CN103633034A - 影像感测器模组及取像模组 - Google Patents
影像感测器模组及取像模组 Download PDFInfo
- Publication number
- CN103633034A CN103633034A CN201210302301.0A CN201210302301A CN103633034A CN 103633034 A CN103633034 A CN 103633034A CN 201210302301 A CN201210302301 A CN 201210302301A CN 103633034 A CN103633034 A CN 103633034A
- Authority
- CN
- China
- Prior art keywords
- image sensor
- ceramic substrate
- accepting groove
- module
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 10
- 239000003351 stiffener Substances 0.000 claims description 10
- 239000007789 gas Substances 0.000 abstract description 9
- 230000004308 accommodation Effects 0.000 abstract 4
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 239000003292 glue Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
取像模组 | 100 |
影像感测器模组 | 200 |
底板 | 10 |
软性电路板 | 11 |
第一表面 | 111 |
第二表面 | 112 |
粘接层 | 12 |
加强板 | 13 |
导电胶 | 20 |
陶瓷基板 | 30 |
上表面 | 31 |
透光孔 | 311 |
下表面 | 32 |
收容槽 | 321 |
连接面 | 322 |
第一连接点 | 323 |
第二连接点 | 324 |
侧面 | 33 |
逃气孔 | 331 |
影像感测器 | 40 |
感测面 | 41 |
引脚 | 42 |
填充体 | 50 |
滤光片 | 60 |
镜头模组 | 300 |
镜座 | 70 |
座体 | 71 |
收容部 | 72 |
镜头孔 | 721 |
镜头 | 80 |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210302301.0A CN103633034B (zh) | 2012-08-23 | 2012-08-23 | 影像感测器模组及取像模组 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210302301.0A CN103633034B (zh) | 2012-08-23 | 2012-08-23 | 影像感测器模组及取像模组 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103633034A true CN103633034A (zh) | 2014-03-12 |
CN103633034B CN103633034B (zh) | 2017-10-20 |
Family
ID=50213908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210302301.0A Expired - Fee Related CN103633034B (zh) | 2012-08-23 | 2012-08-23 | 影像感测器模组及取像模组 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103633034B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110572537A (zh) * | 2018-06-05 | 2019-12-13 | 三赢科技(深圳)有限公司 | 影像模组 |
TWI686081B (zh) * | 2017-05-17 | 2020-02-21 | 群光電子股份有限公司 | 影像模組 |
CN111323993A (zh) * | 2018-12-15 | 2020-06-23 | 三赢科技(深圳)有限公司 | 镜头模组及电子装置 |
CN112135029A (zh) * | 2020-09-30 | 2020-12-25 | 格科微电子(上海)有限公司 | 摄像头模组及装配方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1441964A (zh) * | 2000-04-11 | 2003-09-10 | 浜松光子学株式会社 | 半导体光检测装置 |
CN102379039A (zh) * | 2009-11-26 | 2012-03-14 | 京瓷株式会社 | 配线基板及摄像装置以及摄像装置模块 |
KR20120032352A (ko) * | 2010-09-28 | 2012-04-05 | 엘지이노텍 주식회사 | 카메라 모듈 |
-
2012
- 2012-08-23 CN CN201210302301.0A patent/CN103633034B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1441964A (zh) * | 2000-04-11 | 2003-09-10 | 浜松光子学株式会社 | 半导体光检测装置 |
CN102379039A (zh) * | 2009-11-26 | 2012-03-14 | 京瓷株式会社 | 配线基板及摄像装置以及摄像装置模块 |
KR20120032352A (ko) * | 2010-09-28 | 2012-04-05 | 엘지이노텍 주식회사 | 카메라 모듈 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI686081B (zh) * | 2017-05-17 | 2020-02-21 | 群光電子股份有限公司 | 影像模組 |
CN110572537A (zh) * | 2018-06-05 | 2019-12-13 | 三赢科技(深圳)有限公司 | 影像模组 |
CN111323993A (zh) * | 2018-12-15 | 2020-06-23 | 三赢科技(深圳)有限公司 | 镜头模组及电子装置 |
CN112135029A (zh) * | 2020-09-30 | 2020-12-25 | 格科微电子(上海)有限公司 | 摄像头模组及装配方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103633034B (zh) | 2017-10-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8976291B2 (en) | Image sensor module with substrate defining gas pressure relieving hole and camera module using same | |
US9007499B2 (en) | Image sensor module and camera module using same | |
CN103904040A (zh) | 影像感测器模组及取像模组 | |
TWI514482B (zh) | Manufacturing method of semiconductor device | |
US8780243B2 (en) | Image sensor module and camera module using same | |
US9041849B2 (en) | Image sensor module and camera module using same | |
US20140212127A1 (en) | Device allowing independent testing of dual camera module | |
US9030602B2 (en) | Image sensor module and camera module using same | |
US9013621B2 (en) | Image sensor module and camera module using same | |
CN103633033A (zh) | 影像感测器模组及取像模组 | |
US8982257B2 (en) | Image sensor module and camera module using same | |
US8917340B2 (en) | Circuit board assembly and camera module using same | |
CN103633034A (zh) | 影像感测器模组及取像模组 | |
KR101632343B1 (ko) | 이중 인쇄회로기판을 이용한 카메라 모듈 | |
CN103780803A (zh) | 取像模组 | |
KR100716788B1 (ko) | 이미지 센서 모듈용 기판 및 이를 이용한 이미지 센서 모듈 | |
KR101360390B1 (ko) | 터치 스크린 패널 | |
JP2015038991A (ja) | 半導体装置の製造方法 | |
KR100653551B1 (ko) | 초음파 접합을 이용한 이미지센서의 칩 스케일 패키지제조방법 | |
CN103839895A (zh) | 影像感测器模组及取像模组 | |
KR101353127B1 (ko) | 이미지 센서 패키지 | |
CN103594427A (zh) | 影像感测器模组及取像模组 | |
EP1526579A3 (en) | Solid-state imaging device and method for manufacturing the same | |
KR101037481B1 (ko) | 카메라 모듈의 제조방법 | |
CN103594426A (zh) | 影像感测器模组及取像模组 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
EXSB | Decision made by sipo to initiate substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170113 Address after: Guangdong province Shenzhen city Baoan District town Longhua tenth Industrial Zone tabulaeformis East Ring Road No. two two Applicant after: FUHONGYANG PRECISION INDUSTRY (SHENZHEN) Co.,Ltd. Applicant after: HON HAI PRECISION INDUSTRY Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) Co.,Ltd. Applicant before: HON HAI PRECISION INDUSTRY Co.,Ltd. |
|
CB02 | Change of applicant information |
Address after: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. two two Applicant after: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.,LTD. Applicant after: HON HAI PRECISION INDUSTRY Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. two two Applicant before: FUHONGYANG PRECISION INDUSTRY (SHENZHEN) Co.,Ltd. Applicant before: HON HAI PRECISION INDUSTRY Co.,Ltd. |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171020 |
|
CF01 | Termination of patent right due to non-payment of annual fee |