CN102300419A - Welding method of coaxial diode and circuit board - Google Patents
Welding method of coaxial diode and circuit board Download PDFInfo
- Publication number
- CN102300419A CN102300419A CN201110165950A CN201110165950A CN102300419A CN 102300419 A CN102300419 A CN 102300419A CN 201110165950 A CN201110165950 A CN 201110165950A CN 201110165950 A CN201110165950 A CN 201110165950A CN 102300419 A CN102300419 A CN 102300419A
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- circuit board
- diode
- welding
- coaxial
- coaxial diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention discloses a welding method of a coaxial diode and a circuit board. A gold-plating copper strip is used as a stress release bridge at the anode of the diode to replace the original solder hard link, so as to solve the problem of stress caused by the longitudinal coefficient of thermal expansion of the circuit board; an In52Sn48 solder is adopted, thus the heat-resistance fatigue capability and uniform elongation are improved, and the reliability of a welding spot is ensured; and the welding area of the cathode of the diode is increased, and the welding spot intensity is ensured by arranging a collet. By utilizing the welding method provided by the invention, the thermal stress caused by different coefficients of thermal expansion of a circuit board material and a diode ceramic body material, and the welding failure or potential hidden danger caused by the thermal stress are resolved, thus improving the quality of the welding spot and the reliability of the product.
Description
Technical field
The present invention relates to the welding method of a kind of microwave device manufacture method, especially coaxial diode and circuit board.
Background technology
Regulation among the space flight industry standard QJ3172-2003 of the People's Republic of China (PRC) " microwave device installation specification ", the assembling of cylindrical microwave diode should be adopted the earth terminal of spill solder horn welding diode, solder joint requires even and smooth, require scolder that its earth terminal is all encased, during the welding of circuit board surface electrode, the solder joint ledge should be not more than 2mm, scolder can not cross flow to the top of electrode.It only the shape of butt welding point claim, mainly have following problem and defective:
A. the different thermal stress that cause of the thermal coefficient of expansion of dielectric material and diode material are not done effective explanation.
B. do not take the Stress Release measure.
C. the solder joint efficient weld area is less relatively.
The cavity of coaxial (or cylindrical) diode is a ceramic material, circuit board material is the rogers plate, the thermal coefficient of expansion contrast of rogers plate commonly used and ceramic material sees attached list 1, by vertical thermal coefficient of expansion that direct relation is arranged with weld failure in the table as can be seen, maximum differs 34.8 times, and minimum also has 3.5 times.Because the selection of material is subjected to the restriction of microwave frequency, product size, selecting for use of common used material is restricted, and the thermal coefficient of expansion deviation is unavoidable, so thermal stress is inevitable.If there is not effective Stress Release channel, can causes thermal stress hidden danger or directly cause weld failure.
Summary of the invention
The technical problem to be solved in the present invention provides the welding method of a kind of coaxial diode and circuit board.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
The welding method of a kind of coaxial diode and circuit board is characterized in that said method comprising the steps of:
A. circuit board welding: ward off the Sn96.5Ag3.5 scolder at the copper carrier with by the circuit board solder side that microstrip line and dielectric material are formed, on 235 ℃ ± 5 ℃ heating stations, weld together, compress, take off after the cooling with briquetting with circuit board with the copper carrier;
B. the chamfering of punching: described circuit board and and the copper carrier on, press the installation diagram position, beat and assemble through hole, described through-hole aperture and coaxial diode are suitable; With drill bit chamfering on described copper carrier, the degree of depth of described chamfering is the thickness of described copper carrier, forms bellmouth, and wards off the In52Sn48 scolder at the position of chamfering;
C. carrier and diode are warded off tin in advance: In52Sn48 scolding tin is warded off in the welding position at described bellmouth and coaxial diode negative pole, wards off tin length and is at least 0.5mm;
D. diode welding: mount support is placed on 100 ℃ ± 5 ℃ heated at constant temperature platforms of high temperature in advance, was at least heating time 5 minutes; Circuit board to be assembled is placed on support after last 2 minute, put into described assembling through hole with finishing the described coaxial diode of warding off tin in advance, circuit board one side at the anodal place of described coaxial diode, with 183 ℃ ± 5 ℃ scolding tin to the spot welding of described coaxial diode positive pole pre-determined bit; The reverse circuit plate, it is reapposed on the support, dips in In52Sn48 scolding tin with 280 ℃ ± 5 ℃ sharp flatirons and weld described coaxial diode negative pole and carrier, mobile solder horn, scolding tin is fully immersed in the described bellmouth, treat to take off circuit board after scolder tamps described bellmouth; With the circuit board upset, be placed on the support, weld gold-plated copper strips with 183 ℃ of scolding tin, weld described coaxial diode positive pole and microstrip line;
E. clean check: the circuit board positive and negative is cleaned up with the latex sponge.
Described dielectric material is CeramTecRubailit 710Al2O3 or RT/duroid 5880 or RT/duroid 6002 or RT/duroid 6010LM.
Adopt the beneficial effect that technique scheme produced to be:
1, at diode cathode, as the Stress Release bridge, replace original scolder hard link with gold-plated copper strips, solve the stress problem that the vertical thermal coefficient of expansion of circuit board causes.
2, adopt the In52Sn48 scolder, improve thermal fatigue resistance ability and uniform elongation, guarantee the reliability of solder joint.
3, add blocking, increase the diode cathode bonding area, guarantee Joint Strength.
4, the invention solves by the different thermal stress that cause of circuit board material, and, improve quality of welding spot and product reliability by weld failure or potential risk that thermal stress causes with diode porcelain body material thermal expansion coefficient.
Description of drawings
Fig. 1 is the welding method schematic diagram (coaxial diode does not cut open among the figure) of coaxial diode of the present invention and circuit board.
1 is that copper carrier 2 is In52Sn48 scolder for coaxial diode anodal 7 for coaxial diode negative pole 8 for microstrip line 6 for gold-plated copper strips 5 for porcelain ring 4 for dielectric material 3.
Embodiment
The welding method of a kind of coaxial diode and circuit board is characterized in that said method comprising the steps of:
A. circuit board welding: ward off the Sn96.5Ag3.5 scolder at copper carrier 1 with by the circuit board solder side that microstrip line 5 and dielectric material 2 are formed, on 235 ℃ of heating stations, weld together, compress, take off after the cooling with briquetting with circuit board with copper carrier 1;
B. the chamfering of punching: described circuit board and and copper carrier 1 on, press the installation diagram position, beat and assemble through hole, described through-hole aperture is ф 1.3mm; With 120 ° Φ, 5 drill bits chamfering on described copper carrier 1, the degree of depth of described chamfering is the thickness of described copper carrier 1, forms bellmouth, and wards off the In52Sn48 scolder at the position of chamfering;
C. carrier and diode are warded off tin in advance: In52Sn48 scolding tin is warded off in the welding position at described bellmouth and coaxial diode negative pole 7, and warding off tin length is 0.5mm;
D. diode welding: mount support is placed on 100 ℃ of heated at constant temperature platforms of high temperature in advance, was at least heating time 5 minutes; Circuit board to be assembled is placed on support after last 2 minute, put into described assembling through hole with finishing the described coaxial diode of warding off tin in advance, circuit board one side at anodal 6 places of described coaxial diode, with 183 ℃ ± 5 ℃ scolding tin to the 6 pre-determined bit spot welding of described coaxial diode positive pole; The reverse circuit plate, it is reapposed on the support, dips in In52Sn48 scolding tin with 280 ℃ sharp flatirons and weld described coaxial diode negative pole 7 and carrier, mobile solder horn, scolding tin is fully immersed in the described bellmouth, treat to take off circuit board after scolder tamps described bellmouth; With the circuit board upset, be placed on the support, weld gold-plated copper strips 4 with 183 ℃ of scolding tin, weld described coaxial diode anodal 6 and microstrip line 5;
E. clean check: the circuit board positive and negative is cleaned up with the latex sponge.
Described dielectric material 2 is CeramTecRubailit 710Al2O3.
The thermal coefficient of expansion comparison sheet of subordinate list 1. rogers plates commonly used and ceramic material
Claims (2)
1. the welding method of coaxial diode and circuit board is characterized in that said method comprising the steps of:
A. circuit board welding: ward off the Sn96.5Ag3.5 scolder at copper carrier (1) with by the circuit board solder side that microstrip line (5) and dielectric material (2) are formed, on 235 ℃ ± 5 ℃ heating stations, weld together with circuit board with copper carrier (1), compress with briquetting, take off after the cooling;
B. the chamfering of punching: described circuit board and and copper carrier (1) on, press the installation diagram position, beat and assemble through hole, described through-hole aperture and coaxial diode are suitable; Go up chamfering with drill bit at described copper carrier (1), the degree of depth of described chamfering is the thickness of described copper carrier (1), forms bellmouth, and wards off the In52Sn48 scolder at the position of chamfering;
C. carrier and diode are warded off tin in advance: In52Sn48 scolding tin is warded off in the welding position at described bellmouth and coaxial diode negative pole (7), wards off tin length and is at least 0.5mm;
D. diode welding: mount support is placed on 100 ℃ ± 5 ℃ heated at constant temperature platforms of high temperature in advance, was at least heating time 5 minutes; Circuit board to be assembled is placed on support after last 2 minute, put into described assembling through hole with finishing the described coaxial diode of warding off tin in advance, circuit board one side at described coaxial diode positive pole (6) place, with 183 ℃ ± 5 ℃ scolding tin to described coaxial diode positive pole (6) pre-determined bit spot welding; The reverse circuit plate, it is reapposed on the support, dips in In52Sn48 scolding tin with 280 ℃ ± 5 ℃ sharp flatirons and weld described coaxial diode negative pole (7) and carrier, mobile solder horn, scolding tin is fully immersed in the described bellmouth, treat to take off circuit board after scolder tamps described bellmouth; With the circuit board upset, be placed on the support, weld gold-plated copper strips (4) with 183 ℃ ± 5 ℃ scolding tin, weld described coaxial diode positive pole (6) and microstrip line (5);
E. clean check: the circuit board positive and negative is cleaned up with the latex sponge.
2. based on the welding method of described a kind of coaxial diode of claim 1 and circuit board, it is characterized in that described dielectric material (2) is CeramTecRubailit 710Al2O3 or RT/duroid 5880 or RT/duroid 6002 or RT/duroid 6010LM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110165950 CN102300419B (en) | 2011-06-20 | 2011-06-20 | Welding method of coaxial diode and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110165950 CN102300419B (en) | 2011-06-20 | 2011-06-20 | Welding method of coaxial diode and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102300419A true CN102300419A (en) | 2011-12-28 |
| CN102300419B CN102300419B (en) | 2012-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110165950 Active CN102300419B (en) | 2011-06-20 | 2011-06-20 | Welding method of coaxial diode and circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103633530A (en) * | 2013-12-02 | 2014-03-12 | 中国电子科技集团公司第四十一研究所 | Interconnection method for coaxial adaptor and printed board transmission line |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040211060A1 (en) * | 2003-04-24 | 2004-10-28 | Tadatomo Suga | Method of mounting an electronic part |
| CN1889813A (en) * | 2006-07-20 | 2007-01-03 | 黄明 | Light-emitting diode forming welding method and used fixed lamp-socket for realizing the same method |
| CN101568229A (en) * | 2008-04-22 | 2009-10-28 | 先进开发光电股份有限公司 | Welding method of light emitting diode |
-
2011
- 2011-06-20 CN CN 201110165950 patent/CN102300419B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040211060A1 (en) * | 2003-04-24 | 2004-10-28 | Tadatomo Suga | Method of mounting an electronic part |
| CN1889813A (en) * | 2006-07-20 | 2007-01-03 | 黄明 | Light-emitting diode forming welding method and used fixed lamp-socket for realizing the same method |
| CN101568229A (en) * | 2008-04-22 | 2009-10-28 | 先进开发光电股份有限公司 | Welding method of light emitting diode |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103633530A (en) * | 2013-12-02 | 2014-03-12 | 中国电子科技集团公司第四十一研究所 | Interconnection method for coaxial adaptor and printed board transmission line |
| CN103633530B (en) * | 2013-12-02 | 2015-10-28 | 中国电子科技集团公司第四十一研究所 | A kind of interconnecting method for coaxial adatpter and printed board transmission line |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102300419B (en) | 2012-11-07 |
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