CN103624909A - Clamp and method for reducing bending of plastic-sealed body - Google Patents
Clamp and method for reducing bending of plastic-sealed body Download PDFInfo
- Publication number
- CN103624909A CN103624909A CN201210304122.0A CN201210304122A CN103624909A CN 103624909 A CN103624909 A CN 103624909A CN 201210304122 A CN201210304122 A CN 201210304122A CN 103624909 A CN103624909 A CN 103624909A
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- plastic
- sealed body
- fixture
- top board
- lower platen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention provides a clamp and a method for reducing bending of plastic-sealed body, and belongs to the technical field of integrated circuit packaging. The clamp comprises an upper pressing plate and a lower pressing plate. The method comprises that during the cooling process of the plastic-sealed body, the plastic-sealed body is placed between the upper pressing plate and the lower pressing plate, and is clamped and pressed by the upper pressing plate and the lower pressing plate, so that the bending of the plastic-sealed body is reduced. The clamp has substantial effect on improving the bending of the plastic-sealed body, the method is simple and the efficiency is high.
Description
Technical field
The invention belongs to ic chip package technical field, relate to the plastic packaging process of encapsulation, the plastic-sealed body relating in particular to after adopting fixture to plastic packaging depanning clamps to avoid plastic-sealed body crooked in cooling procedure.
Background technology
Packed IC chip is exteriorly wrapped up by plastic packaging material substantially, and the outer pin of the conductor part of lead frame stretches out from plastic packaging material.The plastic packaging material of parcel is commonly referred to " plastic-sealed body ", and it has the inner chip of protection and soft function wiry, and then the IC chip after packed can be used easily.
Therefore, in the encapsulation process of IC chip, comprise the process that is used to form plastic-sealed body, be commonly referred to plastic packaging process.Plastic packaging process is also a thermal process (experiencing the significant change of temperature), therefore, at plastic packaging, forms after plastic-sealed body, and thermal stress can cause plastic-sealed body crooked in plastic-sealed body conventionally, thereby causes packed IC chip distortion.The distortion that this bending causes makes it in use may cause serious problem, and the bending that reduces plastic-sealed body is also that the problem solving is endeavoured in this area always.
In current semiconductor packages industry, conventionally exist two schemes to reduce the bending of plastic-sealed body:
The first is, in the process of designing integrated circuit chip product, to reduce the bending of plastic-sealed body by accurate design from source; For example, Chinese Patent Application No. is that CN1122637, name are called in the Chinese patent of " planar plastic packaged module of integrated circuit ", it provides extra material layer in the plastics at layer place that are different from lead frame connecting lead wire, so that each power of balance, thereby reduces the bending of plastic-sealed body;
The second is, in plastic packaging process by regulating parameter or by changing the method for plastic packaging resin structure shape and material.
Wherein, the first scheme is high to technical requirement on design, and is difficult to avoid completely buckling phenomenon, once design imperfect, the plastic-sealed body bending requirement that will be above standard; First scheme can be alleviated buckling problem by improving process conditions and material, and still, the ic core flake products for the larger plastic-sealed body of volume, is also difficult to reach standard-required.
Summary of the invention
The object of the invention is to, reduce the degree of crook of plastic-sealed body.
For realizing above object or other objects, the invention provides following technical scheme.
According to an aspect of of the present present invention, provide that a kind of it comprises top board and lower platen for reducing the fixture of plastic-sealed body bending, the described plastic-sealed body of the cooling procedure of plastic packaging is placed between described top board and lower platen and by described top board and lower platen and clamps.
According to the fixture of one embodiment of the invention, wherein, on the upper surface of described lower platen, be provided with the die cavity of putting described plastic-sealed body for locating.
According to the fixture of further embodiment of this invention, wherein, described fixture also comprises for carrying and shifts described plastic-sealed body support plate, and described plastic-sealed body and described support plate are placed between described top board and lower platen simultaneously.
In the fixture of described arbitrary embodiment before, preferably, on the upper surface of described lower platen, be provided with groove, the plastic-sealed body support plate being placed between described top board and lower platen is placed in described groove.
In the fixture of described arbitrary embodiment before, preferably, described support plate comprises carrying framework and handle, and described carrying framework is embedded in described groove.
The fixture of going back an embodiment according to the present invention, wherein, is provided with in described top board or described lower platen for accelerating the cooling cooling-part of described plastic-sealed body.
According to the fixture of yet another embodiment of the invention, wherein, the surperficial roughness that acts on described plastic-sealed body of described top board is more than or equal to Ra1 and is less than or equal to Ra2, and the surperficial flatness that acts on described plastic-sealed body of described top board is more than or equal to 0.1mm and is less than or equal to 0.5mm.
In the fixture of described arbitrary embodiment before, preferably, the roughness of the bottom surface of described die cavity is more than or equal to Ra0.1 and is less than or equal to Ra0.35, and the flatness of the bottom surface of described die cavity is more than or equal to 0.1mm and is less than or equal to 0.5mm.
According to another aspect of the present invention, provide a kind of and it is characterized in that for reducing the method for plastic-sealed body bending, described plastic-sealed body from plastic package die, take out be placed on the above and arbitrary fixture in complete cooling procedure and clamped.
Preferably, described plastic-sealed body was at least placed in described fixture before its temperature is down to 150 degrees Celsius.
Technique effect of the present invention is use this fixture can greatly reduce plastic-sealed body crooked in cooling procedure, and fixture improves, and plastic-sealed body bending effect to be obvious, method is simple and efficiency is high.
Accompanying drawing explanation
From following detailed description by reference to the accompanying drawings, will make above and other object of the present invention and advantage more completely clear, wherein, same or analogous key element adopts identical label to represent.
Fig. 1 is the perspective structure schematic diagram according to the fixture of one embodiment of the invention.
Fig. 2 is the lower platen structure embodiment schematic diagram in Fig. 1, and wherein, Fig. 2 (a) is top view, and Fig. 2 (b) is A-A sectional view.
Fig. 3 is the carrying board structure embodiment schematic diagram in Fig. 1.
Fig. 4 is the top board structure embodiment schematic diagram in Fig. 1, and wherein, Fig. 4 (a) is upward view, and Fig. 4 (b) is front view.
The specific embodiment
What introduce below is some in a plurality of possibility embodiment of the present invention, aims to provide basic understanding of the present invention, is not intended to confirm key of the present invention or conclusive key element or limits claimed scope.Easily understand, according to technical scheme of the present invention, do not changing under connotation of the present invention other implementations that one of ordinary skill in the art can propose mutually to replace.Therefore, the following specific embodiment and accompanying drawing are only the exemplary illustrations to technical scheme of the present invention, and should not be considered as of the present invention all or be considered as the restriction of technical solution of the present invention or restriction.
In description, use directional terminology (such as " on ", D score and " bottom surface " " etc.) and the parts of the various embodiments described of similar terms represent the direction shown in accompanying drawing or the direction that can be understood by those skilled in the art.These directional terminology are used for relative description and clarification, rather than the orientation of any embodiment will be limited to concrete direction or orientation.
Inventor's discovery of this application, the very large reason of the bending of plastic-sealed body is owing to causing in the cooling procedure of plastic-sealed body.In plastic packaging process, its temperature higher (for example can reach 175 degrees Celsius of left and right) in the process of injection moulding, plastic-sealed body comprises the first half and the latter half, wherein the first half is by the upper cavity plastic film moulding of plastic package die, the lower mode cavity plastic film moulding of the latter half plastic package die, between upper cavity and lower mode cavity by die joint in conjunction with to form plastic packaging chamber.Conventionally owing to having volume difference between upper cavity and lower mode cavity, plastic-sealed body is can be different in the contraction of the upper and lower surface of lead frame, and plastic-sealed body inside just has stress and occurs in cooling process, and plastic-sealed body and then generation are crooked.Especially for the relatively large plastic-sealed body of volume, its buckling phenomenon is more obvious.
Figure 1 shows that the perspective structure schematic diagram according to the fixture of one embodiment of the invention.In this embodiment, fixture 10 is for processing the plastic-sealed body 910 just taking out from plastic package die.Fixture 10 comprises top board 150 and lower platen 110, and plastic-sealed body 910 is placed in and between top board 150 and lower platen 110, carries out coolingly, for convenience of the carrying of plastic-sealed body 910, shifts simultaneously, and fixture 10 also comprises support plate 130.One or more plastic-sealed body 910(are for example with packaging array form) can be placed on support plate 130 simultaneously, and clamp in the process of plastic-sealed body 910 at fixture 10, support plate 130 also can be placed between top board 150 and lower platen 110, therefore, the design of support plate 130 has carrying and shifts outside plastic-sealed body 910 functions meeting, and it need to design its shape so that it does not affect upper surface and lower surface that top board 150 and lower platen 110 act on respectively plastic-sealed body 910 in cramping process.
Figure 2 shows that the lower platen structure embodiment schematic diagram in Fig. 1, wherein, Fig. 2 (a) is top view, and Fig. 2 (b) is A-A sectional view.Figure 3 shows that the carrying board structure embodiment schematic diagram in Fig. 1.Figure 4 shows that the top board structure embodiment schematic diagram in Fig. 1, wherein, Fig. 4 (a) is upward view, and Fig. 4 (b) is front view.In conjunction with shown in Fig. 1 to Fig. 4 further each parts to fixture 10 describe.
In this embodiment, as shown in Figure 4, the lower surface of top board 150 151 be burnishing surface substantially, and in the process of cramping, it is directly to the upper surface effect of plastic-sealed body 910 and plastic-sealed body 910 is exerted pressure.
Particularly, after plastic-sealed body 910 takes out from plastic package die, be placed in immediately on support plate 130 and locate and be placed on lower platen 110, then top board 150 presses down, make plastic-sealed body cooling in this fixture 10, under the external pressure effect of fixture, it forces corrective action to make plastic-sealed body inside reduce and can not cause plastic-sealed body complete because of the thermal stress that cooling procedure produces, thereby it is crooked greatly to reduce the shape of plastic-sealed body 910.
In a preferred embodiment, in the body of top board 150 or lower platen 110, cooling-part is set, for example, circulating water cooling system, like this, can improve the cooling effectiveness of plastic-sealed body, has also improved the plastic packaging efficiency of encapsulation.
In a preferred embodiment also, for reduce the bending of plastic-sealed body as far as possible, arrange top board 150 lower surface 151 roughness in Ra1 to Ra2 scope (for example, Ra1.5), for example, and the flatness of its lower surface 151 is arranged in 0.1mm to 0.5mm scope (, 0.2mm); Similarly, the bottom surface of the die cavity 113 of lower platen 110 also acts on packaging body in cramping process, therefore, arrange lower platen 110 die cavity 113 bottom surface roughness in Ra0.1 to Ra0.35 scope (for example, Ra0.2), for example, and the flatness of the bottom surface of die cavity 113 is arranged in 0.1mm to 0.5mm scope (, 0.2mm).
The present invention also provides a kind of method that reduces plastic-sealed body bending, at plastic-sealed body 910 after in plastic package die, injection moulding completes, from plastic package die, take out, be placed in fixture embodiment illustrated in fig. 1 10 at once and carry out coolingly, and clamped to avoid plastic-sealed body in cooling procedure, to produce bending.Preferably, should make plastic-sealed body 910 in the situation that temperature is more than or equal to 150 degrees Celsius, be placed in fixture 10, also be, plastic-sealed body 910 was at least placed in fixture 10 before its temperature is down to 150 degrees Celsius, like this, the main cooling contraction phase of plastic-sealed body is completed in fixture, be conducive to reduce the bending of plastic-sealed body.
Above example has mainly illustrated fixture of the present invention and has used this fixture to reduce the method for plastic-sealed body bending.Although only some of them embodiments of the present invention are described, those of ordinary skills should understand, and the present invention can be within not departing from its purport and scope implements with many other forms.Therefore, the example of showing and embodiment are regarded as illustrative and not restrictive, and in the situation that not departing from spirit of the present invention as defined in appended each claim and scope, the present invention may be contained various modifications and replacement.
Claims (10)
1. for reducing a fixture for plastic-sealed body bending, it is characterized in that, comprise top board and lower platen, the described plastic-sealed body of the cooling procedure of plastic packaging is placed between described top board and lower platen and by described top board and lower platen and clamps.
2. fixture as claimed in claim 1, is characterized in that, is provided with the die cavity of putting described plastic-sealed body for locating on the upper surface of described lower platen.
3. fixture as claimed in claim 1, is characterized in that, described fixture also comprises for carrying and shift described plastic-sealed body support plate, and described plastic-sealed body and described support plate are placed between described top board and lower platen simultaneously.
4. fixture as claimed in claim 3, is characterized in that, on the upper surface of described lower platen, is provided with groove, and the plastic-sealed body support plate being placed between described top board and lower platen is placed in described groove.
5. fixture as claimed in claim 4, is characterized in that, described support plate comprises carrying framework and handle, and described carrying framework is embedded in described groove.
6. fixture as claimed in claim 1, is characterized in that, is provided with for accelerating the cooling cooling-part of described plastic-sealed body in described top board or described lower platen.
7. fixture as claimed in claim 1, it is characterized in that, the surperficial roughness that acts on described plastic-sealed body of described top board is more than or equal to Ra1 and is less than or equal to Ra2, and the surperficial flatness that acts on described plastic-sealed body of described top board is more than or equal to 0.1mm and is less than or equal to 0.5mm.
8. fixture as claimed in claim 2, is characterized in that, the roughness of the bottom surface of described die cavity is more than or equal to Ra0.1 and is less than or equal to Ra0.35, and the flatness of the bottom surface of described die cavity is more than or equal to 0.1mm and is less than or equal to 0.5mm.
9. for reducing a method for plastic-sealed body bending, it is characterized in that, described plastic-sealed body takes out in the fixture that is placed on as claimed in claim 1 and completes cooling procedure and clamped from plastic package die.
10. method as claimed in claim 9, is characterized in that, described plastic-sealed body was at least placed in described fixture before its temperature is down to 150 degrees Celsius.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210304122.0A CN103624909B (en) | 2012-08-24 | 2012-08-24 | For reducing fixture and the method thereof of plastic-sealed body bending |
| PCT/CN2012/085608 WO2014029176A1 (en) | 2012-08-24 | 2012-11-30 | Clamp for reducing bending in package and method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210304122.0A CN103624909B (en) | 2012-08-24 | 2012-08-24 | For reducing fixture and the method thereof of plastic-sealed body bending |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103624909A true CN103624909A (en) | 2014-03-12 |
| CN103624909B CN103624909B (en) | 2016-09-07 |
Family
ID=50149377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210304122.0A Active CN103624909B (en) | 2012-08-24 | 2012-08-24 | For reducing fixture and the method thereof of plastic-sealed body bending |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103624909B (en) |
| WO (1) | WO2014029176A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108242402A (en) * | 2016-12-26 | 2018-07-03 | 无锡华润华晶微电子有限公司 | Clear die clamper and clear modular system |
| CN110884097A (en) * | 2019-11-29 | 2020-03-17 | 青岛歌尔智能传感器有限公司 | Plastic package anti-warping device and method |
| CN113707578A (en) * | 2021-08-30 | 2021-11-26 | 重庆电子工程职业学院 | Packaging device convenient for packaging integrated circuit chip and use method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1223010A (en) * | 1996-06-20 | 1999-07-14 | 先进自动化体系有限公司 | Method and apparatus for reducing warpage in semiconductor packages |
| JP2000058739A (en) * | 1998-08-10 | 2000-02-25 | Hitachi Ltd | Semiconductor device and lead frame for using manufacture thereof |
| CN1334603A (en) * | 2000-06-28 | 2002-02-06 | 国际商业机器公司 | Planar plastic packaged module of integrated circuit |
| JP4537593B2 (en) * | 2001-02-05 | 2010-09-01 | 新藤電子工業株式会社 | TAB tape carrier warpage correction method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101096126A (en) * | 2006-06-30 | 2008-01-02 | 福懋科技股份有限公司 | IC colloid bend adjusting instrument |
-
2012
- 2012-08-24 CN CN201210304122.0A patent/CN103624909B/en active Active
- 2012-11-30 WO PCT/CN2012/085608 patent/WO2014029176A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1223010A (en) * | 1996-06-20 | 1999-07-14 | 先进自动化体系有限公司 | Method and apparatus for reducing warpage in semiconductor packages |
| JP2000058739A (en) * | 1998-08-10 | 2000-02-25 | Hitachi Ltd | Semiconductor device and lead frame for using manufacture thereof |
| CN1334603A (en) * | 2000-06-28 | 2002-02-06 | 国际商业机器公司 | Planar plastic packaged module of integrated circuit |
| JP4537593B2 (en) * | 2001-02-05 | 2010-09-01 | 新藤電子工業株式会社 | TAB tape carrier warpage correction method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108242402A (en) * | 2016-12-26 | 2018-07-03 | 无锡华润华晶微电子有限公司 | Clear die clamper and clear modular system |
| CN110884097A (en) * | 2019-11-29 | 2020-03-17 | 青岛歌尔智能传感器有限公司 | Plastic package anti-warping device and method |
| CN113707578A (en) * | 2021-08-30 | 2021-11-26 | 重庆电子工程职业学院 | Packaging device convenient for packaging integrated circuit chip and use method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103624909B (en) | 2016-09-07 |
| WO2014029176A1 (en) | 2014-02-27 |
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