CN103633530A - Interconnection method for coaxial adaptor and printed board transmission line - Google Patents
Interconnection method for coaxial adaptor and printed board transmission line Download PDFInfo
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- CN103633530A CN103633530A CN201310634855.5A CN201310634855A CN103633530A CN 103633530 A CN103633530 A CN 103633530A CN 201310634855 A CN201310634855 A CN 201310634855A CN 103633530 A CN103633530 A CN 103633530A
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- printed board
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Abstract
The invention provides an interconnection method for a coaxial adaptor and a printed board transmission line. The method comprises the steps: step 101), providing the coaxial adaptor and a printed board, and assembling the coaxial adaptor and the printed board in an aluminum alloy box body, wherein a conductor in the coaxial adaptor and the printed board transmission line form surfaces to be welded; step 102), extruding a gold-plated copper strip into a step shape; step 3), two ends of the gold-plated copper strip are interconnected with the conductor and the transmission line by virtue of tin soldering; step 4), cleaning a welding spot and detecting. By adopting the scheme, the connection between the conductor of the coaxial adaptor and the printed board transmission line can be buffered when the environment and operating temperature are changed greatly, the probability of invalidation of the welding spot is greatly lowered, and interconnection invalidation caused by mismatch of thermal expansion coefficients in the hard connection by direct soldering is avoided.
Description
Technical field
The invention belongs to microwave module packaging technology field, in particular a kind of interconnecting method for coaxial adatpter and printed board transmission line.
Background technology
In microwave hybrid integrated circuit, microwave multifunction module, often run into the interconnection between coaxial adatpter and printed board transmission line, at present most situation, adopt the interconnecting method of direct soldering.This interconnection structure belongs to hard connection, when ambient temperature or working temperature acute variation, between the inner wire of coaxial adatpter and printed board material, there is Coefficient of Thermal Expansion mismatch problem, cause solder joint inside to have stress and strain, thereby bring out the inner germinating of solder joint crackle, along with the expansion of crackle finally causes solder joint fracture, lost efficacy, therefore be there is to long-term reliability hidden danger in the quality of product.
Number of patent application: 201110165950.6 disclose the welding method of a kind of coaxial diode and printed board, the method at diode cathode with gold-plated copper strips as Stress Release bridge, replace original scolder firmly to connect, solve the stress problem that the longitudinal thermal coefficient of expansion of printed board causes.
The assembly method of number of patent application 201310187995.2 proposes a kind of high-performance broadband coaxial-micro-tape relay of ceramic dielectric substrate, in the method, the assembling of coaxial adatpter inner wire and the micro-tape relay of ceramic dielectric substrate adopts the also mode of thermocompression bonding of gold ribbon parcel.
The disclosed welding method of number of patent application 201110165950.6, although pointed out to replace original scolder firmly to connect with gold-plated copper strips as Stress Release bridge, but do not provide bending shape, deflection of gold-plated copper strips and preparation method thereof, because while directly applying to the welding of coaxial adatpter inner wire and printed board transmission line using gold-plated copper strips as Stress Release bridge, the parameters such as the bending shape of gold-plated copper strips, deflection are very large on its microwave property impact.
The interconnecting method that number of patent application 201310187995.2 discloses, although pointed out that coaxial adatpter inner wire and the interconnection of ceramic dielectric substrate transmission line can replace by the mode that is flexible coupling of gold ribbon parcel thermocompression bonding original conductive adhesive or directly soldering, but, the mode of gold ribbon parcel thermocompression bonding has special requirement to gold plating quality on transmission line and thickness, and transmission line in printed board adopts the thinner hard gold of plating conventionally, cannot meet the technological requirement of gold ribbon parcel thermocompression bonding, can only adopt at present the mode of scolder soldering to weld, therefore, said method is not suitable for the interconnection of coaxial adatpter inner wire and printed board transmission line yet.
Therefore, there is defect in prior art, needs to improve.
Summary of the invention
Technical problem to be solved by this invention is for the deficiencies in the prior art, and a kind of interconnecting method for coaxial adatpter and printed board transmission line is provided.
Technical scheme of the present invention is as follows: a kind of interconnecting method for coaxial adatpter and printed board transmission line, wherein, comprises the following steps:
Step a a: coaxial adatpter and a printed board are provided and are assembled in aluminium alloy box body, described coaxial adatpter inner wire and described printed board transmission line form junction to be welded;
Step b: gold-plated copper strips is squeezed into step shape;
Step c: gold-plated copper strips two ends are interconnected with described inner wire and described transmission line soldering respectively;
Steps d: clean solder joint check.
In described step a, the diameter of described coaxial adatpter inner wire is 0.3-0.8mm; The basis material of described inner wire is that copper maybe can cut down.
In described step a, it is 0-0.3mm that described coaxial adatpter inner wire and described printed board transmission line form the staggered distance of junction to be welded, and vertical height distance is 0.05-0.25mm.
In described step a, the dielectric material of described printed board is
6202, R04003C or R04350B.
In described step b, the basis material of described gold-plated copper strips is red copper alloy, and thickness is 10-30 μ m, and plating oil gidling layer thickness is 0.1-0.5 μ m.
In described step b, use frock that gold-plated copper strips is converted into step shape, concrete method is: adopt special-purpose concave-convex mold fixture by gold plated copper band push, Shape correction, be processed into step shape.
In described step c, the material of described scolding tin is Sn60Pb40 or Sn63Pb37.
In described step c, the gold-plated copper strips total length after described soldering interconnection is by with the coaxial adatpter inner wire solder joint lap of splice, with the horizontal perimetric length of overlap joint line, upper arc length, vertical-direction length, the lower arc length of coaxial adatpter inner wire solder joint with form with the lap of splice six parts of printed board transmission line solder joint; The 1-3 that the gold plated copper strip length of described coaxial adatpter inner wire and printed board transmission line solder joint overlap joint is gold plated copper bandwidth doubly, with the gold plated copper strip length of the horizontal extension of coaxial adatpter inner wire solder joint overlap joint line be inner wire top width 0.5-1 doubly.
In described steps d, the method for described cleaning solder joint is for being used cotton ball soaked in alcohol that solder joint is cleaned up.
Adopt such scheme, the transition band interconnecting between inner wire using gold-plated copper strips as coaxial adatpter and printed board transmission line, and gold-plated copper strips is made into step, during welding, reserve enough baffle safety distances, make when larger environment and temperature change, can play cushioning effect between the inner wire of coaxial adatpter and printed board transmission line, effectively reduce the internal stress in interconnect welds, greatly reduce the failure probability of pad, the interconnect failure directly causing because of coefficient of thermal expansion mismatch in this hard connection of soldering between the inner wire of avoiding coaxial adatpter and printed board transmission line.
Accompanying drawing explanation
Fig. 1 is interconnecting method flow chart of the present invention;
Fig. 2 is for being used coaxial adatpter and the printed board transmission line structure schematic diagram of interconnecting method of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
Embodiment 1
As shown in Figure 1, Fig. 1 is a kind of interconnecting method flow chart for coaxial adatpter and printed board transmission line provided by the invention, and the method comprises the following steps:
Step 101 a: coaxial adatpter and a printed board are provided and are assembled in aluminium alloy box body, described coaxial adatpter inner wire and described printed board transmission line form junction to be welded;
Step 102: gold-plated copper strips is squeezed into step shape;
Step 103: gold-plated copper strips two ends are interconnected with described inner wire and described transmission line soldering respectively;
Step 104: clean solder joint check.
In above-mentioned steps 101, the diameter of coaxial adatpter inner wire is 0.3-0.8mm, and basis material is that copper maybe can cut down.
In above-mentioned steps 101, the staggered distance that coaxial adatpter inner wire and printed board transmission line form solder side is 0-0.3mm, and vertical height distance is 0.05-0.25mm.
In above-mentioned steps 101, described printed board dielectric material is
6202, R04003C or R04350B.
In above-mentioned steps 102, the basis material of gold-plated copper strips is red copper alloy, and thickness is 10-30 μ m, and plating oil gidling layer thickness is 0.1-0.5 μ m.
In above-mentioned steps 102, use method that frock is converted into gold-plated copper strips step for adopt special-purpose concave-convex mold fixture by gold plated copper band push, Shape correction, be processed into step shape.
In above-mentioned steps 103, soldering tin material is Sn60Pb40 or Sn63Pb37.
In above-mentioned steps 103, the gold-plated copper strips total length after soldering interconnection is by with the inner wire solder joint lap of splice, with the horizontal perimetric length of inner wire solder joint overlap joint line, upper arc length, vertical-direction length, lower arc length with form with the printed board transmission line solder joint lap of splice six parts.The 1-3 that is gold plated copper bandwidth with inner wire with the gold plated copper strip length of printed board transmission line solder joint overlap joint doubly, with the gold plated copper strip length of the horizontal extension of inner wire solder joint overlap joint line be inner wire top width 0.5-1 doubly.
In above-mentioned steps 104, the method for cleaning solder joint is to use cotton ball soaked in alcohol that solder joint is cleaned up.
Based on the above method, provide a kind of specific embodiment of the interconnecting method for coaxial adatpter and printed board transmission line to be described in further detail the present invention.As shown in Figure 2, according to circuit drawing requirement, one coaxial adatpter and a printed board are provided and are assembled in silver coated aluminum alloy box body, printed board 5 adopts screw to be fixed on silver coated aluminum alloy box body, coaxial adatpter adopts screw or glue to be fixed on silver coated aluminum alloy box body, the diameter of coaxial adatpter inner wire 4 is 0.3mm, basis material is for cutting down, and coating is Ni/Au, and printed board 5 dielectric materials are R04350B.Coaxial adatpter inner wire 4 forms junction to be welded with printed board transmission line 7, and coaxial adatpter inner wire 4 is 0.1mm with the staggered distance that printed board transmission line 7 forms solder side, and vertical height distance is 0.1mm.
A preferred gold-plated copper strips, it is the red copper alloy that 20 μ m are thick that gold-plated copper strips is selected basis material, then 1 μ m and gold-plated 0.5 μ m on its surface successively nickel plating, gold plated copper bandwidth 0.3mm, length 1.5mm.After electronickelling, gold object be to make gold-plated copper strips be easy to brazing, and can meet surfacecti proteon performance requirement.Next adopt special-purpose concave-convex mold fixture by gold plated copper band push, Shape correction, be processed into step shape.
The gold-plated copper strips of step two ends are interconnected with above-mentioned coaxial adatpter inner wire 4 and 7 solderings of printed board transmission line respectively.Gold-plated copper strips total length after soldering interconnection is by with the inner wire solder joint lap of splice 8, with the horizontal perimetric length 9 of inner wire solder joint overlap joint line, upper arc length 10, vertical-direction length 11, lower arc length 12 with form with the printed board transmission line solder joint lap of splice 13 6 parts.With inner wire with the gold plated copper strip length of printed board transmission line solder joint overlap joint, be 1.5 times of gold plated copper bandwidth, with the gold plated copper strip length of the horizontal extension of inner wire solder joint overlap joint line be 0.5 times of inner wire top width.The concrete grammar that welds gold-plated copper strips is: the silver coated aluminum alloy box body that is assembled with coaxial adatpter and printed board is placed on to preheating 10min on 120 ℃ of heating stations, is placed on inner wire 4 tops of printed board transmission line 7 and coaxial adatpter with the gold-plated copper strips of tweezers gripping.Under the microscope of magnify 20 number, with medical surgical knife, cutting appropriate fusing point is 183 ℃, the Sn63Pb37 solder stick that diameter is 0.5mm.The flatiron that by solder horn temperature is 280 ℃ heats gold plated copper band, the solder stick cutting under microscope is placed on printed board transmission line 7 and interconnection place of gold-plated copper strips simultaneously, solder stick is fully melted, flow into the centre of gold-plated copper strips and printed board transmission line 7, form good solder joint 14.With the solder horn of same temperature, the gold plated copper band of coaxial adatpter inner wire 4 tops is heated again, in inner wire 4 and interconnection place of gold-plated copper strips of coaxial adatpter, put the solder stick cutting in advance, it is fully melted, form good solder joint 15.Be controlled in 1-3s the weld time of each solder joint.
Clean solder joint check.With cotton ball soaked in alcohol, the unnecessary scaling powder in interconnection solder joint place, scolding tin residue etc. are cleaned up.
According to correlation test method in GJB548B-2005 < < microelectronic component Test Methods And Procedures > >, to using the gold-plated copper strips of step that the microwave component product of above-mentioned coaxial adatpter and printed board transmission line soldering interconnection has successively been carried out to the environmental tests such as temperature cycles, temperature shock and mechanical oscillation.Be placed on the micro-Microscopic observation that amplifies 30 multiples, solder joint is intact, do not ftracture, lost efficacy, owing to there being the interconnection structure of metal transfer band, absorb and cushioned the inner thermal stress existing of solder joint, making originally because the weld failure problem that in this hard connection, coefficient of thermal expansion mismatch causes has obtained effective solution.
Should be understood that, for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection range of claims of the present invention.
Claims (9)
1. for an interconnecting method for coaxial adatpter and printed board transmission line, it is characterized in that, comprise the following steps:
Step 101 a: coaxial adatpter and a printed board are provided and are assembled in aluminium alloy box body, described coaxial adatpter inner wire and described printed board transmission line form junction to be welded;
Step 102: gold-plated copper strips is squeezed into step shape;
Step 103: gold-plated copper strips two ends are interconnected with described inner wire and described transmission line soldering respectively;
Step 104: clean solder joint check.
2. interconnecting method as claimed in claim 1, is characterized in that, in described step 101, the diameter of coaxial adatpter inner wire is 0.3-0.8mm; The basis material of described inner wire is that copper maybe can cut down.
3. interconnecting method as claimed in claim 1, is characterized in that, in described step 101, it is 0-0.3mm that described coaxial adatpter inner wire and described printed board transmission line form the staggered distance of junction to be welded, and vertical height distance is 0.05-0.25mm.
4. interconnecting method as claimed in claim 1, is characterized in that, in described step 101, the dielectric material of described printed board is
6202, R04003C or R04350B.
5. interconnecting method as claimed in claim 1, is characterized in that, in described step 102, the basis material of described gold-plated copper strips is red copper alloy, and thickness is 10-30 μ m, and plating oil gidling layer thickness is 0.1-0.5 μ m.
6. interconnecting method as claimed in claim 1, it is characterized in that, in described step 102, use frock that gold-plated copper strips is converted into step shape, concrete method is: adopt special-purpose concave-convex mold fixture by gold plated copper band push, Shape correction, be processed into step shape.
7. interconnecting method as claimed in claim 1, is characterized in that, in described step 103, the material of described scolding tin is Sn60Pb40 or Sn63Pb37.
8. interconnecting method as claimed in claim 1, it is characterized in that, in described step 103, the gold-plated copper strips total length after described soldering interconnection is by with the coaxial adatpter inner wire solder joint lap of splice, with the horizontal perimetric length of overlap joint line, upper arc length, vertical-direction length, the lower arc length of coaxial adatpter inner wire solder joint with form with the lap of splice six parts of printed board transmission line solder joint; The 1-3 that the gold plated copper strip length of described coaxial adatpter inner wire and printed board transmission line solder joint overlap joint is gold plated copper bandwidth doubly, with the gold plated copper strip length of the horizontal extension of coaxial adatpter inner wire solder joint overlap joint line be inner wire top width 0.5-1 doubly.
9. interconnecting method as claimed in claim 1, is characterized in that, in described step 104, the method for described cleaning solder joint is for being used cotton ball soaked in alcohol that solder joint is cleaned up.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310634855.5A CN103633530B (en) | 2013-12-02 | 2013-12-02 | A kind of interconnecting method for coaxial adatpter and printed board transmission line |
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| CN201310634855.5A CN103633530B (en) | 2013-12-02 | 2013-12-02 | A kind of interconnecting method for coaxial adatpter and printed board transmission line |
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| CN103633530A true CN103633530A (en) | 2014-03-12 |
| CN103633530B CN103633530B (en) | 2015-10-28 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111725592A (en) * | 2019-03-20 | 2020-09-29 | 华为技术有限公司 | Phase shifter, antenna and base station |
| CN114083169A (en) * | 2021-12-13 | 2022-02-25 | 上海无线电设备研究所 | Flexible connection process method and tool for converting radio frequency coaxial to microstrip |
| CN116487910A (en) * | 2023-06-25 | 2023-07-25 | 陕西华达科技股份有限公司 | Omega-shaped bonding sheet and power divider thereof |
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| CN103326101A (en) * | 2013-05-20 | 2013-09-25 | 中国电子科技集团公司第四十一研究所 | Method for assembling transferring of broadband high-performance coaxial-ceramic dielectric substrate micro-strip |
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| CN86106553A (en) * | 1985-09-27 | 1987-04-22 | 株式会社日立制作所 | Electric component with lead end |
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| GB2251344A (en) * | 1990-12-03 | 1992-07-01 | Rheinmetall Gmbh | Connecting surface mount devices to printed circuit boards. |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111725592A (en) * | 2019-03-20 | 2020-09-29 | 华为技术有限公司 | Phase shifter, antenna and base station |
| CN114083169A (en) * | 2021-12-13 | 2022-02-25 | 上海无线电设备研究所 | Flexible connection process method and tool for converting radio frequency coaxial to microstrip |
| CN116487910A (en) * | 2023-06-25 | 2023-07-25 | 陕西华达科技股份有限公司 | Omega-shaped bonding sheet and power divider thereof |
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| CN103633530B (en) | 2015-10-28 |
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