CN103631459B - Touch-control sensing layer and manufacture method thereof - Google Patents
Touch-control sensing layer and manufacture method thereof Download PDFInfo
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- CN103631459B CN103631459B CN201210319500.2A CN201210319500A CN103631459B CN 103631459 B CN103631459 B CN 103631459B CN 201210319500 A CN201210319500 A CN 201210319500A CN 103631459 B CN103631459 B CN 103631459B
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- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 238000000059 patterning Methods 0.000 claims abstract description 29
- 239000002131 composite material Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 151
- 238000005530 etching Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 14
- 238000010329 laser etching Methods 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- DNAUJKZXPLKYLD-UHFFFAOYSA-N alumane;molybdenum Chemical group [AlH3].[Mo].[Mo] DNAUJKZXPLKYLD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 2
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 2
- LXFUCSMCVAEMCD-UHFFFAOYSA-N acetic acid;nitric acid;phosphoric acid Chemical compound CC(O)=O.O[N+]([O-])=O.OP(O)(O)=O LXFUCSMCVAEMCD-UHFFFAOYSA-N 0.000 claims description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 239000012780 transparent material Substances 0.000 claims 1
- 238000001035 drying Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacture Of Switches (AREA)
- Position Input By Displaying (AREA)
- Push-Button Switches (AREA)
Abstract
The present invention provides a kind of touch-control sensing layer and manufacture method, the wherein manufacture method of touch-control sensing layer, it is characterised in that comprises the steps of (a) and forms one first conductive layer on a substrate；B () forms one second conductive layer on this first conductive layer；C this first conductive layer of () synchronization patternization and this second conductive layer, to form a patterning composite conductive layers and at least one perimeter leads respectively；And (d) removes this second conductive layer in this patterning composite conductive layers to form at least one electrode, wherein those perimeter leads are electrically connected to those electrodes of correspondence.The present invention is that the fabrication steps utilizing synchronization pattern forms electrode and perimeter leads, thus can simplify production procedure to promote process efficiency.
Description
Technical field
Present disclosure generally relates to a kind of contact panel, in particular to a kind of induction layer of touch panel and manufacture method thereof.
Background technology
The inductive layer of contact panel includes at least electrode and perimeter leads, and its manufacture method relates to multiple step, refer to
Fig. 1, is the method flow diagram of traditional fabrication electrode and perimeter leads, and its step comprises: step S1, formed a transparency conducting layer in
On one substrate；Step S2, forms a photoresist layer on this transparency conducting layer；Step S3, by front drying, expose, develop, after bake
Dry, etching, stripping obtain the transparency conducting layer of patterning, i.e. electrode；Step S4, forms a metal level on this electrode；Step
S5, forms a photoresist layer on this metal level；Step S6, by front drying, expose, develop, post-drying, etching, stripping obtain
The metal level of patterning, i.e. perimeter leads.
In conventional process, electrode and perimeter leads need to separately pattern, and pattern this processing procedure action itself
Contain the process of complexity, as dried, expose, develop, etching, stripping, so that making technology is complicated, cause processing procedure
Efficiency cannot promote.
Summary of the invention
In view of above-mentioned, a kind of touch-control sensing layer of offer and preparation method thereof be provided, be to utilize synchronization pattern
Fabrication steps forms electrode and perimeter leads, thus can simplify production procedure to promote process efficiency.
The present invention provides the manufacture method of a kind of touch-control sensing layer, it is characterised in that comprises the steps of (a) and forms one
First conductive layer is on a substrate；B () forms one second conductive layer on this first conductive layer；(c) synchronization patternization this first
Conductive layer and this second conductive layer, to form a patterning composite conductive layers and at least one perimeter leads respectively；And (d) moves
Except this second conductive layer in this patterning composite conductive layers is to form at least one electrode, wherein those perimeter leads are electrically connected with
To those corresponding electrodes.
The present invention also provides for a kind of touch-control sensing layer, comprises: at least one electrode pattern, is made up of one first conductive layer；
And at least one perimeter leads, it is electrically connected with in those electrode patterns, wherein those perimeter leads are for first being conducted electricity by this
The bilayer conductive structure that layer is made with one second conductive layer.
Accompanying drawing explanation
Fig. 1 is the manufacture method flow chart of conventional touch inductive layer.
Fig. 2 A is the structural representation of a kind of touch-control sensing layer in one embodiment of the invention.
Fig. 2 B is Fig. 2 A profile along A-A ' direction.
Fig. 3 is the manufacture method flow chart of the touch-control sensing layer of one embodiment of the invention.
Fig. 4 A is the structural representation during the manufacture method of one embodiment of the invention.
Fig. 4 B is Fig. 4 A profile in the horizontal direction.
Fig. 5 A is the structural representation during the manufacture method of one embodiment of the invention.
Fig. 5 B is Fig. 5 A profile in the horizontal direction.
Fig. 6 A is the structural representation during the manufacture method of one embodiment of the invention.
Fig. 6 B is Fig. 6 A profile along B-B ' direction.
Fig. 7 A is the structural representation during the manufacture method of one embodiment of the invention.
Fig. 7 B is Fig. 7 A profile along C-C ' direction.
Fig. 8 is the manufacture method flow chart of one embodiment of the invention.
Fig. 9 A is the structural representation during the manufacture method of one embodiment of the invention.
Fig. 9 B is Fig. 9 A profile along D-D ' direction.
[main element symbol description]
10 touch-control sensing layers
1 electrode
2 perimeter leads
20 substrates
21 first conductive layers
22 second conductive layers
23 patterning composite conductive layers
24 protective layers
VA viewing area
SA neighboring area
S1 forms a transparency conducting layer on a substrate
S2 forms a photoresist layer on this transparency conducting layer
S3 by front drying, expose, develop, post-drying, etching, stripping obtain the transparency conducting layer of patterning, i.e. electrode
S4 forms a metal level on this electrode
S5 forms a photoresist layer on this metal level
S6 by front drying, expose, develop, post-drying, etching, stripping obtain the metal level of patterning, i.e. perimeter leads
A forms one first conductive layer on a substrate
B forms one second conductive layer on this first conductive layer
This first conductive layer of c synchronization patternization and this second conductive layer, with formed respectively a patterning composite conductive layers with
And at least one perimeter leads
D removes this second conductive layer in this patterning composite conductive layers to form at least one electrode, wherein those peripheries
Lead-in wire is electrically connected to those electrodes of correspondence
E formation protective layer is on perimeter leads, and makes patterning composite bed exposed
F removes above-mentioned protective layer
Detailed description of the invention
Hereinafter will be described each embodiment of this case, and coordinate diagram illustratively.In addition to these describe in detail, this
Bright can also implement in other examples widely, the replacement easily of any described embodiment, amendment, equivalence change be all wrapped
It is contained in the range of this case, and is as the criterion with the scope of the claims afterwards.In the description of description, in order to make reader that the present invention to be had
More completely understand, it is provided that many specific detail；But, the present invention may be in clipped or whole these specific detail
Under premise, still can implement.Moreover, it is well known that step or element be not described in details, to avoid causing the present invention not
The restriction of necessity.Assembly same or like in diagram will represent with same or like symbol.It is specifically intended that diagram is only
It is used for signal, size that not representation element is actual or quantity, unless otherwise specified.
Fig. 2 A and Fig. 2 B are the touch-control sensing Rotating fields schematic diagram in one embodiment of the invention, and wherein Fig. 2 B is Fig. 2 A along A-
The profile in A ' direction.In the present embodiment, touch-control sensing layer 10 comprises the electrode 1 being positioned at visible area VA and is positioned at non-visible area VS
Perimeter leads 2, wherein perimeter leads 2 is electrically connected with electrode 1.Electrode 1 is made up of the first conductive layer 21.Perimeter leads 2 is by
One conductive layer 21 is made with the second conductive layer 22, therefore perimeter leads 2 is a kind of bilayer conductive structure.
In one embodiment of the invention, electrode 1 is made by the first conductive layer 21 with perimeter leads 2, therefore electrode 1 draws with periphery
The electric connection of line 2 is by the first conductive layer 21 itself, therefore without overlapping by other between electrode 1 with perimeter leads 2
Overlapping mode turns on, and in other words, electrode 1 is non-overlapping with the junction of perimeter leads, thus avoids because overlapping exists
Difference in height and the problem such as open circuit of causing.
Fig. 3 is the method flow diagram making above-mentioned touch-control sensing layer.Refer to Fig. 3, the manufacture method bag of touch-control sensing layer
Include following steps: (a) forms one first conductive layer on a substrate；B () forms one second conductive layer on this first conductive layer；
C this first conductive layer of () synchronization patternization and this second conductive layer, to form a patterning composite conductive layers and at least respectively
One perimeter leads；And (d) removes this second conductive layer in this patterning composite conductive layers to form at least one electrode, wherein
Those perimeter leads are electrically connected to those electrodes of correspondence.
Please merge with reference to Fig. 4 A and Fig. 4 B, wherein Fig. 4 A is the structural representation illustrating above-mentioned steps (a), and Fig. 4 B is Fig. 4 A
Profile in the horizontal direction.Step (a), forms the first conductive layer 21 on substrate 20, as shown in Fig. 4 A to Fig. 4 B, and wherein shape
The mode become can be deposit, be deposited with, print, be coated with, sputter etc..
Please merge with reference to Fig. 5 A and Fig. 5 B, wherein Fig. 5 A is the structural representation illustrating above-mentioned steps (b), and Fig. 5 B is Fig. 5 A
Profile in the horizontal direction.Step (b), forms the second conductive layer 22 on the first conductive layer 21, as shown in Fig. 5 A and Fig. 5 B,
The mode wherein formed can be deposit, be deposited with, print, be coated with, sputter etc..
Please merge with reference to Fig. 6 A and Fig. 6 B, wherein Fig. 6 A is the structural representation illustrating above-mentioned steps (c), and Fig. 6 B is Fig. 6 A
Profile along B-B ' direction.Step (c), synchronization patternization the first conductive layer 21 and the second conductive layer 22, to form figure respectively
Case composite conductive layers 23 and perimeter leads 2, as shown in Fig. 6 A and Fig. 6 B.Wherein, perimeter leads 2 is electrically connected with in figure
Case composite conductive layers 23, and patterning composite conductive layers 23 is located substantially in the viewing area VA of substrate 20, perimeter leads 2 is big
The neighboring area SA of substrate 20 it is positioned in cause.
In the present embodiment, it is preferred that be to use a laser etching mode to pattern the first conductive layer 21 and second to lead simultaneously
Electric layer 22.According to pattern to be formed, utilize laser to rule etching machine, control suitable laser etching parameter, simultaneously by the
Two conductive layers 22 are complete with the portions of etch of the first required etching of conductive layer 21 below, and avoid etching into the first conductive layer
Substrate 20 under 21, such as plastic substrate.In one embodiment, the thunder laser beam of wavelength 1064nm is selected in laser etching, and takes
Join following parameters: power 3W, laser frequency 70K, speed 1000mm/s of ruling, according to above-mentioned parameter, etchable go out live width and line
Away from the perimeter leads 2 for 30 ± 5 μm.In another embodiment, the thunder laser beam of wavelength 355nm is selected in laser etching, and arranges in pairs or groups
Following parameters: power 0.7W, laser frequency 100K, rule speed 1000mm/s, according to above-mentioned parameter, etchable go out live width and line
Away from the perimeter leads 2 for 15 ± 5 μm.Therefore the wavelength used during by adjusting radium-shine etching and other relevant parameters, available
Live width is the perimeter leads of 10 μm to 35 μm.Owing to being easier to control in laser etching precision, use the making side of the present embodiment
Method, the line-spacing of perimeter leads 2 can reach about 10 μm to 35 μm.
In an alternative embodiment of the invention, it is mode synchronization patternization the first conductive layer 21 and second using lithography
Conductive layer 22.In the present embodiment, after above-mentioned steps (b) completes, it is initially formed a photoresist layer on the second conductive layer 22, then warp
Dries before crossing, expose, develop, post-drying, etching, the operation formation such as stripping pattern composite conductive layers 23 and perimeter leads 2.
Please merge with reference to Fig. 7 A and Fig. 7 B, wherein Fig. 7 A is the structural representation illustrating above-mentioned steps (d), and Fig. 7 B is Fig. 7 A
Profile along C-C ' direction.Step (d) remove patterning composite conductive layers 23 in the second conductive layer 22 to form electrode 1,
Wherein those perimeter leads 2 are electrically connected to those electrodes 1 of correspondence, as shown in figs. 7 a and 7b.Such as, utilize dry ecthing or
Wet etching removes the second conductive layer 22.The second conduction in composite conductive layers 23 is patterned in the present embodiment, viewing area VA
Layer 22, can be removed by an etching solution etching, wherein have different etching due to the first conductive layer 21 and the second conductive layer 22
Attribute, therefore can be selected for suitable etching solution, makes this etching solution only the second conductive layer 22 can be had etching action, without to
One conductive layer 21 has etching action.Therefore, the selection of etching solution need to determine according to the material of the second conductive layer 22, such as, as
Really the material of the second conductive layer 22 is molybdenum-aluminum-molybdenum (Mo-Al-Mo) alloy, then use acetic acid-nitric acid-phosphoric acid solution as etching
Liquid；If the material of the second conductive layer 22 is copper, then use ferric chloride solution as etching solution.
Fig. 8 is the other method flow chart making above-mentioned touch-control sensing layer.The present embodiment and the district of said method embodiment
Not part is: further includes a step (e) between step (c) and step (d), i.e. forms a protective layer 24 at perimeter leads 2
On, and make patterning composite conductive layers 23 exposed.Please merge with reference to Fig. 9 A and Fig. 9 B, wherein Fig. 9 A is to illustrate above-mentioned steps (e)
Structural representation, Fig. 9 B is Fig. 9 A profile along D-D ' direction.In one embodiment, protective layer 24 is employing silk screen printing
The anti-etching ink layer that mode is formed, to cover and to protect the perimeter leads 2 of neighboring area SA, exposes simultaneously and is positioned at visually
The patterning composite conductive layers 23 of region VA；Then, with heating or ultraviolet light radiation modality cured anti-etching ink layer.In
In another embodiment, with method for printing screen, print peelable glue-line 24 to protect perimeter leads 2, simultaneously at neighboring area SA
Expose the patterning composite conductive layers 23 being positioned at viewing area VA；Then, adhesive is made by ultraviolet light or mode of heating
Layer solidification.Formed after protective layer 24, then carry out step (d) remove the second conductive layer 22 action, to prevent perimeter leads 2 in step
Suddenly it is corroded during (d).
In an embodiment of the present invention, after step (d), further include a step (f), i.e. remove above-mentioned protective layer 24.In
The present embodiment, uses a stripper solution to remove protective layer 24, such as potassium hydroxide (KOH) solution, by anti-etching ink 24 or peelable
Peel off from glue 24.
In the present embodiment, remaining step and use material are all similar with said method embodiment, do not repeat them here.
By said method, touch-control sensing layer 10 can be formed on the base plate 20.
Additionally it is preferred that described touch-control sensing layer 10 is a kind of touch-control sensing structure for capacitance type touch-control panel, its
Form is not limited to the monolayer single-shaft configuration shown in Fig. 2 A, it is also possible to be a monolayer cross-compound arrangement, pair of lamina cross-compound arrangement etc..
It should be noted that in foregoing embodiments, substrate 20 can be a transparent inorganic substrate, such as one glass base
Plate；Or a transparent organic substrate, such as one plastic substrate, its material such as polyethylene terephthalate (Polyethylene
Terephthalate, PET), Merlon (Poly Carbonate, PC), polyethylene (Polyethylene, PE) or poly-first
Base acrylic acid methyl ester. (Polymethylmethacrylate, PMMA) etc..First conductive layer 21 is transparent conductive material, its material
Can be selected from one of them or a combination thereof of following group: tin indium oxide (ITO), antimony tin (ATO), zinc oxide (ZnO), two
Zinc oxide (ZnO2), tin ash (SnO2), indium sesquioxide (In2O3).Second conductive material 22 is metal material, its material
Comprise any electrically conductive metal or alloy, such as copper, copper alloy, molybdenum-aluminum-molybdenum alloy, silver, silver alloy etc..
Touch-control sensing layer that the embodiment of the present invention provides and preparation method thereof, is the fabrication steps shape utilizing synchronization pattern
Become electrode and perimeter leads, thus production procedure can be simplified to promote process efficiency, if use radium in patterning step in addition
Penetrating the mode of etching, produced perimeter leads is finer.
The foregoing is only the preferred embodiments of the invention, be not limited to the claim of the present invention；
All other change without departing from the lower equivalence completed of the spirit that invention is disclosed or modify, and should be included in following applying for a patent
In the range of.
Claims (17)
1. the manufacture method of a touch-control sensing layer, it is characterised in that comprise the steps of
A () forms one first conductive layer on a substrate；
B () forms one second conductive layer on this first conductive layer；
C this first conductive layer of () synchronization patternization and this second conductive layer, to form a patterning composite conductive layers and at least
One perimeter leads, wherein this patterning composite conductive layers and this perimeter leads are by this first conductive layer and this second conductive layer
Synchronization patternization is formed；And
D () removes this second conductive layer in this patterning composite conductive layers to form at least one electrode, wherein those peripheries draw
Line is electrically connected to those electrodes of correspondence；Wherein,
In step (c), the step of patterning be use a laser etching mode etch simultaneously this first conductive layer with this second
Conductive layer.
2. the manufacture method of touch-control sensing layer as claimed in claim 1, it is characterised in that between step (c) and step (d)
Further include a step (e) and form a protective layer on those perimeter leads, and make this patterning composite conductive layers exposed.
3. the manufacture method of touch-control sensing layer as claimed in claim 2, it is characterised in that further include after step (d)
Step (f) removes this protective layer.
4. the manufacture method of touch-control sensing layer as claimed in claim 1, it is characterised in that this laser etching mode system uses ripple
The thunder laser beam of a length of 355nm or 1064nm.
5. the manufacture method of touch-control sensing layer as claimed in claim 2, it is characterised in that the formation system of this protective layer uses silk
One anti-etching ink layer of net mode of printing formation or a peelable glue-line.
6. the manufacture method of touch-control sensing layer as claimed in claim 5, it is characterised in that the formation of this protective layer further includes adopts
By the mode of heating or ultraviolet light polymerization, this protective layer is solidified.
7. the manufacture method of touch-control sensing layer as claimed in claim 1, it is characterised in that be with an etching solution in step (d)
Removing this second conductive layer in this patterning composite conductive layers, wherein this first conductive layer has different with this second conductive layer
Etch properties.
8. the manufacture method of touch-control sensing layer as claimed in claim 7, it is characterised in that the material of this second conductive layer is
Molybdenum-aluminum-molybdenum alloy, this etching solution is acetic acid-nitric acid-phosphoric acid solution.
9. the manufacture method of touch-control sensing layer as claimed in claim 7, it is characterised in that the material of this second conductive layer is
Copper, this etching solution is ferric chloride solution.
10. the manufacture method of touch-control sensing layer as claimed in claim 3, it is characterised in that in step (f), be with a stripping
Film liquid removes this protective layer.
The manufacture method of 11. touch-control sensing layers as claimed in claim 10, it is characterised in that this stripper solution comprises potassium hydroxide
Solution.
The manufacture method of 12. touch-control sensing layers as claimed in claim 4, it is characterised in that those perimeter leads are to each other
Line-spacing is that 10 μm are to 35 μm.
The manufacture method of 13. touch-control sensing layers as claimed in claim 4, it is characterised in that the live width of those perimeter leads is
10 μm are to 35 μm.
The manufacture method of 14. touch-control sensing layers as claimed in claim 1, it is characterised in that the material of this first conductive layer is
Transparent conductive material, the material of this second conductive layer is metal material.
15. 1 kinds of touch-control sensing layers, comprise:
At least one electrode, is made up of one first conductive layer；And
At least one perimeter leads, is electrically connected with in those electrodes, wherein those perimeter leads be by this first conductive layer with
The bilayer conductive structure that one second conductive layer is made；Wherein,
Described at least one perimeter leads is to use a laser etching mode to etch this first conductive layer and this second conductive layer simultaneously
Step patterning formed；
The formation of described at least one electrode, is to use a laser etching mode to etch this first conductive layer and this second conduction simultaneously
Layer, forms a patterning composite conductive layers, and removes this second conductive layer in this patterning composite conductive layers.
16. touch-control sensing layers as claimed in claim 15, it is characterised in that the material of this first conductive layer is electrically conducting transparent material
Material, the material of this second conductive layer is metal material.
17. touch-control sensing layers as claimed in claim 15, it is characterised in that those electrodes and the junction of those perimeter leads
Non-overlapping.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210319500.2A CN103631459B (en) | 2012-08-26 | 2012-08-26 | Touch-control sensing layer and manufacture method thereof |
| TW101145758A TWI474237B (en) | 2012-08-26 | 2012-12-05 | Sensing layer and method for producing the same |
| TW101223610U TWM453901U (en) | 2012-08-26 | 2012-12-05 | Sensing layer |
| PCT/CN2013/081829 WO2014032534A1 (en) | 2012-08-26 | 2013-08-20 | Touch induction layer and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210319500.2A CN103631459B (en) | 2012-08-26 | 2012-08-26 | Touch-control sensing layer and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103631459A CN103631459A (en) | 2014-03-12 |
| CN103631459B true CN103631459B (en) | 2016-12-21 |
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|---|---|---|---|
| CN201210319500.2A Active CN103631459B (en) | 2012-08-26 | 2012-08-26 | Touch-control sensing layer and manufacture method thereof |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103631459B (en) |
| TW (2) | TWI474237B (en) |
| WO (1) | WO2014032534A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103631459B (en) * | 2012-08-26 | 2016-12-21 | 宝宸（厦门）光学科技有限公司 | Touch-control sensing layer and manufacture method thereof |
| CN103841765A (en) * | 2014-03-18 | 2014-06-04 | 蔡莳铨 | Method for machining printed circuit board |
| TWI553379B (en) * | 2014-06-25 | 2016-10-11 | 群創光電股份有限公司 | Display panel and display device applying the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI474237B (en) | 2015-02-21 |
| TW201409314A (en) | 2014-03-01 |
| CN103631459A (en) | 2014-03-12 |
| WO2014032534A1 (en) | 2014-03-06 |
| TWM453901U (en) | 2013-05-21 |
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Effective date of registration: 20240307 Address after: 361101 No. 996 Min'an Avenue, Torch High tech Zone (Xiang'an) Industrial Zone, Xiamen City, Fujian Province Patentee after: TPK GLASS SOLUTIONS (XIAMEN) Inc. Country or region after: China Address before: Floor 3, 4, 5 and 8, 190 Jimei Avenue, Jimei District, Xiamen, Fujian, 361009 Patentee before: TPK Touch Systems (Xiamen) Inc. Country or region before: China |