CN103632983A - Ceramic support for pre-oxidating copper sheet - Google Patents
Ceramic support for pre-oxidating copper sheet Download PDFInfo
- Publication number
- CN103632983A CN103632983A CN201310595905.3A CN201310595905A CN103632983A CN 103632983 A CN103632983 A CN 103632983A CN 201310595905 A CN201310595905 A CN 201310595905A CN 103632983 A CN103632983 A CN 103632983A
- Authority
- CN
- China
- Prior art keywords
- ceramic
- copper
- copper sheet
- sheet
- oxidating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 239000000919 ceramic Substances 0.000 title claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 42
- 239000010949 copper Substances 0.000 title claims abstract description 42
- 239000011889 copper foil Substances 0.000 claims abstract description 18
- 238000005452 bending Methods 0.000 claims abstract description 17
- 230000003647 oxidation Effects 0.000 claims description 27
- 238000007254 oxidation reaction Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 abstract description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052593 corundum Inorganic materials 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 abstract description 3
- 239000001301 oxygen Substances 0.000 abstract description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
Abstract
The invention discloses a ceramic support for pre-oxidating a copper sheet. The ceramic support comprises a ceramic sheet body and copper foils; ceramic bending parts are arranged at two ends of the ceramic sheet body; the copper foils are attached to the inner surfaces of the ceramic sheet body and the ceramic bending parts; the central lines of the copper foils are coincided with the folding marks of the connecting parts of the ceramic sheet body and the ceramic bending parts; the ceramic bending parts are vertical to the ceramic sheet body. The ceramic sheet body and the ceramic bending parts are 0.635mm thick; the copper foils are 0.1-0.4mm thick. According to the ceramic support for pre-oxidating the ceramic sheet, the copper sheet is directly placed on the support to be oxidated instead of being placed on a conveyor belt to be pre-oxidated with one surface, so a certain dangling degree exists between the copper sheet and the conveyor belt, the smooth flowing of oxygen is ensured, and double surfaces of the copper sheet are uniformly oxidated. The surface grain state after the product is sintered is improved, and the roughness is uniform. According to the ceramic support for pre-oxidating the copper sheet, the ceramic sheet made of Al2O3 and the copper foils are adopted as the making material of a jig which is made with a DBC (Direct Bonding Copper) method, and the jig is simple in structure and durable.
Description
Technical field
The invention belongs to semiconductor manufacture, LED, optical communication field, particularly a kind of ceramics bracket for copper sheet pre-oxidation.
Background technology
Directly cover before copper ceramic substrate (DBC substrate) sintering, copper sheet all needs to process through pre-oxidation process.At present conventional copper sheet pre-oxidation process carries out pre-oxidation for directly copper sheet being placed in oxidizing atmosphere on conveyer belt.Because copper sheet directly contacts with conveyer belt, copper sheet is substantially in the one side state of oxidation.Copper sheet and conveyer belt contact position are understood dysoxidation, have been polluted copper sheet surface simultaneously, have affected product surface crystal grain roughness and presentation quality, and chips welding and surperficial routing performance also decline.
Summary of the invention
The object of the present invention is to provide a kind of product surface crystal grain that improves, improve the ceramics bracket for copper sheet pre-oxidation of product yields.
For solving the problems of the technologies described above, the present invention is for the ceramics bracket of copper sheet pre-oxidation, and potsherd body, is provided with ceramic bending part at the two ends of described potsherd body; Copper Foil, described Copper Foil is fitted in the inner surface of described potsherd body and described ceramic bending part, and the center line of described Copper Foil overlaps with the folding line of described ceramic bending part junction with described potsherd body.
Described ceramic bending part is perpendicular to described potsherd body.The thickness of described potsherd body and described ceramic bending part is 0.635 millimeter.The thickness of described Copper Foil is 0.1 millimeter～0.4 millimeter.
The present invention is placed directly on conveyer belt one side pre-oxidation for the ceramics bracket of copper sheet pre-oxidation by copper sheet and changes into copper sheet is placed on support and is oxidized, making has certain unsettled degree between copper sheet and conveyer belt, guarantee the mobile smooth and easy of oxygen, made the two-sided oxidation of copper sheet even.Improved product sintering rear surface crystal grain state, roughness is even.The present invention adopts the potsherd of Al2O3 and Copper Foil as the making material of tool for the ceramics bracket of copper sheet pre-oxidation, by DBC method, makes, and jig structure is simple, durable.
Accompanying drawing explanation
Fig. 1 is that the present invention is for the ceramic stand structure schematic diagram of copper sheet pre-oxidation;
Fig. 2 is that the present invention is for the ceramics bracket use schematic diagram of copper sheet pre-oxidation.
The present invention is used for the ceramics bracket accompanying drawing description of reference numerals of copper sheet pre-oxidation:
1-potsherd body 2-pottery bending part 3-Copper Foil
4-conveyer belt 5-treats cupric oxide plate 6-ceramics bracket
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail for the ceramics bracket of copper sheet pre-oxidation.
As shown in Figure 1, the present invention, for the ceramics bracket of copper sheet pre-oxidation, first uses the ceramic substrate of 138 millimeters * 188 millimeters * 0.635 millimeter, is covered with the Copper Foil 3 of 0.1 millimeter～0.4 millimeter on its surface.With figure shift and etching process by ceramic substrate Etching out.With laser cutting machine, by specific width, ceramic substrate is cut into single strip.Along Copper Foil 3 centers, rectangular-shaped ceramic substrate two ends are converted into 90 degree, the ceramic bending part 2 that forms potsherd body 1 and be arranged on potsherd body 1 two ends.
As shown in Figure 2, two ceramics brackets 6 are placed on conveyer belt 4 face-to-face, then can carry out copper sheet pre-oxidation process by needing pre-oxidation copper sheet 5 to be placed on ceramics bracket 6.
The present invention is placed directly on conveyer belt one side pre-oxidation for the ceramics bracket of copper sheet pre-oxidation by copper sheet and changes into copper sheet is placed on support and is oxidized, making has certain unsettled degree between copper sheet and conveyer belt, guarantee the mobile smooth and easy of oxygen, made the two-sided oxidation of copper sheet even.Improved product sintering rear surface crystal grain state, roughness is even.The present invention adopts the potsherd of Al2O3 and Copper Foil as the making material of tool for the ceramics bracket of copper sheet pre-oxidation, by DBC method, makes, and jig structure is simple, durable.
Below the preferred embodiment of the invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all modification being equal to or replacement under the prerequisite without prejudice to the invention spirit, and the modification that these are equal to or replacement are all included in the application's claim limited range.
Claims (4)
1. for the ceramics bracket of copper sheet pre-oxidation, it is characterized in that, comprising:
Potsherd body, is provided with ceramic bending part at the two ends of described potsherd body;
Copper Foil, described Copper Foil is fitted in the inner surface of described potsherd body and described ceramic bending part, and the center line of described Copper Foil overlaps with the folding line of described ceramic bending part junction with described potsherd body.
2. the ceramics bracket for copper sheet pre-oxidation according to claim 1, is characterized in that, described ceramic bending part is perpendicular to described potsherd body.
3. the ceramics bracket for copper sheet pre-oxidation according to claim 1, is characterized in that, the thickness of described potsherd body and described ceramic bending part is 0.635 millimeter.
4. the ceramics bracket for copper sheet pre-oxidation according to claim 1, is characterized in that, the thickness of described Copper Foil is 0.1 millimeter～0.4 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310595905.3A CN103632983B (en) | 2013-11-22 | 2013-11-22 | Ceramics bracket for copper sheet pre-oxidation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310595905.3A CN103632983B (en) | 2013-11-22 | 2013-11-22 | Ceramics bracket for copper sheet pre-oxidation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103632983A true CN103632983A (en) | 2014-03-12 |
| CN103632983B CN103632983B (en) | 2017-11-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310595905.3A Active CN103632983B (en) | 2013-11-22 | 2013-11-22 | Ceramics bracket for copper sheet pre-oxidation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103632983B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108155102A (en) * | 2017-11-13 | 2018-06-12 | 上海申和热磁电子有限公司 | The preparation and application of the uniform jig of surface oxidation during for improving copper sheet pre-oxidation |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1296629A (en) * | 1998-04-08 | 2001-05-23 | 真空融化股份有限公司 | Support for electronic components |
| CN1345465A (en) * | 1999-03-25 | 2002-04-17 | Memc电子材料有限公司 | Method and pressure jetting machine for processing semiconductor wafer |
| CN1630023A (en) * | 2003-12-18 | 2005-06-22 | 上海宏力半导体制造有限公司 | Water-cooling device of semiconductor hot technology |
| CN201717285U (en) * | 2010-02-26 | 2011-01-19 | 华宏光电子(深圳)有限公司 | Novel LED |
| CN103113126A (en) * | 2011-11-17 | 2013-05-22 | 上海申和热磁电子有限公司 | Method for directly cladding copper by sintering wet-method copper oxide piece |
| CN103201828A (en) * | 2010-11-05 | 2013-07-10 | 夏普株式会社 | Oxidation/annealing treatment apparatus and process for production of thin film transistor employing oxidation/annealing treatment |
| CN103280418A (en) * | 2013-05-07 | 2013-09-04 | 上海华力微电子有限公司 | High-temperature oxidization equipment |
| CN203674184U (en) * | 2013-11-22 | 2014-06-25 | 上海申和热磁电子有限公司 | Ceramic support used for copper sheet pre-oxidation |
-
2013
- 2013-11-22 CN CN201310595905.3A patent/CN103632983B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1296629A (en) * | 1998-04-08 | 2001-05-23 | 真空融化股份有限公司 | Support for electronic components |
| CN1345465A (en) * | 1999-03-25 | 2002-04-17 | Memc电子材料有限公司 | Method and pressure jetting machine for processing semiconductor wafer |
| CN1630023A (en) * | 2003-12-18 | 2005-06-22 | 上海宏力半导体制造有限公司 | Water-cooling device of semiconductor hot technology |
| CN201717285U (en) * | 2010-02-26 | 2011-01-19 | 华宏光电子(深圳)有限公司 | Novel LED |
| CN103201828A (en) * | 2010-11-05 | 2013-07-10 | 夏普株式会社 | Oxidation/annealing treatment apparatus and process for production of thin film transistor employing oxidation/annealing treatment |
| CN103113126A (en) * | 2011-11-17 | 2013-05-22 | 上海申和热磁电子有限公司 | Method for directly cladding copper by sintering wet-method copper oxide piece |
| CN103280418A (en) * | 2013-05-07 | 2013-09-04 | 上海华力微电子有限公司 | High-temperature oxidization equipment |
| CN203674184U (en) * | 2013-11-22 | 2014-06-25 | 上海申和热磁电子有限公司 | Ceramic support used for copper sheet pre-oxidation |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108155102A (en) * | 2017-11-13 | 2018-06-12 | 上海申和热磁电子有限公司 | The preparation and application of the uniform jig of surface oxidation during for improving copper sheet pre-oxidation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103632983B (en) | 2017-11-21 |
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| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20201123 Address after: Building 3, 181 Shanlian Road, Baoshan District, Shanghai, 200444 Patentee after: Shanghai fulewa Semiconductor Technology Co., Ltd Address before: 200444 Baoshan District, Baoshan City Industrial Park Road, No., Hill Road, No. 181 Patentee before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. |
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| TR01 | Transfer of patent right |