay, and it is characterized in that: the thickness of described black polyamidoimide film is the 5-10 micron.
5. a flexible printed wiring board, is characterized in that: be made of molded circuit base plate (1) and structure coverlay as folded in the described combined type of arbitrary claim in claim 1 to 4.
6. a kind of flexible printed wiring board as claimed in claim 5 is characterized in that: the position that does not cover the folded structure coverlay of described combined type on described molded circuit base plate (1) surface forms the section (4) of windowing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220593859 CN202979454U (en) | 2012-11-13 | 2012-11-13 | Combined type stack-up covering film and circuit board with the covering film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220593859 CN202979454U (en) | 2012-11-13 | 2012-11-13 | Combined type stack-up covering film and circuit board with the covering film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202979454U true CN202979454U (en) | 2013-06-05 |
Family
ID=48520468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220593859 Expired - Lifetime CN202979454U (en) | 2012-11-13 | 2012-11-13 | Combined type stack-up covering film and circuit board with the covering film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202979454U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103813616A (en) * | 2012-11-13 | 2014-05-21 | 昆山雅森电子材料科技有限公司 | Composite stackup covering film, circuit board provided with covering film and manufacturing method thereof |
-
2012
- 2012-11-13 CN CN 201220593859 patent/CN202979454U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103813616A (en) * | 2012-11-13 | 2014-05-21 | 昆山雅森电子材料科技有限公司 | Composite stackup covering film, circuit board provided with covering film and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130605 |
|
| CX01 | Expiry of patent term |