CN103631459A - Touch sensing layer and manufacturing method thereof - Google Patents
Touch sensing layer and manufacturing method thereof Download PDFInfo
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- CN103631459A CN103631459A CN201210319500.2A CN201210319500A CN103631459A CN 103631459 A CN103631459 A CN 103631459A CN 201210319500 A CN201210319500 A CN 201210319500A CN 103631459 A CN103631459 A CN 103631459A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 57
- 238000000059 patterning Methods 0.000 claims abstract description 33
- 239000002131 composite material Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000005530 etching Methods 0.000 claims description 28
- 230000001681 protective effect Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 238000010329 laser etching Methods 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- DNAUJKZXPLKYLD-UHFFFAOYSA-N alumane;molybdenum Chemical group [AlH3].[Mo].[Mo] DNAUJKZXPLKYLD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 2
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 2
- LXFUCSMCVAEMCD-UHFFFAOYSA-N acetic acid;nitric acid;phosphoric acid Chemical compound CC(O)=O.O[N+]([O-])=O.OP(O)(O)=O LXFUCSMCVAEMCD-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 abstract 3
- 230000001360 synchronised effect Effects 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical compound [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacture Of Switches (AREA)
- Position Input By Displaying (AREA)
- Push-Button Switches (AREA)
Abstract
The invention provides a touch sensing layer and a manufacturing method thereof. The manufacturing method of the touch sensing layer is characterized by comprising the following steps that (a) a first conductive layer is formed on a substrate; (b) a second conductive layer is formed on the first conductive layer; (c) the first conductive layer and the second conductive layer are subjected to synchronous patterning to form a patterned composite conductive layer and at least one peripheral lead respectively; (d) the second conductive layer in the patterned composite conductive layer is removed to form at least one electrode, and the peripheral leads are electrically connected to corresponding electrodes. According to the method, the synchronous patterning manufacturing step is used to form the electrodes and the peripheral leads, production processes are simplified, and manufacturing efficiency is improved.
Description
Technical field
The present invention system is about a kind of contact panel, particularly relevant for a kind of induction layer of touch panel and manufacture method thereof.
Background technology
The inductive layer of contact panel at least comprises electrode and periphery lead-in wire, and its manufacture method relates to a plurality of steps, please refer to Fig. 1, is the method flow diagram of traditional fabrication electrode and periphery lead-in wire, and its step comprises: step S1, forms a transparency conducting layer on a substrate; Step S2, forms a photoresist layer on this transparency conducting layer; Step S3, obtains the transparency conducting layer of patterning, i.e. electrode by front oven dry, exposure, development, post-drying, etching, stripping; Step S4, forms a metal level on this electrode; Step S5, forms a photoresist layer on this metal level; Step S6, obtains the metal level of patterning by front oven dry, exposure, development, post-drying, etching, stripping, i.e. periphery lead-in wire.
In conventional process, electrode and periphery lead-in wire need separately carry out patterning, and this processing procedure action of patterning itself has comprised complicated process, as oven dry, exposure, development, etching, stripping, so make making technology complicated, cause processing procedure efficiency to promote.
Summary of the invention
In view of above-mentioned, the invention reside in a kind of touch-control sensing layer and preparation method thereof is provided, be to utilize the fabrication steps of synchronization pattern to form electrode and periphery lead-in wire, thereby can simplify production procedure to promote processing procedure efficiency.
The manufacture method that the invention provides a kind of touch-control sensing layer, is characterized in that, comprises following steps: (a) form one first conductive layer on a substrate; (b) form one second conductive layer on this first conductive layer; (c) this first conductive layer of synchronization patternization and this second conductive layer, to form respectively a patterning composite conducting layer and at least one periphery lead-in wire; And (d) remove this second conductive layer in this patterning composite conducting layer to form at least one electrode, wherein those peripheries lead-in wires are electrically connected to those corresponding electrodes.
The present invention also provides a kind of touch-control sensing layer, comprises: at least one electrode pattern is to be made by one first conductive layer; And at least one periphery lead-in wire, be electrically connected at respectively those electrode patterns, wherein those peripheries lead-in wires double-deck conductive structure that this first conductive layer and one second conductive layer are made of serving as reasons.
Accompanying drawing explanation
Fig. 1 is the method for making process flow diagram of traditional touch-control sensing layer.
Fig. 2 A is the structural representation of a kind of touch-control sensing layer in one embodiment of the invention.
Fig. 2 B is that Fig. 2 A is along the sectional view of A-A ' direction.
Fig. 3 is the method for making process flow diagram of the touch-control sensing layer of one embodiment of the invention.
Fig. 4 A is the structural representation in the method for making process of one embodiment of the invention.
Fig. 4 B is the sectional view of Fig. 4 A along continuous straight runs.
Fig. 5 A is the structural representation in the method for making process of one embodiment of the invention.
Fig. 5 B is the sectional view of Fig. 5 A along continuous straight runs.
Fig. 6 A is the structural representation in the method for making process of one embodiment of the invention.
Fig. 6 B is that Fig. 6 A is along the sectional view of B-B ' direction.
Fig. 7 A is the structural representation in the method for making process of one embodiment of the invention.
Fig. 7 B is that Fig. 7 A is along the sectional view of C-C ' direction.
Fig. 8 is the method for making process flow diagram of one embodiment of the invention.
Fig. 9 A is the structural representation in the method for making process of one embodiment of the invention.
Fig. 9 B is that Fig. 9 A is along the sectional view of D-D ' direction.
[main element symbol description]
10 touch-control sensing layers
1 electrode
2 periphery lead-in wires
20 substrates
21 first conductive layers
22 second conductive layers
23 patterning composite conducting layers
24 protective seams
VA viewing area
SA neighboring area
S1 forms a transparency conducting layer on a substrate
S2 forms a photoresist layer on this transparency conducting layer
S3 obtains the transparency conducting layer of patterning, i.e. electrode by front oven dry, exposure, development, post-drying, etching, stripping
S4 forms a metal level on this electrode
S5 forms a photoresist layer on this metal level
S6 obtains the metal level of patterning by front oven dry, exposure, development, post-drying, etching, stripping, i.e. periphery lead-in wire
A forms one first conductive layer on a substrate
B forms one second conductive layer on this first conductive layer
This first conductive layer of c synchronization patternization and this second conductive layer, to form respectively a patterning composite conducting layer and at least one periphery lead-in wire
D removes this second conductive layer in this patterning composite conducting layer to form at least one electrode, and wherein those peripheries lead-in wires are electrically connected to those corresponding electrodes
E forms protective seam on periphery lead-in wire, and makes patterning composite bed exposed
F removes above-mentioned protective seam
Embodiment
To in detail each embodiment of this case be described in detail below, and coordinate diagram as illustration.Except these are described in detail, the present invention can also be implemented in other embodiment widely, the substituting easily of any described embodiment, revise, equivalence changes and is included in the scope of this case, and with after the scope of the claims be as the criterion.In the description of instructions, in order to make reader have more complete understanding to the present invention, many specific detail are provided; Yet the present invention may, at clipped or all under the prerequisite of these specific detail, still can implement.In addition, well-known step or element are not described in details, with the restriction of avoiding causing the present invention unnecessary.Assembly identical or similar in diagram will represent with identical or simileys.Pay special attention to, diagram is only the use of signal, is not size or the quantity of representation element reality, unless otherwise specified.
Fig. 2 A and Fig. 2 B are the touch-control sensing layer structural representation in one embodiment of the invention, and wherein Fig. 2 B is that Fig. 2 A is along the sectional view of A-A ' direction.In the present embodiment, touch-control sensing layer 10 comprises the electrode 1 that is positioned at visible area VA and the periphery lead-in wire 2 that is positioned at non-visible area VS, and wherein periphery lead-in wire 2 is electrically connected electrode 1.Electrode 1 is made by the first conductive layer 21.Periphery lead-in wire 2 is made by the first conductive layer 21 and the second conductive layer 22, therefore periphery lead-in wire 2 is a kind of double-deck conductive structure.
In one embodiment of the invention, electrode 1 is made by the first conductive layer 21 with periphery lead-in wire 2, therefore electrode 1 is own by the first conductive layer 21 with the electric connection of periphery lead-in wire 2, therefore electrode 1 and periphery go between between 2 without carrying out conducting by other overlapping overlapping modes, in other words, the junction zero lap of electrode 1 and periphery lead-in wire, thus avoided because of problems such as overlapping opening circuit of having that difference in height causes.
Fig. 3 is for making the method flow diagram of above-mentioned touch-control sensing layer.Please refer to Fig. 3, the method for making of touch-control sensing layer comprises the following steps: (a) form one first conductive layer on a substrate; (b) form one second conductive layer on this first conductive layer; (c) this first conductive layer of synchronization patternization and this second conductive layer, to form respectively a patterning composite conducting layer and at least one periphery lead-in wire; And (d) remove this second conductive layer in this patterning composite conducting layer to form at least one electrode, wherein those peripheries lead-in wires are electrically connected to those corresponding electrodes.
Please merge with reference to figure 4A and Fig. 4 B, wherein Fig. 4 A is the structural representation that illustrates above-mentioned steps (a), and Fig. 4 B is the sectional view of Fig. 4 A along continuous straight runs.Step (a), forms the first conductive layer 21 on substrate 20, and as shown in Fig. 4 A to Fig. 4 B, the mode wherein forming can be deposition, evaporation, printing, coating, sputter etc.
Please merge with reference to figure 5A and Fig. 5 B, wherein Fig. 5 A is the structural representation that illustrates above-mentioned steps (b), and Fig. 5 B is the sectional view of Fig. 5 A along continuous straight runs.Step (b), forms the second conductive layer 22 on the first conductive layer 21, and as shown in Fig. 5 A and Fig. 5 B, the mode wherein forming can be deposition, evaporation, printing, coating, sputter etc.
Please merge with reference to figure 6A and Fig. 6 B, wherein Fig. 6 A is the structural representation that illustrates above-mentioned steps (c), and Fig. 6 B is that Fig. 6 A is along the sectional view of B-B ' direction.Step (c), synchronization patternization the first conductive layer 21 and the second conductive layer 22, to form respectively patterning composite conducting layer 23 and periphery lead-in wire 2, as shown in Fig. 6 A and Fig. 6 B.Wherein, periphery lead-in wire 2 is electrically connected at respectively patterning composite conducting layer 23, and patterning composite conducting layer 23 is positioned at the viewing area VA of substrate 20 haply, and periphery lead-in wire 2 is positioned at the neighboring area SA of substrate 20 haply.
In the present embodiment, preferably, be to adopt a laser etching mode patterning the first conductive layer 21 and the second conductive layer 22 simultaneously.According to the pattern that will form, utilize laser line etching machine, control suitable laser etching parameter, simultaneously that the second conductive layer 22 is complete with the required etched part etching of the first conductive layer 21 of its below, and avoid etching into the substrate 20 under the first conductive layer 21, for example plastic substrate.In one embodiment, the thunder laser beam of wavelength 1064nm is selected in laser etching, and the following parameters of arranging in pairs or groups: power 3W, and laser frequency 70K, line speed 1000mm/s, according to above-mentioned parameter, can etch live width and line-spacing is the periphery lead-in wire 2 of 30 ± 5 μ m.In another embodiment, the thunder laser beam of wavelength 355nm is selected in laser etching, and the following parameters of arranging in pairs or groups: power 0.7W, and laser frequency 100K, line speed 1000mm/s, according to above-mentioned parameter, can etch live width and line-spacing is the periphery lead-in wire 2 of 15 ± 5 μ m.Therefore the wavelength using when adjusting radium-shine etching and other correlation parameters, can obtain live width is the periphery lead-in wire of 10 μ m to 35 μ m.Owing to being easier to control in laser etching precision, use the method for making of the present embodiment, the line-spacing of periphery lead-in wire 2 can reach about 10 μ m to 35 μ m.
In another embodiment of the present invention, be mode synchronization patternization the first conductive layer 21 and the second conductive layer 22 that adopts lithography.In the present embodiment, after above-mentioned steps (b) completes, first form a photoresist layer on the second conductive layer 22, then form patterning composite conducting layer 23 and periphery lead-in wire 2 through operations such as front oven dry, exposure, development, post-drying, etching, strippings.
Please merge with reference to figure 7A and Fig. 7 B, wherein Fig. 7 A is the structural representation that illustrates above-mentioned steps (d), and Fig. 7 B is that Fig. 7 A is along the sectional view of C-C ' direction.Step (d) removes the second conductive layer 22 in patterning composite conducting layer 23 to form electrode 1, and wherein those peripheries lead-in wires 2 are electrically connected to those corresponding electrodes 1, as shown in Fig. 7 A and Fig. 7 B.For example, utilize dry ecthing or wet etching to remove the second conductive layer 22.In the present embodiment, the second conductive layer 22 in the VA of viewing area in patterning composite conducting layer 23, can remove by an etching solution etching, wherein because the first conductive layer 21 and the second conductive layer 22 have different etch properties, therefore can select suitable etching solution, make this etching solution only can have etching action to the second conductive layer 22, but can not have etching action to the first conductive layer 21.Therefore, selecting of etching solution need be determined according to the material of the second conductive layer 22, for example, if the material of the second conductive layer 22 is molybdenum-aluminium-molybdenum (Mo-Al-Mo) alloy, uses acetic acid-nitric acid-phosphoric acid solution as etching solution; If the material of the second conductive layer 22 is copper, use ferric chloride solution as etching solution.
Fig. 8 is for making the other method process flow diagram of above-mentioned touch-control sensing layer.The difference part of the present embodiment and said method embodiment is: between step (c) and step (d), more comprise a step (e), form a protective seam 24 on periphery lead-in wire 2, and make patterning composite conducting layer 23 exposed.Please merge with reference to figure 9A and Fig. 9 B, wherein Fig. 9 A is the structural representation that illustrates above-mentioned steps (e), and Fig. 9 B is that Fig. 9 A is along the sectional view of D-D ' direction.In one embodiment, protective seam 24 is an anti-etching ink layer that adopts screen printing mode to form, and to cover and to protect the periphery lead-in wire 2 of neighboring area SA, exposes the patterning composite conducting layer 23 that is positioned at viewing area VA simultaneously; Then, to heat or the anti-etching ink layer of the curing processing of UV-irradiation mode.In another embodiment, with method for printing screen, at neighboring area SA, print peelable glue-line 24 with protection periphery lead-in wire 2, expose the patterning composite conducting layer 23 that is positioned at viewing area VA simultaneously; Then, by ultraviolet light or type of heating, peelable glue-line is solidified.Form after protective seam 24, then carry out second conductive layer 22 actions that remove of step (d), to prevent that periphery lead-in wire 2 is corroded in the process of step (d).
In an embodiment of the present invention, in step (d), more comprise afterwards a step (f), remove above-mentioned protective seam 24.In the present embodiment, use a stripper solution to remove protective seam 24, for example potassium hydroxide (KOH) solution, peels off anti-etching ink 24 or adhesive 24.
In the present embodiment, all the other steps and use material are all similar with said method embodiment, do not repeat them here.
By said method, can on substrate 20, form touch-control sensing layer 10.
In addition, preferably, described touch-control sensing layer 10 is a kind of touch-control sensing structures for capacitance type touch-control panel, and its form is not limited to the individual layer single-shaft configuration shown in Fig. 2 A, can be also an individual layer cross-compound arrangement, pair of lamina cross-compound arrangement etc.
It should be noted that, in aforementioned each embodiment, substrate 20 can be a transparent inorganic substrate, for example a glass substrate; An or transparent organic substrate, a plastic substrate for example, its material is polyethylene terephthalate (Polyethylene terephthalate for example, PET), polycarbonate (Poly Carbonate, PC), tygon (Polyethylene, PE) or polymethylmethacrylate (Polymethylmethacrylate, PMMA) etc.The first conductive layer 21 is transparent conductive material, and its material can be selected from one of them or its combination of following group: tin indium oxide (ITO), antimony tin (ATO), zinc paste (ZnO), zinc oxide (ZnO
2), tin ash (SnO
2), indium sesquioxide (In
2o
3).The second conductive material 22 is metal material, and its material comprises any metal or alloy that can conduct electricity, for example copper, aldary, molybdenum-aluminium-molybdenum alloy, silver, silver alloy etc.
Touch-control sensing layer that the embodiment of the present invention provides and preparation method thereof, be to utilize the fabrication steps of synchronization pattern to form electrode and periphery lead-in wire, thereby can simplify production procedure to promote processing procedure efficiency, if use in addition radium-shine etched mode in patterning step, produced periphery lead-in wire is meticulousr.
The foregoing is only the present invention's preferred embodiment, not in order to limit the present invention's claim; All other do not depart from lower the equivalence completing change of spirit or the modification that invention is disclosed, and all should be included in following claim.
Claims (20)
1. a manufacture method for touch-control sensing layer, is characterized in that, comprises following steps:
(a) form one first conductive layer on a substrate;
(b) form one second conductive layer on this first conductive layer;
(c) this first conductive layer of synchronization patternization and this second conductive layer, to form respectively a patterning composite conducting layer and at least one periphery lead-in wire; And
(d) remove this second conductive layer in this patterning composite conducting layer to form at least one electrode, wherein those peripheries lead-in wires are electrically connected to those corresponding electrodes.
2. the manufacture method of touch-control sensing layer as claimed in claim 1; it is characterized in that; in more comprising a step (e) between step (c) and step (d), form a protective seam on those periphery lead-in wires, and make this patterning composite conducting layer exposed.
3. the manufacture method of touch-control sensing layer as claimed in claim 2, is characterized in that, more comprises afterwards a step (f) remove this protective seam in step (d).
4. the manufacture method of touch-control sensing layer as claimed in claim 1, is characterized in that, in step (c), the step of patterning is to adopt a laser etching mode this first conductive layer of etching and this second conductive layer simultaneously.
5. the manufacture method of touch-control sensing layer as claimed in claim 4, is characterized in that, this laser etching mode system is used the thunder laser beam that wavelength is 355nm or 1064nm.
6. the manufacture method of touch-control sensing layer as claimed in claim 1, is characterized in that, more comprises a step (g) and form on a photoresist layer and the second conductive layer between step (b) and step (c).
7. the manufacture method of touch-control sensing layer as claimed in claim 6, is characterized in that, in step (c), the step of patterning comprises the front oven dry of operation, exposure, development, post-drying, etching, stripping.
8. the manufacture method of touch-control sensing layer as claimed in claim 2, is characterized in that, an anti-etching ink layer or a peelable glue-line that the formation system of this protective seam adopts screen printing mode to form.
9. the manufacture method of touch-control sensing layer as claimed in claim 8, is characterized in that, the formation of this protective seam more comprises that the mode of employing heating or ultraviolet light polymerization is cured this protective seam.
10. the manufacture method of touch-control sensing layer as claimed in claim 1, it is characterized in that, in step (d), be this second conductive layer removing with an etching solution in this patterning composite conducting layer, wherein this first conductive layer and this second conductive layer have different etch properties.
The manufacture method of 11. touch-control sensing layers as claimed in claim 10, is characterized in that, the material of this second conductive layer is molybdenum-aluminium-molybdenum alloy, and this etching solution is acetic acid-nitric acid-phosphoric acid solution.
The manufacture method of 12. touch-control sensing layers as claimed in claim 10, is characterized in that, the material of this second conductive layer is copper, and this etching solution is ferric chloride solution.
The manufacture method of 13. touch-control sensing layers as claimed in claim 3, is characterized in that, in step (f), is to remove this protective seam with a stripper solution.
The manufacture method of 14. touch-control sensing layers as claimed in claim 13, is characterized in that, this stripper solution comprises potassium hydroxide solution.
The manufacture method of 15. touch-control sensing layers as claimed in claim 5, is characterized in that, those periphery lead-in wires line-spacing is to each other 10 μ m to 35 μ m.
The manufacture method of 16. touch-control sensing layers as claimed in claim 5, is characterized in that, the live width of those periphery lead-in wires is 10 μ m to 35 μ m.
The manufacture method of 17. touch-control sensing layers as claimed in claim 1, is characterized in that, the material of this first conductive layer is transparent conductive material, and the material of this second conductive layer is metal material.
18. 1 kinds of touch-control sensing layers, comprise:
At least one electrode is to be made by one first conductive layer; And
At least one periphery lead-in wire, is electrically connected at respectively those electrodes, wherein those peripheries lead-in wires double-deck conductive structure that this first conductive layer and one second conductive layer are made of serving as reasons.
19. touch-control sensing layers as claimed in claim 18, is characterized in that, the material of this first conductive layer is transparent conductive material, and the material of this second conductive layer is metal material.
20. touch-control sensing layers as claimed in claim 18, is characterized in that, the junction zero lap of those electrodes and those peripheries lead-in wire.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210319500.2A CN103631459B (en) | 2012-08-26 | 2012-08-26 | Touch-control sensing layer and manufacture method thereof |
| TW101145758A TWI474237B (en) | 2012-08-26 | 2012-12-05 | Sensing layer and method for producing the same |
| TW101223610U TWM453901U (en) | 2012-08-26 | 2012-12-05 | Sensing layer |
| PCT/CN2013/081829 WO2014032534A1 (en) | 2012-08-26 | 2013-08-20 | Touch induction layer and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210319500.2A CN103631459B (en) | 2012-08-26 | 2012-08-26 | Touch-control sensing layer and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103631459A true CN103631459A (en) | 2014-03-12 |
| CN103631459B CN103631459B (en) | 2016-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210319500.2A Active CN103631459B (en) | 2012-08-26 | 2012-08-26 | Touch-control sensing layer and manufacture method thereof |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103631459B (en) |
| TW (2) | TWM453901U (en) |
| WO (1) | WO2014032534A1 (en) |
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| CN103841765A (en) * | 2014-03-18 | 2014-06-04 | 蔡莳铨 | Method for machining printed circuit board |
| CN104503636A (en) * | 2014-11-26 | 2015-04-08 | 业成光电（深圳）有限公司 | Touch module |
| CN104635981A (en) * | 2014-11-26 | 2015-05-20 | 业成光电（深圳）有限公司 | Touch module and touch display device with same |
| CN106569624A (en) * | 2015-10-09 | 2017-04-19 | 群创光电股份有限公司 | Touch substrate and touch device |
| CN106909258A (en) * | 2015-12-23 | 2017-06-30 | 汉思高电子科技（义乌）有限公司 | A kind of structure of touch screen function piece lead and preparation method thereof |
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| CN103631459B (en) * | 2012-08-26 | 2016-12-21 | 宝宸（厦门）光学科技有限公司 | Touch-control sensing layer and manufacture method thereof |
| TWI553379B (en) * | 2014-06-25 | 2016-10-11 | 群創光電股份有限公司 | Display panel and display device applying the same |
| CN106155394A (en) * | 2015-04-17 | 2016-11-23 | 宸鸿科技(厦门)有限公司 | Contact panel |
| CN108803946A (en) * | 2018-09-07 | 2018-11-13 | 蓝思科技（长沙）有限公司 | A kind of flexibility narrow frame touch-control sensor and preparation method thereof |
| CN115657874A (en) * | 2022-10-28 | 2023-01-31 | 业成科技（成都）有限公司 | Touch display module and manufacturing method thereof |
| CN116009724B (en) * | 2022-12-30 | 2024-06-18 | 浙江万超电器有限公司 | Production process and production line of laser carving automobile touch panel |
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| CN106909258B (en) * | 2015-12-23 | 2020-05-01 | 汉思高电子科技（义乌）有限公司 | Structure of touch screen functional sheet lead wire and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM453901U (en) | 2013-05-21 |
| WO2014032534A1 (en) | 2014-03-06 |
| TWI474237B (en) | 2015-02-21 |
| TW201409314A (en) | 2014-03-01 |
| CN103631459B (en) | 2016-12-21 |
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Effective date of registration: 20240307 Address after: 361101 No. 996 Min'an Avenue, Torch High tech Zone (Xiang'an) Industrial Zone, Xiamen City, Fujian Province Patentee after: TPK GLASS SOLUTIONS (XIAMEN) Inc. Country or region after: China Address before: Floor 3, 4, 5 and 8, 190 Jimei Avenue, Jimei District, Xiamen, Fujian, 361009 Patentee before: TPK Touch Systems (Xiamen) Inc. Country or region before: China |