CN104503636A - Touch module - Google Patents
Touch module Download PDFInfo
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- CN104503636A CN104503636A CN201410689355.6A CN201410689355A CN104503636A CN 104503636 A CN104503636 A CN 104503636A CN 201410689355 A CN201410689355 A CN 201410689355A CN 104503636 A CN104503636 A CN 104503636A
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- conductive layer
- sensing electrode
- conductive
- sensing
- touch module
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
A touch module comprises a touch area, a routing area and a substrate, wherein the routing area is positioned on the periphery of the touch area; a first sensing electrode and a second sensing electrode which are made of conductive materials are arranged on the substrate and correspond to the touch area; the first sensing electrode is insulated from the second sensing electrode; and a conductive signal wire is arranged on the substrate, corresponds to the routing area and comprises at least two layers of conductive structures comprising a first conductive layer and a second conductive layer which are stacked.
Description
Technical field
The present invention relates to a kind of touch module.
Background technology
Along with the development of electronic technology, the consumption electronic products such as mobile phone, portable computer, personal digital assistant (PDA), panel computer, media player all adopt touch module as input equipment mostly, have more friendly man-machine interaction mode to make product.
According to the difference of its touch-control principle, touch module comprises electric resistance touch-control module, capacitance touching control module, infrared type touch module and sound wave type touch module etc.At present, widely used touch module comprises the touch module such as resistance-type, condenser type, optical profile type, acoustic wave.Wherein, especially more extensive with the application of capacitance touching control module.Capacitance touching control module because its touch-control sensitivity is good, long service life, not easily by advantages such as outer signals interference, be widely used in various consumption electronic products.
At present, the capacitance touching control module be widely used, such as projecting type capacitor touch module, mostly comprise touch-control sensing region and be positioned at cabling (fan-out) region or frame (border) region of this touch-control sensing area periphery.
The touch-control sensing parts of projecting type capacitor touch screen are generally staggered to form induction matrix by column electrode and row electrode.Column electrode and row electrode can be arranged on the two sides of same transparency carrier respectively, prevent from occurring short circuit at intervening portion.
In addition, a kind of typical capacitance touching control module, also column electrode and row electrode can be arranged on the homonymy of same transparency carrier, its column electrode and row electrode comprise series of sense sheet respectively, and sensing sheet can be rhombus or other polygon.The design proposal that this touch module adopts usually is: one of column electrode or row electrode are arranged continuously on conducting film, and another electrode on conducting film with the electrode arranged continuously for being arranged to some electrode blocks in interval, by conducting bridge, adjacent electrode block is electrically connected in the position of cross-point, thus forms the continuous electrode on other direction.Separated by insulation course between conducting bridge and the electrode arranged continuously, thus effective column electrode and the row electrode of stoping is in cross-point short circuit.Then, the column electrode made and row electrode are connected to a control circuit (as FPC) by the metal routing of frame region again.The touch module of this structure generally needs five road lithographic process (gold-tinted processing procedure) to make the protective seam covered above conducting bridge, insulation course, the electrode (one of column electrode and row electrode) arranged continuously, plain conductor and plain conductor respectively.In order to save processing procedure cost, the wire in cabling district uses same material to be formed in same lithographic process with sensing electrode by some capacitance touching control modules.A kind of widely used electrode material is the transparent oxide semiconductor materials such as tin indium oxide (ITO).But use tin indium oxide as the wire of routing region, the resistance of its line can be higher, can affect the laser propagation effect of signal.
Summary of the invention
For overcoming the above problems, be necessary to provide a kind of touch module reducing routing region wire resistance.
A kind of touch module provided by the invention, comprise touch area and be positioned at the routing region of periphery, touch area, this touch module comprises a substrate, the position of the corresponding touch area of this substrate is provided with the first sensing electrode and the second sensing electrode that are formed by conductive material, this first sensing electrode and the second sensing electrode mutually insulated are arranged, and the position of the corresponding routing region of this substrate is provided with conductive signal wire.This conductive signal wire comprises at least two-layer conductive structure, and this at least two-layer conductive structure comprises the first conductive layer and second conductive layer of stacked setting, and the material of this first conductive layer and the second conductive layer is tin indium oxide.
Preferably, described first conductive layer, the second conductive layer and the second sensing electrode are formed in same lithographic process.
Preferably, the bridging structure that described first sensing electrode comprises multiple first sensing cell and is electrically connected by adjacent two the first sensing cells, described first conductive layer and this bridging structure are formed in same lithographic process, and described second conductive layer and the second sensing electrode are formed in same lithographic process.
Preferably, an insulation coating is covered directly over described bridging structure, the connection wire that described second sensing electrode comprises multiple second sensing cell and is connected in series by the plurality of second sensing cell, this connection wire traverses this bridging structure and adjacent two the second sensing cells are electrically connected by this insulation coating.
Preferably, described first conductive layer overlaps with the second conductive layer, and this first conductive layer is identical with the thickness of the second conductive layer.
The invention provides another kind of touch module, comprise touch area and be positioned at the routing region of periphery, touch area, this touch module comprises a substrate, the position of the corresponding touch area of this substrate is provided with the first sensing electrode and the second sensing electrode that are formed by conductive material, this first sensing electrode and the second sensing electrode mutually insulated are arranged, and the position of the corresponding routing region of this substrate is provided with conductive signal wire.This conductive signal wire comprises at least two-layer conductive structure, this at least two-layer conductive structure comprises the first conductive layer and second conductive layer of stacked setting, this first conductive layer is positioned at immediately below the second conductive layer, the material of this first conductive layer is metal material, and the material of this second conductive layer is tin indium oxide.
Preferably, described first conductive layer, the second conductive layer and the second sensing electrode are formed in same lithographic process.
Preferably, the bridging structure that described first sensing electrode comprises multiple first sensing cell and is electrically connected by adjacent two the first sensing cells, described first conductive layer and this bridging structure are formed in same lithographic process, and described second conductive layer and the second sensing electrode are formed in same lithographic process.
Preferably, described first conductive layer overlaps with the second conductive layer, and the thickness of this first conductive layer is greater than the thickness of this second conductive layer.
Compared to prior art, the lithographic process of the conductive signal wire of touch module of the present invention can be integrated into a lithographic process with the lithographic process of the lithographic process of the first sensing electrode or the second sensing electrode, thus reduces the processing procedure cost of touch module.In addition, conductive signal wire adopts bilayer conductive structure, also can reduce impedance, improves conductance.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of touch control display apparatus provided by the invention.
Fig. 2 is the wire structures schematic diagram of the touch module shown in Fig. 1.
Fig. 3 is the floor map of the touch-control graphic structure of touch module described in an embodiment.
Fig. 4 be in an embodiment touch module shown in Fig. 2 along the cross-sectional view of IV-IV tangent line.
Fig. 5 be in another embodiment the touch module shown in Fig. 2 along the cross-sectional view of IV-IV tangent line.
Main element symbol description
| Touch control display apparatus | 1 |
| Glass cover-plate | 10 |
| Touch module | 20 |
| Display module | 30 |
| Touch area | 21 |
| Routing region | 22 |
| Substrate | 200，300 |
| First sensing electrode | 210 |
| First sensing cell | 211 |
| Bridging structure | 212 |
| Second sensing electrode | 220 |
| Second sensing cell | 221 |
| Connect wire | 222 |
| Insulation coating | 230 |
| Black resin layer | 240，340 |
| Protective seam | 250 |
| Conductive signal wire | 260，360 |
| First conductive layer | 261，361 |
| Second conductive layer | 262，362 |
| First protective seam | 350 |
| Second protective seam | 370 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1, Fig. 1 is the schematic perspective view of touch control display apparatus 1 provided by the invention.This touch control display apparatus 1 comprises the cover-plate glass 10, touch module 20 and the display module 30 that are laminated to each other and arrange.This cover-plate glass 10 is also called cover lens or cover glass.This touch module 20 is sandwiched between this cover-plate glass 10 and display module 30.Preferably, in an embodiment, this touch module 20 is by optical cement and described glass cover-plate 10 and show module 30 and be bonded together.Such as, this optical cement can be the tackifier that optical clear tackifier (Optical Clear Adhesive, OCA) or optical clear resin (Optical Clear Resin, OCR) etc. have high transmission rate.
Refer to Fig. 2, Fig. 2 is the wire structures schematic diagram of the touch module 20 shown in Fig. 1.This touch module 20 comprises touch area 21 and is positioned at the routing region 22 of this periphery, touch area 21.This touch area 21 is also known as viewing area or " AA " district.This routing region 22 is for the wiring of the conductive signal wire of touch module 20, and it is provided with the various conductive signal wires needed for touch module 20.In the present embodiment, the conductive signal wire in this routing region 22 is arranged around the side of touch area 21, and this conductive signal wire line can be straight line or broken line.
Refer to Fig. 3, Fig. 3 is the floor map of the touch-control graphic structure of touch module 20 described in an embodiment.
This touch module 20 comprises multiple first sensing electrode 210 and multiple second sensing electrode 220.In the present embodiment, this first sensing electrode 210 extends or arrangement along first direction (such as longitudinally).This second sensing electrode 220 extends or arrangement along second direction (such as laterally).This first sensing electrode 210 and this second sensing electrode 220 insulate crossing setting, are configured for the capacitance touching control induction structure responding to touch-control action.Should be understood that, in other embodiments, the first sensing electrode 210 on described first direction can with the second sensing electrode 220 switch in second direction.Also namely, the first sensing electrode 210 extends or arrangement in second direction, and the second sensing electrode 220 extends or arrangement at first direction.
In the present embodiment, the bridging structure 212 that the first sensing electrode 210 comprises multiple first sensing cell 211 and is electrically connected by adjacent two the first sensing cells 211.Second sensing electrode 220 comprises multiple second sensing cell 221.This second sensing cell 221 is sequentially connected in series by the connection wire 222 traversing this bridging structure 212.Preferably, the plurality of first sensing cell 211 is along the equidistant linear array of described first direction, and the plurality of second sensing cell 221 is along the equidistant linear array of described second direction.The pattern of this first sensing cell 211 and the second sensing cell 221 is rhombus.In other embodiment, the pattern of this first sensing cell 211 and the second sensing cell 221 also can be other shape.
Wherein, described bridging structure 212 covers an insulation coating 230, described connection wire 222 traverses this insulation coating 230 and adjacent two the second sensing cells 221 are electrically connected by this bridging structure 212.This insulation coating 230 is formed by the material that is electrically insulated (as photoresist), with the isolation that the first sensing electrode 210 and the second sensing electrode 220 is electrically insulated.
Refer to Fig. 4, Fig. 4 is the cross-sectional view of the touch module 20 in an embodiment shown in Fig. 2 along IV-IV tangent line.
In the present embodiment, touch module 20 comprises a substrate 200.This substrate 200 can be glass substrate or transparent resin substrate or film etc.This substrate 200 arranges light shield layer 240 in the position of corresponding routing region 22, and light shield layer 240 is positioned at one of them surface of substrate 200.
Described light shield layer 240 can be made up of light screening materials such as black resins.Concrete formation method can be: by black resin through rotary coating mode or scrape formula coating method even spread on the transparent substrate, coating thickness is approximately 0.3um ~ 5um, pre-baked through well heater, exposure, development, makes it the light shield layer needed for being formed.
This substrate 200 arranges protective seam 250 on the position and light shield layer 240 of corresponding touch area 21.This protective seam 250 is formed by insulating material.In the position of corresponding touch area 21, this protective seam 250 is provided with bridging structure 212 and second sensing electrode 220 of the first sensing electrode 210 formed by conductive material.This bridging structure 212 is coated with insulation coating 230.The connection wire 222 of the second sensing electrode 220 traverses this insulation coating 230 and adjacent two the second sensing cells 221 are electrically connected by this bridging structure 212.Be electrically insulated by this insulation coating 230 between the bridging structure 212 of the first sensing electrode 210 and the second sensing electrode 220 and arrange.Preferably, the bridging structure 212 of this first sensing electrode 210 can be made up of transparent conductive material with this second sensing electrode 220.This transparent conductive material is preferably tin indium oxide (Indium Tin Oxides, ITO).Insulation coating 30 can be made up of materials such as insulating resins.
In the position of corresponding routing region 22, described protective seam 250 is provided with many spaced conductive signal wires 260.This conductive signal wire 260 is for transmitting the signal of the first sensing electrode 210 and/or the second sensing electrode 220 to external control circuit.In the present embodiment, this conductive signal wire 260 comprises the first conductive layer 261 and the second conductive layer 262 of stacked setting.This first conductive layer 261 and the second conductive layer 262 can be manufactured from the same material, and also can be made up of different materials.Preferably, this first conductive layer 261 and the second conductive layer 262 are made up of same conductive, and such as this first conductive layer 261 is made up of the conductive material identical with described bridging structure 212 and the second sensing electrode 220 with the second conductive layer 262.The material of this first conductive layer 261 and the second conductive layer 262 is preferably tin indium oxide.In one preferred embodiment, the first conductive layer 261 of this conductive signal wire 260 and the second conductive layer 262 and the second sensing electrode 220 are formed in same lithographic process by same material, can avoid the contraposition offset problem of the first conductive layer 261 and the second conductive layer 262.Meanwhile, this first conductive layer 261 and the second conductive layer 262 overlap, and this first conductive layer 261 is roughly the same with the thickness of the second conductive layer 262.In other embodiments, the bridging structure 212 of this first conductive layer 261 and the first sensing electrode 210 is by same material and formed in same lithographic process, and the second conductive layer 262 and the second sensing electrode 220 are formed in same lithographic process by same material.
Should be appreciated that the present embodiment has two-layer conductive structure using conductive signal wire 260 and is introduced as preferred embodiment.In other embodiments, this conductive signal wire 260 also can be designed to two-layer above conductive structure, and this two-layer above conductive structure also can be formed in same lithographic process with the bridging structure 212 of the first sensing electrode 210 or the second sensing electrode 220.
Refer to Fig. 5, Fig. 5 is the cross-sectional view of the touch module 20 in another embodiment shown in Fig. 2 along IV-IV tangent line.
In the present embodiment, touch module 20 comprises a substrate 300.This substrate 300 can be glass substrate or transparent resin substrate or film etc.This substrate 300 arranges light shield layer 340 in the position of corresponding routing region 22, and light shield layer 340 is positioned at one of them surface of substrate 300.
Described light shield layer 340 can be made up of light screening materials such as black resins.Concrete formation method can be: by black resin through rotary coating mode or scrape formula coating method even spread on the transparent substrate, coating thickness is approximately 0.3um ~ 5um, pre-baked through well heater, exposure, development, makes it the light shield layer needed for being formed.
This substrate 300 arranges the first protective seam 350 on the position and light shield layer 340 of corresponding touch area 21.This first protective seam 350 is formed by insulating material.In the position of corresponding touch area 21, the bridging structure 212 of the first sensing electrode 210 and the second sensing electrode 220 are arranged at above this this protective seam 250.This bridging structure 212 is coated with insulation coating 230.The connection wire 222 of the second sensing electrode 220 traverses this insulation coating 230 and adjacent two the second sensing cells 221 are electrically connected by this bridging structure 212.Be electrically insulated by this insulation coating 230 between the bridging structure 212 of the first sensing electrode 210 and the second sensing electrode 220 and arrange.In the present embodiment, the bridging structure 212 of this first sensing electrode 210 and this second sensing electrode 220 can be made up of transparent conductive material.This transparent conductive material is preferably tin indium oxide (Indium Tin Oxides, ITO) etc.Insulation coating 30 can be made up of materials such as insulating resins.
In the position of corresponding routing region 22, described first protective seam 350 is provided with many spaced conductive signal wires 360.This conductive signal wire 360 is for transmitting the signal of the first sensing electrode 210 and/or the second sensing electrode 220 to external control circuit.In the present embodiment, this conductive signal wire 360 comprises the first conductive layer 361 and the second conductive layer 362 of stacked setting.This first conductive layer 361 and the second conductive layer 362 can be manufactured from the same material, and also can be made up of different materials.Preferably, this first conductive layer 361 and the second conductive layer 362 are made up of different conductive material.In one preferred embodiment, this first conductive layer 361 is metal level, and the second conductive layer 362 is indium tin oxide layer.This metal level is positioned at immediately below indium tin oxide layer, and the thickness of this metal level is greater than the thickness of this indium tin oxide layer.The material of this metal level can be, silver, aluminium, molybdenum, copper or alloy etc.
In the present embodiment, this conductive signal wire 360 and the second sensing electrode 220 are made in same lithographic process.Particularly, first, in the position of corresponding routing region 22, a metal level can be applied above the first protective seam 350.Then, in the position of corresponding touch area 21, apply an indium tin oxide layer and be covered in above insulation coating 230 and the first protective seam 350, and apply an indium tin oxide layer simultaneously and be covered on described metal level.Finally, in same lithographic process, photoetching (such as gold-tinted etching) process is carried out to the indium tin oxide layer of this coating and metal level, forms the second sensing electrode 220 and conductive signal wire 360 with patterning.In another embodiment, described first conductive layer 361(metal level) can be formed in same lithographic process with the bridging structure 212 of the first sensing electrode 210, and the second conductive layer 362(indium tin oxide layer) can be formed in same lithographic process with the second sensing electrode 220.
In addition, touch module 20 also comprises one second protective seam 370, and this second protective seam 370 is covered in whole touch area 21 and routing region 22, to protect the second sensing electrode 220 and conductive signal wire 360.This second protective seam 370 can be made up of the insulating material identical with the first protective seam 350.
Should be appreciated that the present embodiment has two-layer conductive structure using conductive signal wire 360 and is introduced as preferred embodiment.In other embodiments, this conductive signal wire 360 also can be designed to two-layer above conductive structure, and this two-layer above conductive structure also can be formed in same lithographic process with the bridging structure 212 of the first sensing electrode 210 or the second sensing electrode 220.
In sum, the lithographic process of described conductive signal wire can be integrated into a lithographic process with the lithographic process of the lithographic process of the bridging structure of the first sensing electrode 0 or the second sensing electrode, thus reduces the processing procedure cost of touch module.In addition, conductive signal wire adopts bilayer conductive structure, also can reduce impedance, improves conductance.
Above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not depart from the spirit and scope of technical solution of the present invention.
Claims (10)
1. a touch module, comprise touch area and be positioned at the routing region of periphery, touch area, this touch module comprises a substrate, the position of the corresponding touch area of this substrate is provided with the first sensing electrode and the second sensing electrode that are formed by conductive material, this first sensing electrode and the second sensing electrode mutually insulated are arranged, the position of the corresponding routing region of this substrate is provided with conductive signal wire, it is characterized in that, this conductive signal wire comprises at least two-layer conductive structure, this at least two-layer conductive structure comprises the first conductive layer and second conductive layer of stacked setting, the material of this first conductive layer and the second conductive layer is tin indium oxide.
2. touch module as claimed in claim 1, it is characterized in that, described first conductive layer, the second conductive layer and the second sensing electrode are formed in same lithographic process.
3. touch module as claimed in claim 1, it is characterized in that, the bridging structure that described first sensing electrode comprises multiple first sensing cell and is electrically connected by adjacent two the first sensing cells, described first conductive layer and this bridging structure are formed in same lithographic process, and described second conductive layer and the second sensing electrode are formed in same lithographic process.
4. touch module as claimed in claim 3, it is characterized in that, an insulation coating is covered directly over described bridging structure, the connection wire that described second sensing electrode comprises multiple second sensing cell and is connected in series by the plurality of second sensing cell, this connection wire traverses this bridging structure and adjacent two the second sensing cells are electrically connected by this insulation coating.
5. touch module as claimed in claim 1, it is characterized in that, described first conductive layer overlaps with the second conductive layer, and this first conductive layer is identical with the thickness of the second conductive layer.
6. a touch module, comprise touch area and be positioned at the routing region of periphery, touch area, this touch module comprises a substrate, the position of the corresponding touch area of this substrate is provided with the first sensing electrode and the second sensing electrode that are formed by conductive material, this first sensing electrode and the second sensing electrode mutually insulated are arranged, the position of the corresponding routing region of this substrate is provided with conductive signal wire, it is characterized in that, this conductive signal wire comprises at least two-layer conductive structure, this at least two-layer conductive structure comprises the first conductive layer and second conductive layer of stacked setting, this first conductive layer is positioned at immediately below the second conductive layer, the material of this first conductive layer is metal material, the material of this second conductive layer is tin indium oxide.
7. touch module as claimed in claim 6, it is characterized in that, described first conductive layer, the second conductive layer and the second sensing electrode are formed in same lithographic process.
8. touch module as claimed in claim 6, it is characterized in that, the bridging structure that described first sensing electrode comprises multiple first sensing cell and is electrically connected by adjacent two the first sensing cells, described first conductive layer and this bridging structure are formed in same lithographic process, and described second conductive layer and the second sensing electrode are formed in same lithographic process.
9. touch module as claimed in claim 8, it is characterized in that, an insulation coating is covered directly over described bridging structure, the connection wire that described second sensing electrode comprises multiple second sensing cell and is connected in series by the plurality of second sensing cell, this connection wire traverses this bridging structure and adjacent two the second sensing cells are electrically connected by this insulation coating.
10. touch module as claimed in claim 6, it is characterized in that, described first conductive layer overlaps with the second conductive layer, and the thickness of this first conductive layer is greater than the thickness of this second conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410689355.6A CN104503636A (en) | 2014-11-26 | 2014-11-26 | Touch module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410689355.6A CN104503636A (en) | 2014-11-26 | 2014-11-26 | Touch module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104503636A true CN104503636A (en) | 2015-04-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410689355.6A Pending CN104503636A (en) | 2014-11-26 | 2014-11-26 | Touch module |
Country Status (1)
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105718128A (en) * | 2016-04-13 | 2016-06-29 | 京东方科技集团股份有限公司 | Touch panel, preparation method thereof and touch device |
| TWI581142B (en) * | 2015-04-23 | 2017-05-01 | 業成光電（深圳）有限公司 | Touch module and touch display device having same |
| CN107340941A (en) * | 2017-06-28 | 2017-11-10 | 昆山国显光电有限公司 | A kind of capacitive touch screen and preparation method thereof |
| CN107678590A (en) * | 2017-09-29 | 2018-02-09 | 上海中航光电子有限公司 | A kind of touch-control display panel and its driving method |
| CN109062445A (en) * | 2018-09-06 | 2018-12-21 | 牧东光电科技有限公司 | A method of touch screen is prepared using abnormity cutting |
| CN111857414A (en) * | 2020-07-02 | 2020-10-30 | Tcl华星光电技术有限公司 | Capacitive touch screen |
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| CN203376736U (en) * | 2013-08-09 | 2014-01-01 | 芜湖长信科技股份有限公司 | Capacity touch panel |
| CN103631459A (en) * | 2012-08-26 | 2014-03-12 | 宝宸（厦门）光学科技有限公司 | Touch sensing layer and manufacturing method thereof |
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| CN102043872A (en) * | 2009-10-15 | 2011-05-04 | 英业达股份有限公司 | Circuit board wiring method |
| CN103631459A (en) * | 2012-08-26 | 2014-03-12 | 宝宸（厦门）光学科技有限公司 | Touch sensing layer and manufacturing method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI581142B (en) * | 2015-04-23 | 2017-05-01 | 業成光電（深圳）有限公司 | Touch module and touch display device having same |
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| CN107340941A (en) * | 2017-06-28 | 2017-11-10 | 昆山国显光电有限公司 | A kind of capacitive touch screen and preparation method thereof |
| CN107678590A (en) * | 2017-09-29 | 2018-02-09 | 上海中航光电子有限公司 | A kind of touch-control display panel and its driving method |
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| CN109062445A (en) * | 2018-09-06 | 2018-12-21 | 牧东光电科技有限公司 | A method of touch screen is prepared using abnormity cutting |
| CN111857414A (en) * | 2020-07-02 | 2020-10-30 | Tcl华星光电技术有限公司 | Capacitive touch screen |
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